Adjustable flower basket for silicon wafer cleaning

Abstract

The utility model provides a kind of adjustable flower basket for silicon wafer cleaning, belong to silicon wafer flower basket technical field, including flower basket side plate one and the flower basket side plate two of horizontal side thereof;Respectively set up in the silicon wafer clamping groove of the one side wall of flower basket side plate one and flower basket side plate two;Lateral plate distance adjusting assembly between the flower basket side plate one and the flower basket side plate two is equipped;And silicon wafer self-rotating component on the flower basket side plate one and the flower basket side plate two;Wherein, the silicon wafer self-rotating component includes: two supporting columns respectively symmetrically set on the outer side wall of the flower basket side plate one and the flower basket side plate two;The utility model makes it rotate by the friction between disc and silicon wafer when rotating, and silicon wafer is rotated in silicon wafer clamping groove, the position of each part of silicon wafer in ultrasonic water tank is adjusted by the rotation of silicon wafer, and then the cleaning of silicon wafer is cleaned in all directions using ultrasonic wave, improve the effect of cleaning, and ensure the uniformity of silicon wafer cleaning.

Description

Technical Field

[0001] This utility model belongs to the field of silicon wafer flower basket technology, specifically relating to an adjustable flower basket for cleaning silicon wafers. Background Technology

[0002] Silicon wafers are thin sheets made of high-purity crystalline silicon and are an important component of semiconductor materials, widely used in the electronics industry. After being manufactured through processes such as cutting, grinding, and polishing, silicon wafers need to be cleaned. In conventional silicon wafer cleaning, the wafers are placed in a cleaning basket, which is then placed in a water tank. An ultrasonic motor generates ultrasonic waves in the water, causing cavitation, acceleration, and direct flow. These effects work together on the water and contaminants, dispersing, emulsifying, and peeling off the contaminant layer, thereby achieving the purpose of cleaning.

[0003] However, the silicon wafers are fixed in the water tank. Because the ultrasonic waves form a standing wave field in the cleaning tank, the sound pressure amplitude distribution is uneven. In particular, the upper area of ​​the water tank with lower sound pressure may not be able to effectively trigger cavitation. This results in different cleaning effects on the silicon wafers in the vertical direction, and the cleaning is uneven. Moreover, most of the silicon wafers in the basket are at the same height, which makes it very inconvenient to remove the silicon wafers and makes it difficult to remove adjacent silicon wafers one by one.

[0004] Therefore, an adjustable basket for cleaning silicon wafers is proposed. Summary of the Invention

[0005] This invention provides an adjustable flower basket for cleaning silicon wafers, the purpose of which is to solve the problems mentioned above.

[0006] This utility model provides an adjustable basket for silicon wafer cleaning, including a basket side plate one and a basket side plate two located on its horizontal side; silicon wafer clamping slots respectively formed on one side wall of the basket side plate one and the basket side plate two; a side plate spacing adjustment assembly disposed between the basket side plate one and the basket side plate two; and a silicon wafer self-rotation assembly disposed on the basket side plate one and the basket side plate two; wherein, the silicon wafer self-rotation assembly includes: two support columns respectively symmetrically disposed on the outer side walls of the basket side plate one and the basket side plate two; and a rotatable sleeve on the two support columns. A rotating plate on the side wall; a motor disposed on one side wall of one of the rotating plates; a rotating rod fixed to the output end of the motor; a disc disposed on the outer side wall of the rotating rod; a pin hole one opened on one side wall of the rotating plate; pin holes two respectively opened on one side wall of the basket side plate one and the basket side plate two; positioning pins inserted into pin holes one and two; disc receiving grooves respectively opened on the other side wall of the basket side plate one and the basket side plate two, the disc receiving grooves being connected to the silicon wafer clamping grooves; and a silicon wafer discharge assembly disposed below the basket side plate one and the basket side plate two.

[0007] Furthermore, the side panel spacing adjustment assembly includes an inner rod disposed on one side wall of the flower basket side panel and an outer rod sleeve disposed on one side wall of the flower basket side panel. The outer side wall of the inner rod is provided with axially spaced adjusting screw holes near the top position. The outer side wall of the outer rod sleeve is provided with a screw rod through the bottom and one end positions. The screw rod and the adjusting screw hole are connected by threaded engagement.

