Multifunctional high-efficiency wafer cleaning tank

Abstract

The utility model provides a kind of multi-functional efficient wafer cleaning tank.The multi-functional efficient wafer cleaning tank includes tank body, bearing assembly, driving assembly, cleaning assembly, drying assembly and particle trapping assembly, bearing assembly is used to place fixed wafer, driving assembly is used to drive bearing assembly to move, cleaning assembly is arranged in tank body, and is used to clean wafer, drying assembly is used to dry the moisture on wafer surface, particle trapping assembly is used to remove particle impurities in cleaning assembly, the multi-functional efficient wafer cleaning tank of the utility model is realized to the cleaning of the impurities and particles attached to wafer surface by the setting of each structure, simultaneously, the integrated design of cleaning assembly and drying assembly not only reduces cost, and improves cleaning efficiency.

Description

Technical Field

[0001] This utility model relates to the technical field of wafer cleaning tanks, and in particular to a multifunctional and high-efficiency wafer cleaning tank. Background Technology

[0002] A wafer is a substrate used to manufacture semiconductor transistors or integrated circuits. It is a crystalline material with a circular shape, hence the name wafer.

[0003] In semiconductor manufacturing processes, wafer cleaning is a crucial step that directly affects the quality and performance of the final chip. The main purpose of wafer cleaning is to remove various impurities generated on the wafer surface during the front-end process steps to ensure smooth processing in subsequent steps and improve chip yield.

[0004] After the wafers are cleaned, they need to be dried. Currently, wafer cleaning and drying are often done by two separate devices, which not only increases costs, but also makes it easier for airborne particles and impurities to adhere to the wet surface of the wafers during the wafer transfer process, reducing efficiency. Utility Model Content

[0005] This invention provides a multifunctional and efficient wafer cleaning tank to solve the technical problems mentioned in the background section.

[0006] This utility model provides a multifunctional and high-efficiency wafer cleaning tank, which includes a tank body, a support component, a drive component, a cleaning component, a drying component, and a particle capture component. The support component is disposed within the tank body and connected to it, and is used to place and fix the wafer. The drive component is disposed within the tank body and connected to it, and is used to drive the support component to move. The cleaning component is disposed within the tank body and is used to clean the wafer. The drying component is disposed above the cleaning component and connected to the tank body, and is used to dry the moisture on the wafer surface. The particle capture component is disposed below the cleaning component and connected to the tank body, and is used to remove particulate impurities from the cleaning component.

[0007] Optionally, the bearing assembly includes a chuck, grippers, a turntable, a driving bevel gear, a driven bevel gear, and a first motor. The chuck is disposed within the groove and connected to the groove. Three grippers are evenly arranged in a circumferential shape on the chuck and are all slidably connected to the chuck. The turntable is disposed within the chuck and rotatably connected to the top of the chuck. The turntable has three sliding grooves, and the three grippers are slidably disposed within the three sliding grooves respectively. Three driving bevel gears are evenly arranged in a circumferential shape on the side wall of the chuck and are rotatably connected to the chuck. The driven bevel gear is rotatably disposed at the bottom end of the turntable and meshes with all three driving bevel gears. The first motor is fixedly disposed on the side wall of the chuck, and the output shaft of the first motor is coaxially fixedly connected to one of the driving bevel gears.

[0008] Optionally, the drive assembly includes a slide rail, a second motor, a worm gear, a mounting plate, a slider, a worm wheel, a first bevel gear, a second bevel gear, a first pulley, a rotating shaft, a second pulley, and a conveyor belt. Two slide rails are provided, each located on one side of the groove and fixedly connected to the side wall of the groove. Two second motors are provided, each fixedly located at the bottom of the groove and situated on one side of the groove. Two worm gears are provided, each mounted on the output shaft of one of the two second motors and coaxially fixedly connected to the output shaft of the second motor. The mounting plate is located at the bottom of the chuck and is rotatably connected to the chuck. The slider is fixedly mounted at the bottom of the mounting plate. Both ends of the slider are slidably mounted within the two slide rails and threadedly connected to the two worm gears. The worm wheel is mounted within the slider and meshes with the worm gear. The first bevel gear is coaxially mounted with the worm wheel. The second bevel gear is rotatably mounted within the slider and meshes with the first bevel gear. The first pulley is located below the second bevel gear and coaxially mounted with it. The rotating shaft is rotatably mounted at the center of the mounting plate and is fixedly connected to the chuck. The second pulley is coaxially fixedly mounted on the rotating shaft, and the second pulley is connected to the first pulley via the conveyor belt.

