Wafer cleaning equipment metal connecting structure with anti-dropping effect

Abstract

The utility model discloses a wafer cleaning equipment metal connecting structure with prevent effect of falling off relates to wafer cleaning technical field. The utility model discloses a base, and the upper surface of base is fixed with support frame, and the central fixed location board of support frame is fixed with the thread pipe of location board surface, and the inside screw thread connection of thread pipe has screw rod, and one end of screw rod is fixed with bearing, and the inner ring fixed link of bearing has, and one end of link is fixed with support plate, and the top fixed first motor of support plate. The utility model discloses the effect of adjusting groove, and adjusting groove is arc structure and with movable plate different shaft center, when first motor drives movable plate rotation, and it can produce the stable driving force of movable plate shaft center direction to the adjusting block of inside sliding connection through arc trajectory, and then drive the centripetal movement of connecting plate and clamping plate synchronization, realize the clamping of wafer edge, provide firm clamping for subsequent depth cleaning, drying and other procedures, fundamentally avoid wafer falling off in the processing.

Description

Technical Field

[0001] This utility model belongs to the field of wafer cleaning technology, and in particular relates to a metal connection structure for wafer cleaning equipment with anti-detachment effect. Background Technology

[0002] In the semiconductor manufacturing industry, wafer cleaning is a core process for ensuring chip yield. The metal connection structure in wafer cleaning equipment, as a key component for holding the wafer, directly determines the safety and precision of the cleaning process due to its clamping stability. Wafers themselves are thin, brittle, and require extremely high surface precision. During cleaning, the metal connection structure must be used to precisely clamp the wafer edges and work with the equipment to perform rotation, spraying, and drying. If the clamping mechanism is unstable, it can easily lead to wafer detachment, surface scratches, or edge breakage, resulting in significant material losses and production stoppages.

[0003] Existing clamping mechanisms mostly employ linear adjustment designs, such as bolt tightening or linear cylinder pushing, where the adjusting block slides along a straight trajectory to bring the clamping plate closer to the wafer. This type of structure lacks the guidance of an arc-shaped trajectory and the uniform transfer of force. When the adjusting block slides, it is prone to jamming or deviation due to the single trajectory, leading to asynchronous movement of multiple clamping plates. This results in an imbalance of force on the wafer during clamping; some areas experience excessive pressure, easily causing indentations, while other areas are clamped too loosely, leaving gaps. Especially during wafer rotation cleaning, the centrifugal force generated by eccentric clamping directly exacerbates the risk of wafer detachment, leading to a significant decrease in wafer cleaning yield.

[0004] To address this issue, we provide a metal connection structure for a wafer cleaning device with anti-detachment properties. Utility Model Content

[0005] The purpose of this invention is to provide a metal connection structure for wafer cleaning equipment with anti-detachment effect. Through the action of an adjusting groove, which is arc-shaped and not aligned with the axis of the movable plate, when the first motor drives the movable plate to rotate, it generates a stable driving force towards the axis of the movable plate through the arc-shaped trajectory on the internally slidingly connected adjusting block. This, in turn, drives the connecting plate and clamping plate to move synchronously towards the center, achieving clamping of the wafer edge. This provides a firm grip for subsequent deep cleaning and drying processes, fundamentally preventing the wafer from detaching during processing. This solves the problem that existing clamping mechanisms often use linear adjustment designs, such as bolt tightening or linear cylinder pushing, where the adjusting block slides along a linear trajectory to bring the clamping plate closer to the wafer. Such structures lack the guidance of an arc-shaped trajectory and uniform force conversion. When the adjusting block slides, it is prone to jamming or deviation due to the single trajectory, leading to asynchronous movement of multiple clamping plates and unbalanced force on the wafer during clamping.

