Wafer box transfer mechanism and production line

Abstract

The utility model relates to a wafer box transfer mechanism and production line, including horizontal -moving mechanism and jacking mechanism, wherein, horizontal -moving mechanism adopts multilayer drive structure of two -stage sliding plate, can realize high accuracy and high speed drive, has higher stability, the layout is more nimble and saves space more, discarded the CV mode of continuous operation, executes strict " point to point " motion control, can accelerate to target speed again smoothly and decelerate to zero smoothly, has eliminated the impact and vibration from rigidity start -stop fundamentally, and the transmission mode of drive mechanism is mainly for meshing transmission, has reduced the dust particle produced in the operation process, is favorable to guarantee the cleanliness of product to ensure the final quality of product, simultaneously adopts the double positioning detection of mechanical positioning pin and photoelectric sensor, ensures the stability and reliability of wafer box transfer process.

Description

Technical Field

[0001] This utility model relates to the field of wafer cell production equipment technology, and in particular to a wafer cell transfer mechanism and production line. Background Technology

[0002] In high-precision manufacturing industries such as semiconductor integrated circuits and flat panel displays, the front-opening unified pod (FOUP) is a key container for carrying wafers. Its efficient, stable, and clean transport in automated material handling systems directly affects the throughput and product yield of the production line.

[0003] Currently, the transfer of FOUPs between different devices or storage units within the production line mainly relies on automated overhead hoist transport (OHT) systems. After the OHT transports the FOUP to the target location, it typically needs to be placed on a fixed transfer platform, where its own robotic arm will then handle the loading and unloading. However, in certain specific applications, such as when the FOUP needs to be transported into the car of a vertical lift storage system, or to a location where direct docking with the OHT is not possible, an intermediate transfer mechanism is required to complete the "relay" transfer.

[0004] Traditional transfer solutions commonly employ continuous velocity (CV) conveyors, either belt-driven or roller-driven. However, this method has significant limitations: First, CV conveyors inevitably experience slight vibrations and slippage during start-up and shutdown. For FOUPs carrying expensive and fragile wafers, this poses a potential risk of positioning deviations and vibrations, potentially affecting wafer positioning accuracy or even causing damage. Second, the transmission mechanisms (such as belts and motors) may generate micron-sized dust particles during operation, which is an unacceptable source of contamination in semiconductor workshops with extremely high cleanliness requirements.

[0005] Therefore, the industry urgently needs a non-CV type, high-precision, high-cleanliness and stable FOUP transfer technology to meet the stringent requirements of special workstation docking and ensure the absolute safety and stability of wafers during the transfer process. Utility Model Content

[0006] Therefore, the technical problem to be solved by this utility model is to overcome the problem that the existing technology generally uses belt or roller conveyors to transport FOUP, which has potential positioning deviation and vibration risks, which may affect the positional accuracy of the wafer or even cause damage; and may generate micron-sized dust particles during operation, which may contaminate the product.

[0007] To solve the above-mentioned technical problems, this utility model provides a wafer cassette transfer mechanism, comprising: A lateral movement mechanism includes a base plate, a primary sliding plate, a secondary sliding plate, a first drive source, a second drive source, and a synchronous belt. The primary sliding plate is slidably connected to and parallel to the base plate. The first drive source is disposed on the base plate to drive the primary sliding plate to slide. The secondary sliding plate is slidably connected to and parallel to the primary sliding plate. The synchronous belt is disposed on the primary sliding plate parallel to the sliding direction of the secondary sliding plate. The second drive source is mounted on the secondary sliding plate and engages with the synchronous belt through a synchronous pulley. The lifting mechanism includes a base, a lifting plate, a platform, a third drive source, a rack, positioning pins, and photoelectric sensors. The base is mounted on the secondary sliding plate, and the lifting plate is slidably connected to the base in a direction perpendicular to the secondary sliding plate. A rack extending parallel to the sliding direction is mounted on one side of the lifting plate. The third drive source is mounted on the secondary sliding plate, and its output end meshes with the rack via gears. The platform is disposed on the lifting plate, and multiple positioning pins and multiple photoelectric sensors are disposed on the platform.

[0008] In one embodiment of the present invention, the substrate is provided with two first slide rails extending along their length direction, the first-stage sliding plate is slidably connected to the first slide rails by a first slider, and the first driving source is mounted on the substrate parallel to the first slide rails and located between the two first slide rails.

