A heating device and a wet cleaning apparatus

Abstract

The application provides a heating device and a wet cleaning device. The heating device is arranged in a semiconductor device and comprises an outer tube and an inner tube arranged in the outer tube, a sealing member arranged at both ends of the outer tube and the inner tube to seal the outer tube and the inner tube and form a cavity between the inner wall of the outer tube and the outer wall of the inner tube for gas or liquid flow, a first heating member arranged in the inner tube along the axial direction of the inner tube, and a second heating member arranged on the outer wall of the outer tube. The heating device avoids the risk of metal ion contamination, improves the heating uniformity, and widens the range of heating medium.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing technology, and in particular to a heating device and a wet cleaning equipment. Background Technology

[0002] In wet cleaning equipment, heating the cleaning medium is often necessary to improve the cleaning effect when cleaning wafers. However, due to the short cleaning time and the requirement for the heating device to heat the cleaning medium rapidly (e.g., 0.33℃ / s) and uniformly (e.g., temperature difference between different locations less than ±1.0℃), the performance of the heating device is extremely challenging.

[0003] Currently, PFA (Perfluoroalkoxy) coated resistance wire heating elements can be used to heat the cleaning medium. However, these elements face several risks: firstly, PFA coating damage, resistance wire corrosion, and metal ion contamination; secondly, the heating temperature is limited by the temperature resistance of PFA, allowing a maximum of only 170–180°C, while actual processes may require temperatures up to 220°C. Therefore, PFA-coated resistance wire heating elements cannot meet all heating requirements. PFA is a high-performance coating or coating material, belonging to the category of fluoropolymers, such as polytetrafluoroethylene (PTFE).

[0004] Existing technology can also use halogen lamp heating to heat the cleaning medium. This technology involves placing halogen lamp heating components on both sides of a quartz tube and allowing the cleaning medium to flow through the tube for heating. However, this technology suffers from low heating efficiency, large size, and uneven heating of the solution within the quartz tube due to the poor absorption of infrared light by some cleaning media.

[0005] Therefore, it is necessary to improve the heating device of wet cleaning equipment to avoid the risk of metal ion contamination, improve heating uniformity, and broaden the range of heating media. Utility Model Content

[0006] This application provides a heating device to avoid the risk of metal ion contamination, improve heating uniformity, and broaden the range of heating media.

[0007] One aspect of this application discloses a heating device disposed in a semiconductor device, comprising:

[0008] An outer tube and an inner tube, wherein the inner tube is disposed inside the outer tube; a sealing element is disposed at both ends of the outer tube and the inner tube, which seals the outer tube and the inner tube and forms a cavity between the inner wall of the outer tube and the outer wall of the inner tube for the flow of gas or liquid.

[0009] The first heating element is disposed inside the inner tube along the axial direction of the inner tube;

[0010] The second heating element is disposed on the outer wall of the outer tube.

[0011] In some embodiments of this application, the heating device further includes a first pipe and a second pipe, the first pipe and the second pipe being respectively disposed in the closures at both ends of the outer pipe and the inner pipe, the first pipe being used for the gas or liquid to flow into the cavity, and the second pipe being used for the gas or liquid to flow out of the cavity.

[0012] In some embodiments of this application, the heating device further includes a temperature sensor disposed in the second pipeline for measuring the temperature of the gas or liquid flowing out of the cavity.

[0013] In some embodiments of this application, the heating device further includes an electrode located on the outer wall of the outer tube and in contact with the second heating element.

[0014] In some embodiments of this application, the heating device further includes a temperature controller, which is electrically connected to the temperature sensor and electrically connected to the first heating element and the second heating element respectively, thereby controlling the first heating element and the second heating element respectively.

[0015] In some embodiments of this application, the first heating element is a halogen lamp, and the halogen lamp includes one or more.

[0016] In some embodiments of this application, the second heating element is an electrothermal film.

[0017] In some embodiments of this application, the thickness of the electrothermal film is 0.5 micrometers to 5 micrometers.

[0018] This application also provides a wet cleaning device, including the heating device described in any of the above-mentioned embodiments; a receiving cavity in which the heating device is disposed; and a housing in which the receiving cavity is disposed.

[0019] In some embodiments of this application, the outer wall of the accommodating cavity is covered with a heat insulation film.

