Chip cooling tray device

Abstract

The utility model provides a kind of chip cooling disc device.The present chip cooling disc device includes rack, the rack is axially fixed with the rotating disc that can rotate in circumference, the rack also has driving element, the output end of the driving element is connected with rotating disc, the rotating disc has the positioning seat for placing chip, the rotating disc has adsorption assembly, when chip is located at positioning seat, the adsorption force generated by above-mentioned adsorption assembly can position chip at positioning seat, the number of positioning seat is several, several positioning seats are evenly distributed on rotating disc in circumference;It further includes a cooling assembly connected on rack, the cooling assembly covers on rotating disc upper portion and the cooling channel with arc track on cooling assembly, when cooling assembly is located directly above rotating disc, several positioning seats are located in cooling channel.The present chip cooling disc device is high in work efficiency.

Description

Technical Field

[0001] This utility model relates to the field of mechanical technology, and more specifically to a chip cooling plate device. Background Technology

[0002] With the rapid development of semiconductor technology, the integration and power consumption of chips continue to increase, resulting in a significant increase in heat generation. To ensure the reliability and lifespan of chips, high-temperature testing must be conducted before they leave the factory.

[0003] Turret sorters, as highly efficient chip testing and sorting equipment, are key pieces of equipment for completing this process. After passing through the high-temperature testing station, the chip surface temperature is typically between 85°C and 175°C. Chips in this high-temperature state must be effectively cooled before subsequent processes such as tape-and-reel packaging can proceed; otherwise, it will affect production safety and product yield.

[0004] Currently, turret sorters mostly use forced air cooling technology to cool chips after testing, which uses a fan to generate airflow to achieve cooling. While this method has the advantages of simple structure and low cost, its cooling efficiency is not high and the cooling speed is slow.

[0005] To achieve the cooling target required by the process, it is often necessary to set up a long cooling path or extend the cooling time, which directly limits the test sorting efficiency (UPH, number of units processed per hour) of the turret sorter and becomes a bottleneck to improve the overall capacity.

[0006] The industry also uses solutions such as water cooling circulation, compressor refrigeration or thermoelectric cooling (TEC) to improve cooling efficiency; however, such systems generally have problems such as complex structure, leakage risk, high maintenance and use costs, and slow cooling response speed. Utility Model Content

[0007] The purpose of this invention is to address the aforementioned problems in existing technologies by providing a chip cooling pad device with high operating efficiency.

[0008] To achieve the above objectives, this utility model can be implemented through the following technical solutions: A chip cooling tray device includes a frame, on which a turntable capable of circumferential rotation is axially fixed. The frame also has a driving component, the output end of which is connected to the turntable. The turntable is characterized in that it has a positioning seat for placing a chip, and an adsorption component. When the chip is located at the positioning seat, the adsorption force generated by the adsorption component can position the chip at the positioning seat. The number of positioning seats is several, and the several positioning seats are evenly distributed circumferentially on the turntable. It also includes a cooling assembly connected to the frame, which covers the upper part of the turntable and has a cooling channel with an arc-shaped trajectory. When the cooling assembly is located directly above the turntable, several positioning seats are located within the cooling channel.

[0009] In the aforementioned chip cooling pad device, the cooling component includes a disc-shaped cooling pad with a recessed clearance notch at the edge of the cooling pad, and a positioning seat is located at the clearance notch. The cooling channel is annular and recessed into the lower part of the cooling pad.

[0010] In the chip cooling plate device described above, the cooling plate also has an air inlet interface. The outer end of the air inlet interface is used to connect to a cold air source, and the inner end of the air inlet interface is connected to the cooling channel.

[0011] In the chip cooling plate device described above, there are several air inlets, which are evenly distributed along the cooling channel.

[0012] The chip cooling plate device described above also includes an adjustment plate one and an adjustment plate two. The adjustment plate one is vertically arranged and its lower end is detachably connected to the frame. The adjustment plate two is horizontally arranged and its inner end is detachably connected to the upper end of the adjustment plate one. The cooling plate is fixedly connected to the outer end of the adjustment plate two.

