Wafer processing apparatus

Abstract

The utility model relates to wafer processing technical field discloses a wafer processing equipment. Wherein wafer processing equipment includes process cavity and transmission cavity, process cavity is used to carry out heat anneal to wafer, and transmission cavity is provided with wafer box, preheating storage station, cooling station and manipulator, and wafer box is used to deposit the wafer of waiting for processing, preheating storage station is provided with preheating bearing device, and preheating bearing device bears simulation sheet, and simulation sheet is used to simulate wafer, cooling station is provided with tray, and tray is used to bear wafer, and manipulator is used to transmit wafer between process cavity, wafer box, preheating bearing device and cooling station. The utility model avoids the product performance failure problem caused by the first piece effect. Furthermore, automatic preheating only occupies the standby time of wafer processing equipment, and compared with the fact that every time operation product needs to add the wafer preheating of waiting for processing after standby time is too long, a large number of process time can be saved.

Description

Technical Field

[0001] This utility model relates to the field of wafer processing technology, and in particular to a wafer processing equipment. Background Technology

[0002] In the semiconductor manufacturing industry, annealing is a crucial step in improving device performance and reliability. Rapid thermal annealing, as an important annealing technique, is widely used due to its unique advantages.

[0003] Rapid thermal annealing utilizes various heat irradiation sources to directly irradiate the sample surface, rapidly heating the sample to approximately 700℃-1200℃ within seconds to tens of seconds and completing the annealing process. However, rapid thermal annealing technology faces challenges in practical applications. After prolonged idle time, the machine is prone to the "first-wafer effect," where the first few wafers processed fail to meet process standards, leading to product performance failure. This not only wastes raw materials but also affects production efficiency and product yield.

[0004] Therefore, there is an urgent need for a wafer processing equipment to solve the aforementioned problems. Utility Model Content

[0005] Based on the above, the purpose of this utility model is to provide a wafer processing equipment that avoids product performance failure caused by the first wafer effect and saves a lot of processing time.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] A wafer processing apparatus includes a process cavity and a transfer cavity; the process cavity is used for thermal annealing of the wafer, and the transfer cavity is provided with:

[0008] A wafer box is used to store wafers to be processed.

[0009] The preheating storage station is equipped with a preheating support device, which carries a simulation wafer used to simulate a real wafer.

[0010] A cooling station is provided with a tray for holding wafers;

[0011] A robotic arm for transferring wafers between the process chamber, the wafer cassette, the preheating support device, and the cooling station.

[0012] As a preferred technical solution for wafer processing equipment, the preheating support device includes a stage, which is used to support a simulation wafer;

[0013] There are multiple platforms, and the multiple platforms are stacked sequentially along the height direction.

[0014] As a preferred technical solution for wafer processing equipment, the preheating support device includes a connector that is connected to the sidewalls of the plurality of carrier stages.

[0015] As a preferred technical solution for wafer processing equipment, a clearance notch for avoiding a robotic arm is provided on one side of the stage.

[0016] As a preferred technical solution for wafer processing equipment, the other side of the stage is provided with an arc-shaped edge, which forms a support groove for supporting the simulation wafer, and the arc of the arc-shaped edge is no greater than 180°.

[0017] As a preferred technical solution for wafer processing equipment, the bottom of the support groove is provided with multiple support bosses, the radius of the arc edge is a first preset size, and the simulated wafer with a radius of the first preset size can be attached to the multiple support bosses.

[0018] As a preferred technical solution for wafer processing equipment, the inner wall of the arc-shaped edge is provided with a chamfer.

[0019] As a preferred technical solution for wafer processing equipment, a plurality of the bearing bosses form a receiving groove of a second preset size, and the simulated wafer of the second preset size can be embedded in the receiving groove.

[0020] As a preferred technical solution for wafer processing equipment, the preheating support device further includes a base, a support plate, and multiple leveling components. The base is disposed on the worktable, the bottom of the multiple leveling components is connected to the base, the support plate is installed on the top of the multiple leveling components, and the lowest stage is connected to the support plate. The leveling components are used to adjust the levelness of the support plate.

[0021] As a preferred technical solution for wafer processing equipment, the leveling assembly includes a support column, an adjusting bolt, and an elastic element. The bottom end of the support column is connected to the base. One end of the elastic element abuts against the top end of the support column, and the other end abuts against the bottom wall of the support plate. The support plate is provided with a through hole, and the top end of the support column is provided with a threaded hole. The adjusting bolt passes through the through hole and is threadedly connected to the threaded hole.

