A light emitting device

Abstract

The utility model discloses a light emitting device, light emitting device includes device support, the front of device support is provided with a plurality of cup -shaped structure, a plurality of cup -shaped structure includes drive cup and light emitting cup, drive cup is provided with the fixed crystal area of drive IC chip in, the number of light emitting cup is more than one, and the fixed crystal area of at least one light emitting chip is provided in light emitting cup. Still include light emitting chip and drive IC chip: light emitting chip sets up in light emitting cup, drive IC chip sets up in drive cup. The light emitting device provided by the utility model sets up drive cup and light emitting cup on device support, sets up drive IC chip in drive cup, sets up at least one light emitting chip in light emitting cup, improves the control precision of drive IC chip to light emitting chip, realizes better light mixing light -emitting effect.

Description

Technical Field

[0001] This utility model relates to the field of light-emitting device technology, and in particular to a light-emitting device. Background Technology

[0002] Against the backdrop of the ever-increasing demand for efficient, energy-saving, and intelligent living environments in modern society, the fields of smart lighting and healthy lighting have also put forward higher requirements, and light-emitting devices with multi-color temperature adjustment functions have become the core product solutions in this field.

[0003] Currently, mainstream lighting devices mainly employ integrated or discrete solutions using RGB three-color chips and driver IC chips. However, both of these solutions have limitations in terms of flexibility and adaptability. Regardless of whether it's an integrated or discrete solution, the RGB three-color chips are always integrated into a single package, leading to crosstalk between them and resulting in poor light mixing and ultimately poor light output. Furthermore, when the driver IC chip is integrated with the RGB three-color chips, the driver IC chip's control precision over the RGB chips is insufficient, similarly resulting in inadequate multi-color temperature adjustment capabilities and poor light output. Utility Model Content

[0004] The purpose of this utility model is to overcome the shortcomings of the prior art. This utility model provides a light-emitting device, in which a driving cup and a light-emitting cup are set on the device support. A driving IC chip is set in the driving cup, and at least one light-emitting chip is set in the light-emitting cup. This improves the control accuracy of the driving IC chip on the light-emitting chip and achieves a better light mixing and output effect.

[0005] This utility model provides a light-emitting device, which includes a device support. The front side of the device support is provided with a plurality of cup-shaped structures, and the plurality of cup-shaped structures include a driving cup and a light-emitting cup. The drive cup contains a die-bonding area for the drive IC chip; The number of light-emitting cups is one or more, and the light-emitting cup is provided with a die-bonding region for at least one light-emitting chip.

[0006] Furthermore, the length of the driving cup in the first preset direction and the length of the light-emitting cup in the first preset direction The range of values ​​for the ratio is: 0.1 < ≤1.

[0007] Furthermore, the length of the light-emitting cup in the second predetermined direction The value range is: 0.7mm < <1.5mm; The first preset direction and the second preset direction are orthogonal on the plane where the front of the device bracket is located.

[0008] Furthermore, the length of the light-emitting cup in the second predetermined direction The length of the device support in the second predetermined direction The range of values ​​for the ratio is: 0.2 ≤ ≤0.6.

[0009] Furthermore, in any of the cup-shaped structures, the included angle between the inner wall of the cup and the bottom of the cup... The range of values ​​is: 90° < <120°.

[0010] Furthermore, a baffle wall is provided between any two adjacent cup-shaped structures, and the top surface of the baffle wall is flush with the rim of the cup-shaped structure.

[0011] Furthermore, the device support is provided with a first pad, a second pad, and a third pad; A portion of the first pad is disposed within the driving cup, and another portion of the first pad is disposed within the light-emitting cup; The second pad is disposed inside the light-emitting cup, and the second pad extends out from the edge of the device bracket to form a light-emitting chip control pin; The third pad is disposed inside the drive cup, and the third pad extends out from the edge of the device bracket to form a power pin, a data input pin, and a data output pin.

[0012] Furthermore, at least two light-emitting cups are arranged adjacent to each other, and the second pads in the adjacent light-emitting cups are common.

[0013] Furthermore, the light-emitting device also includes a light-emitting chip and a driver IC chip: The light-emitting chip is disposed in the light-emitting cup; The driver IC chip is disposed in the driver cup.

