A liquid supply system for a semiconductor cleaning machine

Abstract

The utility model provides a kind of liquid supply system for semiconductor cleaning machine, the utility model's liquid supply system for semiconductor cleaning machine includes first reagent supply source, second reagent supply source, ultrapure water supply source and gas source;Nano bubble generating device;Nano bubble solution storage tank, with nano bubble generating device intercommunication, for storing nano bubble solution generated in nano bubble generating device;Pre-liquid tank is equipped with the first intercommunication channel being interconnected with first reagent supply source, the second intercommunication channel being interconnected with second reagent supply source, nano bubble solution channel being interconnected with nano bubble solution storage tank;Pre-liquid tank is further equipped with first circulation pipeline;Reaction tank, bottom is equipped with second heater;First connecting pipeline, between pre-liquid tank and reaction tank is set up. By first in pre-liquid tank completing the configuration, mixing and temperature rise of chemical liquid, save time, improve efficiency.

Description

Technical Field

[0001] This utility model relates to the field of wafer cleaning processes, and more specifically, to a liquid supply system for a semiconductor cleaning machine. Background Technology

[0002] In the cleaning process of semiconductor wafers, specialized equipment such as tank cleaning units are typically used to remove chemicals from the wafers. However, the current SC1 chemical tank has several problems during solution changeover: product stagnation during the changeover prevents production from continuing; and the excessively long changeover time severely impacts the overall equipment capacity. Specifically, the existing SC1 tank's solution changeover process includes multiple steps such as draining, water replenishment, chemical addition, circulation, and heating, with a total time of approximately 30 minutes for each changeover and heating cycle. Performing two solution changes per shift results in a loss of one hour of effective production time, significantly reducing equipment uptime and becoming a bottleneck for capacity improvement. Utility Model Content

[0003] In view of the problems existing in the liquid supply system for semiconductor cleaning machines described above, this application provides a liquid supply system for semiconductor cleaning machines, which improves the existing liquid exchange tank to shorten the liquid exchange time and improve the liquid exchange efficiency.

[0004] To achieve the above and other related objectives, this utility model provides a liquid supply system for a semiconductor cleaning machine, comprising: First drug solution supply source, second drug solution supply source, ultrapure water supply source and gas source; The nanobubble generator is equipped with a first ultrapure water communication channel connected to the ultrapure water supply source and a gas source communication channel connected to the gas source. A nanobubble solution storage tank, connected to the nanobubble generator, is used to store the nanobubble solution generated in the nanobubble generator; The pre-mixed liquid tank is equipped with a first connecting channel connected to the first drug supply source, a second connecting channel connected to the second drug supply source, and a nano-bubble solution channel connected to the nano-bubble solution storage tank; the pre-mixed liquid tank is also equipped with a first circulation pipeline; The reaction vessel is equipped with a second heater at the bottom; The first connecting pipeline is located between the pre-mixed liquid tank and the reaction tank.

[0005] Optionally, the pre-mixed liquid tank further includes a first heater disposed at the bottom of the pre-mixed liquid tank.

[0006] Optionally, the first circulation pipeline includes a first circulation pump and a concentration meter disposed on the circulation pipeline.

[0007] Optionally, the pre-mixed liquid tank further includes: A pressure relief valve is located at the top of the pre-mixed liquid tank; A drain pipe, one end of which is connected to the bottom of the pre-mixed liquid tank; A drain valve is located on the drain pipe.

[0008] Optionally, the reaction tank further includes a second ultrapure water connection channel connected to the ultrapure water supply source.

[0009] Optionally, the first connecting channel, the second connecting channel, the nanobubble solution channel, the first ultrapure water connecting channel, and the second ultrapure water connecting channel are all equipped with flow valves.

[0010] Optionally, it further includes: a hot ultrapure water supply source, wherein the reaction tank includes a hot ultrapure water communication channel connected to the hot ultrapure water supply source.

[0011] Optionally, the reaction tank has a double-layer overflow structure, comprising an inner reaction tank and an outer reaction tank, wherein the outer reaction tank is sleeved outside the inner reaction tank, and the side wall height of the outer reaction tank is greater than the side wall height of the inner reaction tank.