[0009] Optionally, the cleaning assembly includes a storage tank, a first water pump, an inlet pipe, a spray pipe, a first valve, and ultrasonic transducers. The storage tank is disposed on one side of the tank body. The first water pump is disposed inside the storage tank. The inlet pipe is disposed on the side wall of the storage tank and communicates with the outlet of the first water pump. The end of the inlet pipe away from the storage tank passes through the tank body. There are two spray pipes, which are respectively disposed on both sides of the inlet pipe and communicate with it. Multiple nozzles are disposed on the spray pipes. There are three first valves, which are respectively fixedly disposed on the two spray pipes and the inlet pipe. Multiple ultrasonic transducers are disposed on the side wall of the tank body.

[0010] Optionally, the drying assembly includes a sealing plate, an exhaust pipe, a second valve, a hot air nozzle, a vacuum pump, and a nitrogen nozzle. The sealing plate is fixedly mounted on the side wall of the tank and located above the injection pipe. The exhaust pipe is fixedly mounted on the top of the tank. The second valve is fixedly mounted on the exhaust pipe. Two hot air nozzles are provided, each located on one side of the tank and fixedly connected to the tank. The vacuum pump is fixedly mounted on the outer side wall of the tank and communicates with the interior of the tank. Two nitrogen nozzles are provided, each located on one side of the tank and fixedly connected to the side wall of the tank.

[0011] Optionally, a sealing groove is provided at the bottom end of the sealing plate, and a sealing strip is fixedly provided on the side wall of the chuck, with the sealing groove and the sealing strip cooperating.

[0012] Optionally, the particle capture assembly includes a filter chamber, a guide plate, a rotating filter screen, a vacuum tube, a first gear, a second gear, a third motor, a collection bottle, and a second vacuum pump. The filter chamber is located at the bottom of the tank and is fixedly connected to the side wall of the tank. The guide plate is fixedly located at the top of the filter chamber. The vacuum tube is rotatably located at the center of the bottom end of the filter chamber. The rotating filter screen is fixedly located on the vacuum tube. The first gear is fixedly located on the vacuum tube and is coaxially arranged with the vacuum tube. The second gear is rotatably located at the bottom end of the filter chamber and meshes with the first gear. The output end of the third motor is coaxially fixedly connected to the second gear. The collection bottle is detachably connected to the bottom end of the vacuum tube. The second vacuum pump is located inside the collection bottle and connected to the vacuum tube.

[0013] Optionally, the bottom of the filter chamber is also provided with a liquid outlet pipe, the end of which is away from the filter chamber is inserted through the side wall of the storage tank, and a second water pump is provided inside the storage tank, with the inlet of the second water pump connected to the liquid outlet pipe.

[0014] The beneficial effects of this utility model are as follows: This multifunctional and high-efficiency wafer cleaning tank includes a tank body, a support component, a drive component, a cleaning component, a drying component, and a particle capture component. The support component is used to place and fix the wafer, the drive component is used to drive the support component to move, the cleaning component is set in the tank body and is used to clean the wafer, the drying component is used to dry the moisture on the wafer surface, and the particle capture component is used to remove particulate impurities from the cleaning component. This multifunctional and high-efficiency wafer cleaning tank achieves the cleaning of impurities and particles attached to the wafer surface through the arrangement of various structures. At the same time, the integrated design of the cleaning component and the drying component not only reduces costs but also improves cleaning efficiency. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the structure of a multifunctional and high-efficiency wafer cleaning tank provided by this utility model; Figure 2 This is a schematic diagram intended to illustrate the internal structure of the tank; Figure 3 This is a schematic diagram intended to illustrate the structure of the second vacuum pump; Figure 4 This is a schematic diagram intended to illustrate the structure of the load-bearing components; Figure 5 This is a schematic diagram intended to illustrate the structure of the first pulley; Figure 6 This is a schematic diagram intended to illustrate the structure of the sealing strip.

