An organic light emitting display device

Abstract

The utility model discloses an organic light emitting display device, including the partition structure of setting between the pixel area, the partition structure includes the first insulating layer, first partition layer, second partition layer, third partition layer, fourth partition layer, fifth partition layer and sixth partition layer that set successively, wherein, the edge of fourth partition layer exceeds the edge of third partition layer, the edge of sixth partition layer exceeds the edge of fifth partition layer, the vertical projection of fifth partition layer on the substrate covers the vertical projection of third partition layer on the substrate, the vertical projection of sixth partition layer on the substrate covers the vertical projection of fourth partition layer on the substrate. The organic light emitting display device provided by the utility model embodiment, the partition structure forms two stage roof structure to cut off organic light emitting layer when preparing organic light emitting layer, and further strengthens the blocking capacity to the organic light emitting layer along the partition structure and extends upwards, solves the color crosstalk problem caused by the organic light emitting layer along the partition structure and climbs the slope.

Description

Technical Field

[0001] This utility model relates to the field of display technology, and in particular to an organic light-emitting display device. Background Technology

[0002] Organic light-emitting diode (OLED) display technology is widely used in smartphones, televisions, and microdisplays due to its advantages such as self-emission, high contrast, wide viewing angle, and fast response time. In silicon-based OLED (S-OLED) devices, pixels are typically arranged side-by-side, meaning that red (R), green (G), and blue (B) subpixels are arranged horizontally on a driving backplane, each emitting light independently and synthesizing a color image through a microlens system. To achieve high resolution and high color purity, it is essential to ensure strict isolation between the organic light-emitting layers of each subpixel to avoid material mixing or light crosstalk between different colors.

[0003] Therefore, a pixel definition layer (PDL) or separator structure is usually set above the pixel anode to physically separate adjacent pixel regions and limit the deposition range of organic functional layers (such as organic light-emitting layers and carrier adjustment layers).

[0004] However, in the actual manufacturing process, due to the surface diffusion and step coverage of organic materials during vapor deposition, the organic light-emitting layer tends to climb up the sidewall of the partition structure (i.e., the climbing effect). When the organic light-emitting layer climbs up to the top of the partition structure and extends to the adjacent pixel area, a "bridging" phenomenon may be formed, resulting in color crosstalk between adjacent pixels. Utility Model Content

[0005] This invention provides an organic light-emitting display device to solve the technical problem of color crosstalk caused by the climbing of the organic light-emitting layer.

[0006] This utility model provides an organic light-emitting display device, comprising:

[0007] A substrate, the substrate comprising a plurality of pixel regions spaced apart;

[0008] An anode is disposed within the pixel region, and multiple separating structures are disposed between the pixel regions;

[0009] The partition structure includes:

[0010] The first insulating layer is filled between the anodes;

[0011] A first partition layer is disposed on the first insulating layer, and the first partition layer covers the first insulating layer;

[0012] A second partition layer is disposed on the first partition layer;

[0013] A third partition layer is disposed on the second partition layer;

[0014] A fourth partition layer is disposed on the third partition layer, the edge of the fourth partition layer extending beyond the edge of the third partition layer;

[0015] A fifth partition layer is disposed on the fourth partition layer;

[0016] A sixth partition layer is disposed on the fifth partition layer, the edge of the sixth partition layer extending beyond the edge of the fifth partition layer;

[0017] The vertical projection of the fifth partition layer on the substrate covers the vertical projection of the third partition layer on the substrate, and the vertical projection of the sixth partition layer on the substrate covers the vertical projection of the fourth partition layer on the substrate.

[0018] The organic light-emitting display device provided in this embodiment of the invention features a multi-layered, stacked partition structure between pixel areas. This partition structure comprises a first insulating layer, a first partition layer, a second partition layer, a third partition layer, a fourth partition layer, a fifth partition layer, and a sixth partition layer, stacked sequentially. The edge of the fourth partition layer extends beyond the edge of the third partition layer, and the edge of the sixth partition layer extends beyond the edge of the fifth partition layer, forming a two-tiered roof structure to cut off the organic light-emitting layer during fabrication. Furthermore, the vertical projection of the sixth partition layer covers the fourth partition layer, and the vertical projection of the fifth partition layer covers the third partition layer, further enhancing the ability to block the upward extension of the organic light-emitting layer along the partition structure and solving the color crosstalk problem caused by the organic light-emitting layer climbing up the partition structure.

[0019] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of this utility model, nor is it intended to limit the scope of this utility model. Other features of this utility model will become readily apparent from the following description. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1A schematic diagram of the structure of an organic light-emitting display device provided in an embodiment of this utility model;

[0022] Figure 2 for Figure 1 A schematic diagram of the cross-sectional structure along the A-A' direction;

[0023] Figure 3 This is a partial cross-sectional structural diagram of an organic light-emitting display device provided in an embodiment of the present invention;

[0024] Figure 4 A partial cross-sectional structural diagram of another organic light-emitting display device provided in an embodiment of this utility model;

[0025] Figure 5 This is a partial cross-sectional structural diagram of another organic light-emitting display device provided in an embodiment of the present invention. Detailed Implementation

[0026] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of the present invention.

[0027] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this utility model are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the utility model described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0028] Figure 1 This is a schematic diagram of the structure of an organic light-emitting display device provided in an embodiment of the present invention. Figure 2 for Figure 1 A schematic diagram of the cross-sectional structure along the A-A' direction, as shown below. Figure 1 and Figure 2 As shown, the organic light-emitting display device provided in this embodiment of the present invention includes:

[0029] The substrate 10 includes a plurality of pixel regions 101 spaced apart.

[0030] An anode 11 is disposed within a pixel region 101, and a separation structure 20 is disposed between pixel regions 101.

[0031] The partition structure 20 includes:

[0032] The first insulating layer 200 is filled between the anodes 11.

[0033] A first partition layer 201 is disposed on the first insulating layer 200, and the first partition layer 201 covers the first insulating layer 200.

[0034] The second partition layer 202 is disposed on the first partition layer 201.

[0035] The third partition layer 203 is disposed on the second partition layer 202.

[0036] A fourth partition layer 204 is disposed on the third partition layer 203, and the edge of the fourth partition layer 204 extends beyond the edge of the third partition layer 203.

[0037] The fifth partition layer 205 is installed on the fourth partition layer 204.

[0038] A sixth partition layer 206 is disposed on the fifth partition layer 205, the edge of the sixth partition layer 206 extending beyond the edge of the fifth partition layer 205.

[0039] The vertical projection of the fifth partition layer 205 on the substrate 10 covers the vertical projection of the third partition layer 203 on the substrate 10, and the vertical projection of the sixth partition layer 206 on the substrate 10 covers the vertical projection of the fourth partition layer 204 on the substrate 10.

[0040] Specifically, such as Figure 1 and Figure 2 As shown, the substrate 10 can be a driving substrate, and multiple pixel regions 101 are defined on the substrate 10 in an array.