[0020] This embodiment of the application employs a bidirectional heating method by placing a first heating element in the inner tube for radiative heating from the inside to the outside, and a second heating element in the outer tube for heating from the outside to the inside, thereby improving the uniformity of heating. Furthermore, the first heating element uses a halogen lamp as a heat source, while the second heating element uses a nano-quartz resistance film. This combined heating method of the nano-quartz resistance film and the halogen lamp not only avoids the risk of metal ion contamination but also broadens the range of heating media. Attached Figure Description

[0021] The following accompanying drawings describe in detail the exemplary embodiments disclosed in this application. The same reference numerals denote similar structures in several views of the drawings. Those skilled in the art will understand that these embodiments are non-limiting and exemplary, and the drawings are for illustrative purposes only and are not intended to limit the scope of this application. Other embodiments may similarly fulfill the inventive intent of this application. It should be understood that the drawings are not drawn to scale.

[0022] in:

[0023] Figure 1 This is a schematic diagram of the structure of a heating device according to one embodiment of this application;

[0024] Figure 2 This is a partial structural schematic diagram of a heating device according to one embodiment of this application. Detailed Implementation

[0025] The following description provides specific application scenarios and requirements for this application, intended to enable those skilled in the art to make and use the content of this application. Various partial modifications to the disclosed embodiments will be apparent to those skilled in the art, and the general principles defined herein can be applied to other embodiments and applications without departing from the spirit and scope of this application. Therefore, this application is not limited to the embodiments shown, but rather to the widest scope consistent with the claims.

[0026] This application provides a heating device that avoids the risk of metal ion contamination, improves heating uniformity, and broadens the range of heating media. The heating device is installed in a semiconductor device and includes: an outer tube and an inner tube, the inner tube being disposed within the outer tube; a sealing member disposed at both ends of the outer and inner tubes, sealing the outer and inner tubes and forming a cavity between the inner wall of the outer tube and the outer wall of the inner tube for gas or liquid flow; a first heating element disposed axially within the inner tube; and a second heating element disposed on the outer wall of the outer tube.

[0027] like Figure 1 As shown, the heating device of this application is disposed in a semiconductor device, such as a wet cleaning device, for heating a cleaning medium, such as water or other solvents. The heating pipeline can also be used to heat a gaseous medium.

[0028] The heating device includes an outer tube 110 and an inner tube 112, with the inner tube 112 disposed inside the outer tube 110. Optionally, the outer tube 110 is a hollow quartz tube with a thickness of, for example, 2.5 mm to 3.0 mm, and an inner diameter of 140 mm to 200 mm, for example, 150 mm. Optionally, the inner tube 112 is a hollow quartz tube, and the outer diameter of the inner tube 112 is smaller than the inner diameter of the outer tube 110, so that a cavity is formed between the outer tube 110 and the inner tube. In some embodiments of this application, the outer diameter of the inner tube can be 50 mm to 80 mm, for example, 60 mm, and the thickness of the inner tube is, for example, 2.5 mm to 3.0 mm.

[0029] In some embodiments of this application, the outer tube 110 and the inner tube 112 have the same length and their center lines coincide, forming a ring structure between the outer tube 110 and the inner tube 112.

[0030] In some embodiments of this application, a second heating element 111 is provided on the outer wall of the outer tube 110. The second heating element 111 can be an electrothermal film with a thickness of 0.5 micrometers to 5 micrometers. The second heating element 111 can be formed using chemical vapor deposition or chemical evaporation, uniformly covering the outer wall of the outer tube 110. The electrothermal film is, for example, a deposited film formed of nano-resistive materials, such as an N-type Bi₂Te₃ nanofilm. The Bi₂Te₃ nanofilm may also contain elements such as tellurium (Te), silver (Ag), germanium (Ge), and antimony (Sb). Optionally, the second heating element 111 covers most of the outer wall of the outer tube 110, but not both ends of the outer tube 110. When the second heating element 111 is in operation, it provides heat from the outer wall of the outer tube 110 to the cavity between the outer tube 110 and the inner tube 112, heating the liquid or gas flowing within the cavity. The second heating element can be powered by a power supply. The second heating element 111 performs planar heating, which has high thermal efficiency. The stacked film structure composed of nano-resistive materials is compact and is formed on the surface of the outer tube by chemical vapor deposition or chemical evaporation. It is resistant to high temperature, corrosion, and pressure, and the quartz breakdown voltage is greater than 5000V / mm.

[0031] In some embodiments of this application, electrodes 114 are respectively provided on the outer wall surfaces at both ends of the outer tube 110. The electrode 114 can be made of silver, copper, gold, etc., and the electrodes can be formed on the surface of the outer tube 110 in a portion of the area not covering the second heating element 111 by an electroplating process. The second heating element 111 is connected to a power supply through the electrodes 114.