[0006] To solve the above technical problems, this utility model is achieved through the following technical solution: This utility model is a metal connection structure for a wafer cleaning device with anti-detachment effect, including a base, and a support frame is fixed on the upper surface of the base;

[0007] A positioning plate is fixed in the center of the support frame, and a threaded tube is fixed on the surface of the positioning plate;

[0008] The threaded tube is internally threaded with a threaded rod, one end of which is fixed with a bearing, and the inner ring of the bearing is fixed with a connecting rod.

[0009] One end of the connecting rod is fixed with a support plate, and the top of the support plate is fixed with a first motor;

[0010] The first motor output shaft is fixed with a movable plate, and the surface of the movable plate has several adjustment slots. The adjustment slots are arc-shaped and are not aligned with the axis of the movable plate.

[0011] An adjusting block is slidably connected inside the adjusting groove, and a connecting plate is fixed to one side of the adjusting block;

[0012] A clamp is fixed to one side of the connecting plate.

[0013] The present invention is further configured such that: a support rod is fixed to the top of the movable plate, and a slider is fixed to the top of the support rod;

[0014] The support rod and the slider form a "T" shape.

[0015] The present invention is further configured such that: a sliding groove is fixed at the bottom of the connecting plate, and the slider is slidably connected to the sliding groove;

[0016] The slider matches the inner wall of the groove.

[0017] The present invention is further configured such that: a support block is fixed on the upper surface of the movable plate, and both the support block and the clamping plate are made of rubber material.

[0018] The present invention is further configured such that: a second motor is fixed to the end of the threaded rod away from the bearing, and a movable rod is fixed to the output shaft of the second motor;

[0019] A movable groove is provided on one side of the inner wall of the support frame, and the end of the movable rod away from the second motor is slidably connected to the movable groove.

[0020] The present invention is further configured such that: a limit rod is fixed at the bottom of the support plate, and a through hole is opened on the surface of the positioning plate;

[0021] The limiting rod passes through the through hole and slides inside the through hole.

[0022] The present invention is further configured such that: a support ring is fixed at the top of the support frame, and a plurality of limiting blocks are fixed on the upper surface of the support ring.

[0023] This utility model has the following beneficial effects:

[0024] 1. This utility model utilizes the function of an adjusting groove, which has an arc-shaped structure and is not axially aligned with the movable plate. When the first motor drives the movable plate to rotate, it generates a stable driving force towards the axis of the movable plate through the arc-shaped trajectory of the internally slidingly connected adjusting block. This, in turn, drives the connecting plate and the clamping plate to move synchronously towards the center, achieving clamping of the wafer edge. This provides a firm grip for subsequent deep cleaning, drying, and other processes, fundamentally preventing the wafer from falling off during processing. The arc-shaped structure design ensures that the adjusting block slides smoothly and without jamming or offset within the adjusting groove. Combined with the guiding effect of the slider and the groove, it ensures that the clamping plate is evenly stressed when clamping the wafer, preventing damage caused by uneven force on the wafer due to poor sliding. At the same time, the axially aligned design precisely controls the centripetal movement trajectory of the clamping plate, ensuring accurate clamping position and further improving the stability of wafer clamping.

[0025] 2. This utility model utilizes a limiting rod, which is fixed to the bottom of the support plate and slides through the through hole of the positioning plate. This limits the movement trajectory of the support plate, preventing it from swaying or tilting during its ascent or descent with the threaded rod, ensuring that the support plate always moves smoothly in the vertical direction. Furthermore, by stabilizing the movement of the support plate, the positional stability of the clamping components such as the first motor, movable plate, and clamping plate on the support plate is indirectly guaranteed. This prevents the adjustment block and connecting plate from becoming misaligned due to the offset of the support plate, thereby ensuring that the clamping plate can accurately align with the edge of the wafer for clamping and guaranteeing the clamping effect. Attached Figure Description

[0026] To more clearly illustrate the technical solutions of the embodiments of this utility model, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 This is a schematic diagram of the metal connection structure of a wafer cleaning device with anti-detachment effect according to the present invention.