[0041] Figure 3 This is a partial cross-sectional structural diagram of an organic light-emitting display device provided in an embodiment of the present invention, as shown below. Figure 3 As shown, optionally, the substrate 10 includes a substrate 102, on which a driving transistor T corresponding to the pixel region 101 is disposed. The driving transistor T is connected to the anode 11, and the driving transistor T can provide the pixel with a working signal corresponding to the light emission brightness through the anode 11 to drive the pixel to emit light.

[0042] The driving transistor T may include an active region T1, a gate T2 and a source / drain electrode layer T3 stacked together. The active region T1 may be formed in the substrate 102, but is not limited thereto. This embodiment of the present invention does not make specific limitations in this regard.

[0043] Continue to refer to Figures 1-3 An anode 11 is formed in the pixel region 101 on the substrate 10. The anodes 11 corresponding to each pixel region 101 are electrically isolated from each other. The anode 11 serves as an electrode of the pixel and can inject carriers (such as holes) into the pixel under the drive of a positive voltage from an external power supply.

[0044] A separation structure 20 is provided between adjacent pixel regions 101. The separation structure 20 is used to physically isolate different pixel regions and prevent the organic light-emitting layers between adjacent pixels from connecting to each other.

[0045] like Figure 2 and Figure 3 As shown, the partition structure 20 includes multiple layers stacked from bottom to top, as detailed below:

[0046] The first insulating layer 200 fills the gap region between adjacent anodes 11. In the transverse direction, the first insulating layer 200 is located between two adjacent anodes 11, which helps to ensure electrical insulation between the two adjacent anodes 11. At the same time, since the anodes 11 have a certain thickness, a pit is formed between the two anodes 11. Filling the gap between the two adjacent anodes 11 with the first insulating layer 200 also helps to reduce the height difference between the area where the anodes 11 are located and the area where the pit is located, so that the subsequent film layer can be prepared on a relatively flat surface, thereby ensuring the continuity of the subsequent film layer.

[0047] The first isolation layer 201 is disposed on the first insulating layer 200 and completely covers its surface, so that the first isolation layer 201 extends to the edge of the anode 11, which can more clearly define the spatial boundary of each pixel and help reduce optical crosstalk and electrical crosstalk between adjacent pixels.

[0048] In some embodiments, the first partition layer 201 may cover at least part of the edge of the anode 11, that is, there is a certain overlap between the first partition layer 201 and the anode 11. When forming the first partition layer 201, the influence of the misalignment caused by photolithography alignment deviation on the function of the first partition layer 201 can be reduced.

[0049] A second partition layer 202, a third partition layer 203, and a fourth partition layer 204 are disposed on top of the first partition layer 201. Specifically, in the thickness direction of the substrate 10, the fourth partition layer 204 covers the third partition layer 203, and the edge of the fourth partition layer 204 extends beyond the edge of the third partition layer 203; that is, the distance between the vertical projection of the edge of the fourth partition layer 204 onto the substrate 10 and the vertical projection of the edge of the third partition layer 203 onto the substrate 10 is greater than 0. At this time, the length of the fourth partition layer 204 in the transverse direction is greater than the length of the third partition layer 203 in the transverse direction, or in other words, the projected area of ​​the fourth partition layer 204 onto the substrate 10 is greater than the projected area of ​​the third partition layer 203 onto the substrate 10, such that the edge portion of the fourth partition layer 204 forms an eaves structure above the edge of the third partition layer 203.

[0050] like Figure 2 and Figure 3 As shown, vacuum evaporation is typically used to prepare the organic light-emitting layer 30. Organic materials are incident from the evaporation source onto the substrate surface at a certain angle and deposited uniformly in unobstructed areas. However, in areas with a three-dimensional structure, the geometric projection effect plays a role. Because the edge of the fourth partition layer 204 extends beyond the edge of the third partition layer 203, the outward-extending eaves structure at the edge of the fourth partition layer 204 blocks the organic materials from the evaporation source. This results in a portion of the upper surface of the second partition layer 202 being in an obstructed area, preventing direct deposition of organic materials. Consequently, the organic light-emitting layer 30 cannot form a continuous coverage within this obstructed area, resulting in an interruption.

[0051] The fifth partition layer 205 and the sixth partition layer 206 are disposed above the fourth partition layer 204. Specifically, in the thickness direction of the substrate 10, the sixth partition layer 206 covers the fifth partition layer 205. Simultaneously, the edge of the sixth partition layer 206 extends beyond the edge of the fifth partition layer 205; that is, the distance between the vertical projection of the edge of the sixth partition layer 206 onto the substrate 10 and the vertical projection of the edge of the fifth partition layer 205 onto the substrate 10 is greater than 0. At this time, the length of the sixth partition layer 206 in the lateral direction is greater than the length of the fifth partition layer 205 in the lateral direction, or in other words, the projected area of ​​the sixth partition layer 206 onto the substrate 10 is greater than the projected area of ​​the fifth partition layer 205 onto the substrate 10, such that the edge portion of the sixth partition layer 206 forms an eaves structure above the edge of the fifth partition layer 205.

[0052] like Figure 2 and Figure 3As shown, during the preparation of the organic light-emitting layer 30, since the edge of the sixth partition layer 206 extends beyond the edge of the fifth partition layer 205, the outwardly extending eaves structure at the edge of the sixth partition layer 206 will block the organic material from the evaporation source, causing at least part of the upper surface of the fourth partition layer 204 to be in the blocked area, and organic material cannot be directly deposited. Therefore, the organic light-emitting layer 30 cannot form a continuous coverage in the blocked area, resulting in an interruption.

[0053] In some embodiments, if the width by which the edge of the sixth partition layer 206 extends beyond the edge of the fifth partition layer 205 is too small, the depth to which the edge of the fifth partition layer 205 is recessed relative to the edge of the sixth partition layer 206 towards the light-emitting area away from the pixel is too shallow. This causes the organic light-emitting layer 30 to climb along the sidewall of the fifth partition layer 205 to the sidewall of the sixth partition layer 206, thus failing to ensure that the organic light-emitting layer 30 breaks at the recess. To solve the above technical problem, the width by which the edge of the sixth partition layer 206 extends beyond the edge of the fifth partition layer 205 is set to be greater than or equal to 50 nm in a direction parallel to the plane of the substrate 10. In this case, when multiple pixel arrays are arranged, the shortest distance between the edge of the sixth partition layer 206 and the edge of the fifth partition layer 205 in the row or column direction is greater than or equal to 50 nm. In this way, the depth by which the edge of the fifth partition layer 205 is recessed relative to the edge of the sixth partition layer 206 towards the light-emitting area away from the pixel is avoided, thereby ensuring sufficient space for the organic light-emitting layer 30 to break at the recess.

[0054] In some embodiments, along a direction parallel to the plane of the substrate 10, the width by which the edge of the sixth partition layer 206 extends beyond the edge of the fifth partition layer 205 is less than or equal to 500 nm. This increases the mechanical stress on the portion of the sixth partition layer 206 extending beyond the edge of the fifth partition layer 205, reducing the risk of interlayer delamination or deformation.

[0055] The specific value of the width by which the edge of the sixth partition layer 206 extends beyond the edge of the fifth partition layer 205 can be set according to actual needs, and this embodiment of the utility model does not impose a specific limitation on this.