[0014] Furthermore, the light-emitting cup is filled with a phosphor layer, which covers the light-emitting chip in the light-emitting cup.

[0015] This invention provides a light-emitting device, which includes a driver cup and a light-emitting cup on a device support. The driver cup contains a die-bonding area for a driver IC chip, while the light-emitting cup contains a die-bonding area for at least one light-emitting chip. This design effectively solves the problem of light crosstalk between light-emitting chips of different colors when using an integrated packaging scheme, improves the control precision of the driver IC chip over the light-emitting chip, and achieves a better light mixing and emission effect. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a front view of the device support structure of the light-emitting device in Embodiment 1 of this utility model; Figure 2 This is a side view schematic diagram of the device support structure of the light-emitting device in Embodiment 1 of this utility model; Figure 3 This is a schematic diagram of the pad structure on the device support in Embodiment 1 of this utility model; Figure 4 This is a front view of the light-emitting device structure in Embodiment 1 of this utility model; Figure 5 This is a front view of the device support structure of the light-emitting device in Embodiment 2 of this utility model; Figure 6 This is a schematic diagram of the pad structure on the device support in Embodiment 2 of this utility model; Figure 7 This is a front view of the light-emitting device structure in Embodiment 2 of this utility model; Figure 8 This is a front view of the device support structure of the light-emitting device in Embodiment 3 of this utility model; Figure 9 This is a schematic diagram of the back of the device support structure of the light-emitting device in Embodiment 3 of this utility model; Figure 10 This is a side view of the device support structure of the light-emitting device in Embodiment 3 of this utility model. Detailed Implementation

[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0019] In this invention, it should be understood that terms such as “comprising” or “having” are intended to indicate the presence of features, figures, steps, actions, components, portions or combinations thereof disclosed in this specification, and are not intended to exclude the possibility of the presence or addition of one or more other features, figures, steps, actions, components, portions or combinations thereof.

[0020] It should also be noted that, where there is no conflict, the embodiments and features in the embodiments of this utility model can be combined with each other. The present utility model will now be described in detail with reference to the accompanying drawings and embodiments.

[0021] Example 1 Embodiment 1 of this utility model provides a light-emitting device, which includes a device support. The front side of the device support is provided with a plurality of cup-shaped structures, and the plurality of cup-shaped structures include a driving cup and a light-emitting cup. The drive cup contains a die-bonding area for the drive IC chip; The number of light-emitting cups is one or more, and the light-emitting cup is provided with a die-bonding region for at least one light-emitting chip.

[0022] In one optional implementation of this embodiment, such as Figure 1 and Figure 2 As shown, Figure 1 This diagram shows a front view of the device support structure of the light-emitting device in Embodiment 1 of this utility model. Figure 2 The diagram shows a side view of the device support structure of the light-emitting device in Embodiment 1 of this utility model. The light-emitting device includes a device support 1. The front of the device support 1 is provided with a plurality of cup-shaped structures, including two specific cup-shaped structures: a driving cup and a light-emitting cup.

[0023] Furthermore, the number of the light-emitting cups is more than one.

[0024] Specifically, in this embodiment, four cup-shaped structures are provided on the front side of the device support 1, including one driving cup and three light-emitting cups, specifically the first driving cup 21, the first light-emitting cup 22, the second light-emitting cup 23 and the third light-emitting cup 24. The first driving cup 21 is located on the left side of the front side of the device support 1, and the first light-emitting cup 22, the second light-emitting cup 23 and the third light-emitting cup 24 are located on the right side of the front side of the device support 1.

[0025] In an optional implementation of this embodiment, the drive cup is provided with a die-bonding region for the drive IC chip, and the die-bonding region in the drive cup is used to place the drive IC chip.

[0026] Specifically, the first drive cup 21 has a die-bonding area for the drive IC chip.