[0017] Explanation of reference numerals in the attached figures: 1. Tank; 2. Bearing assembly; 21. Chuck; 211. Sealing strip; 22. Gripper; 23. Turntable; 231. Slide groove; 24. Driving bevel gear; 25. Driven bevel gear; 26. First motor; 3. Drive assembly; 310. Slide rail; 311. Second motor; 312. Worm gear; 313. Mounting plate; 314. Slider; 315. Worm wheel; 316. First bevel gear; 317. Second bevel gear; 318. First pulley; 319. Shaft; 320. Second pulley; 321. Conveyor belt; 4. Cleaning assembly; 41. Liquid storage tank; 42. 43. First water pump; 44. Inlet pipe; 45. Injection pipe; 46. First valve; 57. Drying assembly; 58. Sealing plate; 59. Sealing groove; 50. Exhaust pipe; 51. Second valve; 52. Hot air nozzle; 53. Vacuum pump; 54. Nitrogen nozzle; 65. Particle capture assembly; 66. Filter chamber; 67. Drainage plate; 68. Rotating filter screen; 69. Vacuum tube; 60. First gear; 61. Second gear; 612. Third motor; 613. Collection bottle; 614. Second vacuum pump; 615. Outlet pipe; 626. Second water pump. Detailed Implementation

[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. It should be understood that the specific embodiments described herein are only for explaining the present utility model and not for limiting it. Furthermore, it should be noted that, for ease of description, only the parts related to the present utility model are shown in the drawings, not all of the structures. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the scope of protection of the present utility model.

[0019] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of the present invention. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0020] Please see Figures 1 to 6 The present invention provides a multifunctional and high-efficiency wafer cleaning tank, comprising a tank body 1, a support component 2, a drive component 3, a cleaning component 4, a drying component 5, and a particle capture component 6. The carrier component 2 is disposed within and connected to the tank 1, and is used to place and fix the wafer. The drive component 3 is disposed within the tank 1 and connected to the carrier component 2, and is used to drive the carrier component 2 to move. The cleaning component 4 is disposed within the tank 1 and is used to clean the wafer. The drying component 5 is disposed above the cleaning component 4 and connected to the tank 1, and is used to dry the moisture on the surface of the wafer. The particle component 6 is disposed below the cleaning component 4 and connected to the tank 1, and is used to remove particulate impurities from the cleaning component 4. In this process, the worker places the wafer on the support component 2, which supports and fixes the wafer. The drive component 3 drives the support component 2 to move within the tank 1. At this time, the cleaning component 4 cleans the impurities attached to the wafer surface. After the wafer is cleaned, the drive component 3 drives the support component 2 to move to the drying component 5, where the drying component 5 dries the wafer. This process cleans the impurities on the wafer surface and ensures that subsequent processing can proceed smoothly. During the wafer drying process, the particle capture component 6 cleans the floating impurities in the cleaning component 4, preventing the cleaning component 4 from performing the next cleaning operation and causing secondary contamination of the wafer, thereby reducing the cleaning efficiency.