[0008] Furthermore, the silicon wafer unloading assembly includes a base plate located below the first and second side panels of the basket, and the top of the base plate is provided with an ejector plate, an ejector plate, and an ejector plate in sequence in the horizontal direction, with the ejector plate being located between the ejector plate and the ejector plate.

[0009] Furthermore, the silicon wafer feeding assembly also includes four guide pillars symmetrically arranged on the top of the base plate, and two guide blocks symmetrically arranged on the outer side walls of both the first and second side panels of the basket. Each of the four guide blocks has a guide hole at its top, and the guide pillars pass through the guide holes.

[0010] Furthermore, the bottom of the flower basket side panel one and the flower basket side panel two are provided with a bent portion on one side, and the bent portion is at an obtuse angle.

[0011] Furthermore, one end of the inner rod is embedded inside the outer rod sleeve.

[0012] Furthermore, the disk, the silicon wafer clamping groove, and the disk receiving groove are all located on the same vertical plane, and the outer diameter of the disk is smaller than the inner diameter of the disk receiving groove.

[0013] Furthermore, the heights of the ejector plate one, ejector plate two, and ejector plate three increase sequentially, and the ejector plate one, ejector plate two, and ejector plate three are on the same vertical plane as the silicon wafer clamping groove.

[0014] The beneficial effects of this utility model are as follows:

[0015] 1. This utility model uses a silicon wafer self-rotating assembly to allow a portion of the disc to extend into the silicon wafer clamping groove after the disc position changes. The disc can lift the silicon wafer in the clamping groove, and the friction between the disc and the silicon wafer pulls the silicon wafer to rotate within the clamping groove during rotation. By rotating the silicon wafer, the position of each part of the silicon wafer in the ultrasonic water tank is adjusted, thereby using ultrasonic waves to clean the silicon wafer from all directions, improving the cleaning effect and ensuring the uniformity of silicon wafer cleaning.

[0016] 2. This utility model can lift the silicon wafer by moving the ejector plate 1, ejector plate 2 and ejector plate 3 relative to it. Since the ejector plate 1, ejector plate 2 and ejector plate 3 are at different heights, the tops of adjacent silicon wafers are not at the same height after being lifted, and the adjacent silicon wafers are in a misaligned state, which makes it easier to remove the silicon wafer.

[0017] Other features and advantages of this invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. The objects and other advantages of this invention can be realized and obtained by means of the structures particularly pointed out in the description and the drawings. Attached Figure Description

[0018] The accompanying drawings are provided to further illustrate the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention, but do not constitute a limitation thereof. In the drawings:

[0019] Figure 1 This is a schematic diagram of the structure of an embodiment of the present utility model;

[0020] Figure 2 This is a schematic diagram showing the assembly of the flower basket side panel one and the flower basket side panel two according to an embodiment of the present utility model;

[0021] Figure 3 This is a schematic diagram of the silicon wafer self-rotating assembly structure according to an embodiment of the present invention;

[0022] Figure 4 This is a schematic diagram of the structure of the flower basket side panel according to an embodiment of the present utility model;

[0023] Figure 5 This is a cross-sectional view of the side panel of the flower basket according to an embodiment of the present utility model;

[0024] Figure 6 This is a schematic diagram of the silicon wafer feeding assembly structure according to an embodiment of the present invention;

[0025] Reference numerals: 1. Side plate one of the basket; 2. Side plate two of the basket; 3. Silicon wafer clamping groove; 4. Side plate spacing adjustment assembly; 41. Inner rod; 42. Outer rod sleeve; 43. Adjusting screw hole; 44. Screw; 5. Silicon wafer self-rotation assembly; 51. Support column; 52. Rotating plate; 53. Motor; 54. Rotating rod; 55. Disc; 56. Pin hole one; 57. Pin hole two; 58. Positioning pin; 59. Disc receiving groove; 6. Silicon wafer discharge assembly; 61. Base plate; 62. Ejector plate one; 63. Ejector plate two; 64. Ejector plate three; 65. Guide column; 66. Guide block; 67. Guide hole. Detailed Implementation

[0026] To make the objectives, technical solutions, and advantages of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. The same reference numerals in the drawings represent the same components. It should be noted that the described embodiments are only some, not all, of the embodiments of this utility model. All other embodiments obtained by those skilled in the art based on the described embodiments of this utility model without creative effort are within the scope of protection of this utility model.

