Wafer cooling device

Abstract

The utility model provides a kind of wafer cooling device, including box, air inlet pump, air inlet end valve array, air outlet end valve array and gas collecting pump;Box includes chamber, air inlet end valve array and air outlet end valve array are arranged in chamber, air inlet end valve array and air outlet end valve array divide chamber into first chamber, second chamber and third chamber;Air inlet pump is communicated with first chamber, multiple layers of support plate for placing wafer are provided in second chamber, gas collecting pump is communicated with third chamber;Multiple rows of adjustable air inlet orifices of opening degree are provided on air inlet end valve array from top to bottom;Air inlet orifice is closed when the air pressure in first chamber is less than set value, and is opened when the air pressure in first chamber is equal to or greater than set value.The device can generate parallel airflow in the second chamber, improve the emission efficiency of residual etching gas on the wafer and the cooling efficiency of the wafer, and can reduce the probability of moving the residual particle contaminants on the back of the wafer to the front of the wafer.

Description

Technical Field

[0001] This utility model relates to the field of wafer manufacturing technology, and in particular to a wafer cooling device. Background Technology

[0002] In semiconductor manufacturing, after the wafer is removed from the cavity through the etching process, the robotic arm in the Equipment Front End Module (EFEM) first places the processed wafer into the wafer cooling device (also known as a buffer zone or cooling area) to dissipate residual gases and cool down. After the wafer has completed the dissipation of residual gases and cooling down, the robotic arm then transfers the wafer to the wafer cassette.

[0003] like Figure 1 As shown, Figure 1 This is a schematic diagram of airflow in a wafer cooling device in the prior art. The blue arrow indicates the direction of airflow. Existing wafer cooling devices generally use inert gas to be blown in from the top of the device and waste gas to be recovered from the bottom of the device. By blowing the wafer with inert gas, the residual etching gas on the wafer can be dissipated as soon as possible, and the temperature of the wafer can be reduced as quickly as possible.

[0004] However, as Figure 1 As shown, multiple wafers 9 are usually placed in the wafer cooling device for simultaneous cooling. For process stability, multiple dummy wafers 10 are also usually placed. When inert gas is blown from top to bottom, the airflow direction in the wafer cooling device is relatively turbulent due to the obstruction of the wafers 9. This results in low dissipation efficiency of residual etching gas on wafers 9 and low cooling efficiency of wafers 9. The probability of residual particulate contaminants on the back of the wafer moving to the front of the wafer is relatively high. Figure 1 The red gradient area in the image represents the concentration and temperature distribution of residual etching gas; the darker the red gradient area, the higher the concentration and temperature of the residual etching gas. Figure 1 It can be seen that the concentration and temperature of the residual etching gas in the middle position are the highest, but only a small amount of inert gas flows into this position and is difficult to escape, which means that the residual etching gas in the middle position needs a long time to completely dissipate, and the wafer 9 in the middle position needs a long time to reduce its temperature. Utility Model Content

[0005] This invention provides a wafer cooling device to solve the technical problem of turbulent airflow direction within the wafer cooling device.

[0006] To solve the above-mentioned technical problems, this utility model provides a wafer cooling device, including a housing, an air inlet pump, an air inlet valve array, an air outlet valve array, and an air collection pump;

[0007] The housing includes a chamber, and the air inlet valve array and the air outlet valve array are disposed in the chamber, dividing the chamber into a first chamber, a second chamber and a third chamber; the air inlet pump is connected to the first chamber, the second chamber is provided with multiple layers of support plates for placing wafers, and the air collecting pump is connected to the third chamber;

[0008] The air inlet valve array has multiple rows of adjustable air inlets from top to bottom; the air inlets are closed when the air pressure in the first chamber is less than a set value, and open when the air pressure in the first chamber is equal to or greater than the set value; the air outlet valve array has multiple rows of air outlets corresponding to the air inlets from top to bottom.

[0009] Preferably, the device further includes a drive unit; the air inlet valve array includes two flat plates that are attached together, and multiple rows of through holes are respectively provided on the two flat plates from top to bottom; the drive unit is connected to one of the flat plates to align or misalign the through holes on the two flat plates, thereby regulating the gas flow rate.

[0010] Preferably, each row of the plate has multiple through holes.

