Liquid cooling heat dissipation structure, heat dissipation mounting device and optical communication equipment
Patent Information
- Application Number
- CN202522127615.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-30
- Publication Date
- 2026-09-29
- Estimated Expiration
- 2035-09-30
AI Technical Summary
[0003]然而，现有的液冷散热方案，存在适用鼠笼架构有局限，制作、装配难度大，光模块易发生接触不良，不易插拔等问题
[0008]本公开实施例提供的液冷散热结构中，可压缩的导热垫被接纳在浮动托盘的托盘主体的凹槽结构中，导热垫的顶面与液冷板的底面接触，浮动托盘利用特定结构浮动安装在衬板上。该液冷散热结构自身具备浮动功能，可以与光模块鼠笼解耦，因此能够与各种风冷、液冷鼠笼兼容，无需定制鼠笼；整体结构简单，利于装配操作和批量化生产；能够保证托盘主体与导热垫、导热垫与液冷板均充分接触，从而避免发生接触不良，确保光模块得到良好的散热，且利于光模块的插拔。
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Figure CN224818421U_ABST
Abstract
Description
Technical Field
[0001] This disclosure relates to the field of optical communication, and more particularly to a liquid cooling heat dissipation structure, a heat dissipation mounting device for optical modules, and optical communication equipment. Background Technology
[0002] With the commercial application of new technologies such as 5G, cloud computing, big data, and the Internet of Things, users are placing higher demands on the bandwidth of optical communication networks. The optical module industry is gradually developing towards higher speeds, integration, and intelligence, leading to a continuous increase in the power consumption of optical modules, and consequently, more prominent heat dissipation design issues. Currently, the mainstream heat dissipation solution for optical modules is air cooling. This involves installing the optical module in a cage with a vent at the top, allowing partial contact between the optical module and the heat sink. Heat is conducted from the optical module to the heat sink fins and dissipated into the external environment through air cooling. However, air cooling suffers from low thermal efficiency and poor heat dissipation effect. Therefore, liquid cooling technology for optical modules has emerged.
[0003] However, existing liquid cooling solutions have limitations in their applicability to squirrel cage architectures, are difficult to manufacture and assemble, and are prone to poor contact and difficult to plug and unplug optical modules. Utility Model Content
[0004] To solve at least some of the above technical problems, this disclosure provides a liquid cooling heat dissipation structure, a heat dissipation mounting device for an optical module, and an optical communication device.
[0005] In a first aspect, this disclosure provides a liquid cooling heat dissipation structure, comprising: a compressible thermal pad, a floating tray, a liner, and a liquid cooling plate. The floating tray includes a tray body, spring contacts, and a tray mounting portion, wherein the tray body has a groove structure for receiving the thermal pad; spring contacts are respectively connected to both ends of the tray body in a first direction, with one end of each spring contact connected to the tray body and the other end connected to a corresponding tray mounting portion; tray mounting structures are respectively formed on both sides of the liner in a first direction, and each tray mounting portion of the floating tray is connected to a corresponding tray mounting structure; the liner also has a tray opening for the tray body of the floating tray to pass through; the floating tray is floatingly mounted on the liner; the liquid cooling plate is fixed to the top surface of the liner, and the bottom surface of the liquid cooling plate contacts the top surface of the thermal pad.
[0006] In a second aspect, this disclosure provides a heat dissipation mounting device for an optical module, the heat dissipation mounting device including a liquid cooling heat dissipation structure according to the first aspect above, and an optical module cage; wherein the optical module cage, the liner of the liquid cooling heat dissipation structure, and the floating tray form a space for inserting the optical module along the first direction; when the optical module is inserted into the space, the optical module pushes the tray body toward the liquid cooling plate to compress the thermal pad.
[0007] Thirdly, this disclosure provides an optical communication device, the optical communication device including the heat dissipation mounting device according to the second aspect above.
