Cover plate and electronic device

Abstract

The utility model discloses a kind of cover plate and electronic equipment, cover plate includes glass substrate and heat dissipation column, glass substrate is equipped with heat dissipation area, multiple through holes are provided in heat dissipation area, multiple through holes are arranged at intervals and are respectively set through glass substrate;Heat dissipation column is filled in through hole by heat dissipation material and is formed, the number of heat dissipation column is set to multiple, multiple heat dissipation columns are respectively one-to-one corresponding and set in multiple through holes.The cover plate of the utility model, by filling heat dissipation material in through hole to form heat dissipation column, so that the heat of glass substrate inside can be conducted to glass substrate outside by heat dissipation column, heat dissipation column plays the role of conducting the heat inside electronic equipment to the outside of electronic equipment, effectively prevent heat accumulation in electronic equipment, so that heat conduction efficiency and heat dissipation effect are greatly improved, meet the heat dissipation demand of electronic equipment, improve user experience.

Description

Technical Field

[0001] This utility model belongs to the field of electronic equipment technology, specifically relating to a cover plate and an electronic device. Background Technology

[0002] As electronic devices become increasingly powerful, chip processing speeds continue to improve, and structural designs become more compact, the need for heat dissipation in electronic devices has become more urgent.

[0003] Currently, a common heat dissipation method for electronic devices is to attach graphene patches to the inside of the back cover, dispersing heat through thermal conductivity. However, the graphene patches are encapsulated inside the back cover, making it difficult for heat to be effectively dissipated to the outside of the electronic device. Furthermore, the interfacial thermal resistance between the graphene patches and the back cover (the resistance generated at the interface when heat is transferred from one material to another) further reduces thermal conductivity. In addition, some electronic devices use metal inserts to guide and transfer heat generated by the circuit board to accelerate heat dissipation. However, metal materials can easily cause signal shielding and increase the overall weight of the device, and heat still accumulates inside the electronic device. In summary, existing heat dissipation structures are insufficient to meet the heat dissipation requirements of electronic devices, and the accumulation of heat inside the devices affects user experience. Utility Model Content

[0004] In view of the above-mentioned defects or deficiencies, this utility model provides a cover plate and an electronic device, aiming to solve the technical problem that the existing heat dissipation structure is difficult to meet the heat dissipation requirements of electronic devices.

[0005] To achieve the above objectives, this utility model provides a cover plate for use in electronic devices, the cover plate comprising: A glass substrate with a heat dissipation area and multiple through holes arranged at intervals and penetrating the glass substrate. Heat dissipation columns are formed by filling through holes with heat dissipation material. The number of heat dissipation columns is set to multiple, and the multiple heat dissipation columns are respectively set in the multiple through holes.

[0006] In this embodiment of the invention, the heat dissipation material is copper, graphene, or thermally conductive ink.

[0007] In this embodiment of the invention, the diameter of the through hole is set as d, where d = 20μm~100μm.

[0008] In this embodiment of the invention, the thickness of the glass substrate is set as H, where H:d ≤ 10:1; And / or, in any two adjacent through holes, the distance between the center points of the two through holes is set to 60μm~300μm.

[0009] In this embodiment of the utility model, the width of the heat dissipation area is set as W1, and the width of the glass substrate is set as W2, where W1:W2 = 1 / 5 to 1 / 3; And / or, the length of the heat dissipation area is L1, and the length of the glass substrate is set to L2, where L1:L2 = 1 / 8 to 1 / 4.

[0010] In this embodiment of the invention, a stress buffer layer is provided on the wall of the through hole, and the stress buffer layer surrounds the outer periphery of the heat dissipation column.

[0011] In this embodiment of the invention, the stress buffer layer is formed by deposition or coating of graphene material; And / or, the thickness of the stress buffer layer is set to 0.1μm~0.3μm.

[0012] In this embodiment of the invention, the cover plate further includes a heat-conducting sheet, which is disposed on the glass substrate at a position corresponding to the heat dissipation area, and the heat-conducting sheet is located between the heat dissipation area and the motherboard of the electronic device.

[0013] In this embodiment of the invention, the heat-conducting sheet is attached to the glass substrate, and both the heat-conducting sheet and the heat dissipation column are made of non-metallic materials.

[0014] To achieve the above objectives, the present invention also provides an electronic device, which includes a cover plate as described above.

