Heat dissipation structure of handheld device

Abstract

The utility model discloses a handheld equipment heat dissipation structure relates to electronic equipment heat dissipation technical field, including the casing and silica gel heat insulating layer, the inside wall fixed of casing has the mounting frame, the recess of casing inside right side is connected with compression spring, the both ends of linkage link are hinged with support arm no.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology for electronic devices, specifically a heat dissipation structure for handheld devices. Background Technology

[0002] In the field of handheld products such as smartphones, tablets, and handheld gaming devices, performance upgrades have become a core trend in industry development. However, this has led to a continuous increase in chip integration and power consumption. Under high-load scenarios (such as large-scale games and video rendering), the internal heat of the device explodes, and the surface temperature can easily rise above 45°C. This not only directly causes CPU / GPU throttling and performance degradation (up to 30%), resulting in lag, but also causes significant discomfort due to the hot grip area, affecting the user experience. Prolonged high temperatures will also accelerate the aging of internal components and shorten the device's lifespan. To ensure a smooth user experience in high-performance applications and gaming scenarios, a heat dissipation structure is required.

[0003] Existing heat dissipation structures are mostly custom-designed for specific devices, only compatible with handheld devices of specific brands and models. When replacing a device, a new one needs to be purchased, which increases the user's operating costs. Furthermore, their lack of versatility makes it difficult to meet the needs of users with multiple devices.

[0004] Therefore, in view of this, we have studied and improved the existing structure and its shortcomings, and proposed a heat dissipation structure for handheld devices. Utility Model Content

[0005] The purpose of this invention is to provide a heat dissipation structure for handheld devices to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a heat dissipation structure for a handheld device, comprising a shell and a silicone heat insulation layer. A mounting frame is fixed to the inner side wall of the shell, and a miniature fan is fixed to the mounting frame by screws. A compression spring is connected to a groove on the right side inside the shell, and a linkage rod is provided at the other end of the compression spring. Support arm one is hinged to both ends of the linkage rod by a pin, and support arm two is hinged to the other end of support arm one by a pin. Support arm three is hinged to the grooves at the top and bottom of the shell by a pin, and a side clamping plate is hinged to the other end of support arm three by a pin. The silicone heat insulation layer is disposed on the side of the side clamping plate near the transverse central axis of the shell.

[0007] Furthermore, a composite heat dissipation component is provided on the side of the mounting frame away from the micro fan, and the composite heat dissipation component includes a carbon nanotube heat dissipation layer and a copper foil heat dissipation layer, with the copper foil heat dissipation layer provided on the outer surface of the carbon nanotube heat dissipation layer.

[0008] Furthermore, the composite heat dissipation component also includes a graphene thermal conductive layer and a thermally conductive silicone pad, and the side of the copper foil heat dissipation layer away from the carbon nanotube heat dissipation layer is provided with a graphene thermal conductive layer, and the other side of the graphene thermal conductive layer is provided with a thermally conductive silicone pad.

[0009] Furthermore, each of the support arm one, support arm two, side clamping plate and support arm three is provided in twos, and the two ends of support arm two are respectively hinged to the housing and side clamping plate by pins.

[0010] Furthermore, the second and third support arms are parallel to each other, and the side clamping plates are symmetrically distributed about the transverse central axis of the shell.

[0011] Furthermore, a lithium battery is installed in the groove on the rear left side of the housing, and the miniature fan is electrically connected to the lithium battery.

[0012] Furthermore, a control switch is provided in the groove on the front left side of the housing, and the miniature fan is electrically connected to the control switch.

[0013] This utility model provides a heat dissipation structure for handheld devices, which has the following beneficial effects:

[0014] 1. This utility model allows the linkage rod to be pulled, which in turn drives the second support arm to rotate, causing the two side clamping plates to unfold. After placing the handheld device inside, the linkage rod is released, and the spring rebound drives the side clamping plates to tightly clamp the device through the silicone heat insulation layer. It is compatible with various products such as 6-7.2-inch smartphones, 8-12.9-inch tablets, and handheld gaming devices. There is no need to customize a dedicated heat dissipation structure for different devices. Compared with the traditional dedicated heat dissipation structure, users do not need to repurchase when replacing devices, reducing usage costs and meeting the needs of users with multiple devices.

[0015] 2. The thermally conductive silicone pad of this utility model is closely attached to the core heat-generating area of ​​the equipment. After the control switch is turned on, the heat generated by the high load of the equipment is quickly conducted to the graphene thermal conductive layer through the thermally conductive silicone pad. The graphene thermal conductive layer diffuses the heat laterally to avoid accumulation, and then transfers it to the copper foil heat dissipation layer to further expand the heat distribution area. Finally, the carbon nanotube heat dissipation layer, together with the micro fan, accelerates the convection heat dissipation, so that the temperature of the equipment drops by 10-15℃ under high load scenarios, and the CPU / GPU performance degradation is reduced from 30% to less than 5%, solving the problem of operation lag. Attached Figure Description

[0016] Figure 1 This is a front view schematic diagram of the heat dissipation structure of a handheld device according to the present invention.