[0011] Preferably, the outlet valve array and the inlet valve array have the same structure.

[0012] Preferably, the intake valve array includes a first vertical plate, on which multiple rows of cross-shaped cuts are provided from top to bottom, and the area where the cross-shaped cuts are located is made of an elastic material.

[0013] Preferably, the air outlet valve array includes a second vertical plate, on which multiple rows of air outlet holes are arranged from top to bottom, and the air outlet holes and the air inlet holes correspond one-to-one in the horizontal direction.

[0014] Preferably, the housing is rectangular in shape and includes a top surface, a bottom surface, a front side surface, a rear side surface, a left side surface, and a right side surface; the air inlet valve array and the air outlet valve array are arranged in parallel and are both perpendicularly connected to the top surface, bottom surface, front side surface, and rear side surface of the housing.

[0015] Preferably, the front side of the housing has an opening for wafer loading and unloading, and the opening is provided with a door panel that can open or close the opening; the air intake pump is located on the left side of the housing, and the air collection pump is located on the right side of the housing.

[0016] Preferably, the volume of the second chamber is larger than the volumes of the first chamber and the third chamber.

[0017] Preferably, a check valve is provided at the air intake of the air collecting pump.

[0018] This invention provides a wafer cooling device, including a housing, an air inlet pump, an air inlet valve array, an air outlet valve array, and a gas collecting pump. The air inlet pump delivers gas into a first chamber. When the gas pressure in the first chamber is equal to or greater than a set value, the air inlets on the air inlet valve array open, allowing the gas in the first chamber to enter the second chamber in a parallel direction through the air inlets of each layer, blowing on the wafers of each layer. This facilitates the rapid dissipation of residual etching gas on the wafers and quickly lowers the wafer temperature. The gas collecting pump absorbs gas from the third chamber, creating a negative pressure in the third chamber, thereby accelerating the gas flow rate and gas recovery efficiency in the first, second, and third chambers. This wafer cooling device generates parallel airflow in the second chamber, which simultaneously blows on the front and back sides of each wafer layer, improving the dissipation efficiency of residual etching gas and the cooling efficiency of the wafers. It also reduces the probability of particulate contaminants remaining on the back side of the wafer moving to the front side. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of airflow in a wafer cooling device in the prior art.

[0020] Figure 2 This is a schematic diagram of airflow in a wafer cooling device according to an embodiment of the present invention.

[0021] Figure 3 This is a schematic diagram of the structure of a wafer cooling device in use according to an embodiment of the present invention.

[0022] Figure 4 yes Figure 3 The corresponding airflow diagram.

[0023] Figure 5 This is a schematic diagram of the structure of an air intake valve array when disassembled according to an embodiment of the present invention.

[0024] Figure 6 This is a side view of an intake valve array according to an embodiment of the present invention.

[0025] Figure 7 This is a schematic diagram of another intake valve array provided in one embodiment of the present invention.

[0026] Figure 8 yes Figure 7 A side view structural diagram.

[0027] The attached figures are labeled as follows:

[0028] 1. Housing - 2. Inlet pump - 3. Inlet valve array - 4. Outlet valve array - 5. Collector pump - 6. Support plate - 7. Drive unit - 8. Check valve - 9. Wafer - 10. Filler sheet;

[0029] First chamber-11, second chamber-12, third chamber-13;

[0030] Air inlet-31, flat plate-32, through hole-33, first vertical plate-34, cross-shaped cut-35;

[0031] Vent-41. Detailed Implementation

[0032] To make the objectives, advantages, and features of this utility model clearer, the wafer cooling device proposed by this utility model will be further described in detail below with reference to the accompanying drawings. It should be noted that the drawings are all in a very simplified form and use non-precise proportions, and are only used to facilitate and clarify the explanation of the embodiments of this utility model.

[0033] In the description of this utility model, the terms "first," "second," and other qualifiers are added for convenience of description and reference, and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with qualifiers such as "first" and "second" may explicitly or implicitly include one or more of that feature.