[0022] The beneficial effects of this utility model are as follows:

[0023] This invention provides a wafer processing equipment. After a preset standby time, a robotic arm carries a simulated wafer, supported by a preheating carrier, into the process cavity. The simulated wafer undergoes a thermal annealing process, simulating a real wafer, achieving automatic preheating. Finally, the simulated wafer is moved back onto the preheating carrier. The process cavity remains relatively stable in this invention. Since the simulated wafer is not the actual wafer to be processed, there is no need to worry about the first-wafer effect, and the simulated wafer can be reused, avoiding product performance failures caused by the first-wafer effect. Furthermore, automatic preheating only occupies the standby time of the wafer processing equipment, saving significant processing time compared to the need to preheat the wafer for each operation due to excessively long standby times.

[0024] When a wafer needs to be processed, the robot moves the wafer from the wafer cassette to the tray. Then, the tray and wafer are transferred together to the process chamber for thermal annealing. Next, the robot moves the wafer and tray to the cooling station for cooling. Finally, the cooled wafer is moved back into the wafer cassette to complete the wafer processing. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments of this utility model will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the content of the embodiments of this utility model and these drawings without creative effort.

[0026] Figure 1 This is a schematic diagram of the structure of the wafer processing equipment provided in a specific embodiment of this utility model;

[0027] Figure 2 This is a schematic diagram of the preheating bearing device provided in a specific embodiment of this utility model.

[0028] The markings in the image are as follows:

[0029] 10. Process cavity; 20. Transfer cavity;

[0030] 1. Wafer box; 2. Preheating support device; 21. Stage; 211. Clearance notch; 212. Curved edge; 213. Chamfer; 214. Support boss; 215. Receiving groove; 22. Base; 23. Support plate; 24. Leveling assembly; 241. Support column; 242. Adjusting bolt; 243. Elastic element; 25. Connector;

[0031] 3. Pallet; 4. Robotic arm; 5. Simulation film. Detailed Implementation

[0032] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, not the entire structure.

[0033] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0034] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0035] In the description of this embodiment, the terms "upper," "lower," "left," and "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.

[0036] like Figure 1 and Figure 2 As shown, this embodiment provides a wafer processing equipment, which includes a process cavity 10 and a transfer cavity 20. The process cavity 10 is used for thermal annealing of wafers. The transfer cavity 20 is provided with a wafer cassette 1, a preheating storage station, a cooling station, and a robot arm 4. The wafer cassette 1 is used to store wafers to be processed. The preheating storage station is provided with a preheating support device 2, which carries a simulation wafer 5. The simulation wafer 5 is used to simulate a wafer. The cooling station is provided with a tray 3, which is used to carry wafers. The robot arm 4 is used to transfer wafers between the process cavity 10, the wafer cassette 1, the preheating support device 2, and the tray 3.

[0037] After the wafer processing equipment has been idle for a preset time, the robotic arm 4 carries the simulated wafer 5, which is carried by the preheating support device 2, into the process cavity 10. The simulated wafer 5 simulates the thermal annealing process of the wafer, achieving automatic preheating. Finally, the simulated wafer 5 is moved back onto the preheating support device 2. The process cavity 10 of this invention maintains a relatively stable state. Since the simulated wafer 5 is not the wafer to be processed, there is no need to worry about the first-wafer effect. Furthermore, the simulated wafer 5 can be reused, avoiding product performance failures caused by the first-wafer effect. Moreover, automatic preheating only occupies the idle time of the wafer processing equipment, saving a significant amount of processing time compared to the need to add preheating for each product operation due to excessively long idle times.

[0038] When a wafer needs to be processed, the robot arm 4 moves the wafer in the wafer box 1 to the tray 3, and then the tray 3 and the wafer are transferred together to the process cavity 10 for thermal annealing. Then, the robot arm 4 moves the wafer and the tray 3 to the cooling station for cooling. Finally, the cooled wafer is moved back to the wafer box 1 to complete the wafer processing.

[0039] It should be noted that when the simulation wafer 5 needs to be used in conjunction with the tray 3, the robot arm 4 carries the simulation wafer 5, which is carried by the preheating carrier device 2, to the tray 3. Then, the tray 3 and the simulation wafer 5 are moved into the process cavity 10. The simulation wafer 5 simulates the wafer for thermal annealing. After completion, the tray 3 and the simulation wafer 5 are moved to the cooling station for cooling. Finally, the simulation wafer 5 is moved to the preheating carrier device 2.