[0017] Figure 2 This is a side view of the heat dissipation structure of a handheld device according to the present invention.

[0018] Figure 3 This is a schematic diagram of the unfolded rear view of a heat dissipation structure for a handheld device according to the present invention;

[0019] Figure 4 This is a cross-sectional view of a composite heat dissipation component for a handheld device according to the present invention.

[0020] Figure 5 This is a three-dimensional structural diagram of the housing and mounting frame of a heat dissipation structure for a handheld device according to the present invention.

[0021] In the diagram: 1. Housing; 2. Mounting frame; 3. Composite heat dissipation component; 301. Carbon nanotube heat dissipation layer; 302. Copper foil heat dissipation layer; 303. Graphene thermal conductive layer; 304. Thermally conductive silicone pad; 4. Miniature fan; 5. Compression spring; 6. Linkage rod; 7. Support arm one; 8. Support arm two; 9. Side clamping plate; 10. Support arm three; 11. Silicone insulation layer; 12. Lithium battery; 13. Control switch. Detailed Implementation

[0022] The embodiments of this utility model will be described in further detail below with reference to the accompanying drawings and examples. The following examples are for illustrative purposes only and should not be construed as limiting the scope of this utility model.

[0023] like Figure 1 , Figure 2 , Figure 3 and Figure 5 As shown, a heat dissipation structure for a handheld device includes a housing 1 and a silicone heat insulation layer 11. A mounting frame 2 is fixed to the inner wall of the housing 1, and a miniature fan 4 is fixed to the mounting frame 2 by screws. A compression spring 5 is connected to a groove on the right side inside the housing 1, and a linkage rod 6 is provided at the other end of the compression spring 5. Support arms 1 and 7 are hinged to each other at both ends of the linkage rod 6 via pins, and support arms 2 and 8 are hinged to each other at the other end of support arms 1 and 8 via pins. Support arms 3 and 10 are hinged to the grooves at the top and bottom ends of the housing 1 via pins, and a side clamping plate 9 is hinged to each other at the other end of support arms 3 and 10 via pins. The silicone heat insulation layer... 11 is located on the side of the side clamping plate 9 near the transverse central axis of the housing 1. There are two of each of the following: support arm 1 7, support arm 2 8, side clamping plate 9, and support arm 3 10. The two ends of support arm 2 8 are hinged to the housing 1 and the side clamping plate 9 respectively by pins. Support arm 2 8 and support arm 3 10 are parallel to each other. The side clamping plate 9 is symmetrically distributed about the transverse central axis of the housing 1. A lithium battery 12 is installed in the groove at the rear left side of the housing 1, and the micro fan 4 is electrically connected to the lithium battery 12. A control switch 13 is located in the groove at the front left side of the housing 1, and the micro fan 4 is electrically connected to the control switch 13.

[0024] The specific operation is as follows: after pulling the linkage rod 6, the support arm 1 7 drives the support arm 2 8 to rotate, causing the two side clamping plates 9 to unfold. After placing the handheld device in, release the linkage rod 6. The spring rebound drives the side clamping plates 9 to tightly clamp the device through the silicone heat insulation layer 11. It is compatible with a variety of products such as 6-7.2-inch smartphones, 8-12.9-inch tablets, and handheld gaming devices. There is no need to customize a dedicated heat dissipation structure for different devices. Compared with the traditional dedicated heat dissipation structure, users do not need to repurchase when replacing devices, which reduces the cost of use and meets the needs of users with multiple devices.

[0025] like Figure 4 As shown, a composite heat dissipation component 3 is provided on the side of the mounting frame 2 away from the micro fan 4. The composite heat dissipation component 3 includes a carbon nanotube heat dissipation layer 301 and a copper foil heat dissipation layer 302. The outer surface of the carbon nanotube heat dissipation layer 301 is provided with the copper foil heat dissipation layer 302. The composite heat dissipation component 3 also includes a graphene thermal conductive layer 303 and a thermally conductive silicone pad 304. The side of the copper foil heat dissipation layer 302 away from the carbon nanotube heat dissipation layer 301 is provided with the graphene thermal conductive layer 303, and the other side of the graphene thermal conductive layer 303 is provided with the thermally conductive silicone pad 304.

[0026] The specific operation is as follows: the thermally conductive silicone pad 304 is tightly attached to the core heat-generating area of ​​the device. After the control switch 13 is turned on, the heat generated by the high load of the device is quickly conducted to the graphene thermal conductive layer 303 through the thermally conductive silicone pad 304. The graphene thermal conductive layer 303 diffuses the heat laterally to avoid accumulation, and then transfers it to the copper foil heat dissipation layer 302 to further expand the heat distribution area. Finally, the nano-carbon tube heat dissipation layer 301, together with the micro fan 4, accelerates the convection heat dissipation, so that the temperature of the device drops by 10-15℃ under high load scenarios, and the CPU / GPU performance degradation is reduced from 30% to less than 5%, solving the problem of operation lag.

