Wafer cleaning apparatus

Abstract

The utility model discloses a kind of wafer cleaning equipment, the equipment includes: shell, clamping assembly, two fluid components, driving assembly, air knife assembly and control assembly;Shell is hollow structure, and its front end is provided with opening;Clamping assembly is used to clamp wafer and place wafer into shell through opening;Two fluid components are set in shell, including support piece and multiple spray heads set on support piece;Driving assembly is set in shell, and is connected with support piece, for driving two fluid components reciprocating motion along preset path;Air knife assembly is set on the front end face of shell, is arranged around opening, for forming laminar flow at opening Place airflow;Control assembly is set in the left side or right side of shell cavity, and two fluid components, driving assembly and air knife assembly are respectively electrically connected with control assembly. Through the above setting, cleaning equipment structure is simple, control accurate, convenient integration.

Description

Technical Field

[0001] This utility model relates to the field of wafer processing technology, and in particular to a wafer cleaning device. Background Technology

[0002] In semiconductor manufacturing, silicon carbide wafers are widely used in high-power devices due to their excellent performance. After laser lift-off, wafers often have debris remaining on the surface or on the chuck. If cleaning is not thorough, it will affect subsequent processes and reduce the yield.

[0003] Existing cleaning equipment mostly uses a single liquid spray method, which is difficult to effectively remove highly adhesive microparticles. Furthermore, their complex structures hinder production line integration and maintenance. At the same time, existing systems often lack integrated support for two-fluid cleaning and air knife drying, resulting in insufficient control precision and flexibility, making it difficult to meet the demands for efficient and thorough cleaning. Utility Model Content

[0004] To address the shortcomings of existing technologies, the purpose of this invention is to provide a wafer cleaning device. This wafer cleaning device features a simple structure, precise control, and ease of integration.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: A wafer cleaning device includes: a housing, a clamping assembly, a two-fluid assembly, a driving assembly, an air knife assembly, and a control assembly; the housing has a hollow structure with an opening at its front end; the clamping assembly is used to clamp the wafer and place it into the housing through the opening; the two-fluid assembly is disposed within the housing and includes a support member and multiple nozzles disposed on the support member; the driving assembly is disposed within the housing and connected to the support member, and is used to drive the two-fluid assembly to reciprocate along a preset path; the air knife assembly is disposed on the front end face of the housing and arranged around the opening, and is used to form a laminar airflow at the opening; the control assembly is disposed on the left or right side of the housing cavity, and the two-fluid assembly, the driving assembly, and the air knife assembly are electrically connected to the control assembly.

[0006] Furthermore, multiple nozzles are evenly arranged in the front-to-back and left-to-right directions.

[0007] Furthermore, the drive assembly includes a cable chain extending in the left-right direction and a drive motor for driving the cable chain, with a support mounted on the cable chain; the preset path is the extension direction of the cable chain.

[0008] Furthermore, the air knife assembly includes four mounting bases arranged around the opening and air pipe connectors disposed on the mounting bases for connecting to an external air supply device.

[0009] Furthermore, a baffle is provided on the front end face of the housing, and a lifting door is provided at the opening corresponding to the baffle. When the wafer is inside the housing for cleaning, the lifting door is closed to prevent liquid from splashing out of the housing.

[0010] Furthermore, the housing is provided with a partition perpendicular to the left and right direction, which divides the interior of the housing into a first receiving space and a second receiving space. The two fluid components and the drive components are disposed in the first receiving space, and the control components are disposed in the second receiving space.

[0011] Furthermore, a pre-drying assembly is provided inside the housing, and several mounting holes are provided on the partition plate, with the pre-drying assembly installed at the mounting holes.

[0012] Furthermore, the control components include a two-fluid control unit, an air knife control unit, and a speed regulation unit; the two-fluid control unit is electrically connected to the two-fluid assembly and is used to control the opening and closing of the nozzle and the injection speed of the gas-liquid two-fluid; the air knife control unit is electrically connected to the air knife assembly and is used to control the start and stop of the air knife assembly; the speed regulation unit is electrically connected to the drive component and is used to control the moving speed of the two-fluid assembly on a preset path.

[0013] Furthermore, the top of the housing is provided with a cover plate, which is made of a transparent material.

[0014] The aforementioned wafer cleaning equipment achieves efficient wafer cleaning through the coordinated operation of clamping components, two-fluid components, air knife components, and control components. The equipment features a simple structure and clearly defined modules, enabling precise control of the cleaning path and spray parameters, effectively improving wafer surface cleanliness. It is also easily integrated with other automated devices, solving the problems of insufficient cleaning control precision, complex structure, and difficulty in integration found in existing technologies. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of the wafer cleaning equipment provided by this utility model; Figure 2 This is a schematic diagram of the internal structure of the wafer cleaning equipment provided by this utility model; Figure 3 This is a front view of the wafer cleaning equipment provided by this utility model without baffles. Detailed Implementation

[0016] The technical solutions in the embodiments of this utility model will be clearly and completely described below. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0017] In addition, to clearly illustrate the technical solution of this application, the following are also defined: Figure 1 The top, bottom, left, right, front, and back sides are shown.