[0056] Furthermore, such as Figure 2 and Figure 3As shown, along the thickness direction of the substrate 10, the sixth partition layer 206 completely covers the fourth partition layer 204, so that the entire upper surface of the fourth partition layer 204 is within the vertical projection coverage area formed by the sixth partition layer 206. During the evaporation process of the organic light-emitting layer 30, the fourth partition layer 204 forms a deposition shielding area due to the sixth partition layer 206 above it. The organic material from the evaporation source cannot be directly deposited onto the upper surface of the fourth partition layer 204. This prevents the organic light-emitting layer 30 on the second partition layer 202 from continuously climbing along the sidewall and upper surface of the fourth partition layer 204, thereby effectively blocking the continuous coverage path of the organic light-emitting layer 30 along the upper surface of the partition structure 20, and further ensuring the complete isolation of the organic light-emitting layer between adjacent pixels.

[0057] Figure 4 A partial cross-sectional structural diagram of another organic light-emitting display device provided in an embodiment of this utility model is shown below. Figure 4 As shown, optionally, the edge of the sixth partition layer 206 extends beyond the edge of the fourth partition layer 204, that is, the edge of the sixth partition layer 206 extends outward in the horizontal direction relative to the edge of the fourth partition layer 204, forming a stepped structure that is wider at the top and narrower at the bottom. With this configuration, even if there is a certain deviation in the deposition angle during the evaporation process of the organic light-emitting layer 30, the sixth partition layer 206 can still maintain sufficient coverage of the upper surface and sidewall area of ​​the fourth partition layer 204, preventing organic materials from being directly deposited into this area. This improves the interception capability of the partition structure 20 on the organic light-emitting layer 30 and enhances the tolerance of the partition structure 20 to process deviations, thereby improving the stability and yield of device manufacturing.

[0058] In some embodiments, such as Figure 2 As shown, along the direction parallel to the substrate 10, the width of the sixth partition layer 206 can also be equal to the width of the fourth partition layer 204. That is, the vertical projection of the sixth partition layer 206 on the substrate 10 coincides with the vertical projection of the fourth partition layer 204 on the substrate 10. This is beneficial to make the stress distribution of the partition structure 20 more uniform and reduce the risk of interlayer peeling or deformation caused by excessive extension of the sixth partition layer 206.

[0059] Furthermore, the fourth partition layer 204 has a smaller lateral dimension than the sixth partition layer 206. If the width of the edge of the fourth partition layer 204 extending beyond the edge of the third partition layer 203 is too small, the depth of the recess of the edge of the third partition layer 203 relative to the edge of the fourth partition layer 204 toward the light-emitting area away from the pixel is too shallow. During the evaporation process of the organic light-emitting layer 30, the organic light-emitting layer 30 may climb up along the sidewall of the third partition layer 203 and continue to extend to the sidewall of the fourth partition layer 204, thereby forming a continuous coverage path. This causes the organic light-emitting layer 30 to fail to achieve effective breakage in the recessed area, thereby weakening the isolation capability of the partition structure 20 to the adjacent pixel area and increasing the risk of color crosstalk.

[0060] To solve the above problems, such as Figure 2 and Figure 3 As shown, along the thickness direction of the substrate 10, the fifth partition layer 205 completely covers the third partition layer 203, so that the third partition layer 203 has a smaller lateral dimension, and the fourth partition layer 204 has an outwardly protruding edge relative to the third partition layer 203 below it, which facilitates the formation of a sufficiently deep recessed space at the sidewall of the third partition layer 203, effectively blocking the continuous climbing path of the organic light-emitting layer 30 from the sidewall of the third partition layer 203 to the sidewall of the fourth partition layer 204.

[0061] In some embodiments, such as Figure 4 As shown, the edge of the fifth partition layer 205 extends beyond the edge of the third partition layer 203, allowing the third partition layer 203 to have a smaller lateral dimension while ensuring process tolerance. This results in a deeper recessed space on the sidewall of the third partition layer 203, which helps to block the continuous climbing path of the organic light-emitting layer 30 from the sidewall of the third partition layer 203 to the sidewall of the fourth partition layer 204.

[0062] In some embodiments, along a direction parallel to the plane of the substrate 10, the edge of the fourth partition layer 204 extends beyond the edge of the third partition layer 203 by a width greater than or equal to 50 nm. In this case, when multiple pixel arrays are arranged, the shortest distance between the edge of the fourth partition layer 204 and the edge of the third partition layer 203 in the row or column direction is greater than or equal to 50 nm. This prevents the edge of the fourth partition layer 204 from being recessed too shallowly relative to the edge of the third partition layer 203 towards the light-emitting area away from the pixel, thereby ensuring sufficient space for the organic light-emitting layer 30 to break at the recess.

[0063] In some embodiments, along a direction parallel to the plane of the substrate 10, the width by which the edge of the fourth partition layer 204 extends beyond the edge of the third partition layer 203 is less than or equal to 500 nm. This increases the mechanical stress on the portion of the fourth partition layer 204 extending beyond the edge of the third partition layer 203, reducing the risk of interlayer delamination or deformation.

[0064] The specific value of the width by which the edge of the fourth partition layer 204 extends beyond the edge of the third partition layer 203 can be set according to actual needs, and this embodiment of the utility model does not impose a specific limitation on this.

[0065] In some embodiments, such as Figure 2 As shown, along the direction parallel to the substrate 10, the width of the fifth partition layer 205 can also be equal to the width of the third partition layer 203. That is, the vertical projection of the fifth partition layer 205 on the substrate 10 coincides with the vertical projection of the third partition layer 203 on the substrate 10, which is beneficial to make the stress distribution of the partition structure 20 more uniform and reduce the risk of deformation.

[0066] It should be noted that each film layer in the separating structure 20 (such as the first separating layer 201, the second separating layer 202, the third separating layer 203, the fourth separating layer 204, the fifth separating layer 205, and the sixth separating layer 206) is arranged around the pixel region 101, and an opening is formed above the first separating layer 201. This opening can define the light-emitting area of ​​the pixel. The defined light-emitting area can be any shape such as a rectangle, polygon, or circle. This embodiment of the present invention does not make any specific limitation in this regard.

[0067] In summary, the organic light-emitting display device provided by this embodiment of the invention features a multi-layered stacked partition structure between pixel areas. This partition structure comprises a first insulating layer, a first partition layer, a second partition layer, a third partition layer, a fourth partition layer, a fifth partition layer, and a sixth partition layer, stacked sequentially. The edge of the fourth partition layer extends beyond the edge of the third partition layer, and the edge of the sixth partition layer extends beyond the edge of the fifth partition layer, forming a two-tiered roof structure to cut off the organic light-emitting layer during its fabrication. Furthermore, the vertical projection of the sixth partition layer covers the fourth partition layer, and the vertical projection of the fifth partition layer covers the third partition layer, further enhancing the ability to block the upward extension of the organic light-emitting layer along the partition structure and solving the color crosstalk problem caused by the organic light-emitting layer climbing up the partition structure.