[0027] Example 1

[0028] Reference Figure 1-5 This utility model embodiment proposes an adjustable basket for cleaning silicon wafers, including a basket side plate 1 and a basket side plate 2 located on one side of the basket side plate 1 and the basket side plate 2. The bottom of the basket side plate 1 and the basket side plate 2 is provided with a bent part near one side. The bent part is obtuse angled. The obtuse angled bent part can support the circular silicon wafer and prevent the silicon wafer from falling between the basket side plate 1 and the basket side plate 2. Several silicon wafer clamping grooves 3 are evenly spaced on one side outer wall of the basket side plate 1 and the basket side plate 2 to provide space for the silicon wafer. Both the basket side plate 1 and the basket side plate 2 are provided with silicon wafer self-rotation assembly 5.

[0029] The silicon wafer self-rotating assembly 5 includes two supporting columns 51 symmetrically arranged on the outer walls of the first flower basket side plate 1 and the second flower basket side plate 2, respectively. A rotating plate 52 is fitted onto the outer wall of each of the two supporting columns 51. A motor 53 is installed on one side wall of one of the rotating plates 52. A rotating rod 54 is fixedly connected to the motor 53 via its output end. The other end of the rotating rod 54 is rotatably connected to the other rotating plate 52. Several disks 55 are evenly spaced on the outer wall of the rotating rod 54. A pin hole 56 is provided on the outer wall of the rotating plate 52. The first flower basket side plate 1 and the second flower basket side plate 2... Pin holes 57 are provided on the outer side walls of the two plates. Positioning pins 58 are inserted into the pin holes 56 and 57. A disc receiving groove 59 is provided on the other side of the outer wall of the basket side plate 1 and the basket side plate 2 near the silicon wafer clamping groove 3. The disc 55, the silicon wafer clamping groove 3 and the disc receiving groove 59 are all on the same vertical plane. The outer diameter of the disc 55 is smaller than the inner diameter of the disc receiving groove 59, so that after the disc 55 moves in a circle, a part of it enters the disc receiving groove 59, and then a part of it enters the silicon wafer clamping groove 3, thereby lifting the silicon wafer inside the silicon wafer clamping groove 3.

[0030] In order to achieve uniform and thorough cleaning of the silicon wafers in the basket during ultrasonic cleaning, in this embodiment, the silicon wafers are inserted into the silicon wafer clamping grooves 3 on the basket side plate 1 and the basket side plate 2. The rotating plate 52 is rotated, and the rotating plate 52 moves circumferentially along the support column 51. The disc 55 moves synchronously, and a part of the disc 55 extends into the silicon wafer clamping groove 3. At this time, the positioning pin 58 is inserted into the pin hole 1 56 and the pin hole 2 57 to fix the position of the disc 55. The two discs 55 lift the silicon wafers in the silicon wafer clamping groove 3.

[0031] Then, the flower basket is placed in the ultrasonic water tank. The control motor 53 drives the rotating rod 54 to rotate slowly through its output end on one side. The disc 55 on the rotating rod 54 rotates synchronously. Through the friction between the disc 55 and the circular silicon wafer, the disc 55 pulls the silicon wafer to rotate. The silicon wafer rotates in the silicon wafer clamping groove 3. By rotating the silicon wafer, the position of each part of the silicon wafer in the ultrasonic water tank is adjusted. In this way, the ultrasonic waves are used to clean the silicon wafer from all directions, improve the cleaning effect, and ensure the uniformity of the silicon wafer cleaning.

[0032] Example 2

[0033] Reference Figure 1-2 This utility model embodiment also proposes an adjustable flower basket for cleaning silicon wafers, including a flower basket side plate 1 and a flower basket side plate 2 located on one side of the flower basket side plate 1 and the flower basket side plate 2. A plurality of silicon wafer clamping grooves 3 are evenly spaced on the outer wall of one side of the flower basket side plate 1 and the flower basket side plate 2. A side plate spacing adjustment component 4 is provided between the flower basket side plate 1 and the flower basket side plate 2.

