Heating disc and desmear apparatus

Abstract

A heating disc and a desmear equipment. The heating disc comprises a disc body which can be heated; a supporting member arranged on the disc body and retractable relative to the disc body, used for supporting a wafer; and a positioning member arranged on the disc body and retractable relative to the disc body, used for limiting the wafer; wherein the positioning member comprises a positioning body and a pyramid arranged on the positioning body; the pyramid has opposite maximum dimension end and minimum dimension end; the maximum dimension end of the pyramid is connected with the positioning body; and in the positioning member, the shortest distance from the edge of the maximum dimension end of the pyramid to the center line of the disc body is greater than the shortest distance from the edge of the positioning body to the center line of the disc body. By using the above scheme, the heating uniformity of the wafer in the desmear equipment can be improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, specifically to a heating plate and a glue removal device. Background Technology

[0002] In wafer manufacturing processes, dry resist stripping (plasma ashing) offers numerous advantages over wet resist stripping, including being pollution-free, having a high stripping rate, providing thorough removal, and allowing for precise control, making it an indispensable process in the entire manufacturing process. With the advancement of semiconductor manufacturing technology and the further miniaturization of feature sizes, the requirements for the stability and precise control of plasma processes are becoming increasingly stringent. Among these factors, wafer temperature is one of the most critical influences on the rate and uniformity of plasma resist stripping; therefore, precise temperature control is essential for ensuring process stability.

[0003] However, when using existing resist stripping equipment to process wafers, uneven heating of the wafers can easily occur, which affects the resist stripping rate and uniformity, resulting in poor process stability. Utility Model Content

[0004] The problem this invention aims to solve is: how to improve the heating uniformity of wafers in resist removal equipment.

[0005] To address the above problems, this utility model provides a heating plate, which includes:

[0006] Heated plate;

[0007] A support member, disposed on the disk body and retractable relative to the disk body, is used to support the wafer;

[0008] A positioning element, disposed on the disk body and retractable relative to the disk body, is used to limit the position of the wafer;

[0009] The positioning element includes: a positioning body and a cone body disposed on the positioning body; the cone body has a maximum size end and a minimum size end; the maximum size end of the cone body is connected to the positioning body; in the same positioning element, the shortest distance from the edge of the maximum size end of the cone body to the center line of the disc is greater than the shortest distance from the edge of the positioning body to the center line of the disc.

[0010] In one possible embodiment, the centerline of the positioning body coincides with the centerline of the vertebral body.

[0011] In one possible embodiment, the difference between the shortest distance from the edge of the largest end of the vertebral body to the center line of the disc and the shortest distance from the edge of the positioning body to the center line of the disc is greater than 0.7 mm and less than 2.5 mm.

[0012] In one possible embodiment, the positioning body is a cylinder.

[0013] In one possible embodiment, in use, the top surface of the positioning body is lower than or flush with the surface of the disk that contacts the wafer.

[0014] In one possible embodiment, the heating plate includes at least one set of positioning elements; the number of positioning elements in the set is two or more, and they are distributed in the same circumference around the center of the plate.

[0015] In one possible embodiment, the heating plate includes two or more sets of positioning members, with different sets of positioning members at different distances from the center of the plate.

[0016] In one possible embodiment, the number of the support members is two or more, and they are circumferentially distributed around the center of the disk body, and the distance from the positioning member to the center of the disk body is greater than the distance from the support member to the center of the disk body.

[0017] This utility model embodiment also provides a glue removal device, the glue removal device comprising: a process chamber, wherein the process chamber is provided with a heating plate of any of the above-mentioned types.

[0018] In one possible embodiment, the desizing device further includes a robotic arm for gripping the wafer onto a support of the heating plate.

