Display device
Patent Information
- Application Number
- CN202522123427.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-30
- Publication Date
- 2026-09-29
- Estimated Expiration
- 2035-09-30
AI Technical Summary
然而,将光传感器设置于显示面板的屏下,存在屏下光线的视场角(FOV,Field of View)减小的问题
[0015]本申请实施例的显示装置中,在透光封装层的顶面增设侧向光提取结构,侧向光提取结构的至少部分表面相对于透光封装层的厚度方向平行和/或倾斜。这样,可以减小穿过显示面板的侧向光在侧向光提取结构的至少部分表面的反射率,使得更多侧向光通过侧向光提取结构的至少部分表面入射至透光封装层的内部,使得光传感器接收的侧向光变多,提高光传感器的视场角。
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Figure CN224818513U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of display technology, and more particularly to a display device. Background Technology
[0002] In modern electronic devices, light sensors are widely used for functions such as ambient light detection, automatic brightness adjustment, and gesture recognition. With the popularization of full-screen designs, more and more electronic devices are integrating light sensors under the display panel to achieve a higher screen-to-body ratio and a cleaner appearance. However, placing the light sensor under the display panel presents the problem of a reduced field of view (FOV) for under-screen light. Utility Model Content
[0003] This application provides a display device to improve the field of view of the light sensor in the display device, thereby at least partially solving the above-mentioned technical problems.
[0004] To achieve the above objectives, according to a first aspect of this application, a display device is provided. The display device includes a display panel, a light sensor, a light-transmitting encapsulation layer, and a lateral light extraction structure. The display panel includes an opposing light-emitting surface and a back surface. The light sensor is located on the back surface away from the light-emitting surface. The light-transmitting encapsulation layer covers the light sensor. The light-transmitting encapsulation layer includes a top surface near the display panel. The lateral light extraction structure is located on the top surface. At least a portion of the surface of the lateral light extraction structure is parallel and / or inclined relative to the thickness direction of the light-transmitting encapsulation layer.
[0005] Optionally, the lateral light extraction structure includes a groove that is recessed into the interior of the light-transmitting encapsulation layer from the top surface; and / or, the lateral light extraction structure includes a protrusion that protrudes in a direction away from the light sensor.
[0006] Optionally, the longitudinal section of the groove may have a V-shape, and the longitudinal section is parallel to the thickness direction of the light-transmitting encapsulation layer.
[0007] Optionally, the cross-sectional shape of the groove includes at least one of a circle and a polygon, and the cross-section of the groove is perpendicular to the thickness direction of the light-transmitting encapsulation layer.
[0008] Optionally, the lateral light extraction structure includes a plurality of the grooves, wherein the distance between adjacent grooves is less than or equal to 30 micrometers.
[0009] Optionally, the depth of the groove is H, and the top opening of the groove has a one-dimensional dimension W, where H and W satisfy the formula H / W≤3.
[0010] Optionally, the depth H of the groove is greater than or equal to 5 micrometers and less than or equal to 30 micrometers.
[0011] Optionally, the depth of the groove is less than the distance between the bottom of the groove and the light sensor.
[0012] Optionally, the top surface includes at least one of a plane and a curved surface.
[0013] Optionally, the display panel includes a driving substrate, a light-emitting device layer, a light-shielding matrix layer, and a color filter layer. The light-emitting device layer is located on the driving substrate, the light-shielding matrix layer is located on the side of the light-emitting device layer opposite to the driving substrate and includes a light-transmitting opening, and the color filter layer is located at least in the light-transmitting opening.
[0014] Optionally, the lateral light extraction structure and the light-transmitting encapsulation layer are an integral structure.