[0034] The side panel spacing adjustment assembly 4 includes an inner rod 41 disposed on one side wall of the second side panel 2 of the flower basket and an outer rod sleeve 42 disposed on one side wall of the first side panel 1 of the flower basket. One end of the inner rod 41 is embedded in the interior of the outer rod sleeve 42. The movement trajectory of the inner rod 41 can be limited by the outer rod sleeve 42, so that the first side panel 1 of the flower basket and the second side panel 2 of the flower basket can move horizontally towards each other or in opposite directions. Adjustment screw holes 43 are axially and evenly spaced at the top position of the outer side wall of the inner rod 41. A screw 44 passes through the bottom and one end position of the outer side wall of the outer rod sleeve 42. The screw 44 and the adjustment screw holes 43 are connected by threaded engagement.

[0035] To accommodate silicon wafers of different specifications, in this embodiment, the distance between basket side plate 1 and basket side plate 2 is adjusted according to the size of the silicon wafer. Specifically, screw 44 is unscrewed, at which point the inner rod 41 and the outer rod sleeve 42 are in a movable state. Under the linear guide limit between the inner rod 41 and the outer rod sleeve 42, the distance between basket side plate 1 and basket side plate 2 is adjusted, and screw 44 is screwed into the corresponding adjusting screw hole 43 to fix the inner rod 41 and the outer rod sleeve 42, thereby completing the distance adjustment between basket side plate 1 and basket side plate 2 so that silicon wafers of different specifications can be inserted into the silicon wafer clamping grooves 3 on basket side plate 1 and basket side plate 2.

[0036] Example 3

[0037] Reference Figure 1 and Figure 6 This utility model embodiment also proposes an adjustable basket for cleaning silicon wafers, including a basket side plate 1 and a basket side plate 2 located on one side of the basket side plate 1 and the basket side plate 2. A plurality of silicon wafer clamping grooves 3 are evenly spaced on the outer wall of one side of the basket side plate 1 and the basket side plate 2. A silicon wafer discharge assembly 6 is provided below the basket side plate 1 and the basket side plate 2.

[0038] The silicon wafer ejection assembly 6 includes a base plate 61 located below the basket side plate 1 and the basket side plate 2. The top of the base plate 61 has, in a horizontal direction, three ejection plates: a first ejection plate 62, a second ejection plate 63, and a third ejection plate 64. The second ejection plate 63 is located between the first ejection plate 62 and the third ejection plate 64. The heights of the first ejection plate 62, the second ejection plate 63, and the third ejection plate 64 increase sequentially, and the first ejection plate 62, the second ejection plate 63, and the third ejection plate 64 are on the same vertical plane as the silicon wafer clamping groove 3. The silicon wafers are arranged in a staggered manner by the successive increasing height of the ejector plates 62, 63, and 64, so that the adjacent silicon wafers are staggered after the ejector plates 62, 63, and 64 are lifted, which makes it easier to remove the silicon wafers. The silicon wafer ejection assembly 6 also includes four guide posts 65 symmetrically arranged on the top of the base plate 61. Two guide blocks 66 are symmetrically arranged on the outer side walls of the basket side plate 1 and basket side plate 2. The top of each of the four guide blocks 66 is provided with a guide hole 67, and the guide posts 65 pass through the guide holes 67.

[0039] To facilitate the removal of silicon wafers from the cleaned basket, in this embodiment, after the basket is removed from the ultrasonic water tank, it is vertically guided by the guide post 65 and the guide hole 67, and the basket side plate 1 and basket side plate 2 are placed on the base plate 61. The ejector plate 1 62, ejector plate 2 63 and ejector plate 3 64 come into contact with the silicon wafers. After being squeezed, the silicon wafers move upward along the silicon wafer clamping groove 3. At this time, the silicon wafers are lifted up. Since the ejector plate 1 62, ejector plate 2 63 and ejector plate 3 64 are at different heights, the tops of adjacent silicon wafers are not at the same height after being lifted up. The adjacent silicon wafers are in a misaligned state, which makes it easier to remove the silicon wafers.

