A die bonder

Abstract

The utility model relates to a kind of die bonder, it includes wafer suction accessory, rack and the movable block being set on rack;Movable block can be relative to rack along X direction, Y direction and Z direction movement, X direction, Y direction and Z direction three two two perpendicular;X direction, Y direction and Z direction each all have positive and negative two directions;Elastic arm is equipped on movable block, wafer suction accessory is set on elastic arm, to be connected with movable block by elastic arm;Wafer suction accessory is used to be driven under movable block along the positive direction of Z direction and suck wafer, and wafer suction accessory can swing in Z direction under the action of elastic arm.When movable block drives wafer suction accessory and collides with it along the positive direction of Z direction and suck wafer, elastic arm can buffer impact, and drive wafer suction accessory to swing upward, to avoid wafer suction accessory and wafer occur rigid collision, so it can reduce the damage to wafer.

Description

Technical Field

[0001] This utility model relates to the field of die bonding technology, and in particular to a die bonding machine. Background Technology

[0002] Die bonding machines are used to mount chips onto lead frames or packaging substrates. The quality and efficiency of the die bonding process directly affect the quality and efficiency of subsequent wire bonding. Therefore, die bonding is one of the key technologies in the back-end semiconductor manufacturing process. Die bonding is a critical step in the back-end packaging and testing process. The higher the requirements for precision and speed, the faster the UPH (Uptime Per Hour), the more prone to deviations. Die bonding quality directly affects subsequent steps such as wire bonding, and directly impacts production capacity, chip packaging and testing yield, and cost.

[0003] Existing die bonders include a wafer pick-up unit, a rack, and a movable block mounted on the rack. The movable block can move relative to the rack along the X, Y, and Z directions, with each of the three directions being perpendicular to the others. Each of the X, Y, and Z directions has two opposing directions. The wafer pick-up unit, driven by the movable block, picks up wafers in the forward direction along the Z direction.

[0004] When the moving block drives the wafer pick-up device to pick up the wafer in the positive Z direction, the wafer pick-up device may collide with the wafer due to the wafer's positional deviation, causing damage to the wafer. Therefore, this problem needs to be solved. Summary of the Invention

[0005] In view of this, the present invention provides a die bonder that can solve the technical problem in the prior art where, when the moving block drives the wafer adsorption component to pick up the wafer in the Z direction, the wafer adsorption component may collide with the wafer due to the wafer's positional deviation, causing wafer damage.

[0006] To achieve the above objectives, this utility model mainly provides the following technical solutions: An embodiment of this utility model provides a die bonder, which includes a wafer adsorption component, a frame, and a movable block disposed on the frame; the movable block is capable of moving relative to the frame along the X, Y, and Z directions, wherein the X, Y, and Z directions are perpendicular to each other; each of the X, Y, and Z directions has two opposing directions. The movable block is provided with an elastic arm, and the wafer adsorption component is disposed on the elastic arm to be connected to the movable block through the elastic arm; The wafer adsorption component is used to pick up wafers in the forward direction along the Z direction under the action of the movable block, and the wafer adsorption component can swing in the Z direction under the action of the elastic arm.

[0007] In some embodiments, the movable block is further provided with a first stop and an elastic member, the elastic member being used to apply a force to the wafer adsorption member in the positive direction along the Z direction, so that the wafer adsorption member abuts against the first stop in the initial position.

[0008] In some embodiments, the movable block is further provided with a rotation drive mechanism, which is used to drive the wafer adsorption component to rotate.

[0009] In some embodiments, the elastic arm is provided with a mounting block, and the wafer adsorption component is rotatably disposed on the mounting block to be connected to the elastic arm via the mounting block; The rotary drive mechanism includes a power mechanism, a drive pulley, a driven pulley, and a belt. The drive pulley is rotatably mounted on the movable block. The power mechanism drives the drive pulley to rotate. The driven pulley is fitted onto the wafer adsorption component, and the center line of the driven pulley coincides with the center line of the wafer adsorption component. The drive pulley and the driven pulley are connected by the belt drive.

[0010] In some embodiments, the movable block is further provided with a first stop and an elastic member, the elastic member being used to apply a force for positive movement along the Z direction to the wafer adsorption member, so that when the wafer adsorption member is in the initial position against the first stop,

[0011] The elastic element applies a force to the wafer adsorption component in the positive direction along the Z direction by driving the mounting block; and the wafer adsorption component abuts against the first stop member through the mounting block in the initial position.