[0015] In the display device of this application embodiment, a lateral light extraction structure is added to the top surface of the light-transmitting encapsulation layer. At least a portion of the surface of the lateral light extraction structure is parallel and / or inclined relative to the thickness direction of the light-transmitting encapsulation layer. This reduces the reflectivity of lateral light passing through the display panel on at least a portion of the surface of the lateral light extraction structure, allowing more lateral light to enter the interior of the light-transmitting encapsulation layer through the at least a portion of the surface of the lateral light extraction structure. This increases the amount of lateral light received by the light sensor and improves the field of view of the light sensor. Attached Figure Description
[0016] Figure 1 This is a schematic diagram of a display device provided in an exemplary embodiment of this application;
[0017] Figure 2 This is a cross-sectional view of a display panel provided in an exemplary embodiment of this application;
[0018] Figure 3 This is a cross-sectional view of the light sensor and the light-transmitting encapsulation layer provided in an exemplary embodiment of this application located on a carrier plate;
[0019] Figure 4 This is another cross-sectional view of the light sensor and the light-transmitting encapsulation layer provided in the exemplary embodiment of this application located on the carrier plate;
[0020] Figure 5 This is another cross-sectional view of the light sensor and the light-transmitting encapsulation layer provided in the exemplary embodiments of this application located on the carrier plate;
[0021] Figure 6 This is another cross-sectional view of the light sensor and the light-transmitting encapsulation layer provided in the exemplary embodiments of this application located on the carrier plate;
[0022] Figure 7 This is another cross-sectional view of the light sensor and the light-transmitting encapsulation layer provided in the exemplary embodiments of this application located on the carrier plate;
[0023] Figure 8 This is a schematic diagram of a planar structure with a groove provided in the light-transmitting encapsulation layer according to an exemplary embodiment of the application;
[0024] Figure 9 This is a schematic diagram of another planar structure with a groove provided in the light-transmitting encapsulation layer according to the exemplary embodiment of the application;
[0025] Figure 10 This is a schematic diagram of another planar structure with a groove provided in the light-transmitting encapsulation layer provided in the exemplary embodiment of the application;
[0026] Figure 11 This is a schematic diagram of another planar structure with a groove provided in the light-transmitting encapsulation layer provided in the exemplary embodiment of the application;
[0027] Figure 12 This is a schematic diagram of another planar structure with a groove provided in the light-transmitting encapsulation layer provided in the exemplary embodiment of the application;
[0028] Figure 13 This is a schematic diagram of another planar structure of the light-transmitting encapsulation layer with grooves provided in the exemplary embodiment of the application.
[0029] Explanation of reference numerals in the attached figures:
[0030] 100. Display device;
[0031] 10. Display panel; 101. Light-emitting surface; 102. Back side; 103. Light-transmitting area;
[0032] 11. Driving substrate; 12. Light-emitting device layer; 13. Light-shielding matrix layer; 131. Light-transmitting opening; 14. Color filter layer; 15. Thin film encapsulation layer;
[0033] 20. Optical sensor;
[0034] 21. Carrier plate;
[0035] 23. Transparent encapsulation layer; 231. Top surface; 232. Plane; 233. Curved surface;
[0036] 24. Outer shell; 241. Opening of the outer shell;
[0037] 30. Lateral light extraction structure;
[0038] 31. Groove; 310. Inner surface; 311. First groove; 312. Second groove; 313. Third groove; 314. Fourth groove; 315. Fifth groove; 31A. Groove group;
[0039] 32. Protrusion; 321. Side surface;
[0040] X, first direction; Y, second direction; Z, thickness direction of the light-transmitting encapsulation layer;
[0041] L, target light; SL, side light;
[0042] N1, N2, normal. Detailed Implementation
[0043] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the protection scope of this application.
[0044] Figure 1 This is a schematic diagram of a display device provided in an exemplary embodiment of this application.
[0045] Please see Figure 1 The display device 100 includes a display panel 10 and a light sensor 20. The display panel 10 includes an opposing light-emitting surface 101 and a back surface 102. The light sensor 20 is located on the back surface 102 away from the light-emitting surface 101 and is configured to sense a target light L. The target light L is incident from the light-emitting surface 101, passes through the display panel 10, and is emitted from the back surface 102, ultimately being received by the light sensor 20. The target light L may include, but is not limited to, ambient light. The light sensor 20 can detect ambient light to achieve ambient light detection, automatic brightness adjustment, gesture recognition, and target object imaging.
[0046] In order to improve the transmittance of the target light L through the display panel 10, a light-transmitting area 103 can be provided inside the display panel 10. The light-transmitting area 103 may have a light-transmitting hole or no light-shielding structure such as a metal layer.
[0047] Figure 2 This is a cross-sectional view of a display panel provided in an exemplary embodiment of this application.
[0048] In some embodiments, please refer to Figure 2The display panel 10 includes a driving substrate 11, a light-emitting device layer 12, a light-shielding matrix layer 13, and a color filter layer 14. The light-emitting device layer 12 is located on the driving substrate 11. The light-shielding matrix layer 13 is located on the side of the light-emitting device layer 12 facing away from the driving substrate 11 and includes a light-transmitting opening 131. A portion of the light-transmitting opening 131 is located in the light-transmitting area 103 to ensure that target light L can pass through the light-shielding matrix layer 13 and enter the interior of the display panel 10. The color filter layer 14 is located at least within the light-transmitting opening 131. The color filter layer 14 includes at least two different color resist units. Because the display panel 10 includes the color filter layer 14 and the light-shielding matrix layer 13, the reflectivity of the display panel 10 to ambient light can be reduced, improving display contrast.