[0015] Through the above technical solutions, the cover plate and electronic device provided by the present invention have the following beneficial effects: In the technical solution of this utility model, the cover plate includes a glass substrate and heat dissipation columns. The glass substrate has multiple micro-holes and heat dissipation material is filled in the holes to form heat dissipation columns. The heat dissipation area where the heat dissipation columns are located corresponds to the main heat source of the electronic device, so that the heat inside the glass substrate can be conducted to the outside of the glass substrate through the heat dissipation columns. The heat dissipation columns play the role of conducting the heat inside the electronic device to the outside of the electronic device, effectively preventing heat from accumulating inside the electronic device, which greatly improves the thermal conductivity and heat dissipation effect, meets the heat dissipation needs of the electronic device, and enhances the user experience.

[0016] Other features and advantages of this invention will be described in detail in the following detailed description section. Attached Figure Description

[0017] The accompanying drawings are provided to further illustrate the embodiments of the present invention and form part of the specification. They are used together with the following detailed description to explain the embodiments of the present invention, but do not constitute a limitation thereof. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without any inventive effort. In the drawings: Figure 1 This is a schematic diagram of the structure of the cover plate and the main plate according to an embodiment of the present invention; Figure 2 This is a schematic diagram of the structure of the glass substrate in the cover plate according to an embodiment of the present invention; Figure 3 This is a cross-sectional structural schematic diagram of a cover plate according to an embodiment of the present utility model; Figure 4 This is an exploded structural diagram of the cover plate according to another embodiment of the present utility model; Figure 5 This is a cross-sectional view of the cover plate from one angle according to another embodiment of the present invention; Figure 6 This is a cross-sectional view of the cover plate from another perspective according to another embodiment of the present invention; Figure 7 This is a schematic diagram of the heat dissipation area on the glass substrate according to the first embodiment of the present invention; Figure 8 This is a schematic diagram of the heat dissipation area on the glass substrate according to the second embodiment of the present invention; Figure 9 This is a schematic diagram of the heat dissipation area on the glass substrate according to the third embodiment of the present invention; Figure 10 This is a schematic diagram of the heat dissipation area on the glass substrate according to the fourth embodiment of the present invention; Figure 11 This is a schematic diagram of the heat dissipation area on the glass substrate according to the fifth embodiment of the present invention; Figure 12 This is a schematic diagram of the heat dissipation area on the glass substrate according to the sixth embodiment of the present invention.

[0018] Explanation of reference numerals in the attached figures Detailed Implementation

[0019] The specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustration and explanation only and are not intended to limit the scope of this utility model.

[0020] The cover plate of this utility model is described below with reference to the accompanying drawings.

[0021] like Figures 1 to 6As shown, this utility model provides a cover plate for electronic devices. The cover plate includes a glass substrate 10 and heat dissipation pillars 20. The glass substrate 10 is provided with a heat dissipation area 11, and a plurality of through holes 111 are opened in the heat dissipation area 11. The plurality of through holes 111 are arranged at intervals and respectively penetrate the glass substrate 10. The heat dissipation pillars 20 are formed by filling the through holes 111 with heat dissipation material. The number of heat dissipation pillars 20 is set to a plurality, and the plurality of heat dissipation pillars 20 are respectively arranged in the plurality of through holes 111.

[0022] It should be noted that the cover plate of this utility model can be applied to electronic devices such as mobile phones and tablets. The cover plate can be used as the back cover of electronic devices. Furthermore, this utility model does not limit the types of electronic devices to which the cover plate is applied. The following will take the back cover of a mobile phone as an example for introduction.

[0023] Specifically, the glass substrate 10 of the cover plate is made of glass, which has the advantages of reducing signal shielding and interference, being easy to process and manufacture, and having a high-end texture. The glass substrate 10 is provided with a heat dissipation area 11, which is aligned with the main heat source inside the mobile phone and is located in an area that does not affect the antenna. Using TGV (through glass via) technology, multiple tiny through holes 111 are punched on the glass substrate 10 in the heat dissipation area. Each through hole 111 penetrates the glass substrate 10 and is filled with heat dissipation material to form a heat dissipation column 20. The through holes are small in diameter and numerous. The high hole density avoids signal obstruction and ensures heat dissipation capacity, so that the heat inside the glass substrate 10 can be conducted to the outside of the glass substrate 10 through the heat dissipation column 20. The heat dissipation column 20 plays the role of conducting the heat inside the electronic device to the outside of the electronic device, effectively preventing heat accumulation inside the electronic device, which greatly improves the thermal conductivity and heat dissipation effect, meets the heat dissipation requirements of the electronic device, and enhances the user experience.