[0008] In the liquid cooling structure provided in this embodiment, a compressible thermal pad is received in a groove structure of the tray body of the floating tray. The top surface of the thermal pad contacts the bottom surface of the liquid cooling plate. The floating tray is floatingly mounted on the liner using a specific structure. This liquid cooling structure itself has a floating function and can be decoupled from the optical module cage, thus it is compatible with various air-cooled and liquid-cooled cages without the need for customized cages. The overall structure is simple, facilitating assembly and mass production. It ensures full contact between the tray body and the thermal pad, and between the thermal pad and the liquid cooling plate, thereby avoiding poor contact, ensuring good heat dissipation for the optical module, and facilitating the insertion and removal of the optical module. Attached Figure Description
[0009] In the accompanying drawings of the embodiments disclosed herein:
[0010] Figure 1 This is a schematic side view of a liquid cooling heat dissipation structure according to an embodiment of the present disclosure;
[0011] Figure 2 This is a schematic partial bottom view of a liquid cooling heat dissipation structure according to an embodiment of the present disclosure;
[0012] Figure 3 This is a schematic perspective view of a floating tray of a liquid cooling heat dissipation structure according to an embodiment of the present disclosure;
[0013] Figure 4 This is a schematic partial perspective view of the liner of the liquid cooling heat dissipation structure according to an embodiment of the present disclosure;
[0014] Figure 5 A schematic perspective view of a thermal pad in a liquid cooling heat dissipation structure according to an embodiment of the present disclosure;
[0015] Figure 6 A schematic front view of the liquid cooling heat dissipation structure and optical module according to an embodiment of the present disclosure;
[0016] Figure 7 This is a schematic perspective view of a liquid cooling heat dissipation structure according to an embodiment of the present disclosure;
[0017] Figure 8 for Figure 7 A schematic bottom view of the liner in the liquid cooling structure shown;
[0018] Figure 9 for Figure 7 A schematic perspective view of the liquid cooling plate in the liquid cooling heat dissipation structure shown;
[0019] Figure 10 This is a schematic front view of the heat dissipation mounting device and the optical module according to an embodiment of the present disclosure;
[0020] Figure 11 This is a partial schematic diagram of the thermally conductive and wear-resistant layer and the tray body in the liquid cooling structure according to an embodiment of the present disclosure;
[0021] Figure 12 This is a schematic side view of a heat dissipation mounting device according to an embodiment of the present disclosure;
[0022] Figure 13 A schematic perspective view of the optical module cage in a heat dissipation mounting device according to an embodiment of the present disclosure;
[0023] Figure 14 This is a schematic perspective view of the optical module cage in a heat dissipation mounting apparatus according to an embodiment of the present disclosure.
[0024] In this disclosure, the meanings of the reference numerals in the drawings are as follows:
[0025] 1. 1A, 1B: Liner plate; 1-1: Tray mounting structure; 1-2: Tray opening; 1-3: Through groove; 1-4: Through hole; 2: Floating tray; 2-1: Tray body; 2-2: Spring clip; 2-3: Tray mounting part; 2-4: Snap-fit hole; 3: Liquid cooling plate; 3-1: Screw hole; 3-2: Spacing part; 3-3: Coolant conduit; 3-4: Screw; 4: Thermal pad; 5: Optical module; 6: Optical module cage; 6A: Upper cage; 6B: Lower cage; 7: Thermally conductive and wear-resistant layer; 7-1: Phase change material; 7-2: Metal film; 8: PCB board; 9: Mounting component Detailed Implementation
[0026] To enable those skilled in the art to better understand the technical solutions of this disclosure, the liquid cooling heat dissipation structure, heat dissipation mounting device, and optical communication equipment provided in the embodiments of this disclosure are described in detail below with reference to the accompanying drawings. Those skilled in the art will understand that the illustrated embodiments may be embodied in different forms, and this disclosure should not be construed as limited to the embodiments described below. Rather, these embodiments are provided to make this disclosure thorough and complete, and to enable those skilled in the art to fully understand the scope of this disclosure.
[0027] The accompanying drawings of the embodiments of this disclosure are provided to further illustrate the embodiments of this disclosure and form part of the specification. They are used together with the detailed embodiments to explain this disclosure and do not constitute a limitation thereof. The above and other features and advantages will become more apparent to those skilled in the art from the description of the detailed embodiments with reference to the accompanying drawings. Furthermore, for clarity, the drawings are not necessarily drawn to scale.