[0021] In this embodiment, the bearing assembly 2 includes a chuck 21, grippers 22, a turntable 23, a driving bevel gear 24, a driven bevel gear 25, and a first motor 26. The chuck 21 is disposed within and connected to the groove 1. Three grippers 22 are evenly arranged in a circular shape on the chuck 21 and are all slidably connected to the chuck 21. The turntable 23 is disposed within the chuck 21 and is rotatably connected to the top of the chuck 21. The turntable 23 has three sliding grooves 231. The grippers 22 are slidably disposed in the three grooves 231 respectively. Three active bevel gears 24 are provided and are evenly disposed in a circular shape on the side wall of the chuck 21. The active bevel gears 24 are rotatably connected to the chuck 21. The driven bevel gears 25 are rotatably disposed at the bottom end of the turntable 23 and mesh with all three active bevel gears 24. The first motor 26 is fixedly disposed on the side wall of the chuck 21, and the output shaft of the first motor 26 is coaxially fixedly connected to one of the active bevel gears 24. The first motor 26 drives the active bevel gear 24 to rotate, the active bevel gear 24 drives the driven bevel gear 25 to rotate, the driven bevel gear 25 drives the turntable 23 to rotate, and the rotation of the turntable 23 causes the gripper 22 to move along the slide groove 231, thereby achieving the clamping and fixing of the wafer.

[0022] In this embodiment, the drive assembly 3 includes a slide rail 310, a second motor 311, a worm gear 312, a mounting plate 313, a slider 314, a worm wheel 315, a first bevel gear 316, a second bevel gear 317, a first pulley 318, a rotating shaft 319, a second pulley 320, and a conveyor belt 321. Two slide rails 310 are provided, each located on one side of the groove 1 and fixedly connected to the side wall of the groove 1. Two second motors 311 are provided, each fixedly located at the bottom end of the groove 1 and situated on one side of the groove 1. Two worm gears 312 are provided, each located on the output shaft of one of the two second motors 311 and coaxially fixedly connected to the output shaft of the second motor 311. The mounting plate 313 is located at the bottom end of the chuck 21 and rotates with the chuck 21. The connection is as follows: the slider 314 is fixedly disposed at the bottom end of the mounting plate 313; both ends of the slider 314 are slidably disposed in the two slide rails 310 and threadedly connected to the two worm gears 312 respectively; the worm wheel 315 is disposed in the slider 314 and meshes with the worm gear 312; the first bevel gear 316 is coaxially disposed with the worm wheel 315; the second bevel gear 317 is rotatably disposed in the slider 314 and meshes with the first bevel gear 316; the first pulley 318 is disposed below the second bevel gear 317 and coaxially disposed with the second bevel gear 317; the rotating shaft 319 is rotatably disposed at the center of the mounting plate 313 and is fixedly connected to the chuck 21; the second pulley 320 is coaxially fixedly disposed on the rotating shaft 319 and is connected to the first pulley 318 through the conveyor belt 321. In this system, the second motor 311 drives the worm gear 312 to rotate, which in turn drives the slider 314 to move up and down. The slider 314 then drives the chuck 21 to move up and down. Simultaneously, the turbine 315 meshes with the worm gear 312, which in turn drives the turbine 315 to rotate. The first bevel gear 316 follows the turbine 315 and drives the second bevel gear 317 to rotate. The second bevel gear 317 drives the first pulley 318 to rotate, which in turn drives the second pulley 320 to rotate via the conveyor belt 321. The second pulley 320 is mounted on the rotating shaft 319, which in turn follows the second pulley 320 to rotate. The rotating shaft 319 then drives the chuck 21 to rotate, thus enabling the chuck 21 to rotate while moving up and down, thereby improving the wafer cleaning efficiency.