[0027] In traditional RGB three-color chip and driver IC chip light-emitting device solutions, the driver IC chip is usually directly die-bonded to the surface of the bracket or substrate, and then the operation of the RGB three-color chip is controlled by the connection circuit. There is no protective structure for the driver IC chip, which poses a challenge to the safety and stability of the driver IC chip during long-term operation. At the same time, the control accuracy of the driver IC chip over the RGB three-color chip will also be affected. Therefore, in this embodiment, a driver cup is set separately on the front side of the bracket body to hold the driver IC chip. This improves the safety and stability of the driver IC chip while ensuring the control accuracy of the driver IC chip over the RGB three-color chip.

[0028] In an optional implementation of this embodiment, the light-emitting cup is provided with a die-bonding region for the light-emitting chip, and the die-bonding region in the light-emitting cup is used for die bonding and placing the light-emitting chip.

[0029] Furthermore, the light-emitting cup contains a die-bonding region for at least one light-emitting chip.

[0030] Specifically, each of the first light-emitting cup 22, the second light-emitting cup 23, and the third light-emitting cup 24 is provided with a die-bonding area for a light-emitting chip, or multiple die-bonding areas for light-emitting chips can be provided according to actual design requirements.

[0031] In traditional RGB three-color chip and driver IC chip light-emitting device solutions, the RGB three-color chips are usually integrated and packaged, which leads to crosstalk between them. The actual light mixing effect is poor and cannot meet the requirements of current light-emitting devices for multiple colors, multiple color temperatures and adjustable spectra. Therefore, in this embodiment, each light-emitting chip is packaged with a separate light-emitting cup to isolate the light emitted by different light-emitting chips. This effectively solves the crosstalk problem between light-emitting chips with different light-emitting colors, improves the control accuracy of the driver IC chip on a single light-emitting chip, and achieves a better light mixing and emission effect.

[0032] In an optional implementation of this embodiment, the length of the driving cup in the first preset direction is... and the length of the light-emitting cup in the first preset direction The range of values ​​for the ratio is: 0.1 < <1.

[0033] Specifically, the length of the first driving cup 21 in the first preset direction and the length of the first light-emitting cup 22 in the first preset direction The range of values ​​for the ratio is: 0.1 < <1, the ratio can be one of 0.1, 0.2, 0.5, 0.8, or 1, depending on the actual design requirements.

[0034] It should be noted that in this embodiment, the lengths of the first light-emitting cup 22, the second light-emitting cup 23, and the third light-emitting cup 24 are all equal in the first preset direction.

[0035] Furthermore, the length of the first driving cup 21 in the first preset direction The value range is: 0.4mm < <2.2mm, can be any value among 0.5mm, 1mm, 1.5mm, and 2mm, determined according to actual design requirements.

[0036] Furthermore, the length of the first light-emitting cup 22 in the first preset direction The value range is: 2mm < <3.9mm, can be any value among 2.1mm, 2.5mm, 3mm, 3.5mm, and 3.8mm, determined according to actual design requirements.

[0037] It should be noted that in this embodiment, the lengths of the first light-emitting cup 22, the second light-emitting cup 23, and the third light-emitting cup 24 are all equal in the first preset direction, and their value ranges are also consistent.

[0038] In an optional implementation of this embodiment, the length of the light-emitting cup in the second preset direction is... The value range is: 0.7mm < <1.5mm.

[0039] Specifically, the length of the first light-emitting cup 22 in the second preset direction The value range is: 0.7mm < <1.5mm, can be any one of 0.8mm, 1mm, 1.2mm, or 1.4mm, depending on the actual design requirements.

[0040] It should be noted that in this embodiment, the lengths of the first light-emitting cup 22, the second light-emitting cup 23, and the third light-emitting cup 24 in the second preset direction are all equal, and their value ranges are also consistent.

[0041] It should be noted that the first preset direction and the second preset direction are orthogonal on the plane where the front of the device bracket is located.

[0042] Specifically, the first preset direction and the second preset direction are perpendicular to each other on the plane where the front of the device bracket is located, which is specifically manifested in that the edge of the device bracket in the first preset direction and the edge in the second preset direction are adjacent edges.

[0043] In an optional implementation of this embodiment, the length of the light-emitting cup in the second preset direction is... The length of the device support in the second predetermined direction The range of values ​​for the ratio is: 0.2 ≤ ≤0.6.