[0009] In one embodiment of this utility model, two guide rails are symmetrically arranged on the first sliding plate, each located on one side of the two first slide rails that are opposite to each other. Each guide rail includes a guide groove parallel to the first slide rail. On the side of the two first slide rails that are far apart from each other, multiple sets of guide wheel assemblies are arranged at intervals along a direction parallel to their length. Each guide wheel assembly includes two connecting seats connected in parallel to the base plate. A guide wheel is rotatably connected to each of the two connecting seats, and the guide wheel is in rolling connection with the guide groove that is close to it.

[0010] In one embodiment of this utility model, the primary sliding plate is provided with two second slide rails extending along its length direction, the secondary sliding plate is slidably connected to the second slide rails by a second slider, the secondary sliding plate is provided with a mounting base, the second drive source is mounted on the mounting base, and the mounting base is symmetrically provided with two tensioning pulleys on both sides of the synchronous belt pulley respectively located at the output end of the second drive source, and the synchronous belt passes around one tensioning pulley, the synchronous belt pulley and the other tensioning pulley in sequence.

[0011] In one embodiment of this utility model, a clamping seat is included. Two clamping seats are provided, and the two clamping seats are symmetrically arranged on the primary sliding plate along the sliding direction parallel to the secondary sliding plate. The two ends of the synchronous belt are respectively connected to the two clamping seats.

[0012] In one embodiment of the present invention, a plurality of first sensors are arranged at intervals along the sliding direction of the first-stage sliding plate on one side of the substrate, and a first sensing element for being sensed by the first sensors is provided on one side of the first-stage sliding plate.

[0013] In one embodiment of the present invention, a plurality of second sensors are provided on the first-stage sliding plate and arranged at intervals along the sliding direction of the second-stage sliding plate, and a second sensing element for being sensed by the second sensors is provided on one side of the second-stage sliding plate.

[0014] In one embodiment of the present invention, a connecting plate is provided on the secondary sliding plate, and a plurality of third sensors are provided on the connecting plate at intervals in the sliding direction parallel to the lifting plate. A third sensing element for being sensed by the third sensors is provided on one side of the lifting plate.

[0015] In one embodiment of this utility model, three positioning pins are arranged in a triangle on the platform, and three photoelectric sensors are arranged in a triangle on the platform.

[0016] A production line comprising a wafer cassette transfer mechanism as described in any of the preceding claims.

[0017] The above-mentioned technical solution of this utility model has the following advantages compared with the prior art: This utility model discloses a wafer cassette transfer mechanism and production line, which includes a transverse transfer mechanism and a lifting mechanism. The transverse transfer mechanism adopts a multi-layer drive structure with two-stage sliding plates, enabling high-precision and high-speed drive, higher stability, more flexible layout, and greater space saving. It abandons the continuous operation CV mode and implements strict "point-to-point" motion control, achieving a perfect S-shaped acceleration and deceleration curve, smoothly accelerating to the target speed and then smoothly decelerating to zero, eliminating the impact and vibration caused by rigid start and stop at the source. Furthermore, the drive mechanism mainly uses meshing transmission, reducing dust particles generated during operation, which helps ensure product cleanliness and thus ensures the final product quality. At the same time, it adopts dual positioning detection of mechanical positioning pins and photoelectric sensors to ensure the stability and reliability of the wafer cassette transfer process. Attached Figure Description

[0018] To make the content of this utility model easier to understand, the present utility model will be further described in detail below with reference to specific embodiments and accompanying drawings. Figure 1 This is a perspective view of the wafer cassette transfer mechanism according to a preferred embodiment of the present invention; Figure 2 This is a schematic diagram of the overall structure of the wafer cassette transfer mechanism according to a preferred embodiment of the present invention; Figure 3 This is a schematic diagram of the transverse movement mechanism of the wafer cassette transfer mechanism according to a preferred embodiment of the present invention; Figure 4 This is a schematic diagram of the guide wheel assembly of the wafer cassette transfer mechanism according to a preferred embodiment of the present invention; Figure 5 This is a schematic diagram of the lifting mechanism of the wafer cassette transfer mechanism according to a preferred embodiment of the present invention.