[0012] In some embodiments, the mounting block is provided with a removable second stop, which abuts against the first stop when the mounting block is in the initial position.

[0013] In some embodiments, the mounting block is provided with a limiting groove, the movable block is provided with a limiting boss, one end of the elastic member is sleeved on the limiting boss and abuts against the bottom surface of the limiting boss, and the other end of the elastic member abuts against the bottom surface of the limiting groove.

[0014] In some embodiments, the elastic arm is a spring sheet, one end of which is fixed to the movable block and the other end is fixed to the mounting block.

[0015] In some embodiments, the number of elastic arms is two or more, and they are arranged sequentially at intervals in the Z direction.

[0016] By employing the above technical solution, the die bonder of this utility model has at least the following beneficial effects: Because the wafer suction device can swing in the Z direction under the action of the elastic arm, when the moving block drives the wafer suction device to pick up the wafer in the positive direction of the Z direction and collide with it, the elastic arm can buffer the impact and drive the wafer suction device to swing upward to avoid rigid collision between the wafer suction device and the wafer, thus reducing damage to the wafer.

[0017] The above description is only an overview of the technical solution of this utility model. In order to better understand the technical means of this utility model and to implement it in accordance with the contents of the specification, the preferred embodiments of this utility model are described in detail below with reference to the accompanying drawings. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0019] Figure 1 This is an exploded view of a die bonder provided in one embodiment of the present invention; Figure 2 This is an assembly drawing of a die bonder provided in one embodiment of the present invention; Figure 3 yes Figure 2 Enlarged diagram of point A in the middle.

[0020] Reference numerals in the attached drawings: 1. X-axis linear motor; 2. Y-axis linear motor; 3. Z-axis linear motor; 4. Power mechanism; 5. Mounting block; 6. Wafer adsorption component; 7. Movable block; 8. Frame; 9. Elastic arm; 10. First stop component; 11. Elastic component; 12. Drive pulley; 13. Belt; 14. Driven pulley; 15. Second stop component; 51. Limiting groove; 71. Limiting boss. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicators will also change accordingly.

[0023] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of indicated technical features. Therefore, features defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. If the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0024] like Figure 1-3 As shown in the figure, one embodiment of the present invention provides a die bonder, which includes a wafer adsorption component 6, a frame 8, and a movable block 7 disposed on the frame 8. The movable block 7 is movable relative to the frame 8 in the X, Y, and Z directions, with each of the three directions being perpendicular to the others. Each of the X, Y, and Z directions has two opposing directions. The movable block 7 is provided with an elastic arm 9, and the wafer adsorption component 6 is disposed on the elastic arm 9 to be connected to the movable block 7 through the elastic arm 9. The wafer adsorption component 6 is used to pick up wafers in the positive Z direction under the action of the movable block 7, and the wafer adsorption component 6 can swing in the Z direction under the action of the elastic arm 9.

[0025] In the above example, since the wafer adsorption component 6 can swing in the Z direction under the action of the elastic arm 9, when the movable block 7 drives the wafer adsorption component 6 to pick up the wafer in the positive direction of the Z direction and collide with it, the elastic arm 9 can buffer the impact and drive the wafer adsorption component 6 to swing upward to avoid the wafer adsorption component 6 from rigidly colliding with the wafer, thus reducing the damage to the wafer.

[0026] In some implementations, such as Figure 3 As shown, the aforementioned movable block 7 may also be provided with a first stop 10 and an elastic member 11. The elastic member 11 is used to apply a force for positive movement along the Z direction to the wafer adsorption member 6 so that the wafer adsorption member 6 abuts against the first stop 10 in the initial position.

[0027] In the above example, the elastic element 11 and the first stop element 10 work together to position the wafer adsorption element 6 in its initial position, thus avoiding the inaccuracy of the initial position of the wafer adsorption element 6 from affecting the position adjustment accuracy.

[0028] In some embodiments, the aforementioned movable block 7 may also be provided with a rotary drive mechanism, which is used to drive the wafer adsorption member 6 to rotate in order to correct the angular position of the wafer.