[0068] Optional, such as Figures 2-4 As shown, the edge of the first partition layer 201 extends beyond the edge of the second partition layer 202, the edge of the first partition layer 201 extends beyond the edge of the fourth partition layer 204, and the edge of the first partition layer 201 extends beyond the edge of the sixth partition layer 206.

[0069] Specifically, the first partition layer 201 is configured to have the largest projected area among the partition structures 20. That is, the vertical projected area of ​​the first partition layer 201 on the substrate 10 is greater than the vertical projected area of ​​any one of the partition layers above it (such as the second partition layer 202, the third partition layer 203, the fourth partition layer 204, the fifth partition layer 205, and the sixth partition layer 206) on the substrate 10. Figures 2-4 As shown, in the side cross-sectional view, the edge of the first partition layer 201 extends outward and beyond the edges of all the partition layers above it.

[0070] The first partition layer 201 forms a wide platform, which can improve the deposition uniformity and adhesion strength of the second partition layer 202 to the sixth partition layer 206 above it, avoid problems such as poor coverage, cracking or peeling of the subsequent film layer at the step of the first partition layer 201, ensure the structural density and integrity of the multi-layer partition layer of the partition structure 20, and improve the reliability of the partition structure 20.

[0071] In some embodiments, along a direction parallel to the plane of the substrate 10, the edge of the first partition layer 201 extends beyond the edge of the second partition layer 202 by a width greater than or equal to 50 nm. In this case, when multiple pixel arrays are arranged, the shortest distance between the edge of the first partition layer 201 and the edge of the second partition layer 202 is greater than or equal to 50 nm in the row or column direction. Thus, even with process errors, it can be ensured that the second partition layer 202 to the sixth partition layer 206 are completely located above the first partition layer 201, avoiding structural defects caused by misalignment and improving product yield.

[0072] In some embodiments, along a direction parallel to the plane of the substrate 10, the width by which the edge of the first partition layer 201 extends beyond the edge of the second partition layer 202 is less than or equal to 500 nm. This avoids the partition structure 20 occupying excessive space, which is beneficial for achieving a pixel design with a high aperture ratio.

[0073] The specific value of the width by which the edge of the first partition layer 201 extends beyond the edge of the second partition layer 202 can be set according to actual needs, and this embodiment of the utility model does not impose a specific limitation on this.

[0074] Optionally, the first partition layer 201 is made of an insulating material, and the second partition layer 202 is made of a conductive material.

[0075] Among them, such as Figures 2-4As shown, the first partition layer 201 covers the area between adjacent anodes 11 and the edge area of ​​anodes 11. Since it is located directly between anodes 11 and subsequent conductive film layers, and its lateral dimension is larger than that of each upper partition layer, the first partition layer 201 is made of insulating material to give it good electrical insulation performance in order to prevent electrical crosstalk or short circuit between pixels.

[0076] Furthermore, the vertical projected area of ​​the second partition layer 202 on the substrate 10 is greater than the vertical projected area of ​​any one of the partition layers above it (such as the third partition layer 203, the fourth partition layer 204, the fifth partition layer 205, and the sixth partition layer 206) on the substrate 10. Figures 2-4 As shown, in the side cross-sectional view, the edge of the second partition layer 202 extends outward and beyond the edges of all the partition layers above it.

[0077] In this embodiment, the cathode 40 is deposited onto the second partition layer 202 under the shielding of the third partition layer 203, the fourth partition layer 204, the fifth partition layer 205, and the sixth partition layer 206. The second partition layer 202 is made of a conductive material, allowing the cathodes 40 of each pixel region 101 to be electrically connected via the second partition layer 202. This enables the cathodes 40 to be connected to cathode power supply traces around the display area, providing power to the cathodes 40 of all pixel regions 101, simplifying the wiring structure and reducing costs.

[0078] Optionally, the material of the first partition layer 201 includes at least one of silicon nitride (SiN), silicon oxide (SiO), silicon oxynitride (SiON), and aluminum oxide (Al2O3).

[0079] Among them, silicon nitride (SIN), silicon oxide (SiO), silicon oxynitride (SiON) and aluminum oxide (Al2O3) are all highly insulating inorganic dielectric materials with excellent dielectric properties, thermal stability and chemical inertness. The use of the above materials in the first isolation layer 201 can ensure that the first isolation layer 201 has sufficient electrical insulation capacity, prevent leakage or short circuit between adjacent anodes 11, and effectively realize electrical isolation between adjacent pixel areas.

[0080] In actual processes, the above-mentioned materials can be formed by chemical vapor deposition (CVD), plasma-enhanced chemical vapor deposition (PECVD), atomic layer deposition (ALD) or sputtering, etc., and have good step coverage and film uniformity. They can form a continuous and dense insulating cover layer on the anode 11 and the first insulating layer 200.

[0081] In addition, the first partition layer 201 can be a single-layer structure or a composite laminate structure composed of any two or more of the above materials, so as to synergistically optimize insulation performance, density and process compatibility.

[0082] Optionally, the material of the second partition layer 202 includes at least one of titanium nitride (TiN), tantalum nitride (TaN), indium tin oxide (ITO), and indium zinc oxide (IZO).

[0083] Titanium nitride (TiN), tantalum nitride (TaN), indium tin oxide (ITO), and indium zinc oxide (IZO) are all thin-film materials with excellent electrical conductivity, while also possessing good thermal stability, chemical inertness, and compatibility with subsequent processes. The selection of these materials for the second partition layer 202 ensures its stable conductivity, thereby achieving a reliable electrical connection to the cathode 40.

[0084] In actual manufacturing processes, the above materials can be deposited into films using methods such as physical vapor deposition (PVD, such as sputtering), atomic layer deposition (ALD), or chemical vapor deposition (CVD), and can be precisely patterned using photolithography and etching processes to form a conductive functional layer surrounding the pixel area.

[0085] In addition, the second partition layer 202 can be a single-layer structure made of a single material, or it can be a composite layer composed of any two or more of the above materials, so as to take into account multiple requirements such as conductivity and interfacial adhesion.

[0086] Optionally, the materials of the third partition layer 203 and the fourth partition layer 204 may be different.

[0087] And / or,

[0088] The materials of the fifth partition layer 205 and the sixth partition layer 206 are different.

[0089] Specifically, in some embodiments, by setting the third partition layer 203 and the fourth partition layer 204 to be composed of different materials, a high etching selectivity ratio between the two can be achieved, thereby making it easier to process the third partition layer 203 and the fourth partition layer 204 into the desired shape.

[0090] For example, when forming the third partition layer 203 and the fourth partition layer 204, firstly, the material layers of the first partition layer 201, the second partition layer 202, the third partition layer 203, the fourth partition layer 204, the fifth partition layer 205 and the sixth partition layer 206 are prepared in sequence. The material layers of the third partition layer 203 to the sixth partition layer 206 are patterned by the first photomask, and the common outer contour of the third partition layer 203 to the sixth partition layer 206 is initially defined.