[0012] Optionally, the reaction tank is equipped with a second circulation pipeline, one end of which is connected to the bottom of the outer reaction tank and the other end of which is connected to the inner reaction tank.

[0013] Optionally, an ultrasonic generator is provided inside the reaction tank.

[0014] As described above, the liquid supply system for a semiconductor cleaning machine, its manufacturing method, and the display device provided by this utility model have at least the following beneficial technical effects: This invention relates to a liquid supply system for semiconductor cleaning machines. By introducing a pre-mixed liquid tank and its associated circulation, heating, and monitoring systems, the core time-consuming chemical solution preparation, mixing, and heating processes in the liquid change process are separated from the shutdown liquid change in the reaction tank and transferred to the pre-mixed liquid tank for parallel pre-processing. This significantly reduces equipment waiting time and improves equipment utilization and overall capacity. Furthermore, the independent design of the pre-mixed liquid tank, combined with its built-in circulation pump, concentration meter, and heater, constitutes a closed, controllable precision liquid preparation and preheating unit. This ensures the uniformity of chemical mixing and the accuracy of the proportions. Preheating not only saves time but also avoids localized overheating and temperature fluctuations that may occur when directly heating within the reaction tank.

[0015] Simultaneously, a nanobubble generator is integrated, incorporating nanobubble technology into the standard SC1 cleaning process. Utilizing ultrasonic activation of the nanobubbles generates a dual effect of physical cleaning via microjets and chemical enhancement via free radicals. This synergistic effect, combined with the intrinsic cleaning capabilities of the SC1 solution, results in a more thorough removal of various contaminants from the wafer surface, significantly improving cleaning efficiency and cleanliness. Attached Figure Description

[0016] Figure 1 The diagram shown is a schematic of the liquid supply system for a semiconductor cleaning machine provided in this application.

[0017] Reference numerals: 10. First drug solution supply source; 11. Second drug solution supply source; 12. Ultrapure water supply source; 13. Hot ultrapure water supply source; 14. Flow valve; 15. Gas source; 20. Pre-mixed liquid tank; 201. First heater; 21. First connecting channel; 22. Second connecting channel; 23. Nanobubble solution channel; 24. First circulation pipeline; 241. First circulation pump; 242. Concentration meter; 25. Pressure relief valve; 26. Drain pipe; 261. Drain valve; 30. Reaction tank; 30 1. Inner reaction tank; 302. Outer reaction tank; 31. Second circulation pipeline; 311. Second circulation pump; 312. Second heater; 32. Second ultrapure water connection channel; 33. Hot ultrapure water connection channel; 34. Ultrasonic generator; 40. First connecting pipeline; 41. Pre-filled liquid valve; 50. Temperature sensor; 60. Nanobubble generator; 61. Nanobubble solution storage tank; 62. First ultrapure water connection channel; 63. Gas source connection channel; 64. Nanobubble liquid connection channel. Detailed Implementation

[0018] The following specific examples illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. This utility model can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this utility model.

[0019] It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of this utility model. Although the illustrations only show components related to this utility model and are not drawn according to the actual number, shape and size of the components, the shape, quantity, positional relationship and proportion of each component can be arbitrarily changed under the premise of realizing the technical solution of this utility model, and the layout of the components may also be more complex.

[0020] This embodiment provides a liquid supply system for a semiconductor cleaning machine, such as... Figure 1As shown, the liquid supply system for a semiconductor cleaning machine in this embodiment includes a first liquid supply source 10, a second liquid supply source 11, an ultrapure water supply source 12, and an air source 15; a nanobubble generator 60, which has a first ultrapure water communication channel 62 connected to the ultrapure water supply source 12 and an air source communication channel 63 connected to the air source 15; a nanobubble solution storage tank 61, which is connected to the nanobubble generator 60 and is used to store the nanobubble solution generated in the nanobubble generator 60; a pre-mixed liquid tank 20, which includes a first communication channel 21 connected to the first liquid supply source 10, a second communication channel 22 connected to the second liquid supply source 11, and a nanobubble solution channel 23 connected to the nanobubble solution storage tank 61; the pre-mixed liquid tank is also equipped with a first circulation pipeline 24; a reaction tank 30, which has a second heater 312 at the bottom; and a first connecting pipeline 40, which is disposed between the pre-mixed liquid tank 20 and the reaction tank 30.