[0013] In the chip cooling tray device described above, the adsorption component includes an adsorption channel on a turntable, one end of which is connected to a positioning seat, and the other end of which is used to connect to an air pump.

[0014] In the chip cooling tray device described above, one end of the adsorption channel is connected to all the positioning seats.

[0015] In the aforementioned chip cooling plate device, the cold air source is a vortex tube cooling device and a distributor. The distributor is connected to and communicates with the vortex tube cooling device. The distributor has several connectors, and the connectors are connected to and communicate with the air inlet through flexible hoses.

[0016] The chip cooling plate device described above also includes a bracket, which is vertically arranged and its lower end is fixedly connected to the frame. The drive component is fixedly connected to the side of the bracket.

[0017] In the chip cooling plate device described above, the bracket and the adjustment plate are arranged adjacent to each other.

[0018] Compared with existing technologies, this chip cooling pad device has the following advantages: 1. Precise positioning: The module is finely adjusted by using the XY base (i.e., the adjustment of adjustment plate one and adjustment plate two) to ensure that the material loading turntable and the suction nozzle are precisely aligned. 2. Chip fixing: The chip is firmly fixed in the limiting groove by the vacuum adsorption force at the bottom of the turntable to prevent displacement during high-speed rotation; 3. Waste heat management: Heat-resistant air ducts are connected to the hot air outlet of the vortex tube refrigeration unit to guide hot air directly to the outside of the equipment and discharge it into the workshop's dedicated exhaust system; 4. Precise Temperature Control: The vortex tube cooling system can regulate the temperature and flow rate of the cold air output. By adjusting the opening of the hot-end valve, the flow ratio and temperature of the cold and hot air streams can be changed. The intake pressure can also be increased to lower the cold air output temperature to meet the cooling requirements of different core testing environments.

[0019] 5. Uniform cooling: After being distributed by the cold air distribution block, the cold air is evenly delivered to the cooling cover plate through multiple quick connectors to ensure uniform airflow distribution in the cooling chamber and improve cooling efficiency and consistency. 6. Gap control: The position of the cooling cover can be adjusted by adjusting the bracket. In order to ensure cooling efficiency, the amount of cold air escaping must be controlled. The gap between the cooling cover and the material turntable is <0.4mm. Attached Figure Description

[0020] Figure 1 This is a three-dimensional structural diagram of the chip cooling pad device.

[0021] Figure 2 This is a three-dimensional structural diagram of the turntable and cooling plate in the chip cooling plate device.

[0022] Figure 3 This is a three-dimensional structural diagram of the cooling plate viewed from below.

[0023] Figure 4 This is a cross-sectional view of the connection between the cooling plate and the turntable.

[0024] In the picture: 1. Frame; 2. Turntable; 21. Positioning seat; 22. Adsorption channel; 3. Drive component; 4. Cooling plate; 41. Clearance notch; 42. Cooling channel; 5. Air inlet; 6. Adjustment plate one; 7. Adjustment plate two; 8. Vortex tube cooling device; 9. Flow divider; 10. Bracket; 11. Infrared temperature sensor. Detailed Implementation

[0025] The following are specific embodiments of the present invention, and the technical solution of the present invention will be further described in conjunction with the accompanying drawings.

[0026] like Figure 1-4As shown, this chip cooling tray device includes a frame 1, on which a turntable 2 capable of circumferential rotation is axially fixed. The frame 1 also has a driving component 3, the output end of which is connected to the turntable. The turntable 2 has a positioning seat 21 for placing chips and an adsorption component. When the chip is located at the positioning seat 21, the adsorption force generated by the adsorption component can position the chip at the positioning seat 21. There are several positioning seats 21, which are evenly distributed circumferentially on the turntable 2. It also includes a cooling assembly connected to the frame 1, the cooling assembly covering the upper part of the turntable 2 and having a cooling channel 42 with an arc-shaped trajectory, and when the cooling assembly is located directly above the turntable 2, several positioning seats 21 are located within the cooling channel 42.