[0034] like Figure 3 As shown, this embodiment provides a wafer cooling device, including a housing 1, an inlet pump 2, an inlet valve array 3, an outlet valve array 4, and a collecting pump 5. The housing 1 includes a chamber, and the inlet valve array 3 and the outlet valve array 4 are disposed in the chamber, dividing the chamber into a first chamber 11, a second chamber 12, and a third chamber 13. The inlet pump 2 communicates with the first chamber 11, and the second chamber 12 contains a... The system includes a multi-layer support plate 6, which can be used to place wafers 9 or filler wafers 10. The gas collecting pump 5 is connected to the third chamber 13. The inlet valve array 3 has multiple rows of adjustable air inlets 31 arranged from top to bottom. The air inlets 31 are closed when the air pressure in the first chamber 11 is less than a set value, and open when the air pressure in the first chamber 11 is equal to or greater than the set value. The outlet valve array 4 has multiple rows of outlet holes 41 corresponding to the air inlets 31 arranged from top to bottom.

[0035] like Figure 3 and Figure 4As shown, the flow process of inert gas within the chamber 1 can be divided into three stages. In stage one, the air inlet 31 is closed, and the air pump 2 inputs gas into the first chamber 11. In stage two, when the gas pressure in the first chamber 11 is equal to or greater than a set value, the air inlet 31 opens, and the gas in the first chamber 11 enters the second chamber 12 in a parallel direction through the air inlets 31 of each layer, blowing the wafers 9 on each layer, thereby quickly dissipating the residual etching gas on the wafers 9 and quickly reducing the temperature of the wafers 9. In stage three, the gas in the second chamber 12 enters the third chamber 13, and the air pump 5 can generate negative pressure in the third chamber 13, thereby increasing the flow rate of gas in the first chamber 11, the second chamber 12, and the third chamber 13, as well as the gas recovery efficiency; the gas collecting pump 5 can be opened simultaneously with the air pump 2, or opened only when the air inlet 31 is open.

[0036] like Figure 2 As shown, the red gradient area represents the distribution of the concentration and temperature of the residual etching gas. The darker the red gradient area, the higher the concentration and temperature of the residual etching gas. This scheme can ensure that parallel airflow passes through each position of the red gradient area, which can improve the dissipation efficiency of the residual etching gas on wafer 9 and the cooling efficiency of wafer 9, and reduce the probability of residual particulate contaminants on the back of the die moving to the front of the die.

[0037] like Figure 3 and Figure 4 As shown, this embodiment provides a wafer cooling device, including a housing 1, an air inlet pump 2, an air inlet valve array 3, an air outlet valve array 4, and a gas collecting pump 5. The air inlet pump 2 delivers gas into the first chamber 11. When the gas pressure in the first chamber 11 is equal to or greater than a set value, the air inlet holes 31 on the air inlet valve array 3 open, and the gas in the first chamber 11 enters the second chamber 12 in a parallel direction through the air inlet holes 31 of each layer, blowing the wafers 9 on each layer, thereby quickly dissipating residual etching gas on the wafers 9 and rapidly reducing the temperature of the wafers 9. The gas collecting pump 5 can absorb gas from the third chamber 13, creating a negative pressure in the third chamber 13, thereby accelerating the flow rate of gas in the first chamber 11, second chamber 12, and third chamber 13, and improving the gas recovery efficiency. Figure 2 As shown, the wafer cooling device provided by this solution can generate parallel airflow in the second chamber 12. The parallel airflow can simultaneously blow on the front and back sides of the wafer 9 of each layer, which improves the dissipation efficiency of residual etching gas on the wafer 9 and the cooling efficiency of the wafer 9, and can reduce the probability of residual particulate contaminants on the back side of the wafer moving to the front side of the wafer.

[0038] Preferred, such as Figure 3 , Figure 5 and Figure 6As shown, the device also includes a drive unit 7; the air inlet valve array 3 includes two flat plates 32 that are attached together, and multiple rows of through holes 33 are respectively provided on the two flat plates 32 from top to bottom; the drive unit 7 is connected to one of the flat plates 32 to align or misalign the through holes on the two flat plates 32, thereby regulating the gas flow rate. The drive unit 7 can drive one flat plate 32 to move relative to the other flat plate 32. When the through holes 33 on the two flat plates 32 are aligned, it is equivalent to the air inlet 31 being open; when the through holes 33 on the two flat plates 32 are completely aligned, the opening degree of the air inlet 31 is the maximum; when the through holes 33 on the two flat plates 32 are partially aligned, the opening degree of the air inlet 31 is reduced; when the through holes 33 on the two flat plates 32 are completely misaligned, it is equivalent to the air inlet 31 being closed, at which time the opening degree of the air inlet 31 is zero.