[0049] The driving substrate 11 may include a substrate and a driving circuit layer, with the driving circuit layer located on the substrate. The substrate may include a rigid substrate such as a glass substrate or a flexible substrate. The driving circuit layer includes multiple driving circuits.
[0050] The light-emitting device layer 12 may include an anode layer, a light-emitting functional layer, and a cathode layer. The anode layer may include multiple anodes spaced apart, and the anodes are connected to the driving circuit. The light-emitting functional layer may include multiple organic light-emitting layers, with one organic light-emitting layer disposed on one anode. The cathode layer covers the multiple organic light-emitting layers.
[0051] In some embodiments, the display panel 10 further includes a thin-film encapsulation layer 15, which is located between the light-shielding matrix layer 13 and the light-emitting device layer 12. The thin-film encapsulation layer 15 may include two inorganic encapsulation layers and one organic encapsulation layer, with the organic encapsulation layer located between the two inorganic encapsulation layers.
[0052] Figure 3 This is a cross-sectional view of the light sensor and the light-transmitting encapsulation layer provided in an exemplary embodiment of this application located on a carrier plate. Figure 4 This is another cross-sectional view of the light sensor and the light-transmitting encapsulation layer provided in the exemplary embodiment of this application located on the carrier plate. Figure 5 This is another cross-sectional view of the light sensor and the light-transmitting encapsulation layer provided in the exemplary embodiments of this application located on the carrier plate. Figure 6 This is another cross-sectional view of the light sensor and the light-transmitting encapsulation layer provided in the exemplary embodiments of this application located on the carrier plate. Figure 7 This is another cross-sectional view of the light sensor and the light-transmitting encapsulation layer provided in the exemplary embodiments of this application located on the carrier plate.
[0053] In some embodiments, please refer to Figures 3 to 7The display device 100 also includes a carrier plate 21 and a light-transmitting encapsulation layer 23, with the light sensor 20 located on the carrier plate 21. The light-transmitting encapsulation layer 23 covers the light sensor 20 to protect it. The light-transmitting encapsulation layer 23 is also located on the carrier plate 21, so that the carrier plate 21 supports the light-transmitting encapsulation layer 23. Furthermore, since the light-transmitting encapsulation layer 23 is light-transmitting, the target light L passing through the display panel 10 can pass through the light-transmitting encapsulation layer 23 before being received by the light sensor 20.
[0054] In some embodiments, the thickness Th of the light-transmitting encapsulation layer 23 can be 200 micrometers to 750 micrometers, reducing the difficulty of forming the light-transmitting encapsulation layer 23 while ensuring the protective effect of the light-transmitting encapsulation layer 23 on the photosensitive sensor 20 and ensuring the transmittance of the light-transmitting encapsulation layer 23 to the target light L. The light-transmitting encapsulation layer 23 may include cured epoxy resin or other organic light-transmitting materials.
[0055] In some embodiments, please refer to Figures 3 to 7 The light-transmitting encapsulation layer 23 includes a top surface 231 near the display panel 10. The display device 100 also includes a lateral light extraction structure 30. The lateral light extraction structure 30 is located on the top surface 231. At least a portion of the surface of the lateral light extraction structure 30 is parallel and / or inclined relative to the thickness direction Z of the light-transmitting encapsulation layer 23. The thickness direction Z of the light-transmitting encapsulation layer is parallel to the direction in which the light sensor 20 points towards the display panel 10. Thus, by adding the lateral light extraction structure 30 to the top surface 231 of the light-transmitting encapsulation layer 23, the reflectivity of the lateral light SL incident laterally in the target light L passing through the display panel 10 is reduced on at least a portion of the surface of the lateral light extraction structure 30, allowing more lateral light SL to pass through at least a portion of the surface of the lateral light extraction structure 30 and enter the interior of the light-transmitting encapsulation layer 23. This increases the amount of lateral light SL received by the light sensor 20, thereby improving the field of view of the light sensor 20.
[0056] Furthermore, compared to other structures in the display device 100, the light-transmitting encapsulation layer 23 is a film layer closer to the light sensor 20. The lateral light extraction structure 30 is formed on its top surface 231, allowing more lateral light SL to be incident on the interior of the light-transmitting encapsulation layer 23, thus enabling the light sensor 20 to receive more lateral light SL. Additionally, by forming the lateral light extraction structure 30 on the top surface 231 of the light-transmitting encapsulation layer 23, the structure of the display panel 10 does not need to be changed, nor is an additional structure required for the lateral light extraction structure 30, simplifying the composition of the display device 100 and the manufacturing process of the display panel.