[0021] Optionally, a nanobubble solution is pre-generated in the nanobubble generator 60 and stored in the nanobubble solution storage tank 61. Specifically, the gas provided by the gas source 15 includes nitrogen (N2), oxygen (O2), ozone (O3), and other gases or mixed gases. Specifically, in this embodiment, ozone is used as the gas source 15, as ozone can additionally provide strong oxidizing properties, enhancing the removal capacity of organic pollutants.

[0022] Specifically, the nanobubble generator 60 is connected to the ultrapure water supply source 12 through the first ultrapure water connection channel 62, and to the gas source 15 through the gas source connection channel 63. The nanobubble generator 60, through its unique internal generation mechanism, such as dissolved gas release, ultrasonic cavitation, or rotary shearing, uniformly and stably dissolves or disperses the gas supplied by the gas source 15 into ultrapure water in the form of extremely fine bubbles, typically with diameters ranging from tens to hundreds of nanometers, forming a nanobubble solution.

[0023] The nanobubble solution storage tank 61 is connected to the outlet of the nanobubble generator 60 and is used to temporarily store the nanobubble solution continuously generated by the nanobubble generator 60. The nanobubble liquid connecting channel 64 connects the nanobubble solution storage tank 61 to the pre-mixed liquid tank 20.

[0024] Specifically, flow valves 14 are respectively installed on the first ultrapure water connection channel 62, the gas source connection channel 63, and the nanobubble solution connection channel 64. By controlling the flow valves 14, the volume of ultrapure water and the introduced gas source is adjusted, thereby controlling the mass of the nanobubble solution. By controlling the flow valves 14, the stored nanobubble solution can be quantitatively added to the pre-mixed solution tank 20.

[0025] Ammonia, hydrogen peroxide, ultrapure water, and nanobubble solution are first mixed in a pre-mixing tank 20 according to a certain ratio. The pre-mixing tank 20 is equipped with a first circulation pipe 24, which ensures more uniform mixing of the ammonia, hydrogen peroxide, ultrapure water, and nanobubble solution. Optionally, one end of the first circulation pipe 24 is located at the bottom of the pre-mixing tank 20, and the other end is located on the upper side wall of the pre-mixing tank 20, forming a closed circulation loop. A first circulation pump 241 is installed on the first circulation pipe 24. When the first circulation pump 241 is started, it pumps the solution from the bottom of the pre-mixing tank 20 and returns it from the top of the tank, creating mixing and stirring. This ensures that the chemical reagents in the tank are fully and uniformly mixed, avoiding uneven concentrations in certain areas.

[0026] Optionally, a concentration meter 242 is also installed on the first circulation pipeline 24 to monitor the concentration of key chemical components (such as H2O2 or NH4OH) in the circulating liquid in real time. Specifically, the operator can record the concentration value and adjust the ratio of ammonia, hydrogen peroxide, ultrapure water, and nanobubble solution according to the concentration value. Optionally, the concentration meter 242 can feed back the concentration signal to the system control unit (such as a PLC, not shown in the figure), and then adjust the ratio of ammonia, hydrogen peroxide, ultrapure water, and nanobubble solution according to the concentration value; thereby realizing closed-loop control of the solution preparation process and ensuring that the ratio of solution preparation is consistent each time.

[0027] Optionally, the target temperature of the heated liquid in the first heater 201 is higher than the final temperature of the liquid obtained in the reaction tank 30, specifically, by about 3°C ​​to 10°C. Further, it is 5°C higher.