[0024] Furthermore, the through-holes 111 on the glass substrate 10 are fabricated using the existing TGV (through glass via) technology. Specifically, through-holes 111 are fabricated on the glass substrate 10 by laser-induced acid or alkali etching, sandblasting, dry etching, or laser ablation. Heat dissipation pillars 20 are then formed in the through-holes 111 by filling them with heat dissipation material and then sintering and curing, followed by PVD (physical vapor deposition) seed layer plating and then electroplating, or by chemically plating a seed layer and then electroplating. This allows the heat dissipation pillars 20 to quickly conduct heat from the inside of the glass substrate 10 to the outside, effectively preventing heat accumulation inside the electronic device and significantly improving the heat dissipation effect.

[0025] In one embodiment of this utility model, the heat dissipation material is copper, that is, copper is filled into the through hole 111 to form a heat dissipation column 20. The heat dissipation column 20 made of copper has high thermal conductivity, so that the thermal conductivity of the heat dissipation column 20 can reach 400W / m·K, which is 200 times higher than the thermal conductivity of the glass substrate 10 (less than 2W / m·K), thus greatly improving the heat dissipation effect.

[0026] In another embodiment of this utility model, the heat dissipation material is graphene, that is, by filling the through hole 111 with graphene to form a heat dissipation column 20. The heat dissipation column 20 of the graphene component has extremely strong thermal conductivity, which enables the heat dissipation column 20 to quickly conduct the heat inside the glass substrate 10 to the outside, greatly accelerating the heat conduction rate.

[0027] In another embodiment of this utility model, the heat dissipation material is a thermally conductive ink material, that is, the heat dissipation column 20 is formed by filling the through hole 111 with thermally conductive ink. The thermally conductive ink has good thermal conductivity and fluidity, which makes it easy to fill the through hole 111 with thermally conductive ink to form the heat dissipation column 20, thereby improving the processing convenience and the heat dissipation effect.

[0028] Ideally, using non-metallic materials such as graphene and thermally conductive ink for non-metallic filling can better avoid interfering with antenna signals.

[0029] In the embodiments of this utility model, such as Figures 7 to 10 As shown, the aperture size of the through hole 111 is set to d, where d = 20μm~100μm. Setting the aperture size of the through hole 111 to 20μm~100μm allows the glass substrate 10 to have the advantages of high structural strength, easy processing of the through hole 111, and good heat dissipation after filling with heat dissipation material. Furthermore, the micron-level aperture also ensures the surface flatness and tactile feel of the glass substrate 10.

[0030] Furthermore, the shape of the through hole 111 is not limited in this utility model, such as... Figure 7 As shown, the through hole 111 can be a circular through hole, and the diameter of the through hole 111 can be set to 20μm~100μm; for example Figure 8 As shown, the through hole 111 can be set as a square through hole, and the side length of the through hole 111 can be set to 20μm~100μm; for example Figure 9 As shown, the through hole 111 can be set as an elliptical through hole, with both the major axis and minor axis dimensions set to 20μm~100μm, and the major axis dimension being larger than the minor axis dimension; for example Figure 10As shown, the through hole 111 can be a rectangular through hole, with both the long side and the short side of the through hole 111 being 20μm to 100μm, and the long side being larger than the short side. Furthermore, the shape of the through hole 111 is not limited to the above-mentioned circular, square, elliptical, and rectangular shapes. The through hole 111 can also be other shapes. It is understood that as long as the aperture size of the through hole 111 is between 20μm and 100μm, it should also fall within the protection scope of this application.

[0031] In the embodiments of this utility model, such as Figure 3 and Figure 6 As shown, the thickness of the glass substrate 10 is set to H, where H:d ≤ 10:1. That is, the ratio of the thickness of the glass substrate 10 to the aperture of the through hole 111 is less than 10:1 or equal to 10:1. This ensures the structural strength of the glass substrate 10 and facilitates the filling of heat dissipation material into the through hole 111. Furthermore, the heat dissipation column 20 formed by the heat dissipation material can quickly conduct heat, thus improving the heat dissipation efficiency.