[0057] It should be noted that when the display panel 10 includes a light-shielding matrix layer 13, the absorption of light by the light-shielding rectangular layer reduces the amount of target light L passing through the display panel 10. In this embodiment, a lateral light extraction structure 30 is provided on the light-transmitting encapsulation layer 23, which is closest to the light sensor 20. This lateral light extraction structure 30 allows more lateral light SL to enter the interior of the light-transmitting encapsulation layer 23, particularly more lateral light SL with larger incident angles. This improves the field of view of the light sensor 20 when the display panel includes the light-shielding matrix layer 13 and the color filter layer 14.
[0058] In some embodiments, the lateral light extraction structure 30 can be integrally formed with the light-transmitting encapsulation layer 23. In this way, the lateral light extraction structure 30 and the light-transmitting encapsulation layer 23 can be formed simultaneously, simplifying the formation process of the lateral light extraction structure 30 and the light-transmitting encapsulation layer 23.
[0059] In other embodiments, the lateral light extraction structure 30 and the light-transmitting encapsulation layer 23 can be two independent structures. In this case, the lateral light extraction structure 30 and the light-transmitting encapsulation layer 23 can be made of different materials.
[0060] In some embodiments, please refer to Figures 3 to 7 The lateral light extraction structure 30 may include a groove 31 recessed from the top surface 231 into the interior of the light-transmitting encapsulation layer 23; and / or, the lateral light extraction structure 30 may include a protrusion 32 protruding in a direction away from the light sensor 20. Since at least a portion of the side surfaces of the groove 31 and the protrusion 32 can be parallel and / or inclined relative to the thickness direction Z of the light-transmitting encapsulation layer 23 when the groove 31 and the protrusion 32 are located on the top surface 231, at least a portion of the side surfaces of the groove 31 and the protrusion 32 can be used to allow more lateral light SL to be incident into the interior of the light-transmitting encapsulation layer 23.
[0061] In some embodiments, please refer to Figure 3 The lateral light extraction structure 30 may include a protrusion 32 that protrudes away from the light sensor 20. Since the incident angle of the lateral light SL on the side surface 321 of the protrusion 32 can be small, the transmittance of the lateral light SL through the side surface 321 of the protrusion 32 is improved, and more lateral light SL enters the interior of the light-transmitting encapsulation layer 23 through the protrusion 32.
[0062] In some embodiments, the protrusion 32 is located on the top surface 231, and the protrusion 32 and the light-transmitting encapsulation layer 23 can be an integral structure. In this case, the material of the protrusion 32 can be the same as the material of the light-transmitting encapsulation layer 23, and the protrusion 32 can be formed by patterning a light-transmitting encapsulation layer, simplifying the formation process of the side light extraction structure 30.
[0063] In other embodiments, the protrusion 32 may also be an additional light-transmitting structure provided on the top surface 231, allowing for more flexible design of the protrusion 32. When the protrusion 32 is an additional light-transmitting structure provided on the top surface 231, the difference between the refractive index of the protrusion 32 and the refractive index of the light-transmitting encapsulation layer 23 can be smaller.
[0064] In some embodiments, the three-dimensional shape of the protrusion 32 may include at least one of a cuboid, cube, triangular prism, quadrangular prism, semi-cylinder, hemisphere, cone, and pyramid.
[0065] In some embodiments, please refer to Figure 3 The shape of the longitudinal section of the protrusion 32 may include a triangle. The longitudinal section of the protrusion 32 is parallel to the thickness direction Z of the light-transmitting encapsulation layer. It is understood that the shape of the longitudinal section of the protrusion 32 may also include at least one of a rectangle, a trapezoid, an inverted trapezoid, and a semicircle.
[0066] In some embodiments, the shape of the cross-section of the protrusion 32 may include at least one of a circle and a polygon, and the cross-section of the protrusion 32 is perpendicular to the thickness direction Z of the light-transmitting encapsulation layer.
[0067] In some embodiments, when the protrusion 32 is located on and in contact with the top surface 231, the distance from the bottom surface of the protrusion 32 in contact with the top surface 231 to the light sensor 20 can be 200 micrometers to 700 micrometers, so that the distance from the bottom surface of the protrusion 32 to the light sensor 20 is within a suitable range, thereby increasing the incident rate of lateral light SL into the interior of the light-transmitting encapsulation layer 23 and reducing the risk that the overall thickness of the display device 100 will be too thick due to the excessive distance from the bottom surface of the protrusion 32 to the light sensor 20.