[0028] Figure 2 This is a side view structural diagram of the present invention.

[0029] Figure 3 This is a top-view structural diagram of the present invention.

[0030] Figure 4 This is a schematic diagram of the support frame structure of this utility model.

[0031] Figure 5 This is a schematic diagram of the threaded rod structure of this utility model.

[0032] Figure 6 This is a schematic diagram of the connecting plate structure of this utility model.

[0033] The attached diagram lists the components represented by each number as follows:

[0034] 1-Base, 2-Support frame, 3-Positioning plate, 4-Threaded pipe, 5-Threaded rod, 6-Bearing, 7-Connecting rod, 8-Support plate, 9-First motor, 10-Modible plate, 11-Adjusting groove, 12-Adjusting block, 13-Connecting plate, 14-Clamping plate, 15-Support rod, 16-Slider, 17-Slide groove, 18-Support block, 19-Second motor, 20-Modible rod, 21-Modible groove, 22-Limiting rod, 23-Through hole, 24-Support ring, 25-Limiting block. Detailed Implementation

[0035] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0036] It should be noted that, unless otherwise specified, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains.

[0037] In this utility model, unless otherwise stated, the orientations used, such as "up" and "down", usually refer to the direction shown in the accompanying drawings, or to the vertical, perpendicular, or gravitational direction; similarly, for ease of understanding and description, "left" and "right" usually refer to the left and right shown in the accompanying drawings; "inner" and "outer" refer to the inner and outer contours of each component itself, but the above directional terms are not used to limit this utility model. Specific Implementation Example 1

[0039] Please see Figures 1-6This utility model relates to a metal connection structure for a wafer cleaning device with anti-detachment effect, comprising a base 1, a support frame 2 fixed on the upper surface of the base 1; a positioning plate 3 fixed in the center of the support frame 2, and a threaded tube 4 fixed on the surface of the positioning plate 3; a threaded rod 5 threadedly connected inside the threaded tube 4, a bearing 6 fixed at one end of the threaded rod 5, and a connecting rod 7 fixed to the inner ring of the bearing 6; a support plate 8 fixed at one end of the connecting rod 7, and a first motor 9 fixed at the top of the support plate 8; a movable plate 10 fixed to the output shaft of the first motor 9, and several adjustment grooves 11 with an arc-shaped structure on the surface of the movable plate 10, the adjustment grooves 11 being non-axial with the movable plate 10; an adjustment block 12 slidably connected inside the adjustment groove 11, and a connecting plate 13 fixed on one side of the adjustment block 12; and a clamping plate 14 fixed on one side of the connecting plate 13.

[0040] Specifically, a support rod 15 is fixed to the top of the movable plate 10, and a slider 16 is fixed to the top of the support rod 15; the support rod 15 and the slider 16 form a "T" shape.

[0041] Furthermore, a groove 17 is fixed at the bottom of the connecting plate 13, and the slider 16 is slidably connected to the groove 17; the slider 16 matches the inner wall of the groove 17; a support block 18 is fixed on the upper surface of the movable plate 10, and both the support block 18 and the clamping plate 14 are made of rubber material.