[0091] Further, a selective etching step is performed, wherein a suitable etching gas or liquid is selected for the third partition layer 203 so that the etching rate of the fourth partition layer 204 is less than the etching rate of the third partition layer 203, so that the sidewall of the third partition layer 203 is further etched laterally, while the fourth partition layer 204 basically retains its original shape, thereby forming an inwardly recessed notch on the sidewall of the third partition layer 203, so that the edge of the fourth partition layer 204 extends beyond the edge of the third partition layer 203.

[0092] In some embodiments, by setting the fifth partition layer 205 and the sixth partition layer 206 to be composed of different materials, a high etching selectivity ratio between the two can be achieved, thereby making it easier to process the fifth partition layer 205 and the sixth partition layer 206 into the desired shape.

[0093] For example, after patterning the material layers of the third to sixth partition layers 203 through the first photomask, a selective etching step is performed. In this step, a suitable etching gas or liquid can be selected for the fifth partition layer 205 so that the etching rate of the sixth partition layer 206 is less than that of the fifth partition layer 205. This results in the sidewalls of the fifth partition layer 205 being further etched laterally, while the sixth partition layer 206 remains essentially unchanged. This creates an inwardly recessed notch on the sidewalls of the fifth partition layer 205, allowing the edge of the sixth partition layer 206 to extend beyond the edge of the fifth partition layer 205.

[0094] Optionally, the material of the third partition layer 203 is the same as that of the fifth partition layer 205.

[0095] And / or,

[0096] The material of the fourth partition layer 204 is the same as that of the sixth partition layer 206.

[0097] Specifically, in some embodiments, the third partition layer 203 and the fifth partition layer 205 are made of the same material, so that they can share the same set of deposition parameters and equipment conditions, reduce the number of process changeovers, and improve production efficiency.

[0098] In some embodiments, the fourth partition layer 204 and the sixth partition layer 206 are made of the same material, which not only simplifies material management and process control, but also allows them to share the same set of deposition parameters and equipment conditions, reducing the number of process changeovers and improving production efficiency.

[0099] Furthermore, the third partition layer 203 and the fifth partition layer 205 are made of the same material, and the fourth partition layer 204 and the sixth partition layer 206 are made of the same material. Because they maintain a material difference from adjacent layers (such as the third partition layer 203 and partition layer 204, and the fifth partition layer 205 and the sixth partition layer 206), they exhibit etching selectivity. Therefore, during the patterning process, a stepped morphology can be formed in the same selective etching step, where the edge of the fourth partition layer 204 extends beyond the third partition layer 203 and the edge of the sixth partition layer 206 extends beyond the fifth partition layer 205, without the need for additional etching processes, thus improving production efficiency and reducing manufacturing costs.

[0100] For example, after patterning the material layers of the third to sixth partition layers 203 through the first photomask, a selective etching step is performed. A suitable etching gas or liquid can be selected for the third partition layer 203 and the fifth partition layer 205 so that the etching rate of the fourth partition layer 204 and the sixth partition layer 206 is less than the etching rate of the third partition layer 203 and the fifth partition layer 205. This results in the sidewalls of the third partition layer 203 and the fifth partition layer 205 being further laterally etched simultaneously, while the fourth partition layer 204 and the sixth partition layer 206 remain essentially unchanged. This creates inwardly recessed notches on the sidewalls of the third partition layer 203 and the fifth partition layer 205, allowing the edge of the fourth partition layer 204 to extend beyond the edge of the third partition layer 203, and the edge of the sixth partition layer 206 to extend beyond the edge of the fifth partition layer 205.

[0101] Furthermore, since the same materials have similar coefficients of thermal expansion and internal stress characteristics, in this embodiment, the third partition layer 203 and the fifth partition layer 205, and the fourth partition layer 204 and the sixth partition layer 206 are respectively made of the same material, which helps to form a symmetrical stress distribution in the vertical direction and reduce the accumulated stress caused by the alternating stacking of materials, thereby helping to suppress problems such as warping, cracking or interlayer delamination.

[0102] Optionally, the materials of the third partition layer 203, the fourth partition layer 204, the fifth partition layer 205 and the sixth partition layer 206 are all insulating materials.

[0103] Among them, the third partition layer 203 to the sixth partition layer 206 are all made of insulating material, which can ensure that all film layers of the entire partition structure 20 above the second partition layer 202 have good electrical insulation performance, thereby avoiding problems such as short circuits, leakage or electric field distortion between pixels caused by the introduction of conductive paths by the upper structure.

[0104] Meanwhile, the design of the aforementioned insulating upper layer structure not only ensures the reliability of electrical isolation but also ensures high compatibility with the deposition processes of the organic light-emitting layer 30 and the cathode 40. Furthermore, due to the controllable surface energy and strong chemical inertness of the insulating material, it can effectively suppress the non-uniform adsorption or climbing of organic molecules on the sidewalls of the separating structure 20, further enhancing the cutoff effect of the organic light-emitting layer 30 at the pixel boundary.

[0105] Optionally, the material of the third partition layer 203 includes at least one of silicon nitride (SIN), silicon oxide (SiO), silicon oxynitride (SiON), and aluminum oxide (Al2O3).

[0106] And / or, the material of the fourth partition layer 204 includes at least one of silicon nitride (SIN), silicon oxide (SiO), silicon oxynitride (SiON), and aluminum oxide (Al2O3).

[0107] And / or, the material of the fifth partition layer 205 includes at least one of silicon nitride (SIN), silicon oxide (SiO), silicon oxynitride (SiON), and aluminum oxide (Al2O3).

[0108] And / or, the material of the sixth partition layer 206 includes at least one of silicon nitride (SIN), silicon oxide (SiO), silicon oxynitride (SiON), and aluminum oxide (Al2O3).

[0109] Among them, silicon nitride (SIN), silicon oxide (SiO), silicon oxynitride (SiON) and aluminum oxide (Al2O3) are all highly insulating inorganic dielectric materials with excellent dielectric properties, thermal stability, chemical inertness and good film-forming density, making them suitable for constructing highly reliable separation structures20.

[0110] In this embodiment, applying the above material to at least one of the third to sixth partition layers 203 not only ensures that each film layer has sufficient electrical insulation capability to prevent the formation of conductive paths on the upper structural sidewall of the partition structure 20, but also effectively inhibits water and oxygen permeation and improves the environmental stability of the device.

[0111] Furthermore, by rationally combining different materials, a high etching selectivity ratio between adjacent partition layers can be achieved, thereby precisely controlling the morphology of the multi-level eaves structure.

[0112] For example, when the third partition layer 203 is made of silicon oxide (SiO) and the fourth partition layer 204 is made of silicon nitride (SiN), in the dry etching process with fluorocarbon gas (such as CF4 / CHF3), the etching rate of silicon oxide is significantly higher than that of silicon nitride, which causes the sidewalls of the third partition layer 203 to be preferentially etched, naturally forming the eaves structure at the edge of the fourth partition layer 204.

[0113] Similarly, if the fifth partition layer 205 is made of silicon oxide and the sixth partition layer 206 is made of silicon nitride, the eaves structure at the edge of the sixth partition layer 206 can be achieved under the same etching conditions.