[0019] Compared with the prior art, the technical solution of this utility model embodiment has the following advantages:

[0020] By applying the solution of this utility model, since the distance from the edge of the largest dimension end of the cone to the center line of the disk is greater than the distance from the edge of the positioning body to the center line of the disk, the distance between the wafer and the cone can be increased, thereby reducing the probability of the wafer being too close to the cone, reducing the impact on the resist removal rate and uniformity, and improving process stability. Attached Figure Description

[0021] Figure 1 This is a top view of the heating plate in a glue removal device;

[0022] Figure 2 yes Figure 1 A schematic diagram of the cross-sectional structure of the heating plate along the AA direction when in use;

[0023] Figure 3 This is a top view of a heating plate in a glue-removing device according to an embodiment of this utility model;

[0024] Figure 4 yes Figure 3 Top view of the central heating plate along the BB direction when it is not in use;

[0025] Figure 5 This is a top view of the heating plate in another glue-removing device according to an embodiment of this utility model;

[0026] Figure 6 yes Figure 3 Top view of the heating plate along the BB direction when in use. Detailed Implementation

[0027] In practical applications, desmearing equipment is usually equipped with a process chamber. The process chamber is equipped with a heating plate. The robotic arm can place the wafer on the heating plate of the process chamber and use the heating plate to heat the wafer to meet the temperature requirements of the desmearing process.

[0028] Figure 1 This is a top view of the heating plate 10 in an existing glue-removing device. (Refer to...) Figure 1 In existing glue-removing equipment, the heating plate 10 is typically equipped with several ejector pins 11 and positioning pins 12. The ejector pins 11 are circumferentially distributed around the center of the heating plate 10. The positioning pins 12 are located on the heating plate 10 and around the ejector pins 11, also circumferentially distributed around the center of the heating plate 10. Both the ejector pins 11 and the positioning pins 12 can rise or fall relative to the heating plate 10.

[0029] Reference Figure 2 Before removing the adhesive from wafer 20, the heating plate 10 needs to be heated to a set temperature. Then, the robotic arm can be controlled to place wafer 20 onto the ejector pin 11, which supports wafer 20. As the ejector pin 11 descends... Figure 2 Once the ejector pin 11 has been moved into the heating plate 10, the wafer 20 will also descend to the surface of the heating plate 10, thereby achieving heating of the wafer 20. The positioning pin 12 is located on the periphery of the ejector pin 11 and is used to limit the position of the wafer 20 on the surface of the heating plate 10 to ensure that the wafer 20 falls in the center of the heating plate 10 and does not slide out of the heating plate 10.

[0030] However, in practical applications, since the heating plate 10 is in an atmospheric environment, the wafer 20 may slide due to atmospheric influence as it descends with the ejector pin 11. This can cause the wafer 20 to occasionally come into contact with the edge of the positioning pin 12. Because the positioning pin 12 and the heating plate 10 are made of different materials, there is a temperature difference between them. Therefore, when the wafer 20 comes into contact with the surface of the positioning pin 12, it will cause uneven heating of the wafer 20. Uneven heating of the wafer 20 will affect the resist removal rate and uniformity, resulting in poor process stability.

[0031] For example, Table 1 shows the etching rate (ER) and resist removal uniformity (U%) of cavities A1 and A2 of a certain resist removal equipment on April 16, April 18, April 22, and April 23. As can be seen from Table 1, on April 22, the wafer was close to the edge of the positioning pin, resulting in excessively low etching rates for cavities A1 (268.8 Å / min) and A2 (307.4 Å / min), while excessively high resist removal uniformity for cavities A1 (40.9%) and A2 (37.8%).

[0032] Table 1

[0033]

[0034] To address this issue, this invention provides a heating plate in which the shortest distance from the edge of the largest dimension end of the cone to the center line of the plate is greater than the shortest distance from the edge of the positioning body to the center line of the plate. This increases the distance between the wafer and the cone, thereby reducing the probability of the wafer being too close to the cone, minimizing the impact on the resist removal rate and uniformity, and improving process stability.