[0040] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. An adjustable basket for cleaning silicon wafers, characterized in that: Includes a flower basket side panel one (1) and a flower basket side panel two (2) located on its horizontal side; Silicon wafer clamping grooves (3) are respectively opened on one side wall of the flower basket side plate one (1) and the flower basket side plate two (2); A side panel spacing adjustment assembly (4) is provided between the first side panel (1) and the second side panel (2) of the flower basket; and Silicon wafer self-rotating assembly (5) is provided on the flower basket side plate one (1) and flower basket side plate two (2); The silicon wafer self-rotating assembly (5) includes: Two supporting columns (51) are symmetrically arranged on the outer side walls of the flower basket side panel one (1) and the flower basket side panel two (2); Rotate the rotating plates (52) sleeved on the outer walls of the two supporting columns (51) respectively; A motor (53) is installed on one side wall of one of the rotating plates (52); A rotating rod (54) fixed to the output end of the motor (53); A disk (55) is provided on the outer wall of the rotating rod (54); A pin hole (56) is formed on one side wall of the rotating plate (52); Pin holes 2 (57) are respectively opened on one side wall of the flower basket side plate 1 (1) and the flower basket side plate 2 (2); Positioning pins (58) are inserted into the first pin hole (56) and the second pin hole (57); A disc receiving groove (59) is respectively opened on the other side wall of the flower basket side plate one (1) and the flower basket side plate two (2), and the disc receiving groove (59) is connected to the silicon wafer clamping groove (3); A silicon wafer discharge assembly (6) is located below the first (1) and the second (2) of the flower basket side plate.

2. The adjustable basket for cleaning silicon wafers according to claim 1, characterized in that: The side plate spacing adjustment assembly (4) includes an inner rod (41) on one side wall of the second side plate (2) of the flower basket and an outer rod sleeve (42) on one side wall of the first side plate (1) of the flower basket. The inner rod (41) has axially spaced adjusting screw holes (43) at the top position. The outer rod sleeve (42) has a screw (44) passing through it at the bottom and one end position. The screw (44) and the adjusting screw hole (43) are connected by a threaded connection.

3. The adjustable basket for cleaning silicon wafers according to claim 1, characterized in that: The silicon wafer feeding assembly (6) includes a base plate (61) located below the first side plate (1) and the second side plate (2). The top of the base plate (61) is provided with a first ejector plate (62), a second ejector plate (63) and a third ejector plate (64) in a horizontal direction. The second ejector plate (63) is located between the first ejector plate (62) and the third ejector plate (64).

4. The adjustable flower basket for silicon wafer cleaning according to claim 3, characterized in that: The silicon wafer feeding assembly (6) also includes four guide posts (65) symmetrically arranged on the top of the base plate (61). Two guide blocks (66) are symmetrically arranged on the outer side walls of the basket side plate one (1) and the basket side plate two (2). The top of each of the four guide blocks (66) is provided with a guide hole (67), and the guide post (65) passes through the guide hole (67).

5. The adjustable basket for cleaning silicon wafers according to claim 1, characterized in that: The bottom of the flower basket side panel 1 (1) and the flower basket side panel 2 (2) are provided with a bent part on one side, and the bent part is obtuse angle.

6. The adjustable basket for cleaning silicon wafers according to claim 2, characterized in that: One end of the inner rod (41) is embedded inside the outer rod sleeve (42).

7. The adjustable basket for cleaning silicon wafers according to claim 1, characterized in that: The disk (55), the silicon wafer clamping groove (3), and the disk receiving groove (59) are all located on the same vertical plane, and the outer diameter of the disk (55) is smaller than the inner diameter of the disk receiving groove (59).

8. The adjustable basket for cleaning silicon wafers according to claim 3, characterized in that: The heights of the ejector plate 1 (62), ejector plate 2 (63) and ejector plate 3 (64) increase sequentially, and the ejector plate 1 (62), ejector plate 2 (63) and ejector plate 3 (64) are on the same vertical plane as the silicon wafer clamping groove (3).

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