[0032] In some embodiments of this application, a first heating element 113 is disposed in the inner tube 112. The first heating element 113 is disposed inside the inner tube 112 along the axial direction of the inner tube 112. Optionally, the length of the first heating element 113 is the same as the length of the inner tube 112, and their center lines coincide. In other embodiments, the length of the first heating element 113 may be less than the length of the inner tube 112. The center line of the first heating element 113 does not necessarily have to coincide with the center line of the inner tube 112.

[0033] In some embodiments of this application, the first heating element 113 is a halogen lamp, which can be one or more halogen lamp groups. Since the halogen lamp heats through thermal radiation, the heat emitted by the halogen lamp radiates to the cavity between the outer tube 110 and the inner tube 112, heating the liquid or gas flowing within the cavity. The first heating element 113 can be electrically connected to a power supply via a wire 117.

[0034] In some embodiments of this application, the heating device further includes two sealing members 116, which are respectively disposed at both ends of the outer tube 110 and the inner tube 112, sealing the outer tube 110 and the inner tube 112 and forming a cavity between the inner wall of the outer tube 110 and the outer wall of the inner tube 112 for gas or liquid flow. The sealing member 16 is, for example, an annular PFA sealing head with dimensions matching those of the outer tube 110 and the inner tube 112.

[0035] Continue to refer to the appendix Figure 1 In some embodiments of this application, the heating device further includes a first pipe 115a and a second pipe 115b. The first pipe 115a and the second pipe 115b are respectively disposed on the sealing members 116 at both ends of the outer pipe 110 and the inner pipe 112. The first pipe 115a is used for the gas or liquid to flow into the cavity, and the second pipe 115b is used for the gas or liquid to flow out of the cavity. Control valves are provided in both the first pipe 115a and the second pipe 115b to control the flow rate and volume of the liquid or gas flowing into the cavity through the first pipe 115a for heating and flowing from the cavity to the second pipe 115b, and flowing out of the second pipe 115b.

[0036] In some embodiments of this application, the heating device further includes a temperature sensor (not shown in the figure), which is disposed within the second pipe 115b and used to measure the temperature of the gas or liquid flowing out of the cavity. Optionally, the temperature sensor is covered with PFA and installed at the outlet of the second pipe 115b to detect the temperature of the flowing liquid or gas. The temperature sensor can be electrically connected to a temperature controller, which is electrically connected to the first heating element and the second heating element respectively, to control the operating state and heating temperature of the first heating element 113 and the second heating element 111 respectively. The temperature sensor detects the temperature of the liquid or gas flowing out of the outlet of the second pipe 115b and transmits the temperature to the temperature controller, which controls the first heating element 113 and the second heating element 111 to increase or decrease their power based on the acquired temperature information.

[0037] This embodiment of the application employs a bidirectional heating method by placing a first heating element in the inner tube for radiative heating from the inside out, and a second heating element in the outer tube for heating from the outside in, thus improving heating uniformity. Simultaneously, the first heating element uses a halogen lamp as a heat source, and the second heating element uses a nano-quartz resistance film. This combined heating method of the nano-quartz resistance film and halogen lamp not only avoids the risk of metal ion contamination but also broadens the range of heating media. The technical solution of this embodiment improves heating speed through bidirectional heating, and the combination of the first and second heating elements increases the flexibility of heating power adjustment, resulting in higher heating precision.

[0038] The technical solution described in this application, compared to heating components that only use PFA-coated metal resistance wires, eliminates the risk of metal ion contamination caused by corrosion of the metal resistance wires after PFA damage. Compared to traditional resistance wire heating, it significantly increases the ratio of heat transfer surface to heating surface, improving uniformity. Compared to traditional halogen lamp heaters, it broadens the application range of the heating device, adapting to water, H2O2, ketones, amine solvents, and gaseous substances, with a heating temperature reaching 200 degrees Celsius. Furthermore, this heating device is easy to maintain and offers more flexible power adjustment.

[0039] This application also provides a wet cleaning device, including a heating chamber for accommodating any of the above-mentioned heating devices, wherein the heating devices are disposed in the accommodating chamber, the outer wall of the accommodating chamber may be covered with a heat insulation film, and the accommodating chamber is disposed within a housing.

[0040] It should be noted that different embodiments may produce different beneficial effects. In different embodiments, the beneficial effects may be any one or a combination of the above, or any other possible beneficial effects.