[0028] Optionally, a first heater 201 is also provided in the pre-mixed solution tank 20, located at the bottom of the pre-mixed solution tank 20. By setting up the first heater 201, the solution change cycle is shortened. Specifically, after the mixing and concentration verification of the drug solution are completed in the pre-mixed solution tank 20, the first heater 201 starts working, directly heating the prepared SC1 solution in the tank. Therefore, the drug solution injected into the reaction tank 30 through the first connecting pipe 40 is already preheated, even reaching or approaching the process temperature. The second heater 312 of the reaction tank 30 only needs to perform minor compensatory heating or simply maintain the temperature, eliminating the need to spend a significant amount of time heating from room temperature. The time-consuming heating process originally carried out in the reaction tank is transferred to the pre-mixed solution tank 20. Optionally, the first heater 201 uses an immersion heating tube or plate heater wrapped with corrosion-resistant materials (such as PTFE, PFA, quartz, etc.) to ensure long-term stability and reliability in strong acid and alkali chemical environments.

[0029] Optionally, the pre-mixed liquid tank 20 also includes a pressure relief valve 25 located at the top of the pre-mixed liquid tank 20. Specifically, the pre-mixed liquid tank 20 is a closed cavity. During the pre-mixing process, especially when the first heater 201 in the tank is started to heat the chemical solution, ammonia water is volatile and will generate gas, causing the pressure and temperature inside the tank to gradually increase. The pressure relief valve 25 can automatically open when the internal pressure exceeds a preset safety threshold to discharge excess gas, effectively preventing safety hazards such as equipment deformation, sealing failure, or leakage of connecting pipes that may be caused by excessive pressure inside the tank, and ensuring the safe operation of the system.

[0030] Optionally, the pre-mixed liquid tank 20 also includes a drain pipe 26, which is equipped with a drain valve 261 for cleaning the pre-mixed liquid tank 20. Specifically, one end of the drain pipe 26 is located at the bottom of the pre-mixed liquid tank 20, and the other end is connected to the drain system.

[0031] The reaction tank 30 is the place where the actual cleaning process of silicon wafers is carried out. Optionally, the reaction tank 30 is provided with a second circulation pipeline 31, and a second circulation pump 311 and a second heater 312 are provided on the second circulation pipeline 31 to maintain the working temperature of the cleaning solution in the reaction tank 30.

[0032] Optionally, such as Figure 1 As shown, the reaction tank 30 has a double-layer overflow structure, comprising an inner reaction tank 301 and an outer reaction tank 302 surrounding the inner reaction tank 301. Specifically, the inner reaction tank 301 is used to hold the silicon wafer to be cleaned, serving as the main tank for the cleaning operation, and its depth is greater than that of the outer reaction tank 302. The outer reaction tank 302 is fitted outside the inner reaction tank 301, forming an annular overflow cavity between them. The height of the sidewall of the outer reaction tank 302 is higher than that of the inner reaction tank 301. During normal operation, the cleaning solution is injected into the inner reaction tank 301. When the liquid level exceeds the overflow port on the sidewall of the inner reaction tank 301, the excess solution in the inner reaction tank 301 can flow into the outer reaction tank 302 through the sidewall, automatically maintaining a constant liquid level in the inner reaction tank 301 and ensuring that the silicon wafer to be cleaned is in a stable process environment.

[0033] Specifically, the reaction tank 30 is equipped with a second circulation pipe 31. One end of the second circulation pipe 31 is connected to the bottom of the outer reaction tank 302, and the other end is connected to the inner reaction tank 301. The second circulation pipe 31 allows the cleaning solution to flow from the outer reaction tank 302 back to the inner reaction tank 301. Specifically, the second circulation pipe 31 is equipped with a second circulation pump 311 and a second heater 312 to maintain the working temperature of the cleaning solution in the reaction tank 30. Optionally, the second heater 312 receives instructions from the control system to heat the cleaning solution flowing through the second circulation pipe 31 to compensate for heat loss during the process and maintain the temperature inside the reaction tank 30.