[0035] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0036] Reference Figure 3 and Figure 4 This utility model embodiment provides a heating plate 30, which may include: a heatable plate body 31, a support member 32, and a positioning member 33. Wherein:

[0037] The support member 32, disposed on the disk body 31 and retractable relative to the disk body 31, is used to support the wafer. The positioning member 33, disposed on the disk body 31 and retractable relative to the disk body 31, is used to limit the position of the wafer.

[0038] The positioning element 33 may include: a positioning body 331 and a cone 332 disposed on the positioning body 331; the cone 332 has a maximum size end and a minimum size end; the maximum size end of the cone 332 is connected to the positioning body 331; in the same positioning element 33, the shortest distance L1 from the edge of the maximum size end of the cone 332 to the center line S1 of the disc 31 is greater than the shortest distance L2 from the edge of the positioning body 331 to the center line S1 of the disc 31.

[0039] The wafer is usually lowered onto the surface of the disk 31 along with the support 32. Since the shortest distance L1 from the edge of the largest dimension end of the cone 332 to the center line S1 of the disk 31 is greater than the shortest distance L2 from the edge of the positioning body 331 to the center line S1 of the disk 31, the distance from the cone 332 to the wafer can be increased, thereby reducing the probability of the wafer being close to the cone, reducing the impact on the resist removal rate and uniformity, and improving process stability.

[0040] In specific implementations, the disk body 31 is typically made of metal. The disk body 31 has a built-in heater, which can be a resistance wire or a heating element, etc. Connecting the heater to a power source allows for heating of the disk body 31. The disk body 31 has opposing first surfaces 31a and second surfaces 31b. The first surface 31a of the disk body 31 is in contact with the wafer, and the second surface 31b of the disk body 31 is opposite to the first surface 31a. The centerline S1 of the disk body 31 is the centerline of the disk body 31 perpendicular to the first surface 31a and the second surface 31b.

[0041] In practice, the disk body 31 is provided with several support holes, and a support member 31 is provided in each support hole. The shape of the support hole is consistent with the shape of the support member 31.

[0042] In specific implementations, there can be two or more support holes, which can be circumferentially distributed around the center of the disc 31. Each support hole contains a support member 32, thus allowing the support members 32 to be circumferentially distributed around the center of the disc 31. The support member 31 can be made of ceramic material. The support member 32 within the support hole can extend and retract relative to the disc 31 under the drive of a first driving member, such as a cylinder.

[0043] For example, four support holes can be provided, thereby allowing four support members 32 to be installed on the disk body 31. When the four support members 32 are controlled to extend outside the disk body 31, the top ends of the four support members 32 are on the same plane, thereby supporting the wafer. When the four support members 32 are controlled to retract synchronously, the wafer can be driven down, eventually causing the wafer to land on the surface of the disk body 31, where the temperature of the disk body 31 is used to heat the wafer.

[0044] In a specific implementation, the distance from the positioning member 33 to the center of the disc 31 is greater than the distance from the support member 32 to the center of the disc 31. Specifically, the positioning member 33 may include a positioning body 331 and a cone 332. The cone 332 has a maximum size end and a minimum size end. The maximum size end of the cone 332 is connected to the positioning body 331, and the minimum size end of the cone 332 is away from the positioning body 331. The positioning body 331 and the cone 332 as a whole can be telescopically extended and retractable relative to the disc 31 under the drive of the second driving member.

[0045] In practice, the positioning body 331 and the cone 332 can be formed integrally or independently; no restriction is imposed here. For example, the positioning body 331 and the cone 332 can be formed as a single positioning pin. The material of this positioning pin can be ceramic.

[0046] In specific implementations, the positioning body 331 can have various shapes, such as a cuboid, cube, or cylinder. The centerline of the positioning body 331 may not coincide with the centerline of the cone 332, that is, the centerline of the cone 332 may deviate from the centerline of the positioning body 331.