[0019] Explanation of reference numerals in the accompanying drawings: 1. Transverse movement mechanism; 11. Base plate; 12. First-stage sliding plate; 121. Guide rail; 13. Second-stage sliding plate; 14. First drive source; 15. Second drive source; 16. Synchronous belt; 17. Synchronous belt pulley; 18. Guide wheel assembly; 181. Connecting seat; 182. Guide wheel; 19. Tensioning wheel; 2. Lifting mechanism; 21. Base; 22. Lifting plate; 23. Platform; 24. Third drive source; 25. Rack; 26. Positioning pin; 27. Photoelectric sensor; 28. Gear. Detailed Implementation

[0020] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, so that those skilled in the art can better understand and implement the present invention. However, the embodiments are not intended to limit the present invention.

[0021] Example 1, refer to Figures 1-5 As shown, a wafer cassette transfer mechanism of this utility model includes, The transverse movement mechanism 1 includes a base plate 11, a primary sliding plate 12, a secondary sliding plate 13, a first drive source 14, a second drive source 15, and a synchronous belt 16. The primary sliding plate 12 is slidably connected to and parallel to the base plate 11. The first drive source 14 is disposed on the base plate 11 to drive the primary sliding plate 12 to slide. The secondary sliding plate 13 is slidably connected to and parallel to the primary sliding plate 12. The synchronous belt 16 is disposed on the primary sliding plate 12 parallel to the sliding direction of the secondary sliding plate 13. The second drive source 15 is mounted on the secondary sliding plate 13 and engages with the synchronous belt 16 through a synchronous pulley 17. The lifting mechanism 2 includes a base 21, a lifting plate 22, a platform 23, a third drive source 24, a rack 25, positioning pins 26, and photoelectric sensors 27. The base 21 is mounted on the secondary sliding plate 13. The lifting plate 22 is slidably connected to the base 21 in a direction perpendicular to the secondary sliding plate 13. A rack 25 extending parallel to its sliding direction is mounted on one side of the lifting plate 22. The third drive source 24 is mounted on the secondary sliding plate 13, and its output end meshes with the rack 25 through a gear 28. The platform 23 is disposed on the lifting plate 22, and multiple positioning pins 26 and multiple photoelectric sensors 27 are disposed on the platform 23.

[0022] Specifically, the transverse mechanism 1 adopts a stacked two-stage drive structure, which saves space while ensuring sufficient driving distance. The first-stage drive mechanism uses a rodless cylinder, and the second-stage drive mechanism uses a servo motor and synchronous belt, which can achieve high-precision and high-speed driving and has higher stability. The lifting mechanism 2 realizes the vertical lifting of the wafer cassette. Together with the transverse mechanism 1, it can complete the complete action of "pick-up-transfer-placement". The lifting motion adopts the meshing transmission of gear 28 and rack 25. This is a transmission method with high rigidity, large load-bearing capacity and high efficiency. It is especially suitable for vertical movement that needs to bear the weight of the wafer cassette. Compared with the traditional lead screw lifting, it generates less heat at high speed, has a longer lifespan, and has almost no backlash. It ensures the absolute stability of the lifting plate 22 during lifting and after positioning, and effectively prevents the platform 23 and the wafer cassette on it from shaking. The combination of positioning pin 26 and photoelectric sensor 27 ensures the installation accuracy of the wafer cassette through mechanical positioning and realizes electrical detection through the sensor, providing dual protection for the reliability of the transfer process and avoiding wafer damage caused by position deviation.

[0023] This utility model discloses a wafer cassette transfer mechanism, comprising a transverse transfer mechanism 1 and a lifting mechanism 2. The transverse transfer mechanism 1 adopts a multi-layer drive structure with a two-stage sliding plate 13, which enables high-precision and high-speed drive, has higher stability, and offers a more flexible and space-saving layout. It abandons the continuous operation CV mode and implements strict "point-to-point" motion control, achieving a perfect S-shaped acceleration and deceleration curve, smoothly accelerating to the target speed and then smoothly decelerating to zero, thus eliminating the impact and vibration caused by rigid start-stop. Furthermore, the drive mechanism primarily uses meshing transmission, reducing dust particles generated during operation and helping to ensure product cleanliness, thereby ensuring the final product quality. Simultaneously, it employs dual positioning detection using a mechanical positioning pin 26 and a photoelectric sensor 27 to ensure the stability and reliability of the wafer cassette transfer process.

[0024] Reference Figure 2 , Figure 3 and Figure 4As shown, the substrate 11 is further provided with two first slide rails extending along its length direction. The first-stage sliding plate 12 is slidably connected to the first slide rails by the first slider. The first drive source 14 is mounted on the substrate 11 parallel to the first slide rails and located between the two first slide rails. The first drive source 14 is a rodless motor.