[0042] The operation process of this embodiment is as follows: The wafer to be cleaned is placed stably on the support ring 24 at the top of the support frame 2. Several limiting blocks 25 on the upper surface of the support ring 24 are used for initial positioning of the wafer. The limiting blocks 25 are evenly distributed in a ring shape, which can limit the wafer's horizontal displacement and prevent the wafer from slipping or shifting during the initial cleaning process, thus achieving initial wafer stabilization. When the initial cleaning is completed and the wafer needs to be stably clamped to meet the requirements of high-precision operations such as deep cleaning and drying, the second motor 19 is started. The end of the threaded rod 5 away from the second motor 19 is connected to the connecting rod 7 through a bearing 6. The bearing 6 can prevent the connecting rod 7 from rotating synchronously when the threaded rod 5 rotates, thus the connecting rod 7 will... As the threaded rod 5 rises, it drives the support plate 8 to move upward smoothly. Simultaneously, the limiting rod 22 at the bottom of the support plate 8 passes through the through hole 23 on the positioning plate 3 and slides along the inner wall of the hole, further ensuring that the support plate 8 rises without shaking or tilting, thus ensuring the accuracy of subsequent clamping actions. When the support plate 8 rises to the height where the clamping plate 14 is flush with the edge of the wafer, the first motor 9 is started. The output shaft of the first motor 9 drives the movable plate 10 to rotate slowly around the output shaft axis. Several arc-shaped adjustment slots 11 on the surface of the movable plate 10 rotate synchronously with the movable plate 10. Since the adjustment block 12 is embedded in the adjustment slot 11 and fixedly connected to the connecting plate 13, the rotation of the arc-shaped adjustment slot 11 will affect the adjustment block 12. This generates a thrust towards the axis of the movable plate 10; simultaneously, the sliding groove 17 at the bottom of the connecting plate 13 slides in conjunction with the "T"-shaped slider 16 on the top support rod 15 of the movable plate 10, causing the connecting plate 13 to move smoothly towards the axis along the guide of the slider 16, ultimately driving the clamping plate 14 on one side of the connecting plate 13 to clamp the edge of the wafer. Because both the clamping plate 14 and the support block 18 on the upper surface of the movable plate 10 are made of rubber, physical scratches or indentations on the wafer surface can be avoided during clamping, protecting the precision structure of the wafer; in this device, the adjusting groove 11 has an arc-shaped structure and is not axially aligned with the movable plate 10. When the first motor 9 drives the movable plate 10 to rotate, it can adjust the internal sliding connection through the arc-shaped trajectory. The connecting adjustment block 12 generates a stable driving force in the direction of the axis of the movable plate 10, which in turn drives the connecting plate 13 and the clamping plate 14 to move synchronously towards the center, thereby clamping the edge of the wafer and providing a firm grip for subsequent deep cleaning, drying and other processes, fundamentally preventing the wafer from falling off during processing; the arc structure design ensures that the adjustment block 12 slides in the adjustment groove 11 without jamming or offset, and with the guiding effect of the slider 16 and the slide groove 17, it can ensure that the clamping plate 14 is evenly stressed when clamping the wafer, avoiding damage to the wafer due to unbalanced force caused by poor sliding; at the same time, the off-axis design precisely controls the centripetal movement trajectory of the clamping plate 14, ensuring accurate clamping position and further improving the stability of wafer clamping. Specific Implementation Example 2

[0044] Please see Figures 1-6Based on the first specific embodiment, a second motor 19 is fixed to the end of the threaded rod 5 away from the bearing 6, and a movable rod 20 is fixed to the output shaft of the second motor 19; a movable groove 21 is opened on one side of the inner wall of the support frame 2, and the end of the movable rod 20 away from the second motor 19 is slidably connected to the movable groove 21.

[0045] Specifically, a limiting rod 22 is fixed at the bottom of the support plate 8, and a through hole 23 is opened on the surface of the positioning plate 3; the limiting rod 22 passes through the through hole 23 and slides inside the through hole 23.

[0046] Furthermore, a support ring 24 is fixed to the top of the support frame 2, and several limiting blocks 25 are fixed to the upper surface of the support ring 24.