[0114] In some embodiments, silicon nitride (SIN), silicon oxide (SiO), silicon oxynitride (SiON), and aluminum oxide (Al2O3) can be formed by standard semiconductor processes such as chemical vapor deposition (CVD), plasma-enhanced chemical vapor deposition (PECVD), and atomic layer deposition (ALD), exhibiting excellent step coverage and film thickness uniformity, and capable of forming a continuous and dense insulating layer.

[0115] Optional, such as Figure 2 As shown, there is a first included angle θ1 between the bottom surface of the first partition layer 201 and the side surface of the first partition layer 201, and the first included angle θ1 is less than or equal to 60°.

[0116] And / or,

[0117] The bottom surface of the second partition layer 202 and the side surface of the second partition layer 202 have a second included angle θ2, which is less than or equal to 60°.

[0118] The bottom surface of the first partition layer 201 refers to the surface of the first partition layer 201 that is close to the substrate 10, and the bottom surface of the second partition layer 202 refers to the surface of the second partition layer 202 that is close to the substrate 10.

[0119] Specifically, in the manufacturing process of organic light-emitting display devices, the cathode 40 is typically deposited via vacuum evaporation. Since the evaporated particles travel along a straight path, encountering steep steps (such as vertical sidewalls with an angle close to 90° on the film layer) can easily lead to discontinuities in the sidewall and bottom areas, thinning of the film layer, or even breakage. Therefore, if the sidewalls of the first isolation layer 201 or the second isolation layer 202 are too steep, the cathode 40 will have difficulty effectively extending from the pixel region 101 to the upper surface of the second isolation layer 202, thus failing to establish a low-impedance electrical connection with the second isolation layer 202, affecting the reliability of the cathode 40's power supply.

[0120] Based on the above technical issues, such as Figure 2 As shown, controlling the first included angle θ1 between the bottom surface and the side surface of the first partition layer 201 to 60° or less (i.e., the side wall of the first partition layer 201 is gently sloping) makes it easier for the cathode material to climb up the side wall of the first partition layer 201 and continuously cover the second partition layer 202. This improves the continuity of the cathode 40's coverage on the first partition layer 201 and the second partition layer 202, ensuring that it forms a stable electrical connection with the conductive second partition layer 202.

[0121] In some embodiments, controlling the second included angle θ2 between the bottom surface and the side surface of the second partition layer 202 to 60° or less (i.e., the sidewall of the second partition layer 202 is gently sloping) makes it easier for the cathode material to climb up the sidewall of the second partition layer 202 and continuously cover the top surface of the second partition layer 202, thereby effectively improving the coverage continuity of the cathode 40 on the first partition layer 201 and the second partition layer 202, and ensuring that it forms a stable electrical connection with the conductive second partition layer 202.

[0122] In some embodiments, the first included angle θ1 and the second included angle θ2 can be further set to 30° to 60°. This facilitates the climbing of the cathode material while avoiding increasing the lateral space occupied by the partition structure 20, thereby improving pixel density and achieving high-resolution display.

[0123] In some embodiments, after the third to sixth isolation layers 203 are formed by selective etching, the entire material layer of the lower first isolation layer 201 and second isolation layer 202 is patterned using a second photomask. In this step, the etching process parameters are controlled so that the sidewalls of the first isolation layer 201 and the second isolation layer 202 form a gentle slope morphology, that is, the angle between their bottom surface and side surface (such as the first angle θ1 and the second angle θ2) is less than or equal to 60°. This angled sidewall facilitates the subsequent climbing of the cathode 40 along the sidewalls of the first isolation layer 201 and the second isolation layer 202 during the evaporation process, ensuring a reliable electrical connection between it and the conductive second isolation layer 202.

[0124] Optionally, the second included angle θ2 is less than or equal to the first included angle θ1.

[0125] Specifically, the sidewall tilt angle (i.e., the first included angle θ1) of the first partition layer 201 determines the steepness of the initial step transition from the pixel region 101 to the second partition layer 202, while the sidewall tilt angle (i.e., the second included angle θ2) of the second partition layer 202, as a conductive layer that is in direct contact with the cathode 40, will affect whether the cathode material can effectively climb to the upper surface of the second partition layer 202 to achieve a low-resistance electrical connection.

[0126] In this embodiment, θ2≤θ1 is set. At this time, the sidewall of the second partition layer 202 is more gentle (or at least not more steep) than the sidewall of the first partition layer 201, thereby forming a stepped structure with a gentle slope in the vertical direction, which improves the continuous coverage capability of the cathode 40 and enhances the reliability of the electrical connection between the cathode 40 and the second partition layer 202.

[0127] For example, such as Figure 2As shown, setting θ2=θ1 ensures good step coverage performance of the cathode 40 while reducing the process complexity of the partition structure 20. Simultaneously, the sidewalls of the first partition layer 201 and the second partition layer 202 have the same inclination angle, forming a continuous and consistent slope profile in the vertical direction, which helps avoid uneven film deposition on the cathode 40 caused by abrupt angle changes.

[0128] Furthermore, the θ2=θ1 design facilitates the patterning of the first partition layer 201 and the second partition layer 202 using uniform etching process conditions. For example, sidewalls with the same angle can be formed on the first partition layer 201 and the second partition layer 202 in one step without the need to adjust process parameters step by step, thereby simplifying the manufacturing process and reducing production costs.

[0129] In some specific embodiments, the first included angle θ1 and the second included angle θ2 can be set to specific values ​​such as 45°, 50° or 60° at the same time, so as to meet the cathode 40-degree ramp requirement while taking into account the balance between lateral space occupation and pixel aperture ratio.

[0130] Optional, such as Figure 2 As shown, there is a third included angle θ3 between the bottom surface of the third partition layer 203 and the side surface of the third partition layer 203, and the third included angle θ3 is greater than or equal to 90°.

[0131] And / or, there is a fourth included angle θ4 between the bottom surface of the fourth partition layer 204 and the side surface of the fourth partition layer 204, the fourth included angle θ4 being greater than or equal to 90°.

[0132] And / or, there is a fifth included angle θ5 between the bottom surface of the fifth partition layer 205 and the side surface of the fifth partition layer 205, the fifth included angle θ5 being greater than or equal to 90°.

[0133] And / or, there is a sixth included angle θ6 between the bottom surface of the sixth partition layer 206 and the side surface of the sixth partition layer 206, the sixth included angle θ6 being greater than or equal to 90°.

[0134] The bottom surface of the third partition layer 203 refers to the surface of the third partition layer 203 near the substrate 10, the bottom surface of the fourth partition layer 204 refers to the surface of the fourth partition layer 204 near the substrate 10, the bottom surface of the fifth partition layer 205 refers to the surface of the fifth partition layer 205 near the substrate 10, and the bottom surface of the sixth partition layer 206 refers to the surface of the sixth partition layer 206 near the substrate 10.

[0135] Specifically, in the manufacturing process of organic light-emitting display devices, the organic light-emitting layer 30 is usually formed by vacuum evaporation. When encountering the gentle slope sidewall of the film layer, the organic material tends to climb up the slope along the sidewall, which can easily lead to a continuous coverage along the sidewall of the separation structure 20, thereby forming an organic light-emitting layer bridge between adjacent pixel areas 101, causing pixel crosstalk, leakage current or even short circuit.

