Gas processing system and vacuum process apparatus

Abstract

The utility model provides a kind of gas treatment system and vacuum process equipment.Gas treatment system includes flow pipe body and plasma generator.Flow pipe body includes air inlet and exhaust port, wherein there is accommodation space between air inlet and exhaust port.Plasma generator is configured to generate plasma in accommodation space.Thereby, the probability of equipment jamming and the number of tripping can be reduced, thereby improving equipment uptime and process yield.

Description

Technical Field

[0001] This utility model relates to a gas processing system, and more particularly to a gas processing system and a vacuum process equipment including the same. Background Technology

[0002] Existing semiconductor factories using process equipment such as dry etching equipment often generate various highly viscous and incompressible process byproducts at the downstream end of the equipment. For example, when the process gases are BCl3, Cl2, and CF4, the process byproducts contain complexes of silicon, carbon, chlorine, fluorine, and boron. These complex byproducts easily condense in the pump compression section. The accumulated condensate can flake off, potentially causing blockages in the exhaust gas pipeline and / or the pump itself after water is drawn in, leading to pump seizures and frequent equipment downtime. Furthermore, process byproducts can easily adhere to the walls of the exhaust pipe, forming corrosive solid complexes. When these complexes become too thick and flake off, they can be drawn into the pump, also causing seizures. Therefore, the generation of process byproducts in existing process equipment not only reduces production uptime and yield but also incurs high maintenance costs.

[0003] Current solutions include regularly replacing exhaust pipes or installing filters, but these methods do not effectively address the root cause of the problem.

[0004] In view of this, there is an urgent need to provide a gas handling system and vacuum process equipment to improve process yield and equipment uptime. Utility Model Content

[0005] One aspect of this utility model is to provide a gas processing system, which generates plasma through a plasma generator to convert the gas produced by the process into an easily removable gas or solid.

[0006] Another aspect of this utility model is to provide a vacuum process device, which involves connecting a gas processing system between a vacuum chamber and a pump to process the exhaust gas discharged from the vacuum chamber.

[0007] According to one embodiment of the present invention, a gas processing system is provided, comprising a flow pipe body and a plasma generator. The flow pipe body includes at least one inlet and at least one outlet, wherein a receiving space is provided between the at least one inlet and the at least one outlet. The plasma generator is configured to generate plasma within the receiving space.

[0008] According to one embodiment of the present invention, the gas treatment system further includes a gas trap disposed within the accommodating space, wherein the gas trap is disposed between the plasma generator and the exhaust port.

[0009] According to one embodiment of the present invention, the gas trap is a condenser trap or a chemical adsorber, and the condenser trap includes a water cooling device or an electric cooling device.

[0010] According to one embodiment of the present invention, the plasma generator is selected from at least one of the group consisting of plasma torch, plasma jet, arc, corona discharge, dielectric barrier discharge (DBD), inductively coupled plasma (ICP), capacitively coupled plasma (CCP), hollow cathode discharge, and microwave plasma.

[0011] According to one embodiment of the present invention, the gas processing system further includes a particulate filter module disposed within the accommodating space.

[0012] According to one embodiment of the present invention, the particulate filter module is selected from at least one of the group consisting of a cyclone separator, an electrostatic dust collector, and a filter screen.

[0013] According to one embodiment of the present invention, the inner wall of the above-mentioned flow tube body has a protective coating or lining.

[0014] According to another embodiment of the present invention, a vacuum process apparatus is provided, comprising a vacuum chamber, a gas handling system connected to the vacuum chamber, and a pump. The vacuum chamber includes an exhaust port. The gas handling system includes a flow tube body and a plasma generator, wherein the flow tube body includes at least one inlet and at least one outlet, wherein a accommodating space is provided between the at least one inlet and the at least one outlet, and the inlet is connected to the exhaust port of the vacuum chamber. The plasma generator is configured to generate plasma within the accommodating space. The pump is the exhaust port connected to the gas handling system.

[0015] According to one embodiment of the present invention, the gas treatment system further includes a gas trap disposed within the accommodating space, wherein the gas trap is disposed between the plasma generator and the exhaust port.

[0016] According to one embodiment of the present invention, the gas trap is a condenser trap or a chemical adsorber, and the condenser trap includes a water cooling device or an electric cooling device.