[0034] Specifically, the liquid supply system for the semiconductor cleaning machine includes a first connecting pipe 40. The pre-mixed liquid tank 20 and the reaction tank 30 are connected through the first connecting pipe 40. The first connecting pipe 40 is located between the pre-mixed liquid tank 20 and the reaction tank 30. Furthermore, the first connecting pipe 40 is equipped with a pre-mixed replenishment valve 41, such as a pneumatic valve. After the liquid in the pre-mixed liquid tank 20 has been mixed, circulated evenly, and preheated, the pre-mixed replenishment valve 41 on the first connecting pipe 40 is opened, and the pre-mixed SC1 solution with a temperature close to the target value can be quickly delivered to the reaction tank 30, which greatly shortens the liquid replacement, mixing, and heating time of the reaction tank itself.

[0035] Optionally, the reaction tank 30 also includes a hot ultrapure water connection channel 33 for providing hot ultrapure water. Optionally, the liquid supply system for the semiconductor cleaning machine is provided with a hot ultrapure water supply source 13. Optionally, the hot ultrapure water connection channel 33 is connected to the ultrapure water supply source 12, and a heater is provided on the hot ultrapure water connection channel 33. Specifically, in this embodiment, the liquid supply system for the semiconductor cleaning machine is provided with a hot ultrapure water supply source 13, and the hot ultrapure water connection channel 33 is connected to the hot ultrapure water supply source 13. The hot ultrapure water connection channel 33 can continuously provide high-purity hot water with a stable temperature within a specific range (temperature between 70-90 ℃). In some process steps, it may be necessary to fine-tune the concentration or temperature of the solution in the reaction tank 30. Hot ultrapure water at a predetermined temperature can be directly injected through the hot ultrapure water connection channel 33. Before changing the solution, hot water can be injected into the reaction tank 30 through the hot ultrapure water connection channel 33 for rapid rinsing. Higher water temperatures usually result in better cleaning effects.

[0036] Specifically, the first connecting channel 21, the second connecting channel 22, the nanobubble solution channel 23, the first ultrapure water connecting channel 62, the second ultrapure water connecting channel 32, the hot ultrapure water connecting channel 33, the gas source connecting channel 63, and the nanobubble liquid connecting channel 64 are all equipped with flow valves 14. The flow valves 14 precisely control the dosage and timing of the chemical liquid. Optionally, the flow valves 14 include pneumatic valves, electric valves, and manual valves. In this embodiment, the flow valve 14 is a pneumatic valve with fast response, resistance to chemical corrosion, and ease of remote automatic control. Specifically, the flow valves 14 are controlled by a control system.

[0037] The control system controls the flow valves 14 on each channel, so that ammonia, hydrogen peroxide and ultrapure water can be accurately delivered to the pre-mixing tank 20 according to the preset process formula ratio for pre-mixing and preparation into SC1 standard cleaning solution. Generally, the ratio of NH4OH:H2O2:H2O is between 1:1:5 and 1:1:3.

[0038] Optionally, temperature sensors 50 are also installed in the pre-mixed liquid tank 20 and the reaction tank 30. The temperature sensors 50 feed the temperature back to the control system in real time, and the control system controls the flow valves 14 to control the first heater 201 and / or the second heater 312 to adjust the temperature of the liquid in the pre-mixed liquid tank 20 and the reaction tank 30.

[0039] Optionally, the reaction tank 30 is also equipped with an ultrasonic generator 34. The ultrasonic generator 34 generates sound waves in the cleaning solution. Under the action of the ultrasonic generator 34 at the bottom of the reaction tank 30, the nanobubble solution generates extremely strong local shock waves and microjets when the bubbles burst, which can effectively impact the silicon wafer surface and clean submicron or even nano-sized particulate contaminants attached to the silicon wafer.