[0039] Preferred, such as Figure 5 As shown, each row of the plate 32 has multiple through holes 33, which can increase the gas flow rate into the second chamber 12.

[0040] Preferred, Reference Figure 3 , Figure 5 and Figure 6 As shown, the outlet valve array 4 and the inlet valve array 3 have the same structure. The outlet valve array 4 can also be made of two flat plates 32. By adjusting the offset of the through holes 33 on the two flat plates 32, the exhaust flow rate of the outlet port 41 can be adjusted.

[0041] Preferred, such as Figure 3 , Figure 7 and Figure 8 As shown, the intake valve array 3 includes a first vertical plate 34, on which multiple rows of cross-shaped cuts 35 are arranged from top to bottom. The area where the cross-shaped cuts 35 are located is made of an elastic material. The area where the cross-shaped cuts 35 are located can be... Figure 7 The blue circular area can be made of rubber or plastic. Because the area where the cross-shaped cut 35 is located is elastic, the cross-shaped cut 35 is closed when the air pressure in the first chamber 11 is less than a set value, and is open when the air pressure in the first chamber 11 is equal to or greater than the set value. The greater the air pressure in the first chamber 11, the greater the opening of the cross-shaped cut 35, so the cross-shaped cut 35 can be used as an air inlet 31.

[0042] Preferred, Reference Figure 3As shown, the outlet valve array 4 includes a second vertical plate with multiple rows of outlet holes 41 arranged from top to bottom on the second vertical plate. The outlet holes 41 and the inlet holes 31 correspond one-to-one in the horizontal direction. Using a single second vertical plate to fabricate the outlet valve array 4 simplifies its structure. The one-to-one correspondence between the outlet holes 41 and the inlet holes 31 in the horizontal direction ensures smoother parallel airflow within the second chamber 12.

[0043] Preferred, Reference Figure 3 As shown, the box 1 is rectangular in shape, and the box includes a top surface (which may be...). Figure 3 The top plane and the bottom plane (can be) Figure 3 The bottom plane), the front side (can be) Figure 3 The plane located on the front side), the rear side (can be) Figure 3 The plane located at the rear), the left side (can be) Figure 3 The middle plane located on the left) and the right side (can be Figure 3 (The plane located on the right side); the air inlet valve array 3 and the air outlet valve array 4 are arranged in parallel and are perpendicularly connected to the top, bottom, front and rear sides of the housing 1. This design facilitates the manufacture of the housing 1 and the installation of the air inlet valve array 3 and the air outlet valve array 4 inside the housing 1.

[0044] Preferred, Reference Figure 3 As shown, the front side of the housing 1 has an opening for the entry and exit of the wafer 9, and a door panel is provided on the opening to open or close the opening; the air intake pump 2 is located on the left side of the housing 1, and the air collection pump 5 is located on the right side of the housing 1. The opening of the housing 1 can be opened or closed through the door panel. When the opening is open, the robotic arm can place the wafer 9 on the support plate 6 in the second chamber 12, or remove the wafer 9 from the second chamber 12; when the air intake pump 2 and the air collection pump 5 start running, the opening is closed to prevent harmful gases from escaping from the housing 1 to the outside. The air intake pump 2 and the air collection pump 5 are located on both sides of the door panel to avoid interference between the air intake pump 2 and the air collection pump 5 and the door panel.

[0045] Preferred, such as Figure 3 As shown, the volume of the second chamber 12 is larger than that of the first chamber 11 and the third chamber 13. The second chamber 12 is used to place the wafer 9. To prevent the wafer 9 from colliding with the inlet valve array 3 or the outlet valve array 4, the volume of the second chamber 12 needs to be set larger. The first chamber 11 and the third chamber 13 are used to generate parallel airflow, and the volumes of the first chamber 11 and the third chamber 13 can be set smaller.

[0046] Preferred, such as Figure 3As shown, a check valve 8 is installed at the air intake of the gas collecting pump 5. The check valve 8 prevents harmful gases absorbed by the gas collecting pump 5 from flowing back into the housing 1. The exhaust end of the gas collecting pump 5 can be connected to the waste recycling bin.