[0136] In this embodiment, the angle between the bottom and side surfaces of any one or more of the third to sixth partition layers 203 is greater than or equal to 90° (i.e., the sidewalls are vertical or inwardly inclined inverted cones). This makes it difficult for the organic material to adhere stably to the sidewalls of the film during the evaporation process, increasing the difficulty for the organic material to climb upwards along the sidewalls of the film during the evaporation process. This helps to completely cut off the path for the organic light-emitting layer 30 to climb upwards along the sidewalls of the partition structure 20 and form a continuous coverage, ensuring that the organic light-emitting layer 30 is completely interrupted in the adjacent pixel region 101.

[0137] For example, such as Figure 2 As shown, at least one of the third included angle θ3, the fourth included angle θ4, the fifth included angle θ5, and the sixth included angle θ6 is equal to 90°. At this time, at least one of the third partition layer 203, the fourth partition layer 204, the fifth partition layer 205, and the sixth partition layer 206 has a vertical morphology. This can effectively block the organic light-emitting layer 30 from climbing up along the sidewall during the evaporation process, and also avoid increasing the lateral space occupation due to the inward tilt of the sidewall, which is conducive to maintaining a high pixel aperture ratio and display resolution.

[0138] Figure 5 A partial cross-sectional structural diagram of another organic light-emitting display device provided in this embodiment of the present invention is shown below. Figure 5 As shown, for example, at least one of the third included angle θ3, the fourth included angle θ4, the fifth included angle θ5, and the sixth included angle θ6 is greater than 90°. In this case, at least one of the third partition layer 203, the fourth partition layer 204, the fifth partition layer 205, and the sixth partition layer 206 has an inverted conical sidewall, meaning its top width is greater than its bottom width. Thus, during the evaporation process of the organic material, the difficulty of the organic material adhering to the sidewall of the film layer can be further increased, preventing the organic material from climbing upwards along the sidewall of the film layer during the evaporation process. This completely cuts off the path for the organic light-emitting layer 30 to climb upwards along the sidewall of the partition structure 20 and form a continuous coverage, ensuring that the organic light-emitting layer 30 is completely interrupted in the adjacent pixel region 101.

[0139] It should be noted that the included angles of the side walls of the third partition layer 203 to the sixth partition layer 206 (i.e., the third included angle θ3 to the sixth included angle θ6) can be the same or different, and this embodiment of the utility model does not make specific limitations in this regard.

[0140] Furthermore, the first included angle θ1 to the sixth included angle θ6 can be designed independently according to actual process requirements, material characteristics, or device performance targets, and can be combined with each other at any angle size, as long as their respective functional requirements are met.

[0141] Similarly, the thickness of the first partition layer 201 to the sixth partition layer 206 can be set according to the total height of the partition structure 20, process requirements, etc., and they can be combined in any thickness as long as they meet their respective functional requirements.

[0142] Optional, such as Figures 1-5 As shown, the pixel region 101 also includes an organic light-emitting layer 30 disposed on the anode 11. The organic light-emitting layer 30 includes an organic light-emitting layer 30 that emits light of multiple colors. In the row or column direction, the light-emitting colors of the organic light-emitting layers 30 in adjacent pixel regions 101 are different.

[0143] Specifically, such as Figures 1-5 As shown, an organic light-emitting layer 30 is disposed above the anode 11. When electrons and holes are injected into the organic light-emitting layer 30 from the cathode 40 and the anode 11 respectively, the electrons and holes recombine in the organic light-emitting layer 30 to release energy and emit light.

[0144] The material of the organic light-emitting layer 30 determines the color of the light emitted by the organic light-emitting layer 30.

[0145] like Figures 1-5 As shown, pixel region 101 can be divided into red pixel region 101R, green pixel region 101G, and blue pixel region 101B. Organic light-emitting layer 30 can include red organic light-emitting layer 30R disposed in red pixel region 101R, green organic light-emitting layer 30G disposed in green pixel region 101G, and blue organic light-emitting layer 30B disposed in blue pixel region 101B to realize color image display, but is not limited to this. In some embodiments, organic light-emitting layer 30 can also be provided with white or other colored organic light-emitting layers in addition to organic light-emitting layers of the above three colors.

[0146] In this organic light-emitting display device, the organic materials in the red organic light-emitting layer 30R, the green organic light-emitting layer 30G, and the blue organic light-emitting layer 30B are typically different. In the prior art, the fabrication process for an organic light-emitting display device with the aforementioned light-emitting structure usually requires the use of a fine metal mask (FMM) to separately deposit the red, green, and blue organic light-emitting layers. However, due to manufacturing deviations, alignment errors, and thermal deformation issues inherent in the fine metal mask, the film deposition position of the organic light-emitting layer may deviate significantly from the predetermined position. Furthermore, the high cost of the fine metal mask contributes to the high manufacturing cost of the organic light-emitting display device. Moreover, for high-resolution microdisplays, due to the complexity of the process, it is difficult for the fine metal mask to achieve the ultra-small size of the metal cutout openings.

[0147] In this embodiment, the organic light-emitting layer 30 prepared by the separation structure 20 is divided, and the organic light-emitting layers 30 between adjacent pixels are isolated from each other. The corresponding organic light-emitting layer 30 can be formed in each pixel area 101 without the use of a traditional fine metal mask (FMM), and the organic light-emitting layer 30 is separated between each pixel area 101, thereby reducing manufacturing costs.

[0148] Optional, such as Figures 2-5 As shown, the pixel region 101 also includes an organic light-emitting layer 30 disposed on the anode 11, and the organic light-emitting display device also includes a cathode 40 disposed on the organic light-emitting layer 30, and the cathode 40 and the second isolation layer 202 are electrically connected.

[0149] The specific structure of the organic light-emitting layer 30 can be referred to in any of the above embodiments, and will not be repeated here.

[0150] In this embodiment, as Figures 2-5 As shown, the anode 11 and the cathode 40 are located on both sides of the organic light-emitting layer 30. The cathode 40 is used to provide electrons to the organic light-emitting layer 30. When electrons and holes are injected into the organic light-emitting layer 30 from the cathode 40 and the anode 11 respectively, the electrons and holes recombine in the organic light-emitting layer 30 to release energy and emit light.

[0151] It is understandable that during the fabrication of the cathode 40, the cathode 40 will also be disconnected in the shading area under the eaves structure at the edge of the sixth partition layer 206 and the shading area under the eaves structure at the edge of the fourth partition layer 204. If the cathodes 40 of each pixel area 101 are insulated from each other, the cathodes 40 of each pixel area 101 need to be connected to the cathode power supply line separately, which makes the wiring complicated and increases the cost.

[0152] In this embodiment, the cathode 40 and the second isolation layer 202 are electrically connected so that the cathodes 40 of each pixel area 101 can be electrically connected through the second isolation layer 202. This allows the cathodes 40 to be connected to the cathode power supply lines around the display area, thereby enabling power supply to the cathodes 40 of all pixel areas 101. This helps to simplify the wiring structure and reduce costs.