[0041] The basic concepts have been described above. Obviously, for those skilled in the art, the detailed disclosure above is merely illustrative and does not constitute a limitation of this specification. Although not explicitly stated herein, those skilled in the art may make various modifications, improvements, and corrections to this application. Such modifications, improvements, and corrections are suggested in this specification, and therefore remain within the spirit and scope of the exemplary embodiments of this application.

[0042] It should be noted that, in the description of this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; a mechanical connection or an electrical connection; a rotating connection or a sliding connection; a direct connection or an indirect connection through an intermediate medium; or the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application in light of the specific circumstances.

[0043] Furthermore, when the terms "first," "second," "third," etc., are used in this application specification to describe various features, these terms are only used to distinguish these features and should not be construed as indicating or implying the correlation or relative importance between features or implicitly indicating the number of features indicated.

[0044] In addition, this application specification describes exemplary embodiments by referring to idealized exemplary cross-sectional views and / or plan views and / or perspective views. Therefore, differences from the illustrated shapes are foreseeable due to factors such as manufacturing techniques and / or tolerances. Therefore, exemplary embodiments should not be construed as limited to the shapes of the regions shown herein, but should include deviations in shape caused, for example, by manufacturing processes. Thus, the regions shown in the figures are substantially schematic, and their shapes are not intended to illustrate the actual shapes of the regions of the device, nor to limit the scope of the exemplary embodiments.

[0045] Furthermore, this application uses specific terms to describe embodiments of this specification. For example, "an embodiment," "one embodiment," and / or "some embodiments" refer to a particular feature, structure, or characteristic related to at least one embodiment of this application. Therefore, it should be emphasized and noted that "an embodiment," "one embodiment," or "an alternative embodiment" mentioned twice or more in different locations in this application do not necessarily refer to the same embodiment. In addition, certain features, structures, or characteristics in one or more embodiments of this application can be appropriately combined.

[0046] Similarly, it should be noted that, in order to simplify the description of the present application and thus aid in the understanding of one or more embodiments of the invention, the foregoing description of the embodiments of the present application sometimes combines multiple features into a single embodiment, drawing, or description thereof. However, this disclosure method does not imply that the subject matter of the application requires more features than those mentioned in the claims. In fact, the embodiments contain fewer features than all the features of the single embodiments disclosed above.

[0047] Finally, it should be understood that the embodiments described in this application are merely illustrative of the principles of the embodiments of this application. Other modifications may also fall within the scope of this application. Therefore, alternative configurations of the embodiments of this application are considered as examples and not limitations, and are regarded as consistent with the teachings of this application. Accordingly, the embodiments of this application are not limited to the embodiments explicitly described and illustrated in this application.

Claims

1. A heating device, disposed in a semiconductor device, characterized in that, include: An outer tube and an inner tube, wherein the inner tube is disposed inside the outer tube; A sealing element is disposed at both ends of the outer tube and the inner tube, sealing the outer tube and the inner tube and forming a cavity between the inner wall of the outer tube and the outer wall of the inner tube for gas or liquid to flow. The first heating element is disposed inside the inner tube along the axial direction of the inner tube; The second heating element is disposed on the outer wall of the outer tube.

2. The heating device according to claim 1, characterized in that, It also includes a first pipe and a second pipe, which are respectively disposed in the closures at both ends of the outer pipe and the inner pipe. The first pipe is used for the gas or liquid to flow into the cavity, and the second pipe is used for the gas or liquid to flow out of the cavity.

3. The heating device according to claim 1, characterized in that, It also includes a temperature sensor, which is disposed in the second pipeline and is used to measure the temperature of the gas or liquid flowing out of the cavity.

4. The heating device according to claim 1, characterized in that, It also includes electrodes, which are located on the outer wall of the outer tube and are in contact with the second heating element.

5. The heating device according to claim 1, characterized in that, It also includes a temperature controller, which is electrically connected to a temperature sensor and is also electrically connected to the first heating element and the second heating element, respectively, to control the first heating element and the second heating element.

6. The heating device according to claim 1, characterized in that, The first heating element is a halogen lamp, and the halogen lamp includes one or more.

7. The heating device according to claim 1, characterized in that, The second heating element is an electric heating film.

8. The heating device according to claim 6, characterized in that, The thickness of the electrothermal film ranges from 0.5 micrometers to 5 micrometers.

9. A wet cleaning device, characterized in that, It includes a heating device as described in any one of claims 1 to 8; a receiving cavity in which the heating device is disposed; and a housing in which the receiving cavity is disposed.

10. The wet cleaning equipment according to claim 9, characterized in that, The outer wall of the accommodating cavity is covered with a heat insulation film.

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