[0047] In summary, this utility model provides a wafer cooling device, including a housing 1, an air inlet pump 2, an air inlet valve array 3, an air outlet valve array 4, and a gas collecting pump 5. The air inlet pump 2 delivers gas into the first chamber 11. When the gas pressure in the first chamber 11 is equal to or greater than a set value, the air inlet holes 31 on the air inlet valve array 3 open, and the gas in the first chamber 11 enters the second chamber 12 in a parallel direction through the air inlet holes 31 of each layer, blowing the wafers 9 on each layer, thereby quickly dissipating residual etching gas on the wafers 9 and rapidly reducing the temperature of the wafers 9. The gas collecting pump 5 absorbs gas from the third chamber 13, creating a negative pressure in the third chamber 13, thereby accelerating the flow rate of gas in the first chamber 11, second chamber 12, and third chamber 13, as well as improving gas recovery efficiency. Figure 2 As shown, the wafer cooling device provided by this solution can generate parallel airflow in the second chamber 12. The parallel airflow can simultaneously blow on the front and back sides of the wafer 9 of each layer, which improves the dissipation efficiency of residual etching gas on the wafer 9 and the cooling efficiency of the wafer 9, and can reduce the probability of residual particulate contaminants on the back side of the wafer moving to the front side of the wafer.

[0048] The above description is only a description of the preferred embodiment of the present utility model and is not intended to limit the scope of the present utility model in any way. Any changes or modifications made by those skilled in the art based on the above disclosure shall fall within the protection scope of the present utility model.

Claims

1. A wafer cooling device, characterized in that, Includes housing, air intake pump, air intake valve array, air outlet valve array and air collection pump; The housing includes a chamber, and the air inlet valve array and the air outlet valve array are disposed in the chamber, dividing the chamber into a first chamber, a second chamber and a third chamber; the air inlet pump is connected to the first chamber, the second chamber is provided with multiple layers of support plates for placing wafers, and the air collecting pump is connected to the third chamber; The air inlet valve array has multiple rows of adjustable air inlets from top to bottom; the air inlets are closed when the air pressure in the first chamber is less than a set value, and open when the air pressure in the first chamber is equal to or greater than the set value; the air outlet valve array has multiple rows of air outlets corresponding to the air inlets from top to bottom.

2. The wafer cooling apparatus as described in claim 1, characterized in that, The device also includes a drive unit; the air inlet valve array includes two flat plates that are attached together, and multiple rows of through holes are provided on the two flat plates from top to bottom; the drive unit is connected to one of the flat plates to align or misalign the through holes on the two flat plates, thereby regulating the gas flow rate.

3. The wafer cooling apparatus as described in claim 2, characterized in that, The number of through holes in each row of the plate is multiple.

4. The wafer cooling apparatus as described in claim 3, characterized in that, The outlet valve array and the inlet valve array have the same structure.

5. A wafer cooling apparatus as described in claim 1, characterized in that, The intake valve array includes a first vertical plate, on which multiple rows of cross-shaped cuts are arranged from top to bottom, and the area where the cross-shaped cuts are located is made of an elastic material.

6. A wafer cooling apparatus as described in claim 1, characterized in that, The air outlet valve array includes a second vertical plate, on which multiple rows of air outlet holes are arranged from top to bottom, and the air outlet holes and the air inlet holes correspond one-to-one in the horizontal direction.

7. A wafer cooling apparatus as described in claim 1, characterized in that, The box body is rectangular in shape and includes a top surface, a bottom surface, a front side surface, a rear side surface, a left side surface, and a right side surface; the air inlet valve array and the air outlet valve array are arranged in parallel and are perpendicularly connected to the top surface, bottom surface, front side surface, and rear side surface of the box body.

8. A wafer cooling apparatus as described in claim 7, characterized in that, An opening for wafer loading and unloading is provided on the front side of the enclosure, and a door panel is provided on the opening to open or close the opening; the air intake pump is located on the left side of the enclosure, and the air collection pump is located on the right side of the enclosure.

9. A wafer cooling apparatus as described in claim 1, characterized in that, The volume of the second chamber is greater than the volumes of the first chamber and the third chamber.

10. A wafer cooling apparatus as described in claim 1, characterized in that, A check valve is installed at the air intake of the air collecting pump.

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