[0068] In some embodiments, the height of the protrusion 32 can be 5 micrometers to 30 micrometers, ensuring that the protrusion 32 increases the incident rate of lateral light SL into the interior of the light-transmitting encapsulation layer 23, and reduces the risk that the thickness of the light sensor 20 will be too thick due to the excessive height of the protrusion 32, thereby reducing the risk that the thickness of the display device 100 will be too thick.
[0069] In some embodiments, please refer to Figures 4 to 7 The lateral light extraction structure 30 may include a groove 31, which is recessed from the top surface 231 into the interior of the light-transmitting encapsulation layer 23. In this way, the groove 31 can be formed on the light-transmitting encapsulation layer 23 by processes such as imprinting to form the lateral light extraction structure 30, thus simplifying the formation process of the lateral light extraction structure 30.
[0070] like Figure 4As shown, when the lateral light extraction structure 30 includes a groove 31, for lateral light SL with a large incident angle, the angle α between the lateral light SL and the normal N1 of the top surface 231 is also large, resulting in a greater possibility that the lateral light SL will be reflected and a reduced possibility that it will pass through the top surface 231. In contrast, the groove 31 in this embodiment typically includes an inner surface 310, which is inclined or perpendicular to the top surface 231. The angle b between the lateral light SL and the normal N2 of the inner surface 310 is smaller, reducing the possibility that the lateral light SL will be reflected by the inner surface 310 and increasing the possibility that it will enter the interior of the light-transmitting encapsulation layer 23. That is, the inner surface 310 of the groove 31 can increase the transmittance of the lateral light SL incident into the interior of the light-transmitting encapsulation layer 23 and increase the field of view of the light sensor 20.
[0071] In some embodiments, please refer to Figure 4 and Figure 5 At least one inner surface 310 of a groove 31 is inclined relative to the thickness direction Z of the light-transmitting encapsulation layer 23.
[0072] In some embodiments, please refer to Figure 6 At least one inner surface 310 of a groove 31 is parallel to the thickness direction Z of the light-transmitting encapsulation layer 23.
[0073] In some embodiments, please refer to Figure 7 At least one inner surface 310 of a groove 31 includes a first inner surface 311 and a second inner surface 312 connected to each other. The first inner surface 311 is parallel to the thickness direction Z of the light-transmitting encapsulation layer 23, and the second inner surface 312 is inclined to the thickness direction Z of the light-transmitting encapsulation layer 23.
[0074] In some embodiments, the three-dimensional shape of the groove 31 includes, but is not limited to, at least one of a cuboid, cube, triangular prism, square prism, semi-cylinder, hemisphere, cone, and pyramid. Among them, the pyramid includes, but is not limited to, triangular pyramid, square pyramid, pentagonal pyramid, and hexagonal pyramid.
[0075] In some embodiments, please refer to Figure 4 and Figure 5The longitudinal cross-section of the groove 31 has a V-shape, and the cross-section is parallel to the thickness direction Z of the light-transmitting encapsulation layer. Because the longitudinal cross-section of the groove 31 has a V-shape, the groove 31 includes at least two inclined inner surfaces 310. The angle between the lateral light SL and the normal N2 of the inner surface 310 of the groove 31 can be smaller, increasing the transmittance of the lateral light SL through the at least two inner surfaces 310 of the groove 31. Furthermore, when the longitudinal cross-section of the groove 31 has a V-shape, the area of the inner surface 310 of the groove 31 that is parallel or inclined relative to the thickness direction Z of the light-transmitting encapsulation layer 23 can be larger, allowing more lateral light SL to pass through the inner surface 310 of the groove 31.
[0076] In some embodiments, please refer to Figure 6 The longitudinal cross-section of the groove 31 may also include a first side, a second side, and a bottom edge, with the bottom edge connecting the first side and the second side. The first side and the second side are parallel to the thickness direction Z of the light-transmitting encapsulation layer 23. The bottom edge is perpendicular to the thickness direction Z of the light-transmitting encapsulation layer 23.
[0077] In some embodiments, the shape of the longitudinal section of the groove 31 may also include an arc shape, which includes, but is not limited to, a circular arc and an elliptical arc.