[0017] According to one embodiment of the present invention, the length of the gas processing system is 0.1 meters to 100 meters.

[0018] According to one embodiment of the present invention, the plasma generator is selected from at least one of the group consisting of plasma torch, plasma jet, arc, corona discharge, dielectric barrier discharge (DBD), inductively coupled plasma (ICP), capacitively coupled plasma (CCP), hollow cathode discharge, and microwave plasma.

[0019] According to one embodiment of the present invention, the gas processing system further includes a particulate filter module disposed within the accommodating space.

[0020] According to one embodiment of the present invention, the particulate filter module is selected from at least one of the group consisting of a cyclone separator, an electrostatic dust collector, and a filter screen.

[0021] According to one embodiment of the present invention, the inner wall of the above-mentioned flow tube body has a protective coating or lining.

[0022] The gas handling system and vacuum process equipment of this invention utilize a plasma generator to produce plasma, thereby converting the gases generated during the process into easily removable gases or solids. This reduces the probability of equipment blockage and downtime, thus improving equipment uptime and process yield. Attached Figure Description

[0023] A better understanding of the present invention will be achieved by reading the following detailed description in conjunction with the accompanying drawings. It should be noted that, as is standard practice in the industry, many features are not drawn to scale. In fact, for clarity of discussion, the dimensions of many features can be arbitrarily scaled.

[0024] Figure 1 A schematic diagram of a gas handling system according to some embodiments of the present invention is provided.

[0025] Figure 2 A schematic diagram of a vacuum process apparatus according to some embodiments of the present invention is provided. Detailed Implementation

[0026] The following disclosure provides numerous different embodiments or illustrations to implement various features of the invention. The specific examples of components and configurations described below are for simplification of the invention. These are, of course, merely illustrative and are not intended to be limiting. For example, a description of a first feature formed on or above a second feature includes embodiments where the first and second features are in direct contact, as well as embodiments where other features are formed between the first and second features such that the first and second features are not in direct contact. Furthermore, element symbols and / or letters are repeated in various specific examples. This repetition is for the purpose of simplifying and clarifying the description and does not imply a relationship between the various discussed embodiments and / or configurations.

[0027] Furthermore, spatially relative terms, such as "below," "below," "lower," "above," and "upper," are used to easily describe the relationship between the parts or features depicted in the accompanying drawings and other parts or features. In addition to the directions depicted in the drawings, spatially relative terms also include different orientations of the elements during use or operation. The device may be oriented in other ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used in this invention can also be interpreted in this way.

[0028] The manufacture and use of embodiments of this utility model are discussed in detail below. However, it is understood that the embodiments provide many applicable novel concepts that can be implemented in a wide variety of specific situations. The specific embodiments discussed are for illustrative purposes only and are not intended to limit the scope of this utility model.

[0029] As used in this invention, “around,” “about,” “approximately,” or “substantially” generally mean within 20 percent, 10 percent, or 5 percent of the stated value or range.

[0030] This invention provides a gas handling system and vacuum process equipment, which uses a plasma generator to generate plasma to convert the gas produced in the process into easily removable gases or solids. This reduces the probability of equipment blockage and downtime, thereby improving equipment uptime and process yield.

[0031] Please see Figure 1 This is a schematic diagram illustrating a gas handling system 100 according to some embodiments of the present invention. The gas handling system 100 includes a flow pipe body 110, wherein the flow pipe body 110 includes an inlet 101, an outlet 103, and a receiving space 105 between the inlet 101 and the outlet 103.

[0032] The gas handling system 100 includes a plasma generator 120 configured to generate plasma within the containment space 105. The plasma generated by the plasma generator 120 can break down gases (e.g., complex gases of process byproducts) entering the containment space 105 from the inlet 101 into easily ventable gases (e.g., F2 or Cl2) or easily collectable solids (e.g., silicon oxide). Figure 1 The plasma generator 120 is shown outside the flow tube body 110, but in other embodiments, the plasma generator 120 may also be disposed in the receiving space 105 of the flow tube body 110.