[0028] Where there is no conflict, the various embodiments, implementation methods, and features of the embodiments and implementation methods disclosed herein may be combined with each other.
[0029] The terminology used in this disclosure is for describing particular embodiments only and is not intended to limit the disclosure. The term "and / or" as used in this disclosure includes any and all combinations of one or more of the associated enumerated entries. The singular forms "a" and "the" as used in this disclosure are also intended to include the plural forms unless the context clearly indicates otherwise. The terms "comprising," "made of," etc., as used in this disclosure specify the presence of the stated feature, integral, step, operation, element, and / or component, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or groups thereof. The terms "upper," "lower," "front," "rear," "left," "right," "inner," "outer," "top," "bottom," etc., as used in this disclosure, indicate orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as limiting the disclosure.
[0030] Unless otherwise specified, all terms used in this disclosure (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art. It will also be understood that terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and this disclosure, and will not be interpreted as having an idealized or overly formal meaning, unless expressly so defined in this disclosure.
[0031] In a first aspect, embodiments of this disclosure provide a liquid cooling heat dissipation structure.
[0032] Figure 1 A schematic side view of a liquid cooling heat dissipation structure according to an embodiment of the present disclosure is shown. Figure 2 A partial schematic bottom view of a liquid cooling heat dissipation structure according to an embodiment of the present disclosure is shown. Figures 3 to 5 A perspective view of the floating tray 2, the liner 1, and the compressible thermal pad 4 in the liquid cooling structure according to an embodiment of the present disclosure is shown.
[0033] As shown in the figure, the liquid cooling structure according to the embodiments of this disclosure mainly includes: a liner 1, a floating tray 2, a liquid cooling plate 3, and a thermal pad 4.
[0034] The liquid cooling structure according to embodiments of this disclosure can be used for a single optical module (or a similar device to be cooled), or it can be used to arrange at least one group of optical modules side by side. Taking two optical modules as an example, the corresponding number of floating trays 2 and thermal pads 4 is also two.
[0035] For ease of description, the plane containing the liner 1 is defined as the XY plane, the arrangement direction of the floating tray 2 is defined as the second direction or the Y direction, the direction perpendicular to the Y direction on the XY plane is defined as the first direction or the X direction, and the direction perpendicular to the XY plane is defined as the Z direction. The Z direction is also the thickness direction of the liner 1, floating tray 2, liquid cooling plate 3, and thermal pad 4; the X direction is also the insertion / removal direction of the optical module (see...). Figure 9 Depending on the number of optical modules, the X direction can be the width direction of the liner 1 and the liquid cooling plate 3, or the length direction of the liner 1 and the liquid cooling plate 3; depending on the size of the optical module and the cage and the heat dissipation requirements, the X direction can be the length direction of the floating tray 2 and the thermal pad 4, or the width direction of the floating tray 2 and the thermal pad 4.
[0036] like Figure 2 and Figure 3 As shown, the floating tray 2 includes a tray body 2-1, a spring clip 2-2, and a tray mounting part 2-3. The tray body 2-1 has a feature for receiving a thermal pad 4 (see...). Figure 4 The tray body 2-1 has a groove structure; two ends of the tray body 2-1 in the X direction are respectively connected to spring pieces 2-2, one end of each spring piece 2-2 in the X direction is connected to the tray body 2-1, and the other end is connected to the corresponding tray mounting part 2-3.
[0037] like Figure 2 and Figure 4 As shown, pallet mounting structures 1-1 are formed on both sides of the liner plate 1 in the X direction, and each pallet mounting part 2-3 of the floating pallet 2 is connected to the corresponding pallet mounting structure 1-1. The liner plate 1 has a pallet opening 1-2 for the pallet body 2-1 of the floating pallet 2 to pass through. The floating pallet 2 is floatingly mounted on the liner plate 1.
[0038] like Figure 1 , Figure 3 and Figure 5 As shown, the compressible thermal pad 4 is received in the groove structure of the tray body 2-1. When not under pressure (not compressed), the top surface of the thermal pad 4 ( Figure 1 The upper surface in the Z direction protrudes from the top surface of the pallet body 2-1.
