External heat dissipation module

Abstract

The utility model discloses an external heat dissipation module, include: for with electronic product internal pipeline communication pipe's adapter, circulating pump and water cooling row, the adapter is connected with the liquid inlet end, liquid outlet of water cooling row between respectively through first liquid cooling pipe, second liquid cooling pipe, the circulating pump is installed on the second liquid cooling pipe, the liquid outlet of water cooling row and the second liquid cooling pipe between are connected with a liquid cooling board, and the surface of the liquid cooling board opposite to the side of water cooling row is connected with the refrigeration surface of a refrigeration fin, the heat dissipation surface of refrigeration fin is contacted with a heat conduction sheet, and the one end of a plurality of interval arrangement's heat conduction pipe is connected with the heat conduction sheet, and the other end of each extends to the direction of away from the heat conduction sheet. The utility model can reduce the liquid temperature of circulating back electronic product internal liquid cooling pipeline, improve the heat dissipation effect to the inside of electronic product.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation in electronic products, and in particular to an external heat dissipation module. Background Technology

[0002] With the continuous advancement of technology, the processors in electronic products are becoming increasingly powerful, leading to a corresponding increase in power consumption and heat generation. The heat generated during operation far exceeds the cooling capacity of traditional air-cooling systems, easily causing overheating and frequency throttling, thus affecting the performance of electronic products. Consumer electronics products have high portability requirements, further compressing the heat dissipation space, making it difficult for traditional air-cooling systems to meet the cooling needs under these circumstances. Utility Model Content

[0003] The purpose of this invention is to provide an external heat dissipation module that can reduce the temperature of the liquid circulating back into the internal liquid cooling pipeline of electronic products, thereby improving the heat dissipation effect inside the electronic products.

[0004] To achieve the above objectives, the technical solution adopted by this utility model is as follows: an external heat dissipation module, comprising: an adapter for connecting to the internal piping of an electronic product, a circulation pump, and a water-cooling radiator. The adapter is connected to the inlet and outlet of the water-cooling radiator via a first liquid-cooling pipe and a second liquid-cooling pipe, respectively. The circulation pump is mounted on the second liquid-cooling pipe. A liquid-cooling plate is connected between the outlet of the water-cooling radiator and the second liquid-cooling pipe. The surface of the liquid-cooling plate opposite to the water-cooling radiator is in contact with the cooling surface of a cooling chip. The heat dissipation surface of the cooling chip is in contact with a heat-conducting plate. Several spaced heat-conducting pipes each have one end connected to the heat-conducting plate and the other end extending away from the heat-conducting plate.

[0005] The following are further improvements to the above technical solution: 1. In the above solution, the adapter is installed on the electronic product.

[0006] 2. In the above scheme, a first fan is installed on the outside of the water cooling radiator.

[0007] 3. In the above scheme, the cooling chip is a semiconductor cooling chip or a TEC cooling chip.

[0008] 4. In the above scheme, the liquid cooling plate is installed on the end face of the water cooling radiator near the adapter.

[0009] 5. In the above scheme, a second fan is provided on the side of the heat-conducting plate opposite to the liquid cooling plate, and several heat-conducting pipes are respectively provided on both sides of the second fan. At least two heat-conducting pipes on the same side are each fitted with a heat dissipation fin group on their outer side.

[0010] 6. In the above scheme, a water tank is provided on the second liquid cooling pipe and located between the liquid cooling plate and the circulating pump, and the water tank is located above the circulating pump.

[0011] Due to the application of the above technical solution, this utility model has the following advantages and effects compared with the prior art: This utility model features an external heat dissipation module. A liquid cooling plate connects the outlet end of the water-cooling radiator to the second liquid cooling pipe. The surface of the liquid cooling plate opposite to the water-cooling radiator contacts the cooling surface of a cooling chip. The heat dissipation surface of the cooling chip contacts a heat-conducting plate. Several spaced heat-conducting pipes each have one end connected to the heat-conducting plate and the other end extending away from it. This significantly improves the heat dissipation performance of electronic products and computers. Furthermore, by actively cooling the liquid in the external liquid cooling pipes, it further reduces the temperature of the liquid circulating back into the internal liquid cooling pipes of the electronic product, thus enhancing the heat dissipation effect inside the electronic product. Attached Figure Description

[0012] Appendix Figure 1 This is a schematic diagram of the external heat dissipation module in this utility model.