[0032] In this embodiment of the invention, the distance between the center points of any two adjacent through holes 111 is set to 60μm~300μm, such as... Figures 7 to 10 As shown, multiple through holes 111 are provided in the heat dissipation area 11 at intervals. The distance between the center points of two adjacent through holes 111 is set as c, where c = 60μm~300μm. This makes the spacing between the multiple through holes 111 reasonable, which plays a role in rapid heat conduction and effectively prevents heat accumulation.

[0033] In the embodiments of this utility model, such as Figure 2 As shown, the width of the heat dissipation area 11 is set as W1, and the width of the glass substrate 10 is set as W2, where W1:W2 = 1 / 5 to 1 / 3. Specifically, the glass substrate 10 is rectangular, and the dimension of the heat dissipation area 11 in the width direction of the glass substrate 10 is set as the width dimension of the heat dissipation area 11. Furthermore, in the width direction of the glass substrate 10, the ratio of the width dimension of the heat dissipation area 11 to the width dimension of the glass substrate 10 is 1 / 5 to 1 / 30, which ensures the structural strength of the glass substrate 10 and improves the heat dissipation effect.

[0034] In the embodiments of this utility model, such as Figure 2 As shown, the length of the heat dissipation area 11 is L1, and the length of the glass substrate 10 is L2, where L1:L2 = 1 / 8 to 1 / 4. Specifically, the glass substrate 10 is rectangular, and the length of the heat dissipation area 11 along the length of the glass substrate 10 is the length of the heat dissipation area 11. Furthermore, the ratio of the length of the heat dissipation area 11 to the width of the glass substrate 10 along the length of the glass substrate 10 is 1 / 8 to 1 / 4, which ensures both the structural strength of the glass substrate 10 and improves the heat dissipation effect.

[0035] Furthermore, the shape of the heat dissipation area 11 is not limited in this invention, such as... Figure 1 , Figure 2 and Figure 4 As shown, the shape of the heat dissipation area 11 can be set to a geometric shape, such as a rectangle, and multiple through holes 111 are arranged at intervals within the heat dissipation area 11 so that the heat dissipation pillars 20 within the through holes 111 can conduct heat; as Figure 11 As shown, a pattern may be provided on the glass substrate 10, the shape of the heat dissipation area 11 is consistent with the shape of the pattern, and through holes 111 are arranged at intervals on the pattern; as shown Figure 12 As shown, multiple through holes 111 are arranged at intervals to form a pattern, and the pattern formed by the multiple through holes 111 is a heat dissipation area 11. It can be understood that as long as the glass substrate 10 has a heat dissipation area 11 with multiple through holes 111 and the through holes 111 are filled with heat dissipation material, it should also fall within the protection scope of this application.

[0036] In the embodiments of this utility model, such as Figures 4 to 6 As shown, a stress buffer layer 30 is provided on the wall of the through hole 111, and the stress buffer layer 30 surrounds the outer periphery of the heat dissipation column 20. Specifically, due to the different materials of the glass substrate 10 and the heat dissipation column 20, mechanical stress is generated between the glass substrate 10 and the heat dissipation column 20 due to the inconsistency of their thermal expansion coefficients. The stress buffer layer 30 is located between the glass substrate 10 and the heat dissipation column 20 to buffer the mechanical stress and to improve the interfacial adhesion between the glass substrate 10 and the heat dissipation column 20, thereby improving the structural stability and thermal conductivity.

[0037] Furthermore, the stress buffer layer 30 is formed by deposition or coating of graphene material. The graphene stress buffer layer 30 can effectively buffer mechanical stress and improve structural stability. In addition, the graphene stress buffer layer 30 has good thermal conductivity, which accelerates the heat conduction rate between the glass substrate 10 and the heat dissipation column 20, reduces the interfacial thermal resistance, and further improves the heat dissipation effect.

[0038] In this embodiment of the invention, the thickness of the stress buffer layer 30 is set to 0.1 μm to 0.3 μm, such as... Figure 6 As shown, the thickness of the stress buffer layer 30 is set to... , =0.1μm~0.3μm, which facilitates the deposition or coating of graphene on the wall of the through hole 111 to form a stress buffer layer 30, improving the ease of processing, and effectively buffering mechanical stress and improving thermal conductivity.