[0047] In one embodiment of this utility model, the center line of the positioning body 331 coincides with the center line of the cone 332. Taking the positioning body 331 as a cylinder as an example, the center line of the cylinder can coincide with the center line of the cone 332. In this case, from a top view, the edge of the positioning body 331 and the edge of the largest dimension end of the cone 332 form a concentric ring.

[0048] In specific implementation, the difference between the shortest distance L1 from the edge of the largest size end of the cone 331 to the center line of the disk 31 and the shortest distance L2 from the edge of the positioning body 332 to the center line of the disk 31 can be set according to the distance that the wafer slides due to atmospheric influence during the actual landing process, so as to avoid the wafer from sticking tightly to the surface of the cone 331.

[0049] In one embodiment of this utility model, the difference between the shortest distance L1 from the edge of the largest dimension end of the cone 331 to the center line of the disc 31 and the shortest distance L2 from the edge of the positioning body 332 to the center line of the disc 31 is greater than 0.7mm and less than 2.5mm. For example, it can be 0.75mm, 1mm, 1.2mm or 1.4mm, etc.

[0050] Taking the positioning body 331 as a cylinder as an example, the difference between the diameter of the cylinder and the maximum size of the cone 332 is greater than 0.7mm and less than 2.5mm. For example, the difference between the diameter of the cylinder and the maximum size (i.e., the maximum diameter) of the cone 332 is 1mm.

[0051] In specific implementation, two or more positioning elements 33 at the same distance from the center of the disc 31 can be regarded as a group of positioning elements, that is, the positioning elements 33 in the same group are distributed at intervals along the same circumference with the center of the disc 31 as the center.

[0052] In practical applications, the heating plate 30 may include only one set of positioning elements 33, or it may include two or more sets of positioning elements 33. The distance from each set of positioning elements 33 to the center of the plate body 31 is different. Specifically, the distance from the positioning elements 33 to the center of the plate body 31 can be set according to the size of the wafer. In this case, different sets of positioning elements 33 are distributed around the center of the plate body 31 along different circumferences, thereby matching wafers of different sizes and meeting the positioning requirements of wafers of different sizes.

[0053] For example, refer to Figure 5 The heating plate 30 may include two sets of positioning elements: a first set and a second set. The first set of positioning elements is distributed along a circumference 301 with the center of the plate body 31 as the center, and the second set of positioning elements is distributed along a circumference 302 with the center of the plate body 31 as the center. The distance from the first set of positioning elements distributed along the circumference 301 to the center of the plate body 31 is greater than the distance from the second set of positioning elements distributed along the circumference 302 to the center of the plate body 31. When the wafer size is small, the second set of positioning elements can be used for positioning; when the wafer size is large, the first set of positioning elements can be used for positioning. Thus, the same heating plate 30 can accommodate wafers of various sizes.

[0054] It should be noted that when the heating plate 30 includes two or more sets of positioning members, the distance from the two or more sets of positioning members to the center of the plate body 31 is greater than the distance from the support member 32 to the center of the plate body.

[0055] Taking the heating plate 30 with only one set of positioning members as an example, refer to Figure 6 Before removing the adhesive from wafer 40, a robotic arm can be controlled to place wafer 40 on support 32, and support 32 and positioning element 33 can be controlled to retract. Before wafer 40 lands on the surface of disk 31, positioning body 331 of positioning element 33 retracts into disk 31. That is, in use, the top surface of positioning body 331 is lower than or flush with the first surface 31a of disk 31. This increases the distance between positioning element 33 and wafer 40 when wafer 40 lands on the first surface 31a of disk 31, thus preventing wafer from sticking to the surface of positioning element 33 and improving the heat uniformity of wafer 40.

