Power supply for anti-inrush device

Abstract

This invention provides a power supply for an anti-power fluctuation device, including a mounting base and a power supply body. The mounting base has a top plate and a bottom plate facing each other. The top plate has an upper heat dissipation mechanism, and the bottom plate has a lower heat dissipation mechanism. The power supply body is located between the top plate and the bottom plate. The top of the power supply body is in thermal contact with the upper heat dissipation mechanism, and the bottom of the power supply body is in thermal contact with the lower heat dissipation mechanism. This invention, through the configuration of the two heat dissipation mechanisms, adds two heat dissipation paths—one at the top and one at the bottom—to the power supply body, creating a highly efficient three-dimensional heat dissipation system. This design effectively improves the heat dissipation capacity of the power supply body, significantly reduces the internal operating temperature of the power supply body, thereby helping to delay the aging of energy storage units such as supercapacitors inside the power supply body, extending the service life of core components, and ensuring the reliability of the entire power supply under long-term operating conditions.

Description

Technical Field

[0001] This utility model relates to the field of anti-power fluctuation equipment technology, and more specifically, to a power supply for an anti-power fluctuation device. Background Technology

[0002] The content in this section only provides background information related to this utility model and may not constitute prior art.

[0003] The power supply for anti-voltage fluctuation devices is a key device that provides backup power for industrial anti-voltage fluctuation modules. It integrates energy storage units (such as supercapacitors) and power conversion circuits, and can quickly release energy when the power grid experiences a brief voltage drop, ensuring the continuity of production.

[0004] Currently, these power supplies are generally encased in metal shells and rely on heat dissipation channels on the surface of the metal shells for natural heat dissipation. However, with the continuous increase in power density, this single heat dissipation method is no longer sufficient, leading to heat accumulation inside the power supply. Core components operate in a high-temperature environment for extended periods, which not only accelerates the aging of energy storage units and shortens their lifespan, but also directly affects the reliability of the power supply during power fluctuations, posing a safety hazard. Summary of the Invention

[0005] In view of this, the purpose of this utility model is to provide a power supply for an anti-power fluctuation device, so as to overcome at least the above-mentioned technical problems caused by the existing anti-power fluctuation device power supply relying solely on its own heat dissipation channel for natural heat dissipation.

[0006] The objective of this utility model is achieved through the following technical solution: This utility model provides a power supply for an anti-power fluctuation device, including a mounting base and a power supply body; The mounting base is provided with a top plate and a bottom plate that are opposite each other; the top plate is provided with an upper heat dissipation mechanism, and the bottom plate is provided with a lower heat dissipation mechanism; The power supply body is located between the top plate and the bottom plate; the top of the power supply body is in thermal contact with the upper heat dissipation mechanism, and the bottom of the power supply body is in thermal contact with the lower heat dissipation mechanism.

[0007] Optionally, the upper heat dissipation mechanism includes an upper heat dissipation plate and an upper thermal conductive pad arranged sequentially from top to bottom; the lower heat dissipation mechanism includes a lower heat dissipation plate and a lower thermal conductive pad arranged sequentially from bottom to top. The top and bottom of the power supply body are in thermal contact with the upper thermal pad and the lower thermal pad, respectively.

[0008] Optionally, both the upper thermal pad and the lower thermal pad are made of insulating thermally conductive silicone material.

[0009] Optionally, a driving mechanism is provided between the top plate and the mounting base. The driving mechanism is configured to drive the top plate closer to or away from the bottom plate to clamp and fix the power supply body or release the power supply body.

[0010] Optionally, the drive mechanism includes a lead screw; the lead screw is rotatably mounted on the mounting base along the arrangement direction of the top plate and the bottom plate; The lead screw passes through the top plate and is threadedly connected to the top plate.

[0011] Optionally, the mounting base is provided with an inwardly recessed first mounting groove, the bottom end of the lead screw is rotatably mounted on the bottom of the first mounting groove, and the top end of the lead screw passes through the top of the first mounting groove and is connected to a knob.

[0012] Optionally, the top of the mounting base is provided with a downwardly recessed clearance groove, and the knob is located within the clearance groove.

[0013] Optionally, the mounting base is provided with a magnetic attraction component for fixing it to the magnetic mounting plane.

[0014] Optionally, the mounting base is provided with an inwardly recessed second mounting groove; The magnetic component is detachably installed in the second mounting slot.

[0015] Optionally, the top plate and the bottom plate are both located on the front side of the mounting base; the magnetic suction assembly is located on the rear side of the mounting base.