[0044] Specifically, the length of the first light-emitting cup 22 in the second preset direction The length of the device support 1 in the second predetermined direction The range of values ​​for the ratio is: 0.2 ≤ ≤0.6, and can take one of the values ​​of 0.2, 0.3, 0.4, 0.5, and 0.6, depending on the actual design requirements.

[0045] In an optional implementation of this embodiment, the cup depth of any of the cup-shaped structures is... The value range is: 0.3mm < <0.7mm.

[0046] Specifically, the cup depths of the first driving cup 21, the first light-emitting cup 22, the second light-emitting cup 23, and the third light-emitting cup 24 are... The value range is: 0.3mm < <0.7mm, can be any one of 0.31mm, 0.4mm, 0.5mm, 0.6mm, or 0.69mm, depending on the actual design requirements.

[0047] It should be noted that, in Figure 2 The cup depth is marked in the middle. The depth of the third luminous cup 24.

[0048] In an optional implementation of this embodiment, the included angle between the inner wall of the cup and the bottom of any of the cup-shaped structures is... The range of values ​​is: 90° < <120°.

[0049] Specifically, the angle between the inner wall and the bottom of the first driving cup 21, the first light-emitting cup 22, the second light-emitting cup 23, and the third light-emitting cup 24 The range of values ​​is: 90° < <120°, can be one of 91°, 100°, 110°, or 119°, depending on the actual design requirements.

[0050] It should be noted that, in Figure 2 The included angle marked in the middle The angle between the inner wall of the first driving cup 21 and the bottom of the cup is denoted as .

[0051] In an optional implementation of this embodiment, the thickness of the device support... The value range is: 0.6mm < <1.6mm.

[0052] Specifically, the thickness of the device support 1 The value range is: 0.6mm < <1.6mm, can be any value among 0.7mm, 0.9mm, 1.1mm, 1.3mm, and 1.5mm, determined according to actual design requirements.

[0053] In summary, considering the thickness of the device support, the lengths of each cup-shaped structure in the first and second preset directions, the range of their proportions, and the angle between the inner wall and the bottom of the cup, it is possible to set cup-shaped structures on the original device support without affecting the physical properties of the device itself. The designed cup-shaped structure can accommodate the driver IC chip and the light-emitting chip, effectively solving the problem of light crosstalk between light-emitting chips of different colors when using an integrated packaging solution, improving the control accuracy of the driver IC chip over the light-emitting chip, and achieving a better light mixing and output effect.

[0054] In one optional implementation of this embodiment, a baffle wall is provided between any two adjacent cup-shaped structures, and the top surface of the baffle wall is flush with the rim of the cup-shaped structure.

[0055] Specifically, a baffle 25 is provided between the first driving cup 21 and the first light-emitting cup 22, the first driving cup 21 and the second light-emitting cup 23, the first driving cup 21 and the third light-emitting cup 24, the first light-emitting cup 22 and the second light-emitting cup 23, and the second light-emitting cup 23 and the third light-emitting cup 24. The baffle 25 is used to block adjacent cup-shaped structures and further solve the problem of light leakage between light-emitting chips.

[0056] Furthermore, the width of the top surface of the retaining wall The value range is: 0.2mm < <0.25mm.

[0057] Specifically, such as Figure 1 As shown, the width of the top surface of the retaining wall 25 The value range is: 0.2mm < <0.25mm, can be any one of 0.21mm, 0.22mm, 0.23mm, or 0.24mm, depending on the actual design requirements.

[0058] In an optional implementation of this embodiment, the device support is provided with a first pad, a second pad, and a third pad; A portion of the first pad is disposed within the driving cup, and another portion of the first pad is disposed within the light-emitting cup; The second pad is disposed inside the light-emitting cup, and the second pad extends out from the edge of the device bracket to form a light-emitting chip control pin; The third pad is disposed inside the drive cup, and the third pad extends out from the edge of the device bracket to form a power pin, a data input pin, and a data output pin.