[0040] The liquid supply system for a semiconductor cleaning machine provided in this embodiment has the following specific workflow: Opening the drain valve 261, clean water is introduced into the pre-mixed liquid tank 20 to clean it. A certain time before the reaction tank 30 needs liquid replacement (e.g., half an hour, one hour, etc.), the system starts the pre-mixed liquid process in advance. Chemicals are added to the pre-mixed liquid tank 20 in sequence and quantity, the first circulation pump 241 is started for mixing, and the concentration meter 242 monitors the mixture. Subsequently, the first heater 201 in the pre-mixed liquid tank 20 is started to preheat the solution to the set temperature. After the old liquid in the reaction tank 30 is drained, the qualified chemical solution in the pre-mixed liquid tank 20 is quickly injected into the reaction tank 30 through the first connecting pipe 40. The second heater 312 in the reaction tank 30 only needs to perform a small heating to bring the liquid temperature to the process set point, after which silicon wafers can be inserted for cleaning. Furthermore, by integrating a nanobubble generator, nanobubble technology is incorporated into the standard SC1 cleaning process. By utilizing ultrasound to activate nanobubbles, a dual effect of physical cleaning via microjets and chemical enhancement via free radicals is generated. This synergistic effect with the intrinsic cleaning capabilities of the SC1 solution results in a more thorough removal of various contaminants from the wafer surface, significantly improving cleaning efficiency and cleanliness. This design allows time-consuming operations such as solution preparation, mixing, and heating, which were originally required in the reaction tank, to be performed in parallel beforehand. This drastically reduces the solution changeover time from 30 minutes to less than 10 minutes, significantly improving equipment utilization and overall production capacity.

[0041] The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit the scope of this utility model. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.

Claims

1. A liquid supply system for a semiconductor cleaning machine, characterized in that, include: First drug solution supply source, second drug solution supply source, ultrapure water supply source and gas source; The nanobubble generator is equipped with a first ultrapure water communication channel connected to the ultrapure water supply source and a gas source communication channel connected to the gas source. A nanobubble solution storage tank, connected to the nanobubble generator, is used to store the nanobubble solution generated in the nanobubble generator; The pre-mixed liquid tank is equipped with a first connecting channel connected to the first drug supply source, a second connecting channel connected to the second drug supply source, and a nano-bubble solution channel connected to the nano-bubble solution storage tank; the pre-mixed liquid tank is also equipped with a first circulation pipeline; The reaction vessel is equipped with a second heater at the bottom; The first connecting pipeline is located between the pre-mixed liquid tank and the reaction tank.

2. The liquid supply system for a semiconductor cleaning machine according to claim 1, characterized in that, The pre-mixed liquid tank also includes a first heater, which is disposed at the bottom of the pre-mixed liquid tank.

3. The liquid supply system for a semiconductor cleaning machine according to claim 1, characterized in that, The first circulation pipeline includes a first circulation pump and a concentration meter disposed on the circulation pipeline.

4. The liquid supply system for a semiconductor cleaning machine according to claim 1, characterized in that, The pre-mixed liquid tank also includes: A pressure relief valve is located at the top of the pre-mixed liquid tank; The drain pipe is located at the bottom of the pre-mixed liquid tank; A drain valve is located on the drain pipe.

5. The liquid supply system for a semiconductor cleaning machine according to claim 1, characterized in that, The reaction tank also includes a second ultrapure water connection channel that connects to the ultrapure water supply source.

6. The liquid supply system for a semiconductor cleaning machine according to claim 5, characterized in that, The first connecting channel, the second connecting channel, the nanobubble solution channel, the first ultrapure water connecting channel, and the second ultrapure water connecting channel are all equipped with flow valves.

7. The liquid supply system for a semiconductor cleaning machine according to claim 1, characterized in that, Also includes: Hot ultrapure water supply source; The reaction tank also includes a hot ultrapure water connection channel that connects to the hot ultrapure water supply source.

8. The liquid supply system for a semiconductor cleaning machine according to claim 1, characterized in that, The reaction tank has a double-layer overflow structure, including an inner reaction tank and an outer reaction tank. The outer reaction tank is sleeved outside the inner reaction tank, and the side wall height of the outer reaction tank is greater than that of the inner reaction tank.

9. The liquid supply system for a semiconductor cleaning machine according to claim 8, characterized in that, The reaction tank is equipped with a second circulation pipeline, one end of which is connected to the bottom of the outer reaction tank and the other end of which is connected to the inner reaction tank.

10. The liquid supply system for a semiconductor cleaning machine according to claim 1, characterized in that, An ultrasonic generator is installed inside the reaction tank.

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