[0033] In some embodiments, the plasma generator 120 is an active plasma generator or an inductive plasma generator. Specifically, the plasma generator 120 may include a plasma torch, a plasma jet, an arc, a corona discharge, a dielectric barrier discharge (DBD), an inductively coupled plasma (ICP), a capacitively coupled plasma (CCP), a hollow cathode discharge, a microwave plasma, or any combination thereof.

[0034] In some embodiments, the gas handling system 100 may optionally include a gas trap 130 disposed within the accommodating space 105 and located between the plasma generator 120 and the exhaust port 103. The gas trap 130 is configured to trap the gas fragmented by the plasma and a small amount of gas that has not been fragmented by the plasma (e.g., complex gases). In some specific examples, the gas trap 130 is a condenser or a chemisorber, wherein the aforementioned condenser may include a water-cooling device or an electric-cooling device.

[0035] In some embodiments, the gas processing system 100 may optionally include a particulate filter module 140 disposed within the accommodating space 105 and located between the plasma generator 120 and the exhaust port 103. The particulate filter module 140 is configured to capture particles in the gas or solid matter fragmented by the plasma. In some specific examples, the particulate filter module 140 may include a cyclone separator, an electrostatic precipitator, and a filter, or any combination thereof.

[0036] Since both the gas trap 130 and the particulate filter module 140 are used for secondary interception to capture gases that have not been broken down by the plasma, they can also capture substances produced after plasma breakdown. Figure 1 The order and position of the gas trap 130 and particulate filter module 140 shown are for illustrative purposes only, and their positions and order can be adjusted according to requirements.

[0037] As described above, process byproducts may adsorb and accumulate on the walls of existing gas handling systems, eventually peeling off and causing pump blockage. Therefore, in some embodiments, the inner wall 115 of the flow tube body 110 of the gas handling system 100 has a protective coating (or lining) 150. The primary function of the protective coating 150 is to resist corrosion and / or adhesion, inhibiting gas adhesion and accumulation on the surface of the inner wall 115. In some specific examples, the material of the protective coating 150 may be perfluoroalkoxy alkane (PFA), yttrium oxide (Y₂O₃), alumina (Al₂O₃), titanium oxide (TiO₂), titanium nitride (TiN), chromium oxide (Cr₂O₃), aluminoxane, or any combination thereof.

[0038] Please see Figure 2 This is a schematic diagram illustrating a vacuum process apparatus 200 according to some embodiments of the present invention. The vacuum process apparatus 200 includes a vacuum chamber 210, a gas handling system 100, and a pump 220. The vacuum chamber 210 may be, for example, semiconductor process equipment such as a dry etching apparatus. The vacuum chamber 210 includes an exhaust port 215 for discharging gases generated during the process.

[0039] The configuration of the gas handling system 100 is as described above and will not be repeated here. The gas handling system 100 is connected to the vacuum chamber 210; specifically, the inlet 101 of the gas handling system 100 is connected to the exhaust outlet 215 of the vacuum chamber 210. Process byproducts or complex gases (hereinafter referred to as exhaust gases) generated in the vacuum chamber 210 can be discharged through the exhaust outlet 215 and enter the receiving space 105 of the flow tube body 110 via the inlet 101. The plasma generator 120 can generate plasma to break down the exhaust gases into more easily discharged gases or easily collected solids. In some embodiments, the plasma generated by the plasma generator 120 has a treatment rate of approximately 50% to approximately 80% for the exhaust gases. In other words, the plasma generator 120 can treat most of the exhaust gases to remove the root cause of blockages in the subsequent pump 220.

[0040] In some embodiments, the gas trap 130 and / or particulate filter module 140 (if present) of the gas treatment system 100 can intercept the products of plasma pyrolysis of the exhaust gas and / or the remaining exhaust gas. In some embodiments, the inner wall 115 of the flow pipe body 110 has a protective coating (or liner) 150, which can inhibit the adhesion and accumulation of exhaust gas or its products after plasma pyrolysis on the inner wall 115.

[0041] Pump 220 is connected to gas treatment system 100, specifically, pump 220 is connected to the exhaust port 103 of gas treatment system 100. The exhaust gas is treated by gas treatment system 100 before entering pump 220, thus effectively reducing the clogging rate of pump 220 and reducing the frequency of shutdowns. In some embodiments, the length of gas treatment system 100 is from approximately 0.1 meters to approximately 100 meters.