[0047] The operation process of this embodiment is as follows: When the output shaft of the second motor 19 drives the threaded rod 5 to rotate around its own axis, since the threaded rod 5 is threadedly connected to the threaded tube 4 on the positioning plate 3, and the movable rod 20 at the end of the output shaft of the second motor 19 is embedded in the movable groove 21 on the inner wall of the support frame 2 and slides along the groove, the threaded rod 5 will move upward in a straight line along the axis of the threaded tube 4 during rotation; In this device, the limiting rod 22 is fixed to the bottom of the support plate 8 and passes through the through hole 23 of the positioning plate 3 and slides along the hole, which can limit the movement trajectory of the support plate 8 and prevent it from shaking or tilting during the process of rising or falling with the threaded rod 5, ensuring that the support plate 8 always moves smoothly in the vertical direction; and by stabilizing the movement of the support plate 8, the positional stability of the clamping-related components such as the first motor 9, the movable plate 10, and the clamping plate 14 on the support plate 8 is indirectly guaranteed, avoiding the movement misalignment of the adjusting block 12 and the connecting plate 13 due to the offset of the support plate, thereby ensuring that the clamping plate 14 can accurately align with the edge of the wafer to achieve clamping and guarantee the clamping effect.

[0048] In the description of this specification, references to terms such as "an embodiment," "example," "specific example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0049] The preferred embodiments of this utility model disclosed above are merely illustrative of the present utility model. These preferred embodiments do not exhaustively describe all details, nor do they limit the utility model to the specific implementations described. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of this utility model, thereby enabling those skilled in the art to better understand and utilize it. This utility model is limited only by the claims and their full scope and equivalents.

Claims

1. A metal connection structure for a wafer cleaning device with anti-detachment effect, comprising a base (1), characterized in that: A support frame (2) is fixed on the upper surface of the base (1); The support frame (2) has a positioning plate (3) fixed in the center, and a threaded tube (4) is fixed on the surface of the positioning plate (3); The threaded tube (4) is internally threaded with a threaded rod (5), one end of which is fixed with a bearing (6), and the inner ring of the bearing (6) is fixed with a connecting rod (7); One end of the connecting rod (7) is fixed with a support plate (8), and the top of the support plate (8) is fixed with a first motor (9); The output shaft of the first motor (9) is fixed with a movable plate (10). The surface of the movable plate (10) has several adjustment grooves (11). The adjustment grooves (11) are arc-shaped and have different axes from the movable plate (10). An adjusting block (12) is slidably connected inside the adjusting groove (11), and a connecting plate (13) is fixed on one side of the adjusting block (12); A clamping plate (14) is fixed on one side of the connecting plate (13).

2. The metal connection structure for a wafer cleaning device with anti-detachment effect according to claim 1, characterized in that, The top of the movable plate (10) is fixed with a support rod (15), and the top of the support rod (15) is fixed with a slider (16); The support rod (15) and the slider (16) have a "T" shaped structure.

3. The metal connection structure for a wafer cleaning device with anti-detachment effect according to claim 2, characterized in that, The bottom of the connecting plate (13) is fixed with a sliding groove (17), and the slider (16) is slidably connected to the sliding groove (17); The slider (16) matches the inner wall of the groove (17).

4. The metal connection structure of a wafer cleaning equipment with anti-detachment effect according to claim 1, characterized in that, A support block (18) is fixed on the upper surface of the movable plate (10), and both the support block (18) and the clamping plate (14) are made of rubber material.

5. The metal connection structure for a wafer cleaning device with anti-detachment effect according to claim 1, characterized in that, The threaded rod (5) is fixed with a second motor (19) at the end away from the bearing (6), and the output shaft of the second motor (19) is fixed with a movable rod (20); The support frame (2) has a movable groove (21) on one side of its inner wall, and the end of the movable rod (20) away from the second motor (19) is slidably connected to the movable groove (21).

6. The metal connection structure of a wafer cleaning equipment with anti-detachment effect according to claim 1, characterized in that, The support plate (8) has a limit rod (22) fixed at the bottom, and the positioning plate (3) has a through hole (23) on its surface; The limiting rod (22) passes through the through hole (23) and slides inside the through hole (23).

7. The metal connection structure of a wafer cleaning equipment with anti-detachment effect according to claim 1, characterized in that, The support frame (2) has a support ring (24) fixed at the top, and a number of limiting blocks (25) are fixed on the upper surface of the support ring (24).

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