[0040] It should be noted that, theoretically, the simulated wafer 5 can be transferred from wafer cassette 1 to process cavity 10 by a robotic arm, and then transferred to the cooling station for cooling after thermal annealing. However, there is generally only one wafer cassette 1 in a wafer processing machine. During the preheating process, wafer cassette 1 must remain in the station; otherwise, the wafer processing machine will alarm and affect automatic preheating. Therefore, a preheating storage station is set up as a dedicated storage location for the simulated wafer 5. The preheating support device 2 on the preheating storage station is relatively independent from wafer cassette 1 to avoid interference between wafer loading and unloading on the wafer processing machine and the preheating operation. In addition, it does not occupy the space of wafer cassette 1. The cooling station is also equipped with a blower mechanism, which is located on one side of tray 3. After thermal annealing, when the wafer and tray 3 move to the cooling station, the blower mechanism cools the wafer with air, improving cooling efficiency. It should be noted that the wafer cassette 1, cooling station, and robotic arm 4 in process cavity 10 and transfer cavity 20 are all existing technologies, and their specific working principles will not be described in detail here. After adding the preheating and storage station, the robot arm 4 needs to add a point to meet the mutual transfer between the cooling station, the preheating and storage station, the wafer box 1 and the process cavity 10. The existing robot arm 4 can meet the motion trajectory requirements.

[0041] The preheating support device 2 includes a platform 21 for supporting the simulation sheet 5. Preferably, there are multiple platforms 21, which are stacked sequentially along the height direction. Multiple platforms 21 support multiple simulation sheets 5, and during preheating, multiple simulation sheets 5 are used to simulate the hot annealing process, ensuring that the preheating process environment meets the requirements and remains stable. In this embodiment, there are three platforms 21, and the preheating support device 2 can support three simulation sheets 5.

[0042] In this embodiment, the preheating support device 2 includes a connector 25, which is connected to the side wall of a plurality of platforms 21. Specifically, the connector 25 is connected to the side wall of a plurality of platforms 21 by screws, thereby realizing the connection and fixation between the plurality of platforms 21 and improving stability.

[0043] In this embodiment, a clearance notch 211 for the robotic arm 4 is provided on one side of the platform 21. When the robotic arm 4 places the simulation piece 5, it moves onto the platform 21 carrying the simulation piece 5. At this time, the robotic arm 4 is located within the clearance notch 211. Then, the robotic arm 4 descends, and the simulation piece 5 falls onto the platform 21. When the robotic arm 4 picks up the simulation piece 5, it moves into the clearance notch 211, then rises until the simulation piece 5 falls onto the robotic arm 4, and finally exits.

[0044] Preferably, the other side of the platform 21 is provided with an arc-shaped edge 212, which forms a support groove for supporting the simulation piece 5. The arc of the arc-shaped edge 212 is no greater than 180°. When the robotic arm 4 places the simulation piece 5, the robotic arm 4 carries the simulation piece 5 and extends into the clearance notch 211. The simulation piece 5 moves above the platform 21. The arc-shaped edge 212 can stop the simulation piece 5, preventing it from moving too far. Since the arc of the arc-shaped edge 212 is no greater than 180°, it prevents the arc-shaped edge 212 from interfering with the movement of the simulation piece 5 before it is in place, thus preventing the simulation piece 5 from slipping. Furthermore, when multiple platforms 21 are stacked, the upper platform 21 can overlap the arc-shaped edge 212 of the lower platform 21, increasing the distance between the two platforms 21 and providing height space for picking up or preventing the simulation piece 5 from slipping.

[0045] Furthermore, the bottom of the support groove is provided with multiple support bosses 214. The bottom of the support groove has a groove forming multiple support bosses 214. The radius of the arc-shaped edge 212 is a first preset size, and a simulation piece 5 with a radius of the first preset size can overlap the multiple support bosses 214. When placing a simulation piece 5 of the first preset size, the simulation piece 5 overlaps the multiple support bosses 214. Preferably, the inner wall of the arc-shaped edge 212 is provided with a chamfer 213. When the robot arm 4 lowers the simulation piece 5, the chamfer 213 can guide the simulation piece 5, improving the positional accuracy of the simulation piece 5.

[0046] Preferably, the plurality of supporting bosses 214 form a receiving groove 215 of a second preset size, into which the simulation piece 5 of the second preset size can be embedded. When placing the simulation piece 5 of the second preset size, the simulation piece 5 is embedded in the receiving groove 215. This embodiment realizes the placement of simulation pieces 5 of two sizes, provides positioning for simulation pieces 5 of two sizes, and improves the versatility of the platform 21.

[0047] Furthermore, the preheating support device 2 also includes a base 22, a support plate 23, and multiple leveling components 24. The base 22 is set on the workbench, the bottom of the multiple leveling components 24 is connected to the base 22, the support plate 23 is installed on the top of the multiple leveling components 24, and the lowest platform 21 is connected to the support plate 23. The leveling components 24 are used to adjust the levelness of the support plate 23. The lowest platform 21 is connected to the support plate 23 by screws. By adjusting the levelness of the support plate 23 through the leveling components 24, the levelness of the simulation piece 5 is adjusted, thereby improving the positional accuracy of the simulation piece 5.