[0029] To achieve the function of the aforementioned rotary drive mechanism driving the wafer adsorption component 6 to rotate, in some embodiments, such as... Figure 3 As shown, the aforementioned elastic arm 9 may be equipped with a mounting block 5, and the aforementioned wafer adsorption member 6 is rotatably mounted on the mounting block 5 for connection with the elastic arm 9 via the mounting block 5. The aforementioned rotary drive mechanism may include a power mechanism 4, a driving pulley 12, a driven pulley 14, and a belt 13. The driving pulley 12 is rotatably mounted on the movable block 7, and the power mechanism 4 drives the driving pulley 12 to rotate. The driven pulley 14 is fixed to the wafer adsorption member 6, and the centerline of the driven pulley 14 coincides with the centerline of the wafer adsorption member 6. The driving pulley 12 and the driven pulley 14 are connected by the belt 13.

[0030] In the above example, the power mechanism 4 drives the active pulley 12 to rotate, the active pulley 12 drives the driven pulley 14 to rotate via the belt 13, and the driven pulley 14 drives the wafer adsorption component 6 to rotate, thereby realizing the function of the aforementioned rotary drive mechanism driving the wafer adsorption component 6 to rotate.

[0031] In some embodiments, the aforementioned power mechanism 4 may include a motor to drive the drive pulley 12 to rotate.

[0032] In some embodiments, when the movable block 7 is further provided with a first stop 10 and an elastic member 11, the elastic member 11 is used to apply a force in the Z direction to the wafer adsorption member 6 so that the wafer adsorption member 6 abuts against the first stop 10 in the initial position. The elastic member 11 applies a force in the Z direction to the wafer adsorption member 6 by driving the mounting block 5. And the wafer adsorption member 6 abuts against the first stop 10 through the mounting block 5 in the initial position.

[0033] In some implementations, such as Figure 3 As shown, the aforementioned mounting block 5 is provided with a detachable second stop 15, and the mounting block 5 abuts against the first stop 10 through the second stop 15 when in the initial position.

[0034] In the above example, since the second stop 15 is detachable, it can be repaired or replaced when it is damaged, thus avoiding damage to the mounting block 5 during an impact.

[0035] In order to install the aforementioned elastic element 11, in some embodiments, such as Figure 3 As shown, the aforementioned mounting block 5 may be provided with a limiting groove 51, the aforementioned movable block 7 is provided with a limiting boss 71, one end of the elastic member 11 is sleeved on the limiting boss 71 and abuts against the bottom surface of the limiting boss 71, and the other end of the elastic member 11 abuts against the bottom surface of the limiting groove 51.

[0036] In the above example, the limiting boss 71 can limit one end of the elastic member 11, and the limiting groove 51 can limit the other end of the elastic member 11. The combination of the limiting boss 71 and the limiting groove 51 can improve the installation stability of the elastic member 11.

[0037] In some embodiments, the aforementioned elastic element 11 may be a spring or flexible plastic, etc.

[0038] In some embodiments, the aforementioned elastic arm 9 can be a spring sheet, with one end fixed to the movable block 7 and the other end fixed to the mounting block 5. Both ends of the spring sheet can be fixed with screws.

[0039] In some implementations, such as Figure 3 As shown, the number of the aforementioned elastic arms 9 can be two or more, and they are arranged at intervals in the Z direction, which can improve the connection stability between the mounting block 5 and the movable block 7.

[0040] The aforementioned elastic arm 9 can be divided into two groups. One group of elastic arms 9 can be set at the upper end of the mounting block 5, and the other group of elastic arms 9 can be set at the lower end of the mounting block 5. The upper and lower installation method of the two groups of elastic arms 9 can improve the connection stability between the mounting block 5 and the movable block 7.

[0041] The aforementioned movable block 7 can be driven by linear motors in the X, Y, and Z directions. Specifically, the die bonder has an X-axis linear motor 1, a Y-axis linear motor 2, and a Z-axis linear motor 3. The X-axis linear motor 1 drives the movable block 7 to move along the X direction, the Y-axis linear motor 2 drives the movable block 7 to move along the Y direction, and the Z-axis linear motor 3 drives the movable block 7 to move along the Z direction.

[0042] The aforementioned wafer adsorption component 6 is provided with an adsorption hole. One end of the adsorption hole is used to connect with an external vacuum device, and the wafer adsorption component 6 adsorbs the wafer through the other end of the adsorption hole.