[0056] In the embodiment of this utility model, the heating plate 30 is used. Since the shortest distance from the edge of the largest dimension end of the cone 332 to the center line of the plate 31 is greater than the shortest distance from the edge of the positioning body 331 to the center line of the plate 31, the distance between the positioning member 33 and the wafer 40 can be increased in the use state, thereby avoiding the wafer from being close to the surface of the positioning member 33, and thus improving the heating uniformity of the wafer 40.

[0057] This utility model embodiment also provides a glue removal device, which may include a process chamber, wherein a heating plate of any of the above embodiments is provided in the process chamber.

[0058] In a specific implementation, the adhesive removal device may further include a robotic arm, which can grasp the wafer to be heated onto the support 32 of the heating plate 30.

[0059] Specifically, the heating plate 30 is first heated to a set temperature, and then a robotic arm is controlled to pick up the wafer to be heated from the wafer cavity and place it onto the support 32 of the heating plate 30. Next, the support 32 and positioning member 33 are controlled to retract, lowering the wafer to the center area of ​​the heating plate. Then, oxygen and nitrogen are introduced into the process cavity to form a plasma, which is then used to perform a photoresist removal process on the wafer, removing the photoresist from the wafer surface.

[0060] In a specific implementation, several annular grooves can be provided on the first surface of the heating plate 30, with each annular groove centered on the center of the plate body 31. These annular grooves can form anti-slip textures on the first surface of the heating plate 30, and facilitate the rapid removal of gas from the gap between the wafer and the first surface of the heating plate 30 during wafer descent. This prevents the wafer from sliding when it lands on the first surface of the heating plate 30 due to excessive gas between the wafer and the first surface of the heating plate 30, thereby further improving the heating uniformity of the wafer 40, and thus further improving the resist removal rate and uniformity.

[0061] While the present invention has been disclosed above, it is not limited thereto. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of the present invention; therefore, the scope of protection of the present invention should be determined by the scope defined in the claims.

Claims

1. A heating plate, characterized in that, include: Heated plate; A support member, disposed on the disk body and retractable relative to the disk body, is used to support the wafer; A positioning element, disposed on the disk body and retractable relative to the disk body, is used to limit the position of the wafer; The positioning element includes: a positioning body and a cone body disposed on the positioning body; the cone body has a maximum size end and a minimum size end; the maximum size end of the cone body is connected to the positioning body; in the same positioning element, the shortest distance from the edge of the maximum size end of the cone body to the center line of the disc is greater than the shortest distance from the edge of the positioning body to the center line of the disc.

2. The heating plate as described in claim 1, characterized in that, The centerline of the positioning body coincides with the centerline of the vertebral body.

3. The heating plate as described in claim 2, characterized in that, The difference between the shortest distance from the edge of the largest end of the vertebral body to the center line of the disc and the shortest distance from the edge of the positioning body to the center line of the disc is greater than 0.7 mm and less than 2.5 mm.

4. The heating plate as described in claim 2, characterized in that, The positioning body is a cylinder.

5. The heating plate as described in claim 1, characterized in that, In use, the top surface of the positioning body is lower than or flush with the surface of the disk that contacts the wafer.

6. The heating plate according to any one of claims 1 to 5, characterized in that, The heating plate includes at least one set of positioning elements; the number of positioning elements in the set is two or more, and they are distributed in the same circle around the center of the plate.

7. The heating plate as described in claim 6, characterized in that, The heating plate includes two or more sets of positioning components, and the distance from different sets of positioning components to the center of the plate is different.

8. The heating plate as described in claim 1, characterized in that, The number of the support members is two or more, and they are circumferentially distributed around the center of the disk body. The distance from the positioning member to the center of the disk body is greater than the distance from the support member to the center of the disk body.

9. A glue-removing device, characterized in that, include: A process cavity, wherein a heating plate as described in any one of claims 1 to 8 is provided in the process cavity.

10. The adhesive removal equipment as described in claim 9, characterized in that, Also includes: A robotic arm is used to grip the wafer onto the support of the heating plate.

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