[0023] In this embodiment, the cleaning assembly 4 includes a storage tank 41, a first water pump 42, an inlet pipe 43, a spray pipe 44, a first valve 45, and ultrasonic transducers. The storage tank 41 is disposed on one side of the tank 1. The first water pump 42 is disposed inside the storage tank 41. The inlet pipe 43 is disposed on the side wall of the storage tank 41 and communicates with the outlet of the first water pump 42. The end of the inlet pipe 43 away from the storage tank 41 passes through the tank 1. There are two spray pipes 44, which are respectively disposed on both sides of the inlet pipe 43 and communicate with the inlet pipe 43. Multiple nozzles are disposed on the spray pipe 44. There are three first valves 45, which are respectively fixedly disposed on the two spray pipes 44 and the inlet pipe 43. Multiple ultrasonic transducers are disposed on the side wall of the tank 1. After the wafer is mounted on the chuck 21, the first valve 45 on the liquid inlet pipe 43 is opened, and the first water pump 42 is started, injecting the cleaning solution in the storage tank 41 into the tank 1 through the liquid inlet pipe 43. When the cleaning solution reaches the required amount, the first valve 45 at the liquid inlet pipe 43 is closed, and the chuck 21 drives the wafer to move up and down in the cleaning solution. The chuck 21 rotates, so that the cleaning solution can better clean the wafer surface. When the wafer moves in the cleaning solution, the first valve 45 on the spray pipe 44 is opened, and the cleaning solution is sprayed out from the nozzle on the spray pipe 44 to clean the stubborn impurities attached to the wafer surface and improve the cleaning efficiency. At the same time, the ultrasonic transducer works to generate dense small cavitation bubbles, which peel off loose particles from the wafer surface, further improving cleaning efficiency.

[0024] In this embodiment, the drying assembly 5 includes a sealing plate 51, an exhaust pipe 52, a second valve 53, a hot air nozzle 54, a vacuum pump 55, and a nitrogen nozzle 56. The sealing plate 51 is fixedly disposed on the side wall of the tank 1 and located above the injection pipe 44. The exhaust pipe 52 is fixedly disposed on the top of the tank 1. The second valve 53 is fixedly disposed on the exhaust pipe 52. Two hot air nozzles 54 are provided, and the two hot air nozzles 54 are respectively disposed on both sides of the tank 1 and are fixedly connected to the tank 1. The vacuum pump 55 is fixedly disposed on the outer side wall of the tank 1 and communicates with the interior of the tank 1. Two nitrogen nozzles 55 are provided, and the two nitrogen nozzles 56 are respectively disposed on both sides of the tank 1 and are fixedly connected to the side wall of the tank 1. In this embodiment, a sealing groove 511 is provided at the bottom end of the sealing plate 51, and a sealing strip 211 is fixedly provided on the side wall of the chuck 21. The sealing groove 511 and the sealing strip 211 cooperate with each other. After the wafer cleaning is completed, the second motor 311 drives the chuck 21 to move to the sealing plate 51. The hot air nozzle 54 is connected to the hot air generator and blows hot air into the tank 1. The hot air blows over the wafer surface and removes most of the water on the wafer surface. The second valve 53 on the exhaust pipe 52 is closed, and the vacuum pump 55 makes the tank 1 a vacuum state. By using the principle of lowering the boiling point of water in a low-pressure environment, the residual water on the wafer surface evaporates quickly. The vacuum pump 55 is turned off, and nitrogen is slowly injected into the tank 1 through the nitrogen nozzle 56, so that the nitrogen covers the wafer surface and forms a nitrogen protective film to isolate water vapor and oxygen in the air.

[0025] In this embodiment, the particle capture assembly 6 includes a filter chamber 610, a guide plate 611, a rotating filter screen 612, a vacuum tube 613, a first gear 614, a second gear 615, a third motor 616, a collection bottle 617, and a second vacuum pump 618. The filter chamber 610 is disposed at the bottom of the tank 1 and is fixedly connected to the side wall of the tank 1. The guide plate 611 is fixedly disposed at the top of the filter chamber 610. The vacuum tube 613 is rotatably disposed at the center of the bottom end of the filter chamber 610. The rotating filter screen 612 is fixedly disposed at the top of the filter chamber 610. The first gear 614 is fixedly mounted on the vacuum tube 613 and coaxially mounted with the vacuum tube 613. The second gear 615 is rotatably mounted at the bottom end of the filter chamber 610 and meshes with the first gear 614. The output end of the third motor 616 is coaxially fixedly connected to the second gear 615. The collection bottle 617 is detachably connected to the bottom end of the vacuum tube 613. The second vacuum pump 618 is disposed in the collection bottle 617 and connected to the vacuum tube 613. In this embodiment, a liquid outlet pipe 619 is also provided at the bottom end of the filter chamber 610. One end of the liquid outlet pipe 619 away from the filter chamber 610 passes through the side wall of the liquid storage tank 41. A second water pump 620 is provided inside the liquid storage tank 41, and the inlet of the second water pump 620 is connected to the liquid outlet pipe 619. After the wafer cleaning is completed, the third motor 616 drives the first gear 614 to rotate, the first gear 614 drives the second gear 615 to rotate, the second gear 615 is fixedly connected to the vacuum tube 613, the vacuum tube 613 rotates with the second gear 615, the vacuum tube 613 drives the rotating filter screen 612 to rotate, the cleaning fluid flows from the rotating filter screen 612 to the filter chamber 610 under the action of centrifugal force, the impurities and particles floating in the cleaning fluid adhere to the rotating filter screen 612, at the same time, the second water pump 620 works, so that the cleaning fluid in the filter chamber 610 is returned to the storage tank 41 through the liquid outlet pipe 619; After all the cleaning fluid has flowed out, the second vacuum pump 618 draws the impurities in the rotating filter 612 into the collection bottle 617 through the vacuum tube 613, thereby preventing the cleaning fluid from causing secondary contamination to the wafer during the circulation process.