[0013] In the above attached diagram: 1. Adapter connector; 2. Circulation pump; 3. Water cooling radiator; 61. First liquid cooling pipe; 62. Second liquid cooling pipe; 10. First fan; 11. Liquid cooling plate; 12. Cooling chip; 13. Heat-conducting plate; 14. Heat-conducting pipe; 15. Water tank; 16. Second fan; 17. Heat dissipation fin assembly. Detailed Implementation

[0014] The present patent can be further understood through the specific embodiments given below, but they are not intended to limit the present patent.

[0015] Example 1: An external heat dissipation module includes: an adapter 1 for connecting to the internal piping of an electronic product, a circulation pump 2, and a water-cooled radiator 3. The adapter 1 is connected to the inlet and outlet of the water-cooled radiator 3 via a first liquid-cooling pipe 61 and a second liquid-cooling pipe 62, respectively. The circulation pump 2 is mounted on the second liquid-cooling pipe 62. A liquid-cooling plate 11 is connected between the outlet of the water-cooled radiator 3 and the second liquid-cooling pipe 62. The surface of the liquid-cooling plate 11 opposite to the water-cooled radiator 3 is in contact with the cooling surface of a cooling chip 12. The heat dissipation surface of the cooling chip 12 is in contact with a heat-conducting plate 13. Several spaced heat-conducting pipes 14 each have one end connected to the heat-conducting plate 13 and the other end extending away from the heat-conducting plate 13.

[0016] The aforementioned adapter 1 is installed on the laptop; a first fan 10 is installed on the outside of the aforementioned water cooling radiator 3; The aforementioned cooling chip 12 is a semiconductor cooling chip; the aforementioned liquid cooling plate 11 is installed on the end face of the water cooling radiator 3 near the adapter 1.

[0017] After the external liquid cooling pipes are connected to the internal liquid cooling module of the electronic product (water cooling connectors are plugged in), the water in the internal liquid cooling module of the electronic product is heated by heat-generating components such as the CPU and GPU. Driven by the circulating micro pump, it enters the water cooling radiator. Under the cooling of the axial fan, the water temperature drops and enters the liquid cooling plate. The liquid cooling plate is equipped with a TEC active cooling device. The cold side of the TEC is attached to the liquid cooling plate, and the hot side is attached to the heat pipe radiator. The cold side absorbs heat, causing the water temperature to drop further. The heat generated by the hot side is dissipated through the heat pipe radiator. The further cooled water enters the water tank for storage and is pumped into the internal liquid cooling module of the electronic product by the micro pump to form the final circulation.

[0018] Example 2: An external heat dissipation module includes: an adapter 1 for connecting to the internal piping of an electronic product, a circulation pump 2, and a water-cooled radiator 3. The adapter 1 is connected to the inlet and outlet of the water-cooled radiator 3 via a first liquid-cooling pipe 61 and a second liquid-cooling pipe 62, respectively. The circulation pump 2 is mounted on the second liquid-cooling pipe 62. A liquid-cooling plate 11 is connected between the outlet of the water-cooled radiator 3 and the second liquid-cooling pipe 62. The surface of the liquid-cooling plate 11 opposite to the water-cooled radiator 3 is in contact with the cooling surface of a cooling chip 12. The heat dissipation surface of the cooling chip 12 is in contact with a heat-conducting plate 13. Several spaced heat-conducting pipes 14 each have one end connected to the heat-conducting plate 13 and the other end extending away from the heat-conducting plate 13.