[0016] The technical solution of this utility model embodiment has at least the following advantages and beneficial effects: This invention, through the configuration of two heat dissipation mechanisms at the top and bottom, adds two heat dissipation paths to the power supply body, creating a highly efficient three-dimensional heat dissipation system. This design effectively improves the heat dissipation capacity of the power supply body, significantly reduces the internal operating temperature, thereby helping to delay the aging of energy storage units such as supercapacitors inside the power supply body, extending the service life of core components, and ensuring the reliability of the entire power supply under long-term operating conditions. Attached Figure Description

[0017] Figure 1 A schematic diagram of the power supply for the anti-power fluctuation device provided in an embodiment of this utility model; Figure 2 for Figure 1 A schematic diagram of the power supply for the anti-power fluctuation device is shown from another perspective; Figure 3 for Figure 1 A cross-sectional view of the power supply used in the anti-disruption device is shown.

[0018] Icons: 10-Mounting base, 11-First mounting slot, 12-Allowing slot, 13-Second mounting slot, 20-Power supply body, 30-Top plate, 40-Bottom plate, 50-Upper heat dissipation mechanism, 51-Upper heat sink, 52-Upper thermal pad, 60-Lower heat dissipation mechanism, 61-Lower heat sink, 62-Lower thermal pad, 70-Drive mechanism, 71-Lead screw, 72-Knob, 80-Magnetic assembly. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of this utility model clearer, the technical solutions of this utility model will be clearly and completely described below in conjunction with specific embodiments. The same reference numerals in the accompanying drawings represent the same components. It should be noted that the described embodiments are only some, not all, of the embodiments of this utility model. All other embodiments obtained by those skilled in the art based on the described embodiments of this utility model without creative effort are within the scope of protection of this utility model.

[0020] Compared to the embodiments shown in the accompanying drawings, feasible embodiments within the scope of protection of this utility model may have fewer components, have other components not shown in the drawings, different components, components with different arrangements, or components with different connections, etc. Furthermore, two or more components in the drawings may be implemented in a single component, or a single component shown in the drawings may be implemented as multiple separate components.

[0021] Unless otherwise defined, the technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this invention pertains. The terms "first," "second," and similar terms used in this specification and claims do not indicate any order, quantity, or importance, but are merely used to distinguish different components.

[0022] Please refer to Figures 1 to 3 As shown, an embodiment of this utility model provides a power supply for an anti-power fluctuation device.

[0023] According to embodiments of the present invention, such as Figure 1 As shown, the power supply for the anti-disruption device includes a mounting base 10 and a power supply body 20.

[0024] The mounting base 10 has a top plate 30 and a bottom plate 40 that are vertically opposed to each other. The top plate 30 has an upper heat dissipation mechanism 50 for heat dissipation, and the bottom plate 40 has a lower heat dissipation mechanism 60 for heat dissipation. The power supply body 20 is disposed between the top plate 30 and the bottom plate 40. The top of the power supply body 20 is in thermal contact with the upper heat dissipation mechanism 50, and the bottom of the power supply body 20 is in thermal contact with the lower heat dissipation mechanism 60. Under normal conditions, the power supply body 20 is clamped and fixed by the upper heat dissipation mechanism 50 and the lower heat dissipation mechanism 60.

[0025] According to an embodiment of this utility model, by configuring two heat dissipation mechanisms at the top and bottom, two heat dissipation paths are added to the power supply body 20, creating a highly efficient three-dimensional heat dissipation system. This design can effectively improve the heat dissipation capacity of the power supply body 20, significantly reduce the internal operating temperature of the power supply body 20, thereby helping to delay the aging of energy storage units such as supercapacitors inside the power supply body 20, extend the service life of core components, and ensure the reliability of the entire power supply under long-term operating conditions.

[0026] In a preferred embodiment, both the top plate 30 and the bottom plate 40 can be disposed on the front side of the mounting base 10 to optimize the structural design. Meanwhile, referring to... Figure 3 As shown, a heat dissipation gap is reserved between the rear side of the power supply body 20 located between the top plate 30 and the bottom plate 40 and the front side of the mounting base 10 to reduce the risk of excessive local temperature caused by the contact between the power supply body 20 and the mounting base 10.

[0027] In some possible embodiments, refer to Figure 3 As shown, the upper heat dissipation mechanism 50 includes an upper heat dissipation plate 51 and an upper thermal conductive pad 52 arranged sequentially from top to bottom. The lower heat dissipation mechanism 60 includes a lower heat dissipation plate 61 and a lower thermal conductive pad 62 arranged sequentially from bottom to top. Both the upper heat dissipation plate 51 and the lower heat dissipation plate 61 are heat dissipation plates with heat dissipation fins to improve the heat dissipation capacity of each plate.