[0078] In some embodiments, the depth H of the groove 31 can be greater than or equal to 5 micrometers and less than or equal to 30 micrometers to control the depth H of the groove 31 within a suitable range, allowing more lateral light SL to pass through the inner surface 310 of the groove 31 and enter the interior of the light-transmitting encapsulation layer 23, while reducing the risk that the protective performance of the light-transmitting encapsulation layer 23 for the light sensor 20 will decrease due to the groove 31 being too deep. Optionally, the depth H of the groove 31 can be 8 micrometers to 25 micrometers, or 10 micrometers to 22 micrometers.
[0079] In some embodiments, the depth H of the groove 31 is less than the distance between the bottom of the groove 31 and the photosensor 20. Thus, even if the groove 31 is formed on the light-transmitting encapsulation layer 23 to allow more lateral light SL to pass through the inner surface of the groove 31 and enter the interior of the light-transmitting encapsulation layer 23, the protective performance of the light-transmitting encapsulation layer 23 for the photosensor 20 will not be substantially affected. In some embodiments, the ratio of the distance between the bottom of the groove 31 and the photosensor 20 to the depth H of the groove 31 can be greater than or equal to 2 and less than or equal to 70.
[0080] In some embodiments, the lateral light extraction structure 30 may simultaneously include Figure 3 The protrusion 32 shown and Figures 4 to 7 At least one groove 31 is shown.
[0081] In some embodiments, please refer to Figures 3 to 7The top surface 231 may include at least one of a plane 232 and a curved surface 233.
[0082] In some embodiments, please refer to Figure 3 , Figure 4 , Figure 6 as well as Figure 7 The top surface 231 may include a plane 232, which may be parallel to the carrier plate 21 to simplify the formation process of the light-transmitting encapsulation layer 23.
[0083] In some embodiments, please refer to Figure 5 The top surface 231 may also include a curved surface 233. The curved surface 233 has a higher transmittance for lateral light SL. It can work with the lateral light extraction structure 30 to allow more lateral light SL to enter the interior of the light-transmitting encapsulation layer 23 and then be received by the light sensor 20.
[0084] In some embodiments, the top surface 231 may include both a plane 232 and a curved surface 233, and the groove 31 is recessed from the plane 232 into the interior of the light-transmitting encapsulation layer 23.
[0085] In some embodiments, please refer to Figure 7 The display device 100 may further include a housing 24, which is located on a carrier plate 21 and has a housing opening 241 that exposes a light-transmitting encapsulation layer 23. The housing 24 can reduce the interference of ambient light on the target light L, while allowing the target light L to enter the light-transmitting encapsulation layer 23 inside through the housing opening 241. The housing 24 may be opaque.
[0086] In some embodiments, the side light extraction structure 30 may overlap with both the housing opening 241 and the housing 24 to increase the layout area of the side light extraction structure 30, so that more side light SL can be incident into the light-transmitting encapsulation layer 23 through the side light extraction structure 30, thereby improving the field of view of the light sensor and increasing the light sensitivity of the light sensor 20.
[0087] The following description, in conjunction with the side light extraction structure 30 including the groove 31, describes the cross-sectional and planar layout design of the side light extraction structure 30. It is understood that the protrusion 32 can adopt the same cross-sectional and planar layout design as the groove 31 described below.
[0088] Figure 8 This is a schematic diagram of a planar structure with a groove provided in the light-transmitting encapsulation layer according to an exemplary embodiment of the application. Figure 9 This is a schematic diagram of another planar structure of the light-transmitting encapsulation layer with grooves provided in the exemplary embodiment of the application. Figure 10 This is a schematic diagram of another planar structure of the light-transmitting encapsulation layer with grooves provided in the exemplary embodiment of the application. Figure 11This is a schematic diagram of another planar structure of the light-transmitting encapsulation layer with grooves provided in the exemplary embodiment of the application. Figure 12 This is a schematic diagram of another planar structure of the light-transmitting encapsulation layer with grooves provided in the exemplary embodiment of the application. Figure 13 This is a schematic diagram of another planar structure of the light-transmitting encapsulation layer with grooves provided in the exemplary embodiment of the application.
[0089] In some embodiments, please refer to Figures 8 to 13 The cross-sectional shape of the groove 31 includes at least one of a circle and a polygon. The cross-section of the groove 31 is perpendicular to the thickness direction Z of the light-transmitting encapsulation layer 23, that is, the cross-section of the groove 31 is parallel to the carrier plate 21.
[0090] In some embodiments, please refer to Figure 8 and Figure 9 The plurality of grooves 31 may include a first groove 311, and the cross-sectional shape of the first groove 311 may include an elongated shape. When the cross-sectional shape of the first groove 311 includes an elongated shape and the longitudinal section of the first groove 311 includes a V-shape, the three-dimensional shape of the first groove 311 may be a triangular prism.