[0059] Furthermore, in this embodiment, the front side of the device support is provided with a driving cup (first driving cup) and three light-emitting cups (first light-emitting cup, second light-emitting cup, and third light-emitting cup). Each driving cup is provided with three third pads, which extend out from the edge of the device support to form power pins, data input pins, and data output pins, respectively. Each light-emitting cup is provided with a first pad and a second pad. Part of the first pad in each light-emitting cup is located inside the light-emitting cup, and another part extends across the baffle and is located inside the driving cup. The second pad is located inside the light-emitting cup and extends out from the edge of the device support to form light-emitting chip control pins. The second pad in each light-emitting cup forms the number of light-emitting chip control pins corresponding to the number of die-bonding areas of the light-emitting chip in that light-emitting cup.

[0060] Specifically, such as Figure 3 As shown, Figure 3 A schematic diagram of the pad structure on the device support in Embodiment 1 of this utility model is shown. Figure 3 for Figure 2 The hidden device support 1 includes most of the structure, including a first driving cup 21, a first light-emitting cup 22, a second light-emitting cup 23, and a third light-emitting cup 24, as well as a schematic diagram behind the barrier. The first light-emitting cup 22 includes a first pad 37 and a second pad 36. The second light-emitting cup 23 includes a first pad 33 and a second pad 38. The third light-emitting cup 24 includes a first pad 34 and a second pad 38. The first driving cup 21 includes a third pad 31, a third pad 32, and a third pad 35. The first pad 37 spans the baffle wall 25 and is disposed within the first light-emitting cup 22 and the first driving cup 21. The first pad 33 spans the baffle wall 25 and is disposed within the second light-emitting cup 23 and the first driving cup 21. The first pad 34 spans the baffle wall 25 and is disposed within the third light-emitting cup 24 and the first driving cup 21. The second pad 36 is disposed within the first light-emitting cup 22. The second pad 38 is disposed within the second light-emitting cup 23 and the third light-emitting cup 24. The third pads 31, 32, and 35 are all disposed within the first driving cup 21.

[0061] It should be noted that at least two light-emitting cups are arranged adjacent to each other, and the second pads in adjacent light-emitting cups are common.

[0062] Specifically, in this embodiment, the second light-emitting cup 23 and the third light-emitting cup 24 are arranged adjacent to each other, and the second pads of the second light-emitting cup 23 and the third light-emitting cup 24 are common to the second pad 38.

[0063] Furthermore, after the die-bonded driver IC chip and the light-emitting chip are fabricated into a light-emitting device, the first pad, the second pad, and the third pad are used to connect the electrodes of the driver IC chip and the light-emitting chip disposed on the device support.

[0064] Furthermore, the second pad 36 extends from the edge of the device bracket 1 to form a first light-emitting chip control pin 46, the second pad 38 extends from the edge of the device bracket 1 to form a second / third light-emitting chip control pin 48, the third pad 31 extends from the edge of the device bracket 1 to form a power supply pin 41, the third pad 32 extends from the edge of the device bracket 1 to form a data input pin 42, and the third pad 35 extends from the edge of the device bracket 1 to form a data output pin 45.

[0065] In addition, redundant pin 47 is brought out from the first pad 37, redundant pin 43 is brought out from the first pad 33, and redundant pin 44 is brought out from the first pad 34.

[0066] Furthermore, after the die-bonded driver IC chip and the light-emitting chip are fabricated into a light-emitting device, the control pins, power pins, data input pins, and data output pins of the light-emitting chip are used to connect to external access lines.

[0067] In an optional implementation of this embodiment, the light-emitting device further includes a light-emitting chip and a driver IC chip: The light-emitting chip is disposed in the light-emitting cup; The driver IC chip is disposed in the driver cup.

[0068] Specifically, such as Figure 4 As shown, Figure 4 The diagram shows a front view of the structure of the light-emitting device in Embodiment 1 of the present invention. The light-emitting device also includes three light-emitting chips and a driver IC chip 6. The three light-emitting chips include a first light-emitting chip 71, a second light-emitting chip 72 and a third light-emitting chip 73. The driver IC chip 6 is disposed in the first driver cup 21, the first light-emitting chip 71 is disposed in the first light-emitting cup 22, the second light-emitting chip 72 is disposed in the second light-emitting cup 23, and the third light-emitting chip 73 is disposed in the third light-emitting cup 24; The electrodes of the driver IC chip 6 are connected to the third pad 31, the third pad 32, and the third pad 35, respectively, and are connected to the first pad 33, the first pad 34, the first pad 37, and the second pad 38. The electrodes of the first light-emitting chip 71 are connected to the first pad 37 and the second pad 36 respectively, the electrodes of the second light-emitting chip 72 are connected to the first pad 33 and the second pad 38 respectively, and the electrodes of the third light-emitting chip 73 are connected to the first pad 34 and the second pad 38 respectively.