[0039] like Figure 1 As shown, the liquid cooling plate 3 is fixed on the top surface of the liner 1, and the bottom surface of the liquid cooling plate 3 is in contact with the top surface of the heat-conducting pad 4.
[0040] Figure 6 The diagram illustrates the state of the liquid-cooled heat dissipation structure according to an embodiment of this disclosure when it is combined with the optical module 5. For example... Figure 6 As shown, according to the liquid cooling structure of this embodiment, a floating tray 2 with a spring clip 2-2 is floatingly mounted on the liner 1, meaning the floating tray 2 can float up and down relative to the liner 1. A compressible thermal pad 4 is filled between the tray body 2-1 of the floating tray 2 and the liquid cooling plate 3. When the optical module 5 is assembled into the optical module cage 6 along the X direction (first direction), the optical module 5 abuts against the tray body 2-1, forcing the tray body 2-1 to move upward relative to the liner 1, thereby compressing the thermal pad 4. This ensures that the tray body 2-1 and the thermal pad 4, and the thermal pad 4 and the liquid cooling plate 3, are in full contact, thus avoiding poor contact, ensuring that the optical module 5 can receive good heat dissipation, and facilitating the insertion and removal of the optical module 5 without excessive obstruction. Since the liquid cooling structure itself has a floating function, it can be decoupled from the optical module cage, thus being compatible with various air-cooled and liquid-cooled cages without the need for customized cages. In addition, the overall structure of the liquid cooling structure is simple, which is conducive to assembly operations and mass production.
[0041] In some embodiments, the tray body 2-1 is connected to two parallel wavy spring pieces 2-2 on each side of its X-direction, and the other end of the two parallel spring pieces 2-2 is connected to the same sheet-like tray mounting part 2-3. However, this disclosure does not impose any special limitations on the structure and number of the spring pieces 2-2, or the structure and number of the tray mounting parts 2-3. For example, in some embodiments, one or three spring pieces may be connected to each side of the tray body 2-1, and each spring piece may be connected to a separate tray mounting part; in some embodiments, the tray mounting part may be directly formed on the end of the spring piece away from the tray body; in some embodiments, the projection of the spring piece 2-2 in the Y-direction may be wavy and may have at least one peak and at least one valley. Figure 3 (The middle section has two peaks and one valley); in other embodiments, the projection of the spring sheet in the Y direction can be a straight line, a broken line, or a combination of curves and straight lines. When the tray body 2-1 is subjected to force, the spring sheets 2-2 on both sides of the tray body 2-1 will deform to allow the tray body 2-1 to move, producing a "floating" effect. The material of the spring sheet 2-2 can be copper, aluminum, titanium or their alloys, or stainless steel, spring steel, etc.
[0042] In some embodiments, such as Figure 3 and Figure 4As shown, the pallet mounting structure 1-1 is a snap-fit, and the pallet mounting portion 2-3 has snap-fit holes 2-4 that engage with the snap-fit of the corresponding pallet mounting structure 1-1. In other embodiments (not shown), snap-fits are formed on the pallet mounting portion, and the pallet mounting structure is a snap-fit hole that engages with the snap-fit of the corresponding pallet mounting portion. Using a snap-fit structure, floating pallets can be assembled quickly and easily. This disclosure does not impose any particular limitation on the specific shape and number of snap-fits and snap-fit holes. For example, in some embodiments, the snap-fit is a protrusion directly stamped from the liner 1 or the pallet mounting portion 2-3 (as in the case of stamping described below); in other embodiments, the snap-fit is formed separately and subsequently snap-fitted, welded, or glued to the liner 1 or the pallet mounting portion 2-3.
[0043] In some embodiments, at least one of the liner 1 and the floating pallet 2 is a one-piece structure formed by stamping, which not only simplifies processing and facilitates mass production, but also improves the strength and durability of the liner 1 and the floating pallet 2. In particular, when the floating pallet 2 is formed by stamping, the thickness of the pallet body 2-1 can be reduced, which is beneficial for obtaining lower thermal resistance and a higher upper limit of heat dissipation.