[0026] This multifunctional and high-efficiency wafer cleaning tank includes a tank body 1, a support component 2, a drive component 3, a cleaning component 4, a drying component 5, and a particle capture component 6. The support component 2 is used to place and fix the wafer, the drive component 3 is used to drive the support component 2 to move, the cleaning component 4 is disposed in the tank body 1 and is used to clean the wafer, the drying component 5 is used to dry the moisture on the wafer surface, and the particle capture component 6 is used to remove particulate impurities from the cleaning component 4. This multifunctional and high-efficiency wafer cleaning tank achieves the cleaning of impurities and particles attached to the wafer surface through the arrangement of various structures. At the same time, the integrated design of the cleaning component 4 and the drying component 5 not only reduces costs but also improves cleaning efficiency.

[0027] The above description is merely an embodiment of this utility model and does not limit the patent scope of this utility model. Any equivalent structural or procedural transformations made based on the description and drawings of this utility model, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this utility model.

Claims

1. A multifunctional and high-efficiency wafer cleaning tank, characterized in that, include Tank body; A carrier assembly is disposed within the tank and connected to the tank, and the carrier assembly is used to place and fix the wafer; A drive component is disposed within the groove and connected to the support component, the drive component being used to drive the support component to move; A cleaning assembly is disposed within the tank and is used to clean the wafer; A drying assembly is disposed above the cleaning assembly and connected to the tank. The drying assembly is used to dry the moisture on the wafer surface. A particle capture assembly is disposed below the cleaning assembly and connected to the tank body. The particle capture assembly is used to remove particulate impurities from the cleaning assembly.

2. The multifunctional high-efficiency wafer cleaning tank according to claim 1, characterized in that, The bearing assembly includes a chuck, grippers, a turntable, a driving bevel gear, a driven bevel gear, and a first motor. The chuck is disposed within the groove and connected to the groove. Three grippers are evenly arranged in a circumferential shape on the chuck and are slidably connected to it. The turntable is disposed within the chuck and rotatably connected to its top end. The turntable has three grooves, and the three grippers are slidably disposed within each of the three grooves. Three driving bevel gears are evenly arranged in a circumferential shape on the sidewall of the chuck and are rotatably connected to it. The driven bevel gear is rotatably disposed at the bottom end of the turntable and meshes with all three driving bevel gears. The first motor is fixedly mounted on the sidewall of the chuck, and its output shaft is coaxially fixedly connected to one of the driving bevel gears.