[0027] In summary, the heat dissipation structure of this handheld device works as follows: First, according to the size of the handheld device, pull the linkage rod 6 to the left side of the housing 1. The linkage rod 6 pulls the compression spring 5 to deform it. At this time, the two ends of the linkage rod 6 drive the two sets of support arms 1 7 to rotate synchronously through the pins. The other end of support arm 1 7 drives support arm 2 8 to rotate around the hinge point of the housing 1. Since support arm 2 8 is hinged to the side clamping plate 9, when rotating, it pushes the side clamping plate 9 to unfold away from the horizontal central axis of the housing 1. At the same time, support arm 3 10 rotates around the hinge point of the housing 1 to ensure that the side clamping plate 9 always remains horizontal and avoids clamping tilt.

[0028] Next, place the handheld device between the two clamping plates 9, align the composite heat dissipation component 3 with the heating area, and then release the linkage rod 6. The compression spring 5 elastically rebounds and pushes the linkage rod 6 back to its original position. Through the reverse linkage of support arm 1 7 and support arm 2 8, the side clamping plates 9 move towards each other until the silicone heat insulation layer 11 on the inner side of the side clamping plate 9 is tightly attached to the surface of the handheld device. The silicone heat insulation layer 11 increases friction to prevent the device from slipping and blocks the heat from the device from being transferred to the hand, thus improving the grip comfort.

[0029] When the handheld device is under high load, the heat generated in the core heat-generating area is conducted through the back of the device to the thermally conductive silicone pad 304. The thermally conductive silicone pad 304 is in close contact with the surface of the device, and the heat is quickly transferred to the graphene thermal conductive layer 303. The graphene thermal conductive layer 303 transfers the diffused heat to the copper foil heat dissipation layer 302. The copper foil heat dissipation layer 302 further expands the heat distribution area, so that the heat is evenly covered by the carbon nanotube heat dissipation layer 301. Then, the control switch 13 is turned on, and the lithium battery 12 (capacity 500mAh, supports Type-C interface charging) powers the micro fan 4. The micro fan 4 generates airflow that blows towards the carbon nanotube heat dissipation layer 301, accelerating the heat convection and dissipation, thereby reducing the surface temperature of the device and maintaining the high-performance operation of the device.

[0030] The embodiments of this utility model are given for illustrative and descriptive purposes only, and are not intended to be exhaustive or to limit the utility model to the forms disclosed. Many modifications and variations will be apparent to those skilled in the art. The embodiments were chosen and described in order to better illustrate the principles and practical applications of this utility model, and to enable those skilled in the art to understand this utility model and design various embodiments with various modifications suitable for a particular purpose.

Claims

1. A heat dissipation structure for a handheld device, comprising a housing (1) and a silicone heat insulation layer (11), characterized in that, The inner wall of the housing (1) is fixed with a mounting frame (2), and a miniature fan (4) is fixed on the mounting frame (2) by screws. A compression spring (5) is connected to the groove on the right side inside the housing (1), and a linkage rod (6) is provided at the other end of the compression spring (5). The two ends of the linkage rod (6) are hinged with a support arm (7) by a pin, and the other end of the support arm (7) is hinged with a support arm (8) by a pin. The grooves at the top and bottom of the housing (1) are hinged with a support arm (3) by a pin, and the other end of the support arm (3) is hinged with a side clamping plate (9) by a pin. The silicone heat insulation layer (11) is provided on the side of the side clamping plate (9) near the transverse central axis of the housing (1).

2. The heat dissipation structure for a handheld device according to claim 1, characterized in that, The mounting frame (2) is provided with a composite heat dissipation component (3) on the side away from the micro fan (4), and the composite heat dissipation component (3) includes a carbon nanotube heat dissipation layer (301) and a copper foil heat dissipation layer (302). The outer surface of the carbon nanotube heat dissipation layer (301) is provided with a copper foil heat dissipation layer (302).

3. The heat dissipation structure for a handheld device according to claim 2, characterized in that, The composite heat dissipation component (3) further includes a graphene thermal conductive layer (303) and a thermally conductive silicone pad (304), and the copper foil heat dissipation layer (302) is provided with a graphene thermal conductive layer (303) on the side away from the carbon nanotube heat dissipation layer (301), and a thermally conductive silicone pad (304) is provided on the other side of the graphene thermal conductive layer (303).

4. The heat dissipation structure for a handheld device according to claim 1, characterized in that, Each of the following is provided in two: support arm one (7), support arm two (8), side clamping plate (9) and support arm three (10). The two ends of support arm two (8) are respectively hinged to the housing (1) and the side clamping plate (9) by pins.

5. The heat dissipation structure for a handheld device according to claim 1, characterized in that, The second support arm (8) and the third support arm (10) are parallel to each other, and the side clamping plates (9) are symmetrically distributed about the transverse central axis of the shell (1).

6. The heat dissipation structure for a handheld device according to claim 1, characterized in that, A lithium battery (12) is installed in the groove on the left rear side of the housing (1), and the micro fan (4) and the lithium battery (12) are electrically connected.

7. The heat dissipation structure for a handheld device according to claim 1, characterized in that, A control switch (13) is provided in the groove on the front left side of the housing (1), and the miniature fan (4) is electrically connected to the control switch (13).

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