[0043] The wafer adsorption element 6 mentioned above may also be referred to as a rotating head in some contexts.

[0044] The working principle of this die bonder is as follows: A linear motor control system controls the wafer pick-up component 6 to pick up the wafer from the wafer disk using a vacuum method. After the wafer is picked up, the bonding head moves into the field of view of the vision system. The vision system is responsible for identifying the wafer's position and orientation, ensuring the wafer is correctly placed on the bonding pad. Based on the information provided by the vision system, the wafer pick-up component 6 rotates to correct the wafer's angular position. The voice coil torque control system precisely controls the die bonding pressure. After die bonding is completed, the bonding head returns to its initial position, ready for the next pick-up and bonding operation, repeating the process.

[0045] The above description is only a preferred embodiment of the present utility model and does not limit the patent scope of the present utility model. All equivalent structural transformations made under the inventive concept of the present utility model using the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.

Claims

1. A die bonder, characterized in that, It includes a wafer adsorption component (6), a rack (8), and a movable block (7) disposed on the rack (8); the movable block (7) is capable of moving relative to the rack (8) in the X, Y, and Z directions, wherein the X, Y, and Z directions are perpendicular to each other; each of the X, Y, and Z directions has two opposing directions. The movable block (7) is provided with an elastic arm (9), and the wafer adsorption component (6) is disposed on the elastic arm (9) to be connected to the movable block (7) through the elastic arm (9); The wafer adsorption member (6) is used to pick up the wafer in the positive direction along the Z direction under the drive of the movable block (7), and the wafer adsorption member (6) can swing in the Z direction under the action of the elastic arm (9).

2. The die bonder as described in claim 1, characterized in that, The movable block (7) is also provided with a first stop (10) and an elastic member (11). The elastic member (11) is used to apply a force to the wafer adsorption member (6) in the positive direction along the Z direction so that the wafer adsorption member (6) abuts against the first stop (10) in the initial position.

3. The die bonder as described in claim 1 or 2, characterized in that, The movable block (7) is also provided with a rotation drive mechanism, which is used to drive the wafer adsorption component (6) to rotate.

4. The die bonder as described in claim 3, characterized in that, The elastic arm (9) is provided with a mounting block (5), and the wafer adsorption component (6) is rotatably disposed on the mounting block (5) to be connected to the elastic arm (9) through the mounting block (5); The rotary drive mechanism includes a power mechanism (4), a drive pulley (12), a driven pulley (14), and a belt (13). The drive pulley (12) is rotatably mounted on the movable block (7). The power mechanism (4) drives the drive pulley (12) to rotate. The driven pulley (14) is mounted on the wafer adsorption member (6), and the center line of the driven pulley (14) coincides with the center line of the wafer adsorption member (6). The drive pulley (12) and the driven pulley (14) are connected by the belt (13).

5. The die bonder as described in claim 4, characterized in that, When the movable block (7) is also provided with a first stop (10) and an elastic member (11), the elastic member (11) is used to apply a force to the wafer adsorption member (6) in the positive direction along the Z direction, so that the wafer adsorption member (6) abuts against the first stop (10) in the initial position. The elastic element (11) applies a force to the wafer adsorption element (6) in the Z direction by driving the mounting block (5); and the wafer adsorption element (6) abuts against the first stop element (10) through the mounting block (5) in the initial position.

6. The die bonder as described in claim 5, characterized in that, The mounting block (5) is provided with a detachable second stop (15), and the mounting block (5) abuts against the first stop (10) through the second stop (15) when in the initial position.

7. The die bonder as described in claim 5, characterized in that, The mounting block (5) is provided with a limiting groove (51), the movable block (7) is provided with a limiting boss (71), one end of the elastic member (11) is sleeved on the limiting boss (71) and abuts against the bottom surface of the limiting boss (71), and the other end of the elastic member (11) abuts against the bottom surface of the limiting groove (51).

8. The die bonder as described in claim 4, characterized in that, The elastic arm (9) is a spring sheet, one end of which is fixed to the movable block (7), and the other end is fixed to the mounting block (5).

9. The die bonder as described in any one of claims 1-2 and 4-8, characterized in that, The number of elastic arms (9) is two or more, and they are arranged at intervals in the Z direction.

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