[0153] It should be noted that when preparing the cathode 40, the cathode 40 can cover the sidewall of the organic light-emitting layer 30 at the break point, thereby protecting the organic light-emitting layer 30 and helping to prevent moisture from entering from the sidewall of the organic light-emitting layer 30 at the break point and causing corrosion to the organic light-emitting layer 30.

[0154] In some embodiments, the thickness of the third partition layer 203 and / or the fifth partition layer 205 is greater than the sum of the thicknesses of the organic light-emitting layer 30 and the cathode 40.

[0155] By setting the thickness of the third partition layer 203 to be greater than the sum of the thicknesses of the organic light-emitting layer 30 and the cathode 40, a sufficient height difference can be made between the bottom surface of the fourth partition layer 204 and the top surface of the second partition layer 202. This ensures that the organic light-emitting layer 30 and the cathode 40 are disconnected between the second partition layer 202 and the fourth partition layer 204, which helps to cut off the path of water vapor penetrating into the display device along the organic light-emitting layer 30 and the cathode 40, thus improving the problem of poor display.

[0156] Optionally, the organic light-emitting display device provided in this embodiment is a silicon-based micro-OLED display. This device combines silicon-based integrated circuit (CMOS) technology and organic light-emitting diode (OLED) technology to directly integrate an OLED pixel array onto a silicon wafer, forming a micro-display. Silicon-based micro-OLED displays are characterized by their small size, thinness, low power consumption, high brightness, fast response speed, and wide viewing angle, making them suitable for near-eye display devices such as virtual reality (VR), augmented reality (AR) headsets, head-up display (HUD) systems, micro-projectors, and other portable electronic products with stringent requirements for size, weight, and energy consumption.

[0157] In this embodiment of the present invention, the substrate 10 can be a silicon-based driving backplane, which can form corresponding organic light-emitting layers 30 in each pixel region 101 on the substrate 10 by etching process (e.g., photolithography process including exposure and development steps). The process error can be controlled within ±2μm. Compared with the use of traditional fine metal mask (FMM) to form organic light-emitting layers, smaller pixel size and higher resolution can be achieved, and the manufacturing cost is lower.

[0158] It should be understood that the various forms of the process shown above can be used, with steps reordered, added, or deleted. For example, the steps described in this utility model can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution of this utility model can be achieved, and this is not limited herein.

[0159] The specific embodiments described above do not constitute a limitation on the scope of protection of this utility model. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the scope of protection of this utility model.

Claims

1. An organic light-emitting display device, characterized in that, include: A substrate, the substrate comprising a plurality of pixel regions spaced apart; An anode is disposed within the pixel region, and multiple separating structures are disposed between the pixel regions; The partition structure includes: The first insulating layer is filled between the anodes; A first partition layer is disposed on the first insulating layer, and the first partition layer covers the first insulating layer; A second partition layer is disposed on the first partition layer; A third partition layer is disposed on the second partition layer; A fourth partition layer is disposed on the third partition layer, the edge of the fourth partition layer extending beyond the edge of the third partition layer; A fifth partition layer is disposed on the fourth partition layer; A sixth partition layer is disposed on the fifth partition layer, the edge of the sixth partition layer extending beyond the edge of the fifth partition layer; The vertical projection of the fifth partition layer on the substrate covers the vertical projection of the third partition layer on the substrate, and the vertical projection of the sixth partition layer on the substrate covers the vertical projection of the fourth partition layer on the substrate.

2. The organic light-emitting display device according to claim 1, characterized in that, The edge of the first partition layer extends beyond the edge of the second partition layer; The edge of the first partition layer extends beyond the edge of the fourth partition layer; The edge of the first partition layer extends beyond the edge of the sixth partition layer.

3. The organic light-emitting display device according to claim 1, characterized in that, The first partition layer is made of an insulating material, and the second partition layer is made of a conductive material.

4. The organic light-emitting display device according to claim 1, characterized in that, The material of the first partition layer includes at least one of silicon nitride, silicon oxide, silicon oxynitride, and aluminum oxide.

5. The organic light-emitting display device according to claim 1, characterized in that, The material of the second partition layer includes at least one of titanium nitride, tantalum nitride, indium tin oxide, and indium zinc oxide.

6. The organic light-emitting display device according to claim 1, characterized in that, The material of the third partition layer is different from that of the fourth partition layer; And / or, The material of the fifth partition layer is different from that of the sixth partition layer.

7. The organic light-emitting display device according to claim 6, characterized in that, The material of the third partition layer is the same as the material of the fifth partition layer; And / or, The material of the fourth partition layer is the same as that of the sixth partition layer.

8. The organic light-emitting display device according to claim 1, characterized in that, The materials of the third, fourth, fifth, and sixth partition layers are all insulating materials.

9. The organic light-emitting display device according to claim 1, characterized in that, The material of the third partition layer includes at least one of silicon nitride, silicon oxide, silicon oxynitride, and aluminum oxide; And / or, the material of the fourth partition layer includes at least one of silicon nitride, silicon oxide, silicon oxynitride, and aluminum oxide; And / or, the material of the fifth partition layer includes at least one of silicon nitride, silicon oxide, silicon oxynitride, and aluminum oxide; And / or, the material of the sixth partition layer includes at least one of silicon nitride, silicon oxide, silicon oxynitride, and aluminum oxide.

10. The organic light-emitting display device according to claim 1, characterized in that, There is a first included angle between the bottom surface of the first partition layer and the side surface of the first partition layer, and the first included angle is less than or equal to 60°; And / or, The bottom surface of the second partition layer and the side surface of the second partition layer have a second included angle, which is less than or equal to 60°.

11. The organic light-emitting display device according to claim 10, characterized in that, The second included angle is less than or equal to the first included angle.

12. The organic light-emitting display device according to claim 1, characterized in that, There is a third included angle between the bottom surface of the third partition layer and the side surface of the third partition layer, and the third included angle is greater than or equal to 90°; And / or, there is a fourth included angle between the bottom surface of the fourth partition layer and the side surface of the fourth partition layer, the fourth included angle being greater than or equal to 90°; And / or, there is a fifth included angle between the bottom surface of the fifth partition layer and the side surface of the fifth partition layer, the fifth included angle being greater than or equal to 90°; And / or, there is a sixth included angle between the bottom surface of the sixth partition layer and the side surface of the sixth partition layer, the sixth included angle being greater than or equal to 90°.

13. The organic light-emitting display device according to claim 1, characterized in that, The pixel region also includes an organic light-emitting layer disposed above the anode. The organic light-emitting layer includes an organic light-emitting layer that emits multiple colors of light. In the row or column direction, the organic light-emitting layers in adjacent pixel regions emit different colors of light.

14. The organic light-emitting display device according to claim 3, characterized in that, The pixel area also includes an organic light-emitting layer disposed on the anode, and the organic light-emitting display device also includes a cathode disposed on the organic light-emitting layer, the cathode and the second isolation layer being electrically connected.

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