[0069] In an optional implementation of this embodiment, the first light-emitting chip 71 is a red light chip, the second light-emitting chip 72 is a green light chip, and the third light-emitting chip 73 is a blue light chip.

[0070] In this embodiment, the driver IC chip is placed separately in the first driver cup, and the first, second, and third light-emitting chips are placed separately in the first, second, and third light-emitting cups, respectively. Through the cup-shaped structure and the baffles between the cup-shaped structures, the problem of light crosstalk between light-emitting chip supports of different light-emitting colors is effectively solved, and the light mixing and output effect is optimized. At the same time, the driver IC chip can control each light-emitting chip individually, improving the control accuracy of the driver IC chip on a single light-emitting chip and achieving a better light output effect.

[0071] In an optional implementation of this embodiment, the light-emitting cup is filled with a phosphor layer, and the phosphor layer covers the light-emitting chip in the light-emitting cup.

[0072] Specifically, the first light-emitting chip 71, the second light-emitting chip 72, and the third light-emitting chip 73 can all be set as blue light chips, and the first light-emitting cup 22 is filled with a red phosphor layer, the second light-emitting cup 23 is filled with a green phosphor layer, and the third light-emitting cup 24 is filled with a transparent phosphor layer, thus achieving the requirement of red, green, and blue light emission.

[0073] This design considers using a blue light chip + phosphor layer, which can achieve more tunable spectral schemes, such as a light-colored R / G / B scheme, enabling wide color range, multi-color temperature dimming, and a three-color temperature scheme of 2700K, 4000K, and 6500K, making dimming more continuous.

[0074] In summary, Embodiment 1 of this utility model provides a light-emitting device. A driver cup and a light-emitting cup are arranged on a device support. A die-bonding region for a driver IC chip is arranged in the driver cup, and a die-bonding region for at least one light-emitting chip is arranged in the light-emitting cup. This effectively solves the problem of light crosstalk between light-emitting chips of different colors when using an integrated packaging scheme, improves the control accuracy of the driver IC chip over the light-emitting chip, and achieves a better light mixing and emission effect.

[0075] Example 2 Embodiment 2 of this utility model provides a light-emitting device, which includes a device support. The front side of the device support is provided with a plurality of cup-shaped structures, and the plurality of cup-shaped structures include a driving cup and a light-emitting cup. The drive cup contains a die-bonding area for the drive IC chip; The number of light-emitting cups is one or more, and the light-emitting cup is provided with a die-bonding region for at least one light-emitting chip.

[0076] It should be noted that the structure of the light-emitting device in this embodiment is basically the same as that in Embodiment 1. The difference lies in the number, position and connection relationship of the second pads set on the device support.

[0077] Specifically, such as Figure 5 , Figure 6 and Figure 7 As shown, Figure 5 This diagram shows a front view of the device support structure of the light-emitting device in Embodiment 2 of this utility model. Figure 6 A schematic diagram of the pad structure on the device support in Embodiment 2 of this utility model is shown. Figure 7 A front view of the light-emitting device structure in Embodiment 2 of this utility model is shown; In this embodiment, a first driving cup 21, a first light-emitting cup 22, a second light-emitting cup 23, and a third light-emitting cup 24 are included, as well as a schematic diagram behind a retaining wall. The first light-emitting cup 22 includes a first pad 37 and a second pad 36. The second light-emitting cup 23 includes a first pad 33 and a second pad 38. The third light-emitting cup 24 includes a first pad 34 and a second pad 39. The first driving cup 21 includes a third pad 31, a third pad 32, and a third pad 35, which is the second pad 38 in Embodiment 1. In this embodiment, it is divided into a second pad 38 and a second pad 39. The second pad 38 is disposed in the second light-emitting cup 23, and the second pad 39 is disposed in the third light-emitting cup 24. Furthermore, the second pad 36 extends from the edge of the device bracket 1 to form a first light-emitting chip control pin 46, the second pad 38 extends from the edge of the device bracket 1 to form a second light-emitting chip control pin 48, the second pad 39 extends from the edge of the device bracket 1 to form a third light-emitting chip control pin 49, the third pad 31 extends from the edge of the device bracket 1 to form a power supply pin 41, the third pad 32 extends from the edge of the device bracket 1 to form a data input pin 42, and the third pad 35 extends from the edge of the device bracket 1 to form a data output pin 45.