[0039] In this embodiment of the invention, the cover plate further includes a heat-conducting sheet 40, which is disposed on the glass substrate 10 at a position corresponding to the heat dissipation area 11, and is located between the heat dissipation area 11 and the motherboard 200 of the electronic device. Figure 1 , Figure 3 and Figure 6 As shown, the cover plate is used in electronic devices and serves as the back cover of the electronic devices. The heat-conducting sheet 40 is disposed on the glass substrate 10, and the heat dissipation area 11, the heat-conducting sheet 40, and the main board 200 of the electronic device are stacked in sequence. Since the main board 200 is the main heat source of the electronic device, by placing the heat-conducting sheet 40 between the main board 200 and the heat dissipation area 11, the heat-conducting sheet 40 can quickly conduct the heat generated by the main board 200 to the heat dissipation area 11, and quickly conduct it to the outside of the electronic device through the multiple heat dissipation columns 20 in the heat dissipation area 11, effectively preventing heat from accumulating inside the electronic device and meeting the high heat dissipation requirements of the electronic device.

[0040] Furthermore, the heat-conducting sheet 40 is attached to the glass substrate 10. Both the heat-conducting sheet 40 and the heat sink 20 are made of non-metallic materials, such as graphene or thermally conductive ink. More preferably, the material of the heat-conducting sheet 40 is the same as the heat dissipation material, preventing interfacial thermal resistance between the heat-conducting sheet 40 and the heat sink 20. This allows the heat-conducting sheet 40 to be in direct contact with the heat sink 20, further improving heat conduction efficiency.

[0041] In addition, this utility model also provides an electronic device, which includes a cover plate according to the above description, and the specific structure of the cover plate refers to the above embodiments. Since the electronic device adopts all the technical solutions of the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here.

[0042] In the description of this utility model, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0043] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0044] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0045] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A cover plate for use in electronic devices, characterized in that, The cover plate includes: A glass substrate (10) is provided with a heat dissipation area (11), and a plurality of through holes (111) are provided in the heat dissipation area (11). The plurality of through holes (111) are arranged at intervals and respectively penetrate the glass substrate (10). Heat dissipation column (20), the heat dissipation column (20) is formed by filling the through hole (111) with heat dissipation material, and the number of heat dissipation columns (20) is set to multiple, and the multiple heat dissipation columns (20) are respectively arranged in the multiple through holes (111).

2. The cover plate according to claim 1, characterized in that, The heat dissipation material is made of copper, graphene, or thermally conductive ink.

3. The cover plate according to claim 1, characterized in that, The aperture size of the through hole (111) is set as d, where d = 20μm~100μm.

4. The cover plate according to claim 3, characterized in that, The thickness dimension of the glass substrate (10) is set as H, where H:d≤10:1; And / or, in any two adjacent through holes (111), the distance between the center points of the two through holes (111) is set to 60μm~300μm.

5. The cover plate according to claim 1, characterized in that, The width of the heat dissipation area (11) is set as W1, and the width of the glass substrate (10) is set as W2, where W1:W2 = 1 / 5 to 1 / 3; And / or, the length of the heat dissipation area (11) is L1, and the length of the glass substrate (10) is L2, where L1:L2 = 1 / 8 to 1 / 4.

6. The cover plate according to any one of claims 1 to 5, characterized in that, The through hole (111) has a stress buffer layer (30) on its wall, and the stress buffer layer (30) surrounds the outer periphery of the heat dissipation column (20).

7. The cover plate according to claim 6, characterized in that, The stress buffer layer (30) is formed by deposition or coating of graphene material; And / or, the thickness of the stress buffer layer (30) is set to 0.1μm~0.3μm.

8. The cover plate according to any one of claims 1 to 5, characterized in that, The cover plate also includes a heat-conducting sheet (40), which is disposed on the glass substrate (10) at a position corresponding to the heat dissipation area (11), and the heat-conducting sheet (40) is located between the heat dissipation area (11) and the motherboard (200) of the electronic device.

9. The cover plate according to claim 8, characterized in that, The heat-conducting sheet (40) is attached to the glass substrate (10), and both the heat-conducting sheet (40) and the heat dissipation column (20) are made of non-metallic materials.

10. An electronic device, characterized in that, The electronic device includes a cover plate according to any one of claims 1 to 9.

Images