[0091] When the cross-section of the first groove 311 is elongated, the first groove 311 may extend along at least one of the first direction X and the second direction Y. The first direction X intersects the second direction Y, and both the first direction X and the second direction Y intersect the thickness direction Z of the light-transmitting encapsulation layer 23. In one example, the first direction X is perpendicular to any two of the second direction Y and the thickness direction Z of the light-transmitting encapsulation layer, but this is not a limitation.
[0092] In one example, see Figure 8 Multiple first grooves 311 extend along the second direction Y. This can improve the transmittance of lateral light SL incident from the first direction X through the inner surface 310 of the first grooves 311.
[0093] See another example. Figure 9 A portion of the first groove 311 extends along the first direction X, and another portion of the first groove 311 extends along the second direction Y. The first groove 311 and the other portion of the first groove 311 can intersect, which can improve the transmittance of lateral light SL incident from the first direction X and the second direction Y through the inner surface 310 of the first groove 311.
[0094] In some embodiments, the light-transmitting encapsulation layer 23 may have a length and a width, and the length of the light-transmitting encapsulation layer 23 may be greater than or equal to the width of the light-transmitting encapsulation layer 23. In one example, the first direction X may be the length direction of the light-transmitting encapsulation layer 23, and the second direction Y may be the width direction of the light-transmitting encapsulation layer 23, but is not limited thereto.
[0095] In some embodiments, please refer to Figure 10 The multiple grooves 31 may include multiple second grooves 312 arranged in an array, and the cross-sectional shape of the second groove 312 may be circular. When the cross-sectional shape of the second groove 312 is circular and the longitudinal section shape is triangular, the three-dimensional shape of the second groove 312 may be conical. When the three-dimensional shape of the second groove 312 is conical, the transmittance of the lateral light SL incident from various angles through the inner surface 310 of the second groove 312 is the same or tends to be the same, so that the maximum viewing angle of the lateral light SL incident from various angles received by the light sensor 20 is the same or tends to be the same, thereby improving the symmetry of the field of view.
[0096] In some embodiments, please refer to Figure 11 The plurality of grooves 31 may include a plurality of third grooves 313, at least some of which are arranged in a point-symmetric manner to improve the symmetry of the field of view. In some embodiments, the cross-sectional shape of the third groove 313 may include a triangle and the longitudinal section may also include a triangle, in which case the shape of the third groove 313 may be a triangular pyramid.
[0097] In other embodiments, the shape of the cross-section of the third groove 313 may also include a quadrilateral, pentagon, hexagon, or other polygon.
[0098] In some embodiments, please refer to Figure 12 and Figure 13 The multiple grooves 31 may also include multiple groove groups 31A, which are arranged in an array. A groove group 31A includes a fourth groove 314 and multiple fifth grooves 315, which are arranged around a fourth groove 314. In this way, the amount of light incident on the light-transmitting encapsulation layer 23 by the lateral light SL in the corresponding areas of the fourth groove 314 and the corresponding areas of the fifth grooves 315 can be adjusted more flexibly as needed.
[0099] In some embodiments, please refer to Figure 12 The shape of the fourth groove 314 may differ from the shape of the fifth groove 315. In some embodiments, the number of sides of the cross-section of the fourth groove 314 may differ from the number of sides of the cross-section of the fifth groove 315, allowing the shapes of the fourth groove 314 and the fifth groove 315 to be different. In one example, the cross-section of the fourth groove 314 has 4 sides, and the cross-section of the fifth groove 315 has 5 sides.
[0100] In some embodiments, please refer to Figure 13The shape of the fourth groove 314 can be the same as the shape of the fifth groove 315. When the shape of the fourth groove 314 is the same as the shape of the fifth groove 315, the area of the maximum cross-section of the fourth groove 314 is different from the area of the maximum cross-section of the fifth groove 315, and / or, the depth of the fourth groove 314 is different from the depth of the fifth groove 315.
[0101] In some embodiments, when the lateral light extraction structure 30 includes a plurality of grooves 31, the distance between adjacent grooves 31 is less than or equal to 30 micrometers. This results in a higher overall incident rate of lateral light SL into the transparent encapsulation layer 23 in the regions corresponding to adjacent grooves 31.
[0102] In one example, the distance between adjacent grooves 31 can be equal to 0 micrometers, and a protrusion is provided between adjacent grooves 31.