[0019] The aforementioned cooling chip 12 is a TEC cooling chip; the aforementioned liquid cooling plate 11 is installed on the end face of the water cooling radiator 3 near the adapter 1. A second fan 16 is provided on the side opposite to the liquid cooling plate 11 of the aforementioned heat-conducting plate 13. Several heat-conducting pipes 14 are respectively provided on both sides of the second fan 16. At least two heat-conducting pipes 14 located on the same side are each fitted with a heat dissipation fin group 17. A water tank 15 is provided on the second liquid cooling pipe 62 and between the liquid cooling plate 11 and the circulating pump 2. The water tank 15 is located above the circulating pump 2, which facilitates the initial injection and replenishment of liquid in the pipeline, eliminates the need for self-priming of the circulating pump, and facilitates the venting of gas in the pipeline, thereby improving the stability of various performance aspects during use.

[0020] Note: The liquid cooling plate, circulating pump, water cooling radiator, and cooling chip can all be purchased externally and are within the scope of existing technology, so this application will not elaborate on them.

[0021] When the above-mentioned external heat dissipation module is used, a liquid cooling plate 11 is connected between the liquid outlet end of the water cooling radiator 3 and the second liquid cooling pipe 62. The surface of the liquid cooling plate 11 opposite to the water cooling radiator 3 is in contact with the cooling surface of a cooling chip 12. The heat dissipation surface of the cooling chip 12 is in contact with a heat-conducting plate 13. Several spaced heat-conducting pipes 14 are connected at one end to the heat-conducting plate 13 and at the other end to extend away from the heat-conducting plate 13. On the basis of greatly improving the heat dissipation performance of the electronic product computer, the active cooling of the liquid in the external liquid cooling pipe further reduces the temperature of the liquid circulating back into the internal liquid cooling pipe of the electronic product, thereby improving the heat dissipation effect inside the electronic product.

[0022] The above embodiments are only for illustrating the technical concept and features of this utility model, and are intended to enable those skilled in the art to understand the content of this utility model and implement it accordingly. They should not be construed as limiting the scope of protection of this utility model. All equivalent changes or modifications made in accordance with the spirit and essence of this utility model should be included within the scope of protection of this utility model.

Claims

1. An external heat dissipation module, comprising: The adapter (1), circulation pump (2) and water cooling radiator (3) are used to connect to the internal pipes of electronic products. The adapter (1) is connected to the inlet and outlet of the water cooling radiator (3) through a first liquid cooling pipe (61) and a second liquid cooling pipe (62) respectively. The circulation pump (2) is installed on the second liquid cooling pipe (62). The characteristic is that a liquid cooling plate (11) is connected between the outlet of the water cooling radiator (3) and the second liquid cooling pipe (62). The surface of the liquid cooling plate (11) opposite to the water cooling radiator (3) is in contact with the cooling surface of a cooling chip (12). The heat dissipation surface of the cooling chip (12) is in contact with a heat-conducting plate (13). Several spaced heat-conducting pipes (14) are connected at one end to the heat-conducting plate (13) and at the other end of each pipe extend away from the heat-conducting plate (13).

2. The external heat dissipation module according to claim 1, characterized in that: The adapter (1) is installed on the electronic product.

3. The external heat dissipation module according to claim 1, characterized in that: A first fan (10) is installed on the outside of the water cooling radiator (3).

4. The external heat dissipation module according to claim 1, characterized in that: The cooling chip (12) is a semiconductor cooling chip or a TEC cooling chip.

5. The external heat dissipation module according to claim 1, characterized in that: The liquid cooling plate (11) is installed on the end face of the water cooling radiator (3) near the adapter (1).

6. The external heat dissipation module according to claim 1 or 5, characterized in that: A second fan (16) is provided on the side opposite to the liquid cooling plate (11) of the heat-conducting plate (13), and several heat-conducting pipes (14) are respectively provided on both sides of the second fan (16). At least two heat-conducting pipes (14) on the same side are fitted with a heat dissipation fin group (17) on their outer sides.

7. The external heat dissipation module according to claim 1, characterized in that: A water tank (15) is provided on the second liquid cooling pipe (62) and between the liquid cooling plate (11) and the circulating pump (2), and the water tank (15) is located above the circulating pump (2).

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