[0044] In some embodiments, the tray opening 1-2 has through slots 1-3 on both sides in the X direction that correspond to the spring piece 2-2. The through slots 1-3 are used for the spring piece 2-2 to pass through, so as to prevent the spring piece 2-2 from interfering with the liner 1.
[0045] In some embodiments, the floating tray 2 is made of a metal material with good thermal conductivity, such as copper or aluminum, to ensure heat dissipation efficiency.
[0046] In some embodiments, the liner 1 is made of a hard material such as stainless steel or aluminum.
[0047] In some embodiments, such as Figure 4 As shown, the thermal pad 4 is made of an interface material with high thermal conductivity and high compressibility. In some embodiments, the thermal pad 4 is a graphene thermal pad. In some embodiments, the Z-direction compressibility of the thermal pad 4 can reach up to 50%. Furthermore, the thickness (dimension in the Z direction) of the thermal pad 4 can be designed according to the required tolerance range. When the thermal pad 4 reaches a compression rate of 50%, the corresponding pressure must be limited, which can be calculated based on the insertion and extraction force of the optical module. For example, assuming that the tolerance calculated through the assembly dimensional chain tolerance requires 1mm, since the maximum compression of the thermal pad is 50%, the thickness of the thermal pad needs to be ≥2mm.
[0048] In some embodiments, a plurality of floating trays 2 are floatingly mounted on the liner 1, and the plurality of floating trays 2 are arranged along the Y direction.
[0049] In optical communication equipment such as switches, there are often more than one single-layer optical module. Due to manufacturing and assembly errors, it is difficult for multiple optical modules to be aligned on the same horizontal plane. Related liquid cooling solutions struggle to ensure good simultaneous contact between the liquid cooling plate and multiple optical modules, resulting in poor tolerance. The liquid cooling structure provided in this disclosure, with multiple floating trays mounted on a backing plate, ensures good heat dissipation for each optical module, effectively solving the tolerance problem.
[0050] Figure 7 The liquid cooling structure includes 18 floating trays 2. Figure 8 and Figure 9 They are shown respectively Figure 7 A schematic diagram of the liner 1 and the liquid cooling plate 3.
[0051] In some embodiments, such as Figure 7 As shown, 18 floating trays 2 are arranged along the Y direction, and each floating tray 2 is floatingly mounted on the liner 1. Two adjacent floating trays 2 can form a group, and together with a double-compartment rat cage 6 (see, for example...). Figure 13 (Corresponding to...) Of course, the number of floating trays 2, and the number of floating trays 2 in each group, can also be other numbers, and this disclosure does not impose any special restrictions on this. For example, in some embodiments, three adjacent floating trays can form a group and correspond to a three-compartment mouse cage. In some embodiments, the floating trays are each in a group and each corresponds to a mouse cage; in some embodiments, multiple adjacent floating trays form a group and correspond to only one single-compartment mouse cage.
[0052] In some embodiments, such as Figure 1 , Figure 4 and Figure 9 As shown, the bottom of the liquid cooling plate 3 includes multiple spacers 3-2, and the liquid cooling plate 3 is fixedly connected to the liner 1 through each spacer 3-2. The spacers 3-2 allow for a certain gap between the top surface of the liner 1 and the bottom surface of the liquid cooling plate 3 in the non-connection area between the liner 1 and the liquid cooling plate 3, so as to provide a larger compression space for the heat-conducting pad 4. Specifically, the spacers 3-2 can be arranged along the Y direction on the bottom of the liquid cooling plate 3; the spacers 3-2 and the liquid cooling plate 3 can be integral or separate components; the spacers 3-2 have screw holes 3-1, and the liner 1 has through holes 1-4 corresponding to the screw holes 3-1, the through holes 1-4 being located on one side of the tray opening 1-2; the liner 1 and the liquid cooling plate 3 are fixedly connected by screws 3-4 passing through the through holes 1-4 and the screw holes 3-1. Of course, the liquid cooling plate 3 and the liner 1 can also be connected by means other than screws 3-4, such as welding, snap-fit connection, etc.
[0053] In some embodiments, such as Figure 9As shown, the inlet and outlet of the liquid cooling plate 3 are connected to the coolant conduit 3-3. Coolant flows through the interior of the liquid cooling plate 3, carrying away heat from the optical module. This disclosure does not impose any special limitations on the internal structure of the liquid cooling plate 3 or its connection method with an external cold source.