3. The multifunctional high-efficiency wafer cleaning tank according to claim 2, characterized in that, The drive assembly includes a slide rail, a second motor, a worm gear, a mounting plate, a slider, a worm wheel, a first bevel gear, a second bevel gear, a first pulley, a rotating shaft, a second pulley, and a conveyor belt. Two slide rails are provided, each located on one side of the groove and fixedly connected to the side wall of the groove. Two second motors are provided, each fixedly mounted at the bottom of the groove and located on one side of the groove. Two worm gears are provided, each mounted on the output shaft of one of the two second motors and fixedly coaxially connected to the output shaft of the second motor. The mounting plate is located at the bottom of the chuck and rotatably connected to the chuck. The slider is fixedly mounted at the bottom end of the mounting plate. Both ends of the slider are slidably mounted within the two slide rails and threadedly connected to the two worm gears. The worm wheel is mounted within the slider and meshes with the worm gear. The first bevel gear is coaxially mounted with the worm wheel. The second bevel gear is rotatably mounted within the slider and meshes with the first bevel gear. The first pulley is located below the second bevel gear and is coaxially mounted with it. The rotating shaft is rotatably mounted at the center of the mounting plate and is fixedly connected to the chuck. The second pulley is coaxially fixedly mounted on the rotating shaft, and the second pulley is connected to the first pulley via the conveyor belt.

4. The multifunctional high-efficiency wafer cleaning tank according to claim 3, characterized in that, The cleaning assembly includes a storage tank, a first water pump, an inlet pipe, a spray pipe, a first valve, and ultrasonic transducers. The storage tank is located on one side of the tank body. The first water pump is located inside the storage tank. The inlet pipe is located on the side wall of the storage tank and communicates with the outlet of the first water pump. The end of the inlet pipe away from the storage tank passes through the tank body. There are two spray pipes, which are respectively located on both sides of the inlet pipe and are both communicated with the inlet pipe. Multiple nozzles are provided on the spray pipes. There are three first valves, which are respectively fixedly installed on the two spray pipes and the inlet pipe. Multiple ultrasonic transducers are provided, and all of the multiple ultrasonic transducers are located on the side wall of the tank body.

5. A multifunctional high-efficiency wafer cleaning tank according to claim 4, characterized in that, The drying assembly includes a sealing plate, an exhaust pipe, a second valve, a hot air nozzle, a vacuum pump, and a nitrogen nozzle. The sealing plate is fixedly mounted on the side wall of the tank and located above the injection pipe. The exhaust pipe is fixedly mounted on the top of the tank. The second valve is fixedly mounted on the exhaust pipe. There are two hot air nozzles, each located on one side of the tank and fixedly connected to the tank. The vacuum pump is fixedly mounted on the outer side wall of the tank and communicates with the interior of the tank. There are two nitrogen nozzles, each located on one side of the tank and fixedly connected to the side wall of the tank.

6. The multifunctional high-efficiency wafer cleaning tank according to claim 5, characterized in that, The sealing plate has a sealing groove at its bottom end, and a sealing strip is fixedly installed on the side wall of the chuck. The sealing groove and the sealing strip cooperate with each other.

7. A multifunctional high-efficiency wafer cleaning tank according to claim 5, characterized in that, The particle capture assembly includes a filter chamber, a guide plate, a rotating filter screen, a vacuum tube, a first gear, a second gear, a third motor, a collection bottle, and a second vacuum pump. The filter chamber is located at the bottom of the tank and is fixedly connected to the side wall of the tank. The guide plate is fixedly located at the top of the filter chamber. The vacuum tube is rotatably located at the center of the bottom end of the filter chamber. The rotating filter screen is fixedly located on the vacuum tube. The first gear is fixedly located on the vacuum tube and is coaxially arranged with the vacuum tube. The second gear is rotatably located at the bottom end of the filter chamber and meshes with the first gear. The output end of the third motor is coaxially fixedly connected to the second gear. The collection bottle is detachably connected to the bottom end of the vacuum tube. The second vacuum pump is located inside the collection bottle and connected to the vacuum tube.

8. A multifunctional high-efficiency wafer cleaning tank according to claim 7, characterized in that, The bottom of the filter chamber is also provided with a liquid outlet pipe. The end of the liquid outlet pipe away from the filter chamber passes through the side wall of the liquid storage tank. A second water pump is provided inside the liquid storage tank, and the inlet of the second water pump is connected to the liquid outlet pipe.

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