[0048] In one embodiment, the leveling assembly 24 includes a support column 241, an adjusting bolt 242, and an elastic element 243. The bottom end of the support column 241 is connected to the base 22. One end of the elastic element 243 abuts against the top end of the support column 241, and the other end abuts against the bottom wall of the support plate 23. The support plate 23 is provided with a through hole, and the top end of the support column 241 is provided with a threaded hole. The adjusting bolt 242 passes through the through hole and is threaded into the threaded hole. In this embodiment, there are three leveling assemblies 24, evenly distributed between the base 22 and the support plate 23. The elastic element 243 is a spring. The adjusting bolt 242 passes through the through hole, and the spring is threaded into the threaded hole. When the support part of the leveling assembly 24 is higher, the tightening depth of the adjusting bolt 242 is increased; conversely, when the support part of the leveling assembly 24 is lower, the tightening depth of the adjusting bolt 242 is decreased; thus, the levelness of the support plate 23 is adjusted.

[0049] The wafer processing equipment has added a preheating and storage station for placing the simulation wafer 5. The corresponding software allows setting the standby time interval, preset process, and number of preheated wafers. When the system recognizes that the machine's standby time has reached the set value, it will automatically transfer the simulation wafer 5 into the process chamber 10 to run the preset process. The entire process is automatically recognized and operated by the system, without the need for manual intervention.

[0050] Note that the above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, and substitutions can be made without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and may include many other equivalent embodiments without departing from the concept of the present invention. The scope of the present invention is determined by the scope of the appended claims.

Claims

1. A wafer processing equipment, characterized in that, It includes a process cavity (10) and a transfer cavity (20); the process cavity (10) is used for thermal annealing of the wafer, and the transfer cavity (20) is provided with: A wafer box (1) is used to store wafers to be processed; The preheating storage station is equipped with a preheating support device (2), which carries a simulation wafer (5) for simulating a wafer; A cooling station is provided with a tray (3) for holding wafers; A robotic arm (4) is used to transfer wafers between the process chamber (10), the wafer cassette (1), the preheating support device (2), and the cooling station.

2. The wafer processing equipment according to claim 1, characterized in that, The preheating support device (2) includes a platform (21) for supporting the simulation piece (5). There are multiple platforms (21), and the multiple platforms (21) are stacked sequentially along the height direction.

3. The wafer processing equipment according to claim 2, characterized in that, The preheating support device (2) includes a connector (25) which is connected to the sidewall of the plurality of platforms (21).

4. The wafer processing equipment according to claim 2, characterized in that, One side of the platform (21) is provided with a clearance notch (211) for avoiding the robotic arm (4).

5. The wafer processing equipment according to claim 4, characterized in that, The other side of the stage (21) is provided with an arc-shaped edge (212), which forms a support groove for supporting the simulation piece (5). The arc of the arc-shaped edge (212) is no greater than 180°.

6. The wafer processing equipment according to claim 5, characterized in that, The bottom of the bearing groove is provided with multiple bearing protrusions (214), and the radius of the arc edge (212) is a first preset size. The simulation piece (5) with a radius of the first preset size can be attached to the multiple bearing protrusions (214).

7. The wafer processing equipment according to claim 5, characterized in that, The inner wall of the arc-shaped edge (212) is provided with a chamfer (213).

8. The wafer processing equipment according to claim 6, characterized in that, The plurality of the bearing bosses (214) form a receiving groove (215) of a second preset size, and the simulation piece (5) of the second preset size can be embedded in the receiving groove (215).

9. The wafer processing equipment according to claim 2, characterized in that, The preheating support device (2) also includes a base (22), a support plate (23) and multiple leveling components (24). The base (22) is set on the workbench, the bottom of the multiple leveling components (24) is connected to the base (22), the support plate (23) is installed on the top of the multiple leveling components (24), the lowest platform (21) is connected to the support plate (23), and the leveling components (24) are used to adjust the levelness of the support plate (23).

10. The wafer processing equipment according to claim 9, characterized in that, The leveling assembly (24) includes a support column (241), an adjusting bolt (242), and an elastic element (243). The bottom end of the support column (241) is connected to the base (22). One end of the elastic element (243) abuts against the top end of the support column (241), and the other end abuts against the bottom wall of the bearing plate (23). The bearing plate (23) is provided with a through hole. The top end of the support column (241) is provided with a threaded hole. The adjusting bolt (242) passes through the through hole and is threadedly connected to the threaded hole.

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