[0054] In some embodiments, reference Figure 1 In order to prevent the thermal pad 4 from loosening when the tray body 2-1 is not subjected to an external force toward the liquid cooling plate 3, the thermal pad 4 can be pre-compressed between the bottom surface of the groove structure of the tray body 2-1 and the liquid cooling plate 3, for example, at about 10% of the compression amount. The specific pre-compression amount can be achieved by designing the thickness of the spacer 3-2, the position of the bottom surface of the groove structure, and selecting the thickness of the thermal pad 4.
[0055] In some embodiments, such as Figure 10 As shown, the bottom surface of the pallet body 2-1 of the floating pallet 2 can be connected to a thermally conductive and wear-resistant layer 7 to improve the durability and lifespan of the floating pallet while ensuring thermal conductivity efficiency. In some embodiments, such as Figure 11 As shown, the thermally conductive and wear-resistant layer 7 may include a metal film 7-2 and a phase change material (PCM) 7-1 with good thermal conductivity. The four sides of the metal film 7-2 are bonded to the bottom surface of the tray body to encapsulate the phase change material 7-1 between the metal film 7-2 and the bottom surface of the tray body 2-1. The metal film 7-2 may be, for example, a stainless steel film. Under the rebound force of the thermal pad, this structure can better fill the space between the optical module housing and the tray body compared to hard contact, achieving efficient heat dissipation.
[0056] Secondly, embodiments of this disclosure also provide a heat dissipation mounting device for an optical module, the heat dissipation mounting device including a liquid cooling heat dissipation structure according to the first aspect above, and an optical module cage.
[0057] Figure 12 A schematic side view of a heat dissipation mounting device according to an embodiment of the present disclosure is shown. Figure 12 As shown, the heat dissipation mounting device includes: and Figure 1 A similar liquid cooling structure is shown; the optical module cage 6, together with the liquid cooling structure's liner 1 and floating tray 2, forms a space for the optical module to be inserted along the X direction. (Reference) Figure 6 and Figure 10 When the optical module 5 is inserted into the space, the optical module 5 lifts the tray body 2-1 towards the liquid cooling plate 3 (directly lifting it). Figure 6 ) or lifted up via the thermally conductive and wear-resistant layer 7 ( Figure 10 )) to compress the thermal pad 4.
[0058] As mentioned above, the liquid cooling heat dissipation structure provided in this embodiment has a floating function and can be decoupled from the optical module cage. Therefore, this embodiment does not have special requirements for the optical module cage and in most cases does not require special customization.
[0059] Figure 13 An example of an optical module cage in a heat dissipation mounting apparatus according to an embodiment of the present disclosure is shown. Figure 13 The optical module cage 6 is a single-layer, double-compartment cage capable of housing two optical modules; the liner 1 in the liquid cooling structure is positioned above the cage 6 (other parts of the liquid cooling structure are not shown). It should be noted that the liner 1 and the cage 6 can be connected to each other or not directly connected. When the liner 1 and the cage 6 are not directly connected, they can be directly or indirectly fixed to the same fastener to maintain their positional relationship. In some embodiments, the fastener is a PCB board 8 (see...). Figure 12 The cage 6 is connected to the PCB board 8 via the mounting piece 9 at the bottom, the liner 1 is fixedly connected to the liquid cooling plate 3, and the liquid cooling plate 3 is then fixedly connected to the PCB board 8 via a bracket (not shown).
[0060] Figure 14 Another example of an optical module cage in a heat dissipation mounting apparatus according to an embodiment of the present disclosure is shown. Figure 14 The optical module cage is a double-layer, double-compartment cage that can accommodate four optical modules. The top of the upper cage 6A and the lower cage 6B each correspond to a liquid cooling structure (only the lining plates 1A and 1B of the liquid cooling structure are shown in the figure; other parts of the liquid cooling structure are not shown).
[0061] Thirdly, embodiments of this disclosure also provide an optical communication device, which includes: a heat dissipation mounting device according to the second aspect above, and an optical module, wherein the optical module is adapted to be mounted in the heat dissipation mounting device.