[0027] The cooling assembly includes a disc-shaped cooling plate 4 with a recessed clearance notch 41 at the edge of the cooling plate 4, and a positioning seat 21 that can be located at the clearance notch 41. The cooling channel 42 is annular and recessed into the lower part of the cooling plate 4.

[0028] The cooling plate 4 is located directly above the turntable 2, with a small gap between them. The cooling plate 4 remains stationary, while the turntable 2 rotates under the action of the drive component 3. This gap prevents friction between the turntable 2 and the cooling plate 4.

[0029] After the chip is inserted into the turntable 2 through the self-avoidance notch, it is stably positioned at the positioning seat 21 of the turntable 2 under the action of the adsorption component.

[0030] When the fluid cooling medium at the cooling plate 4 flows through the cooling channel 42, it provides continuous and effective cooling to the chips at the multiple positioning seats 21.

[0031] Of course, after the cooling process is completed, the chips that have been cooled can be removed one by one from the turntable 2 through the clearance notch 41.

[0032] The cooling plate 4 also has an air inlet 5. The outer end of the air inlet 5 is used to connect to a cold air source, and the inner end of the air inlet 5 is connected to the cooling channel 42.

[0033] The cooling fluid medium can be smoothly introduced into the cooling channel 42 through the air intake interface 5. During the continuous introduction of the cooling fluid medium, a flowing cooling fluid medium is generated in the cooling channel 42, thereby effectively and continuously cooling the chip, enabling the chip to be cooled rapidly in a short time.

[0034] The number of air intake ports 5 is several, and the several air intake ports 5 are evenly distributed along the cooling channel 42.

[0035] The multiple air intake ports 5 ensure that there is an appropriate amount of flowing cooling fluid medium in each part of the cooling channel 42.

[0036] It also includes an adjustment plate 6 and an adjustment plate 7. The adjustment plate 6 is vertically arranged and its lower end is detachably connected to the frame 1. The adjustment plate 7 is horizontally arranged and its inner end is detachably connected to the upper end of the adjustment plate 6. The cooling plate 4 is fixedly connected to the outer end of the adjustment plate 7.

[0037] Changing the position of adjustment plate 6 allows the cooling components to be adjusted in the left and right directions.

[0038] Changing the position of adjustment plate 7 allows the cooling components to be adjusted in the vertical direction.

[0039] The adsorption assembly includes an adsorption channel 22 on the turntable 2. One end of the adsorption channel 22 is connected to the positioning seat 21, and the other end of the adsorption channel 22 is used to connect to the air pump.

[0040] The chip can be stably positioned at the positioning seat 21 of the turntable 2 by vacuum adsorption.

[0041] One end of the adsorption channel 22 is connected to all the positioning seats 21.

[0042] This structure allows the chips at several positioning seats 21 to be stably adsorbed simultaneously.

[0043] The cold air source is a vortex tube refrigeration device 8 and a distributor 9. The distributor 9 is connected to and communicates with the vortex tube refrigeration device 8. The distributor 9 has several connectors, and the connectors are connected to and communicate with the air inlet 5 through flexible hoses.

[0044] The vortex tube cooling device 8 can stably generate low-temperature cold air. Since the vortex tube cooling device is a commercially available component, its technical solution will not be described in detail in this embodiment. In this embodiment, the vortex tube cooling device 8 is an AiRTX stainless steel vortex tube sold by Beijing Huapeng Lianchuang Co., Ltd.

[0045] It also includes a bracket 10, which is vertically arranged and its lower end is fixedly connected to the frame 1. The aforementioned drive component 3 is fixedly connected to the side of the bracket 10.

[0046] Since the turntable 2 is close to the cooling plate 4, the bracket 10 provides sufficient space for the drive unit 3 to be installed, and ensures that the turntable 2 and the cooling plate 4 are adjacent after installation.