[0028] The top and bottom of the power supply body 20 are in thermal contact with the upper thermal pad 52 and the lower thermal pad 62, respectively. Under normal conditions, the power supply body 20 is clamped and fixed between the upper and lower thermal pads.

[0029] By employing a heat dissipation mechanism consisting of a heat sink and a thermal pad, on the one hand, the heat sink can quickly conduct and diffuse heat; on the other hand, the soft thermal pad can fill the air gap between the power supply body 20 and the corresponding heat sink, thereby ensuring a tight fit between the heat dissipation contact surfaces and minimizing contact thermal resistance. This allows the aforementioned three-dimensional heat dissipation system to achieve better heat dissipation capabilities.

[0030] Furthermore, both the upper thermal pad 52 and the lower thermal pad 62 can be made of insulating thermally conductive silicone material. This design not only improves the heat dissipation efficiency of each thermal pad but also provides electrical isolation and safety protection, helping to prevent potential electrical risks from the power supply body 20 from being conducted through the heat dissipation mechanism, thus improving the overall safety of the power supply during installation, use, and maintenance.

[0031] In some possible embodiments, refer to Figure 1As shown, a drive mechanism 70 is provided between the top plate 30 and the mounting base 10. The drive mechanism 70 is configured to drive the top plate 30 closer to or further away from the base plate 40 to clamp and fix the power supply body 20 or release the power supply body 20.

[0032] Specifically, when the drive mechanism 70 drives the top plate 30 closer to the bottom plate 40, the upper thermal pad 52 in the upper heat dissipation mechanism 50 applies downward pressure toward the bottom plate 40 to the power supply body 20, thereby reliably clamping and fixing the power supply body 20 between the upper thermal pad 52 of the upper heat dissipation mechanism 50 and the lower thermal pad 62 of the lower heat dissipation mechanism 60. Conversely, when the drive mechanism 70 drives the top plate 30 away from the bottom plate 40, the upper thermal pad 52 in the upper heat dissipation mechanism 50 moves away from the power supply body 20, thereby releasing the clamped and fixed power supply body 20, allowing the power supply body 20 to be removed from between the top plate 30 and the bottom plate 40.

[0033] By setting up the drive mechanism 70, the top plate 30 can be actively moved to clamp or release the power supply body 20. This not only ensures the stability of the power supply body 20 in contact with the upper and lower heat dissipation mechanisms under vibration, preventing a decrease in heat dissipation effect due to loosening, but also makes the installation and disassembly of the power supply body 20 quick and convenient, greatly improving the maintainability of the product.

[0034] In a preferred embodiment, the drive mechanism 70 may specifically be a threaded transmission mechanism. Specifically, refer to... Figure 3 As shown, the drive mechanism 70 includes a lead screw 71. The lead screw 71 is rotatably mounted on the mounting base 10 along the arrangement direction of the top plate 30 and the bottom plate 40. The lead screw 71 passes through the top plate 30 and is threadedly connected to the top plate 30.

[0035] With this setup, simply rotating the lead screw 71 allows the top plate 30 to move axially along the lead screw 71 based on the threaded transmission principle. By employing a threaded transmission mechanism, stepless adjustment of the top plate 30's position can be achieved. Furthermore, utilizing the self-locking characteristic of the threaded transmission, the position of the top plate 30 can be reliably locked, enhancing the stability of the power supply body 20 after it is clamped and fixed.

[0036] Furthermore, continue to refer to Figure 3 As shown, the mounting base 10 has an inwardly recessed first mounting groove 11 on its front side. The bottom end of the lead screw 71 is rotatably mounted on the bottom of the first mounting groove 11, and the top end of the lead screw 71 passes through the top of the first mounting groove 11 and is connected to a knob 72.

[0037] By mounting the lead screw 71 within the inwardly recessed first mounting groove 11, the compactness and aesthetics of the structure are improved. The knob 72 allows the operator to easily drive the lead screw 71 by rotating it, optimizing the operator's experience.

[0038] Furthermore, the top of the mounting base 10 is provided with a downwardly recessed clearance groove 12, within which the knob 72 is located. This design helps to make the top profile of the mounting base 10 flatter, while also protecting the knob 72 to some extent and facilitating the placement of the power supply within a compact cabinet.

[0039] In some possible embodiments, refer to Figure 2 As shown, the mounting base 10 may also be provided with a magnetic attraction component 80 for fixing it to the magnetic mounting plane. Preferably, the magnetic attraction component 80 includes a permanent magnet.