[0103] In another example, the distance between adjacent grooves 31 can also be greater than 0 micrometers, and a light-shielding layer (not shown in the figure) can be provided on the top surface 231 between adjacent grooves 31. The light-shielding layer can absorb or reflect vertical light. The light-shielding layer includes, but is not limited to, an ink layer.
[0104] In some embodiments, please refer again Figure 4 The groove 31 has a depth of H, and its top opening has a one-dimensional dimension W, where H and W satisfy the formula H / W ≤ 3. This reduces the difficulty of forming the groove 31. The one-dimensional dimension W can be either the side length or the diameter of the top opening. Figure 8 As shown, when the cross-section of the groove 31 is polygonal, the one-dimensional dimension W of the top opening of the groove 31 can be the dimension of the shorter side of the top opening; as shown... Figure 10 As shown, when the cross-section of the groove 31 is circular, the one-dimensional dimension W of the top opening of the groove 31 can be the diameter of the circle; as Figure 11 As shown, when the cross-section of the groove 31 is triangular, the one-dimensional dimension W of the top opening of the groove 31 can be the side length of the triangle.
[0105] In some embodiments, H / W≥0.1, such that the depth H of the groove 31 is large enough to allow more lateral light SL to pass through the inner surface 310 of the groove 31 and enter the interior of the light-transmitting encapsulation layer 23.
[0106] Optionally, 0.8 ≤ H / W ≤ 2.5 ensures that the aspect ratio of the groove 31 is within a suitable range, allowing more lateral light SL to pass through the inner surface 310 of the groove 31 and enter the interior of the light-transmitting encapsulation layer 23, while reducing the risk of damage to the groove 31 during its formation. Optionally, H / W can also be 1 to 2.
[0107] In summary, in the display device of this application embodiment, a lateral light extraction structure is added to the top surface of the light-transmitting encapsulation layer, and at least a portion of the surface of the lateral light extraction structure is parallel and / or inclined relative to the thickness direction of the light-transmitting encapsulation layer. In this way, at least a portion of the surface of the lateral light extraction structure can reduce the reflection of lateral light passing through the display panel, allowing more lateral light to enter the interior of the light-transmitting encapsulation layer through at least a portion of the surface of the lateral light extraction structure, thereby increasing the amount of lateral light received by the light sensor and improving the field of view of the light sensor.
[0108] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.
[0109] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.
[0110] The embodiments, implementation methods, and related technical features of this application can be combined and substituted for each other without conflict.
[0111] The above are merely preferred embodiments of this application and are not intended to limit this application in any way. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of this application without departing from the scope of the technical solution of this application shall still fall within the scope of the technical solution of this application.
Claims
1. A display device, characterized in that, include: The display panel includes a light-emitting surface and a back surface; A light sensor is located on the back side away from the light-emitting surface; A light-transmitting encapsulation layer covers the light sensor and includes a top surface near the display panel; A lateral light extraction structure is located on the top surface, and at least a portion of the surface of the lateral light extraction structure is parallel and / or inclined relative to the thickness direction of the light-transmitting encapsulation layer.
2. The display device according to claim 1, characterized in that, The lateral light extraction structure includes a groove, the groove being recessed into the interior of the light-transmitting encapsulation layer from the top surface; and / or The lateral light extraction structure includes a protrusion that protrudes away from the light sensor.
3. The display device according to claim 2, characterized in that, The longitudinal section of the groove has a V-shape, and the longitudinal section is parallel to the thickness direction of the light-transmitting encapsulation layer.
4. The display device according to claim 2, characterized in that, The cross-sectional shape of the groove includes at least one of a circle and a polygon, and the cross-section of the groove is perpendicular to the thickness direction of the light-transmitting encapsulation layer.
5. The display device according to claim 2, characterized in that, The lateral light extraction structure includes a plurality of grooves, and the distance between adjacent grooves is less than or equal to 30 micrometers.
6. The display device according to claim 2, characterized in that, The groove has a depth of H, and the top opening of the groove has a one-dimensional dimension W, where H and W satisfy the formula H / W≤3.
7. The display device according to claim 2, characterized in that, The depth H of the groove is greater than or equal to 5 micrometers and less than or equal to 30 micrometers.
8. The display device according to claim 2, characterized in that, The depth H of the groove is less than the distance between the bottom of the groove and the light sensor.
9. The display device according to claim 1, characterized in that, The top surface includes at least one of a plane and a curved surface.
10. The display device according to claim 1, characterized in that, The lateral light extraction structure and the light-transmitting encapsulation layer are an integral structure.