[0047] The bracket 10 is arranged adjacent to the adjustment plate 6.

[0048] This can appropriately improve the structural compactness of the entire device.

[0049] When the surface temperature inside the cooling channel is lower than the dew point temperature of the ambient air, water vapor in the air will condense into water droplets on its surface. This poses a fatal threat to the high-temperature chip being cooled, and can directly lead to the scrapping of the chip and other test modules. To address this, the system is equipped with a dew point meter to monitor the ambient dew point temperature in real time, and an infrared temperature sensor is integrated on the cooling air distribution block to ensure that the temperature of the cooling air output by the vortex tube is always higher than the dew point temperature, thus fundamentally eliminating the risk of condensation damaging the chip.

[0050] Meanwhile, an infrared temperature sensor 11 is installed in the cooling channel for real-time online monitoring, enabling alarms for abnormal high temperatures and automatic shutdown to ensure production safety.

[0051] The above-described technical solution of this utility model addresses the problem that existing technical solutions are too simplistic and provides a solution that is significantly different from existing technologies. The parts not covered in this application's technical solution are the same as or can be implemented using existing technologies, and will not be described in detail here.

[0052] The technical solutions in the above embodiments have clearly and completely described the content of this utility model. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

Claims

1. A chip cooling pad device, comprising a frame, a turntable rotatable in a circumferential direction is axially fixed on the frame, and a driving component is also provided on the frame, the output end of the driving component being connected to the turntable, characterized in that, The turntable has a positioning seat for placing the chip and an adsorption component. When the chip is located at the positioning seat, the adsorption force generated by the adsorption component can position the chip at the positioning seat. There are several positioning seats, which are evenly distributed around the turntable. It also includes a cooling assembly connected to the frame, which covers the upper part of the turntable and has a cooling channel with an arc-shaped trajectory. When the cooling assembly is located directly above the turntable, several positioning seats are located within the cooling channel.

2. The chip cooling pad device according to claim 1, characterized in that, The cooling assembly includes a disc-shaped cooling plate with a recessed clearance notch at the edge of the cooling plate, a positioning seat that can be located at the clearance notch, and the cooling channel that is annular and recessed into the lower part of the cooling plate.

3. The chip cooling pad device according to claim 2, characterized in that, The cooling plate also has an air intake interface, the outer end of which is used to connect to a cold air source, and the inner end of which is connected to the cooling channel.

4. The chip cooling pad device according to claim 3, characterized in that, The number of air intake ports is several, and the air intake ports are evenly distributed along the cooling channel.

5. The chip cooling pad device according to claim 4, characterized in that, It also includes an adjustment plate one and an adjustment plate two. The adjustment plate one is vertically arranged and its lower end is detachably connected to the frame. The adjustment plate two is horizontally arranged and its inner end is detachably connected to the upper end of the adjustment plate one. The cooling plate is fixedly connected to the outer end of the adjustment plate two.

6. The chip cooling pad device according to claim 5, characterized in that, The adsorption assembly includes an adsorption channel on a turntable, one end of which is connected to a positioning seat, and the other end of which is used to connect to an air pump.

7. The chip cooling pad device according to claim 6, characterized in that, One end of the adsorption channel is connected to all the positioning seats.

8. The chip cooling pad device according to claim 7, characterized in that, The cold air source is a vortex tube refrigeration device and a distributor. The distributor is connected to and communicates with the vortex tube refrigeration device. The distributor has several connectors, and the connectors are connected to and communicate with the air inlet through flexible hoses.

9. The chip cooling pad device according to claim 8, characterized in that, It also includes a bracket, which is vertically arranged and its lower end is fixedly connected to the frame, and the aforementioned drive component is fixedly connected to the side of the bracket.

10. The chip cooling pad device according to claim 9, characterized in that, The bracket and the adjustment plate are arranged adjacent to each other.

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