[0040] Considering that power supplies for anti-power fluctuation devices are typically installed inside server racks, and server racks are usually made of magnetic steel plates, the magnetic component 80 greatly simplifies the process of fixing the mounting base 10 and even the entire power supply inside the server rack.

[0041] Continue to refer to Figure 3 As shown, with the top plate 30 and bottom plate 40 both located on the front side of the mounting base 10, the magnetic assembly 80 can be located on the rear side of the mounting base 10. This design achieves a clear division of functional areas, making the entire power supply structure more compact and rationally laid out.

[0042] Furthermore, the mounting base 10, especially its rear side, is provided with an inwardly recessed second mounting groove 13. The magnetic assembly 80 is detachably installed in the second mounting groove 13. Preferably, when the magnetic assembly 80 is installed in the second mounting groove 13, the magnetic assembly 80 and the rear side of the mounting base 10 are in the same plane, so that the mounting base 10 can be more easily magnetically fixed to the cabinet by means of the magnetic assembly 80.

[0043] By detachably mounting the magnetic assembly 80 within the second mounting slot 13, it is convenient to flexibly replace the magnetic assembly 80 as needed. For example, the magnetic assembly 80 can be fixedly mounted within the second mounting slot 13 using fasteners such as screws.

[0044] In some possible embodiments, refer to Figure 3 As shown, both the top plate 30 and the bottom plate 40 have limiting grooves on opposite sides that are adapted to the power supply body 20. Specifically, the top of the power supply body 20 is secured within the limiting groove of the top plate 30, and the bottom of the power supply body 20 is secured within the limiting groove of the bottom plate 40. This arrangement further enhances the stability of the power supply body 20 after it is clamped and fixed by the two cooling mechanisms.

[0045] The above are merely preferred embodiments of this utility model and are not intended to limit the scope of this utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A power supply for an anti-power fluctuation device, characterized in that, Includes mounting base and power supply unit; The mounting base is provided with a top plate and a bottom plate that are opposite each other; the top plate is provided with an upper heat dissipation mechanism, and the bottom plate is provided with a lower heat dissipation mechanism; The power supply body is located between the top plate and the bottom plate; the top of the power supply body is in thermal contact with the upper heat dissipation mechanism, and the bottom of the power supply body is in thermal contact with the lower heat dissipation mechanism.

2. The power supply for the anti-power fluctuation device according to claim 1, characterized in that, The upper heat dissipation mechanism includes an upper heat dissipation plate and an upper thermal conductive pad arranged sequentially from top to bottom; the lower heat dissipation mechanism includes a lower heat dissipation plate and a lower thermal conductive pad arranged sequentially from bottom to top. The top and bottom of the power supply body are in thermal contact with the upper thermal pad and the lower thermal pad, respectively.

3. The power supply for the anti-power fluctuation device according to claim 2, characterized in that, Both the upper and lower thermal pads are made of insulating and thermally conductive silicone material.

4. The power supply for the anti-power fluctuation device according to claim 1, characterized in that, A driving mechanism is provided between the top plate and the mounting base. The driving mechanism is configured to drive the top plate closer to or away from the bottom plate to clamp and fix the power supply body or release the power supply body.

5. The power supply for the anti-power fluctuation device according to claim 4, characterized in that, The driving mechanism includes a lead screw; the lead screw is rotatably mounted on the mounting base along the arrangement direction of the top plate and the bottom plate; The lead screw passes through the top plate and is threadedly connected to the top plate.

6. The power supply for the anti-power fluctuation device according to claim 5, characterized in that, The mounting base is provided with an inwardly recessed first mounting groove. The bottom end of the lead screw is rotatably mounted on the bottom of the first mounting groove, and the top end of the lead screw passes through the top of the first mounting groove and is connected to a knob.

7. The power supply for the anti-power fluctuation device according to claim 6, characterized in that, The top of the mounting base is provided with a downwardly recessed clearance groove, and the knob is located in the clearance groove.

8. The power supply for the anti-power fluctuation device according to claim 1, characterized in that, The mounting base is provided with a magnetic suction component for fixing it to the magnetic mounting plane.

9. The power supply for the anti-power fluctuation device according to claim 8, characterized in that, The mounting base is provided with an inwardly recessed second mounting groove; The magnetic component is detachably installed in the second mounting slot.

10. The power supply for the anti-power fluctuation device according to claim 8, characterized in that, Both the top plate and the bottom plate are located on the front side of the mounting base; the magnetic suction assembly is located on the rear side of the mounting base.

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