[0018] like Figures 1 to 3 As shown, this application provides a wafer cleaning device, which includes: a housing 1, a clamping assembly, a two-fluid assembly 2, a driving assembly 3, an air knife assembly 4, and a control assembly 5.

[0019] Specifically, the housing 1 has a hollow structure with an opening 11 at its front end. A clamping assembly is used to clamp the wafer and place it into the housing 1 through the opening 11. A two-fluid assembly 2 is disposed within the housing 1, including a support member 21 and multiple nozzles 22 disposed on the support member 21. A drive assembly 3 is disposed within the housing 1 and connected to the support member 21, used to drive the two-fluid assembly 2 to reciprocate along a preset path. An air knife assembly 4 is disposed on the front end face of the housing 1, arranged around the opening 11, used to form a laminar airflow at the opening 11. A control assembly 5 is disposed on the left or right side of the inner cavity of the housing 1, and the two-fluid assembly 2, drive assembly 3, and air knife assembly 4 are electrically connected to the control assembly 5.

[0020] With the above configuration, the cleaning equipment features a compact structure, highly integrated control modules, and simple operation, making it suitable for production line deployment. The introduction of two-fluid cleaning technology significantly improves the removal of adhering particles; combined with the air knife assembly 4, a stable airflow environment is created before and after cleaning, effectively removing liquid adhering to the wafer surface. The control assembly 5 achieves multi-functional integration, improving overall control accuracy and cleaning consistency. The modular structure of the equipment facilitates maintenance and upgrades, enhancing the operational stability and cleaning efficiency of the production line.

[0021] like Figure 2 As shown, multiple nozzles 22 are evenly arranged along the front-to-back and left-to-right directions. This uniform arrangement of the nozzles 22 allows for comprehensive coverage of wafers of different sizes, improving the uniformity and consistency of cleaning. This design helps reduce residual particle rate, improves yield, and eliminates the need for frequent adjustments to the nozzle angle or position, simplifying the operation process. The uniform arrangement also facilitates coordinated control of the cleaning path and nozzle distribution, effectively complementing the reciprocating motion of the drive assembly 3, further enhancing cleaning efficiency and coverage accuracy.

[0022] More specifically, the drive assembly 3 includes a drag chain 31 extending in the left-right direction and a drive motor for driving the drag chain 31. The support member 21 is mounted on the drag chain 31, thereby improving the accuracy and stability of the nozzle 22's movement and ensuring uniform and thorough coverage throughout the cleaning process. The preset path is the extension direction of the drag chain 31.

[0023] like Figure 3As shown, the air knife assembly 4 includes four mounting bases 41 arranged around the opening 11 and air pipe connectors 42 mounted on the mounting bases 41. The air pipe connectors 42 are used to connect to an external air supply device. This arrangement achieves comprehensive airflow coverage of the opening 11 area, effectively reducing the risk of liquid residue and secondary particle deposition. The air pipe connectors 42 are designed for quick connection and disconnection with various air sources, facilitating on-site maintenance and module replacement.

[0024] like Figure 1 As shown, a baffle 6 is provided on the front end face of the housing 1, and a lifting door is provided at the opening 11 corresponding to the baffle 6. When the wafer is being cleaned inside the housing 1, the lifting door is in the closed state to prevent liquid from splashing out of the housing 1, which improves the safety and cleanliness of the cleaning process, prevents liquid from splashing out and causing pollution to the operating environment, and protects the operators.

[0025] like Figure 2 As shown, the housing 1 has a partition 7 perpendicular to the left and right direction, which divides the interior of the housing 1 into a first receiving space and a second receiving space. The two-fluid assembly 2 and the drive assembly 3 are disposed in the first receiving space, and the control assembly 5 is disposed in the second receiving space. The partition 7 serves as a physical separator, preventing water vapor and particulate matter from entering the control module area during the cleaning process, thus ensuring the operational stability and long-term reliability of the electronic control system.

[0026] Furthermore, a pre-drying assembly 8 is provided inside the housing 1, and several mounting holes 71 are provided on the partition plate 7. The pre-drying assembly 8 is installed at the mounting holes 71. Setting up the pre-drying assembly 8 can effectively shorten the drying process time without increasing the overall size of the equipment, enhance the thoroughness of drying after particle removal, and reduce the risk of contamination caused by residual droplets after cleaning.