[0078] In addition, redundant pin 47 is brought out from the first pad 37, redundant pin 43 is brought out from the first pad 33, and redundant pin 44 is brought out from the first pad 34.

[0079] Furthermore, the light-emitting device also includes three light-emitting chips and a driver IC chip 6, wherein the three light-emitting chips include a first light-emitting chip 71, a second light-emitting chip 72, and a third light-emitting chip 73; The driver IC chip 6 is disposed in the first driver cup 21, the first light-emitting chip 71 is disposed in the first light-emitting cup 22, the second light-emitting chip 72 is disposed in the second light-emitting cup 23, and the third light-emitting chip 73 is disposed in the third light-emitting cup 24; The electrodes of the driver IC chip 6 are connected to the third pad 31, the third pad 32, and the third pad 35, respectively, and are connected to the first pad 33, the first pad 34, the first pad 37, and the second pad 39. The electrodes of the first light-emitting chip 71 are connected to the first pad 37 and the second pad 36, respectively; the electrodes of the second light-emitting chip 72 are connected to the first pad 33 and the second pad 38, respectively; and the electrodes of the third light-emitting chip 73 are connected to the first pad 34 and the second pad 39, respectively.

[0080] In summary, Embodiment 2 of this utility model provides a light-emitting device. A driver cup and a light-emitting cup are arranged on the device support. A die-bonding region for a driver IC chip is arranged in the driver cup, and a die-bonding region for at least one light-emitting chip is arranged in the light-emitting cup. This effectively solves the problem of light crosstalk between light-emitting chips of different colors when using an integrated packaging scheme, improves the control accuracy of the driver IC chip over the light-emitting chip, and achieves a better light mixing and output effect.

[0081] Example 3 This utility model provides a light-emitting device in embodiment three. The light-emitting device includes a device support, and the front side of the device support is provided with a plurality of cup-shaped structures, the plurality of cup-shaped structures including a driving cup and a light-emitting cup. The drive cup contains a die-bonding area for the drive IC chip; The number of light-emitting cups is one or more, and the light-emitting cup is provided with a die-bonding region for at least one light-emitting chip.

[0082] It should be noted that the device support structure of the light-emitting device in this embodiment is basically the same as that of the light-emitting device in Embodiment 2. The difference is that a number of surface mount pins are also provided on the back of the support body, and the surface mount pins are connected to the back pads one by one.

[0083] Specifically, such as Figure 8 , Figure 9 and Figure 10 As shown, Figure 8 This diagram shows a front view of the device support structure of the light-emitting device in Embodiment 3 of this utility model. Figure 9 This diagram shows a schematic rear view of the device support structure of the light-emitting device in Embodiment 3 of this utility model. Figure 10 The diagram shows a side view of the device support structure of the light-emitting device in Embodiment 3 of this utility model. The back of the support body 1 is also provided with nine surface mount pins, including a first surface mount pin 51, a second surface mount pin 52, a third surface mount pin 53, a fourth surface mount pin 54, a fifth surface mount pin 55, a sixth surface mount pin 56, a seventh surface mount pin 57, an eighth surface mount pin 58, and a ninth surface mount pin 59.