[0025] Furthermore, two guide rails 121 are symmetrically arranged on the first sliding plate 12, located on opposite sides of the two first slide rails. Each guide rail 121 includes a guide groove parallel to the first slide rail. On the opposite sides of the two first slide rails, multiple sets of guide wheel assemblies 18 are arranged at intervals parallel to their length direction. Each guide wheel assembly 18 includes two connecting seats 181 connected in parallel to the base plate 11. A guide wheel 182 is rotatably connected to each of the two connecting seats 181, and the guide wheel 182 is rolled in connection with its adjacent guide groove. Specifically, the first-stage sliding plate 12 moves to a suspended state during operation. Therefore, based on the guide structure of the slide rail and slider, a guide wheel assembly 18 is set to further support and guide the first-stage sliding plate 12, effectively offsetting the overturning moment generated by the suspension or motion acceleration of the first-stage sliding plate 12, preventing the plate from "tilting" or twisting. Furthermore, the multi-point support greatly enhances the rigidity of the entire moving component, making its deformation minimal when starting and stopping at high speeds or carrying heavy loads. At the same time, it converts sliding friction into rolling friction, reducing motion resistance, making the operation more stable and smooth, and reducing vibration and noise.

[0026] Furthermore, the primary sliding plate 12 is provided with two second slide rails extending along its length. The secondary sliding plate 13 is slidably connected to the second slide rails via a second slider. A mounting base is provided on the secondary sliding plate 13, and the second drive source 15 is mounted on the mounting base. Two tensioning pulleys 19 are symmetrically arranged on the mounting base, located on either side of the synchronous pulley 17 mounted at the output end of the second drive source 15. The synchronous belt passes sequentially around one tensioning pulley 19, the synchronous pulley 17, and the other tensioning pulley 19. It is conceivable that the tensioning pulleys 19 allow for tight meshing between the synchronous pulley 17 and the synchronous belt 16, which is beneficial for transmission accuracy.

[0027] Furthermore, it includes clamping seats, and two clamping seats are provided. The two clamping seats are symmetrically arranged on the primary sliding plate 12 along the sliding direction parallel to the secondary sliding plate 13. The two ends of the synchronous belt 16 are respectively connected to the two clamping seats.

[0028] Furthermore, a plurality of first sensors are provided on one side of the substrate 11, arranged at intervals along the sliding direction of the first-stage sliding plate 12, and a first sensing element for being sensed by the first sensors is provided on one side of the first-stage sliding plate 12.

[0029] Furthermore, the primary sliding plate 12 is provided with a plurality of second sensors arranged at intervals along the sliding direction of the secondary sliding plate 13, and a second sensing element for being sensed by the second sensors is provided on one side of the secondary sliding plate 13.

[0030] Furthermore, a connecting plate is provided on the secondary sliding plate 13, and multiple third sensors are arranged at intervals in the sliding direction parallel to the lifting plate 22 on the connecting plate. A third sensing element is provided on one side of the lifting plate 22 for being sensed by the third sensors. Specifically, this mechanism is provided with a first sensor (detecting the position of the primary sliding plate 12), a second sensor (detecting the position of the secondary sliding plate 13), and a third sensor (detecting the height of the lifting plate 22). This hierarchical detection method realizes full-process monitoring of the movement of the transfer mechanism. Through the precise detection of these sensors and sensing elements, precise control of the movement of each component of the transfer mechanism is achieved. It is conceivable that the multiple sensors arranged at intervals can not only be used for protection of extreme positions, but also realize multi-point position feedback (such as intermediate deceleration points, predetermined positions, and precise positions), and cooperate with the drive source to form a full closed-loop or semi-closed-loop control. This allows the control system to monitor the position status in real time. Once a deviation or overtravel is detected, it can be corrected or stopped immediately, which greatly improves the reliability and safety of the movement and ensures that the wafer cassette can be accurately and repeatedly transferred to the target position.

[0031] Reference Figure 5 As shown, furthermore, three positioning pins 26 are arranged in a triangle on the platform 23, and three photoelectric sensors 27 are also arranged in a triangle on the platform 23. Specifically, the positioning pins 26 cooperate with the positioning holes on the bottom of the product to position the product and prevent the box from falling or shifting; the photoelectric sensors 27 can further sense whether the product is in place. Specifically, the three positioning pins 26 are arranged in a triangle, utilizing the geometric principle of "three points determine a plane" to achieve precise positioning. The three photoelectric sensors 27 are also arranged in a triangle, cooperating with the positioning pins 26 to detect whether the wafer box has completely fallen into the positioning pins 26, or whether there are any abnormal states such as tilting or shifting, ensuring the safety of the transfer operation.