[0042] This invention provides a gas handling system and vacuum process equipment, which generates plasma through a plasma generator to convert the gas produced in the process into easily removable gases or solids. If further processing of the gas or substances generated after plasma conversion is desired, a gas trap and / or particulate filter module can be selectively installed. Additionally, a protective coating or lining can be selectively installed on the inner wall of the pipe to reduce the adsorption or corrosion of the pipe wall by substances. This reduces the probability of equipment blockage and downtime, thereby improving equipment uptime and process yield.

[0043] Although the present invention has been disclosed above with reference to several embodiments, it is not intended to limit the present invention. Any person skilled in the art to which the present invention pertains may make various modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

[0044] [Symbol Explanation]

[0045] 100: Gas Handling System

[0046] 101: Air Intake

[0047] 103: Exhaust port

[0048] 105: Storage space

[0049] 110: Flow tube body

[0050] 115: Inner pipe wall

[0051] 120: Plasma Generator

[0052] 130: Gas trap

[0053] 140: Particulate Filtering Module

[0054] 150: Protective coating

[0055] 200: Vacuum process equipment

[0056] 210: Vacuum cavity

[0057] 215: Exhaust gas outlet

[0058] 220: Pump.

Claims

1. A gas processing system, characterized in that, Include: The flow pipe body includes at least one air inlet and at least one exhaust outlet, wherein a receiving space is provided between the at least one air inlet and the at least one exhaust outlet; and A plasma generator configured to generate plasma within the accommodating space.

2. The gas processing system according to claim 1, characterized in that, Also includes: A gas trap is disposed within the accommodating space, wherein the gas trap is disposed between the plasma generator and the at least one exhaust port.

3. The gas processing system according to claim 2, characterized in that, The gas trap is a condenser or a chemical adsorber, and the condenser includes a water-cooling device or an electric-cooling device.

4. The gas processing system according to claim 1, characterized in that, The plasma generator is selected from at least one of the group consisting of plasma torch, jet plasma, electric arc, corona discharge, dielectric shielded discharge, inductively coupled plasma, capacitively coupled plasma, hollow cathode discharge plasma and microwave plasma.

5. The gas processing system according to claim 1, characterized in that, Also includes: The particulate filter module is located within this accommodating space.

6. The gas handling system according to claim 5, characterized in that, The particulate filter module is selected from at least one of the group consisting of a cyclone separator, an electrostatic precipitator, and a filter screen.

7. The gas processing system according to claim 1, characterized in that, The inner wall of the flow tube body has a protective coating or lining.

8. A vacuum process equipment, characterized in that, Include: Vacuum chamber, including exhaust outlet; A gas handling system, connected to the vacuum chamber, includes: The flow pipe body includes at least one air inlet and at least one exhaust outlet, wherein there is an accommodating space between the at least one air inlet and the at least one exhaust outlet, and the air inlet is connected to the exhaust outlet of the vacuum chamber. as well as A plasma generator, configured to generate plasma within the accommodating space; and A pump connected to at least one exhaust port of the gas handling system.

9. The vacuum process equipment according to claim 8, characterized in that, The gas handling system also includes: A gas trap is disposed within the accommodating space, wherein the gas trap is disposed between the plasma generator and the at least one exhaust port.

10. The vacuum process equipment according to claim 9, characterized in that, The gas trap is a condenser or a chemical adsorber, and the condenser includes a water-cooling device or an electric-cooling device.

11. The vacuum process equipment according to claim 8, characterized in that, The length of the gas handling system ranges from 0.1 meters to 100 meters.

12. The vacuum process equipment according to claim 8, characterized in that, The plasma generator is selected from at least one of the group consisting of plasma torch, jet plasma, electric arc, corona discharge, dielectric shielded discharge, inductively coupled plasma, capacitively coupled plasma, hollow cathode discharge plasma and microwave plasma.

13. The vacuum process equipment according to claim 8, characterized in that, The gas handling system also includes: The particulate filter module is located within this accommodating space.

14. The vacuum process equipment according to claim 13, characterized in that, The particulate filter module is selected from at least one of the group consisting of a cyclone separator, an electrostatic precipitator, and a filter screen.

15. The vacuum process equipment according to claim 8, characterized in that, The inner wall of the flow tube body has a protective coating or lining.

Images