[0084] Furthermore, the power supply pin 41 is connected to the first surface mount pin 51, the data input pin 42 is connected to the second surface mount pin 52, the redundant pin 43 is connected to the third surface mount pin 53, the data output pin 44 is connected to the fourth surface mount pin 54, the redundant pin 45 is connected to the fifth surface mount pin 55, the first light-emitting chip control pin 46 is connected to the sixth surface mount pin 56, the second light-emitting chip control pin 47 is connected to the seventh surface mount pin 57, the redundant pin 48 is connected to the eighth surface mount pin 58, and the third light-emitting chip control pin 49 is connected to the ninth surface mount pin 59.

[0085] Furthermore, after the light-emitting device is manufactured, the nine surface-mount pins are used to replace the nine lead-out pins for connection to external access lines.

[0086] This approach considers setting surface-mount pins to improve the electrical performance, safety, and stability of the manufactured light-emitting devices, while also expanding their application scenarios and broadening their applicability.

[0087] In summary, Embodiment 3 of this utility model provides a light-emitting device. A driver cup and a light-emitting cup are arranged on the device support. A die-bonding region for a driver IC chip is arranged in the driver cup, and a die-bonding region for at least one light-emitting chip is arranged in the light-emitting cup. This effectively solves the problem of light crosstalk between light-emitting chips of different colors when an integrated packaging scheme is used, improves the control accuracy of the driver IC chip over the light-emitting chip, and achieves a better light mixing and output effect.

[0088] The above provides a detailed description of a light-emitting device provided by the embodiments of this utility model. Specific examples have been used to illustrate the principle and implementation of this utility model. The description of the above embodiments is only for the purpose of helping to understand the method and core idea of ​​this utility model. At the same time, for those skilled in the art, there will be changes in the specific implementation and application scope based on the idea of ​​this utility model. Therefore, the content of this specification should not be construed as a limitation of this utility model.

Claims

1. A light-emitting device, characterized in that, The light-emitting device includes a device support, and the front side of the device support is provided with a plurality of cup-shaped structures, the plurality of cup-shaped structures including a driving cup and a light-emitting cup; The drive cup contains a die-bonding area for the drive IC chip; The number of light-emitting cups is one or more, and the light-emitting cup is provided with a die-bonding region for at least one light-emitting chip.

2. The light-emitting device as described in claim 1, characterized in that, The length of the driving cup in the first preset direction and the length of the light-emitting cup in the first preset direction The range of values ​​for the ratio is: 0.1 < ≤1.

3. The light-emitting device as described in claim 2, characterized in that, The length of the luminous cup in the second preset direction The value range is: 0.7mm < <1.5mm; The first preset direction and the second preset direction are orthogonal on the plane where the front of the device bracket is located.

4. The light-emitting device as described in claim 3, characterized in that, The length of the luminous cup in the second preset direction The length of the device support in the second predetermined direction The range of values ​​for the ratio is: 0.2 ≤ ≤0.

6.

5. The light-emitting device as described in claim 1, characterized in that, The angle between the inner wall of the cup and the bottom of any of the cup-shaped structures The range of values ​​for is: 90° < <120°.

6. The light-emitting device as described in claim 1, characterized in that, A retaining wall is provided between any two adjacent cup-shaped structures, and the top surface of the retaining wall is flush with the rim of the cup-shaped structure.

7. The light-emitting device as described in claim 1, characterized in that, The device support is provided with a first pad, a second pad, and a third pad; A portion of the first pad is disposed within the driving cup, and another portion of the first pad is disposed within the light-emitting cup; The second pad is disposed inside the light-emitting cup, and the second pad extends out from the edge of the device bracket to form a light-emitting chip control pin; The third pad is disposed inside the drive cup, and the third pad extends out from the edge of the device bracket to form a power pin, a data input pin, and a data output pin.

8. The light-emitting device as described in claim 7, characterized in that, At least two light-emitting cups are arranged adjacent to each other, and the second pads in the adjacent light-emitting cups are common.

9. The light-emitting device as described in claim 1, characterized in that, The light-emitting device also includes a light-emitting chip and a driver IC chip: The light-emitting chip is disposed in the light-emitting cup; The driver IC chip is disposed in the driver cup.

10. The light-emitting device as described in claim 9, characterized in that, The light-emitting cup is filled with a phosphor layer, which covers the light-emitting chip inside the light-emitting cup.

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