[0027] Furthermore, the control component 5 includes a two-fluid control unit 51, an air knife control unit 52, and a speed regulation unit 53. The two-fluid control unit 51 is electrically connected to the two-fluid assembly 2 and is used to control the opening and closing of the nozzle 22 and the spray speed of the gas-liquid two-fluid mixture. The air knife control unit 52 is electrically connected to the air knife assembly 4 and is used to control the start and stop of the air knife assembly 4. The speed regulation unit 53 is electrically connected to the drive component 3 and is used to control the moving speed of the two-fluid assembly 2 on a preset path. Integrating multiple control units into a single control component 5 not only simplifies hardware wiring and equipment debugging processes but also significantly improves the uniformity and response speed of the control logic. By parametrically controlling the cleaning rhythm and gas-liquid ratio, cleaning adaptation for wafers with different levels of contamination can be achieved. The independence of the air knife control unit 52 also makes the drying stage more flexible, helping to improve equipment operating efficiency. The speed regulation function ensures cleaning uniformity and effectively avoids over-rinsing or under-spraying. Overall, it improves the system's control accuracy, stability, and automation level.

[0028] like Figure 1 As shown, the top of the housing 1 is provided with a cover plate 9, which is made of transparent material, so that the staff or the identification system can monitor the cleaning process in real time, thereby improving production efficiency and fault response speed.

[0029] The above description of embodiments of the present invention, through which those skilled in the art are able to implement or use the present invention, will be readily apparent to those skilled in the art. Various modifications to these embodiments will be readily apparent to those skilled in the art. The general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novelty disclosed herein.

Claims

1. A wafer cleaning device, characterized in that, include: The shell (1) is a hollow structure with an opening (11) at its front end. A clamping assembly for clamping a wafer and placing the wafer into the housing (1) through the opening (11); Two-fluid assembly (2), which is disposed in the housing (1), includes a support member (21) and a plurality of nozzles (22) disposed on the support member (21). The drive assembly (3) is disposed inside the housing (1) and connected to the support member (21) for driving the two-fluid assembly (2) to reciprocate along a preset path; Air knife assembly (4), the air knife assembly (4) is disposed on the front end face of the housing (1) and arranged around the opening (11) for forming laminar airflow at the opening (11); The control component (5) is located on the left or right side of the inner cavity of the housing (1), and the two fluid components (2), the drive component (3) and the air knife component (4) are electrically connected to the control component (5).

2. The wafer cleaning equipment as described in claim 1, characterized in that, The multiple nozzles (22) are evenly arranged in the front-back and left-right directions.

3. The wafer cleaning equipment as described in claim 1, characterized in that, The drive assembly (3) includes a drag chain (31) extending in the left-right direction and a drive motor for driving the drag chain (31). The support member (21) is mounted on the drag chain (31). The preset path is the extension direction of the drag chain (31).

4. The wafer cleaning equipment as described in claim 1, characterized in that, The air knife assembly (4) includes four mounting bases (41) arranged around the opening (11) and an air pipe connector (42) arranged on the mounting base (41), the air pipe connector (42) being used to connect to an external air supply device.

5. The wafer cleaning equipment as described in claim 1, characterized in that, The front end face of the housing (1) is provided with a baffle (6), and the baffle (6) is provided with a lifting door at the opening (11). When the wafer is cleaned inside the housing (1), the lifting door is closed to prevent liquid from splashing out of the housing (1).

6. The wafer cleaning equipment as described in claim 1, characterized in that, The housing (1) is provided with a partition (7) perpendicular to the left and right direction. The partition (7) divides the interior of the housing (1) into a first accommodating space and a second accommodating space. The two-fluid assembly (2) and the drive assembly (3) are disposed in the first accommodating space, and the control assembly (5) is disposed in the second accommodating space.

7. The wafer cleaning equipment as described in claim 6, characterized in that, The housing (1) is provided with a pre-drying assembly (8), and the partition (7) is provided with a plurality of mounting holes (71). The pre-drying assembly (8) is installed at the mounting holes (71).

8. The wafer cleaning equipment as described in claim 1, characterized in that, The control component (5) includes a two-fluid control unit (51), an air knife control unit (52), and a speed regulation unit (53); the two-fluid control unit (51) is electrically connected to the two-fluid assembly (2) and is used to control the opening and closing of the nozzle (22) and the injection speed of the gas-liquid two-fluid; the air knife control unit (52) is electrically connected to the air knife assembly (4) and is used to control the starting and stopping of the air knife assembly (4); the speed regulation unit (53) is electrically connected to the drive component (3) and is used to control the moving speed of the two-fluid assembly (2) on a preset path.

9. The wafer cleaning equipment as described in claim 1, characterized in that, The housing (1) is provided with a cover plate (9) on top, and the cover plate (9) is made of transparent material.

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