[0062] In some embodiments, the optical communication device is a switch. The switch may be a data center switch.
[0063] In some embodiments, the optical communication device is a router.
[0064] It is understood that the above embodiments are merely exemplary implementations used to illustrate the principles of this disclosure, and the present invention is not limited thereto. Various changes in form and detail can be made by those skilled in the art without departing from the scope of the disclosure as set forth in the appended claims.
Claims
1. A liquid-cooled heat dissipation structure, characterized in that, The liquid cooling heat dissipation structure includes: Compressible thermal pad (4); A floating pallet (2), comprising a pallet body (2-1), a spring clip (2-2), and a pallet mounting part (2-3), The tray body (2-1) has a groove structure for receiving the thermal pad (4); The pallet body (2-1) has two ends connected to spring pieces (2-2) in the first direction. One end of each spring piece (2-2) in the first direction is connected to the pallet body (2-1), and the other end is connected to the corresponding pallet mounting part (2-3). A liner (1) has pallet mounting structures (1-1) formed on both sides in a first direction; each pallet mounting part (2-3) of the floating pallet (2) is connected to the corresponding pallet mounting structure (1-1); the liner (1) has a pallet opening (1-2) through which the pallet body (2-1) of the floating pallet (2) passes; the floating pallet is floatingly mounted on the liner; and Liquid cooling plate (3) is fixed on the top surface of the liner (1), and the bottom surface of the liquid cooling plate (3) is in contact with the top surface of the heat-conducting pad (4).
2. The liquid cooling heat dissipation structure according to claim 1, characterized in that, The tray mounting structure (1-1) is a snap-fit, and the tray mounting part (2-3) has snap-fit holes (2-4) that engage with the corresponding tray mounting structure (1-1); or The pallet mounting part (2-3) has a snap fastener, and the pallet mounting structure is a snap fastener hole that engages with the snap fastener of the corresponding pallet mounting part (2-3).
3. The liquid cooling heat dissipation structure according to claim 1, characterized in that, The bottom of the liquid cooling plate (3) includes a plurality of spacers (3-2), and the liquid cooling plate (3) is fixedly connected to the liner (1) through each of the spacers (3-2).
4. The liquid cooling heat dissipation structure according to claim 1, characterized in that, The bottom surface of the tray body (2-1) is connected to a thermally conductive and wear-resistant layer (7).
5. The liquid cooling heat dissipation structure according to claim 4, characterized in that, The thermally conductive and wear-resistant layer (7) includes a metal film (7-2) and a phase change material (7-1). The four sides of the metal film are bonded to the bottom surface of the tray body (2-1) to encapsulate the phase change material (7-1) between the metal film (7-2) and the bottom surface of the tray body (2-1).
6. The liquid-cooled heat dissipation structure according to any one of claims 1-5, characterized in that, The liner (1) is a one-piece structure formed by stamping; and / or The floating pallet (2) is an integral structure formed by stamping.
7. The liquid-cooled heat dissipation structure according to any one of claims 1 to 5, characterized in that, When the tray body (2-1) is not subjected to an external force toward the liquid cooling plate (3), the thermal pad (4) is in a pre-compressed state between the bottom surface of the groove structure of the tray body (2-1) and the liquid cooling plate.
8. The liquid-cooled heat dissipation structure according to any one of claims 1 to 5, characterized in that, A plurality of floating trays (2) are floatingly mounted on the liner (1), and the plurality of floating trays (2) are arranged along a second direction perpendicular to the first direction.
9. A heat dissipation mounting device for an optical module, characterized in that, The heat dissipation mounting device includes: The liquid cooling heat dissipation structure according to any one of claims 1-8; The optical module cage (6), together with the liner (1) of the liquid cooling structure and the floating tray (2), forms a space for the optical module to be inserted along the first direction. When the optical module is inserted into the space, the optical module lifts the tray body (2-1) toward the liquid cooling plate (3) to compress the thermal pad (4).
10. An optical communication device, comprising: The heat dissipation mounting device according to claim 9; as well as An optical module, which is adapted to be installed in the heat dissipation mounting device.