[0032] Example 2: This utility model also discloses a production line, including the wafer cassette transfer mechanism as in Example 1.

[0033] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the protection scope of this invention.

Claims

1. A wafer cassette transfer mechanism, characterized in that: include, A lateral movement mechanism includes a base plate, a primary sliding plate, a secondary sliding plate, a first drive source, a second drive source, and a synchronous belt. The primary sliding plate is slidably connected to and parallel to the base plate. The first drive source is disposed on the base plate to drive the primary sliding plate to slide. The secondary sliding plate is slidably connected to and parallel to the primary sliding plate. The synchronous belt is disposed on the primary sliding plate parallel to the sliding direction of the secondary sliding plate. The second drive source is mounted on the secondary sliding plate and engages with the synchronous belt through a synchronous pulley. The lifting mechanism includes a base, a lifting plate, a platform, a third drive source, a rack, positioning pins, and photoelectric sensors. The base is mounted on the secondary sliding plate, and the lifting plate is slidably connected to the base in a direction perpendicular to the secondary sliding plate. A rack extending parallel to the sliding direction is mounted on one side of the lifting plate. The third drive source is mounted on the secondary sliding plate, and its output end meshes with the rack via gears. The platform is disposed on the lifting plate, and multiple positioning pins and multiple photoelectric sensors are disposed on the platform.

2. The wafer cassette transfer mechanism according to claim 1, characterized in that: The substrate is provided with two first slide rails extending along their length direction. The first-stage sliding plate is slidably connected to the first slide rails by a first slider. The first driving source is mounted on the substrate parallel to the first slide rails and located between the two first slide rails.

3. The wafer cassette transfer mechanism according to claim 2, characterized in that: The primary sliding plate is symmetrically provided with two guide rails located on opposite sides of the two first slide rails. Each guide rail includes a guide groove parallel to the first slide rail. On the opposite side of the two first slide rails, multiple sets of guide wheel assemblies are arranged at intervals along a direction parallel to their length. Each guide wheel assembly includes two connecting seats connected side by side to the base plate. A guide wheel is rotatably connected to each of the two connecting seats, and the guide wheel is in rolling connection with the guide groove it is close to.

4. The wafer cassette transfer mechanism according to claim 1, characterized in that: The primary sliding plate is provided with two second slide rails extending along its length. The secondary sliding plate is slidably connected to the second slide rails via a second slider. The secondary sliding plate is provided with a mounting base. The second drive source is mounted on the mounting base. The mounting base is symmetrically provided with two tensioning pulleys located on both sides of the output end of the second drive source. The synchronous belt passes around one tensioning pulley, the synchronous pulley, and the other tensioning pulley in sequence.

5. The wafer cassette transfer mechanism according to claim 1, characterized in that: The device includes two clamping seats, which are symmetrically arranged on the primary sliding plate along a sliding direction parallel to the secondary sliding plate. The two ends of the synchronous belt are respectively connected to the two clamping seats.

6. The wafer cassette transfer mechanism according to claim 1, characterized in that: A plurality of first sensors are arranged at intervals along the sliding direction of the first-stage sliding plate on one side of the substrate, and a first sensing element for being sensed by the first sensors is provided on one side of the first-stage sliding plate.

7. The wafer cassette transfer mechanism according to claim 1, characterized in that: The primary sliding plate is provided with a plurality of second sensors arranged at intervals along the sliding direction of the secondary sliding plate, and a second sensing element for being sensed by the second sensors is provided on one side of the secondary sliding plate.

8. The wafer cassette transfer mechanism according to claim 1, characterized in that: A connecting plate is provided on the secondary sliding plate, and a plurality of third sensors are arranged at intervals in the sliding direction parallel to the lifting plate on the connecting plate. A third sensing element for being sensed by the third sensors is provided on one side of the lifting plate.

9. The wafer cassette transfer mechanism according to claim 1, characterized in that: The positioning pins are arranged in a triangle on the platform, and the photoelectric sensors are also arranged in a triangle on the platform.

10. A production line, characterized in that: Includes the wafer cassette transfer mechanism as described in any one of claims 1-9.

Images