An IC bonding machine feeding device for crystal oscillator processing

Abstract

The utility model discloses a kind of IC binding machine feeding devices for crystal oscillator processing, belong to feeding device technical field, and it includes: conveying mechanism, it includes conveying belt and several reverse buffering parts, conveying belt is provided with several connecting grooves, and several reverse buffering parts are located in connecting groove;And material taking mechanism, it is located conveying mechanism side, material taking mechanism is connected on first linear module, first linear module is connected on sliding block, and sliding block is movably connected on support frame.The utility model solves when chip size is reduced to millimeter level even sub-millimeter level, the contact area of suction nozzle and chip is greatly reduced, leading to vacuum suction force presents square level attenuation, because suction force distribution is uneven, local air leakage or suction angle deviation often occurs, leading to the problem of low feeding success rate.

Description

Technical Field

[0001] This utility model belongs to the technical field of feeding devices, and in particular relates to a feeding device for an IC bonding machine for crystal oscillator processing. Background Technology

[0002] An IC bonding machine is an electronic industrial device used to precisely position and bond IC chips to LCD glass. It features high precision, automation, and integration, and is widely used in the manufacturing of liquid crystal display modules.

[0003] In the automated chip feeding production process, the traditional suction nozzle method is widely used due to its simple structure and flexible operation. However, in the face of the current trend of chip miniaturization and high integration, its limitations are becoming increasingly prominent. When the chip size is reduced to the millimeter or even sub-millimeter level (such as 0201, 01005 and other package specifications), the contact area between the nozzle and the chip is greatly reduced, resulting in a quadratic decrease in vacuum adsorption force. Due to uneven suction force distribution, local air leakage or adsorption angle deviation often occurs, resulting in a feeding success rate of less than 70%. Utility Model Content

[0004] The purpose of this invention is to provide a feeding device for an IC bonding machine used in crystal oscillator processing, which addresses the problem that when chip size is reduced to the millimeter or even sub-millimeter level, the contact area between the nozzle and the chip is greatly reduced, resulting in a quadratic decrease in vacuum adsorption force. Due to uneven suction force distribution, local air leakage or adsorption angle deviation often occurs, leading to a feeding success rate of less than 70%.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: A feeding device for an IC bonding machine used in crystal oscillator processing includes:

[0006] The conveying mechanism includes a conveyor belt and several reverse buffers. Several connecting grooves are provided on the conveyor belt, and several reverse buffers are located in the connecting grooves.

[0007] The material handling mechanism is located on one side of the conveying mechanism. The material handling mechanism is connected to the first linear module, which is connected to the slider. The slider is movably connected to the support frame.

[0008] Furthermore, the aforementioned material handling mechanism includes a connecting plate, a drive cylinder, a mounting plate, and several suction nozzles. The connecting plate is slidably connected to the first linear module, the drive cylinder is connected to the connecting plate, the mounting plate is connected to the drive cylinder, several telescopic cylinders are provided at the bottom of the mounting plate, the telescopic cylinders are connected to the fixed plate, and several suction nozzles are connected to the fixed plate.

[0009] Furthermore, the aforementioned reverse buffers are arranged in a matrix.

[0010] Furthermore, a second linear module is provided on the aforementioned support frame, and a slider is slidably connected to the second linear module.

[0011] Furthermore, the aforementioned reverse buffer includes several springs and a limiting plate, with the springs located in the connecting groove and the limiting plate connected to the springs.

[0012] Furthermore, both the aforementioned fixing plate and connecting plate have L-shaped cross-sections.

[0013] Furthermore, the aforementioned conveyor belt is fitted onto the connecting shaft, which is connected to the support plate, and the drive motor passes through the support plate and is connected to the connecting shaft.

[0014] The present invention provides a feeding device for an IC bonding machine for crystal oscillator processing. By setting a reverse buffer on the conveyor belt, the reverse buffer includes a spring and a limiting plate. When the suction nozzle picks up the chip, the spring applies a reaction force to the limiting plate, making the chip fit more evenly with the suction nozzle. This ensures that the suction nozzle can accurately pick up the chip for feeding, thereby improving the feeding accuracy and feeding success rate.

[0015] Therefore, this embodiment has the following advantages compared to the prior art:

[0016] A feeding device for IC bonding machine in crystal oscillator processing solves the problem that when the chip size is reduced to the millimeter or even sub-millimeter level, the contact area between the nozzle and the chip is greatly reduced, resulting in a quadratic decrease in vacuum adsorption force. Due to uneven suction force distribution, local air leakage or adsorption angle deviation often occurs, resulting in a feeding success rate of less than 70%. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 A three-dimensional feeding device for an IC bonding machine used in crystal oscillator processing Figure 1 .

[0019] Figure 2 A three-dimensional feeding device for an IC bonding machine used in crystal oscillator processing Figure 2 .

[0020] Figure 3 A three-dimensional feeding device for an IC bonding machine used in crystal oscillator processing Figure 3 .

[0021] Figure 4This is a schematic diagram of the reverse buffer component in the feeding device of an IC bonding machine for crystal oscillator processing.

[0022] Legend:

[0023] 1-Conveying mechanism; 11-Conveyor belt; 12-Reverse buffer; 121-Spring; 122-Limiting plate; 2-Connecting groove; 3-Material handling mechanism; 31-Connecting plate; 32-Drive cylinder; 33-Mounting plate; 34-Suction nozzle; 4-First linear module; 5-Slider; 6-Support frame; 7-Telescopic cylinder; 8-Second linear module; 9-Connecting shaft; 10-Support plate; 13-Drive motor; 14-Fixing plate. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0025] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0026] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0027] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0028] In the description of the embodiments of this utility model, it should be noted that the terms "upper" and "inner" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the utility model product is usually placed when in use. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0029] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0030] Please see Figure 1-4 This utility model provides a technical solution: a feeding device for an IC bonding machine used in crystal oscillator processing, comprising:

[0031] The conveying mechanism 1 includes a conveyor belt 11 and a plurality of reverse buffers 12. The conveyor belt 11 is provided with a plurality of connecting grooves 2, and the plurality of reverse buffers 12 are located in the connecting grooves 2.

[0032] The material handling mechanism 3 is located on one side of the conveying mechanism 1. The material handling mechanism 3 is connected to the first linear module 4, which is connected to the slider 5. The slider 5 is movably connected to the support frame 6.

[0033] Specifically, see Figure 1-4 The material handling mechanism 3 includes a connecting plate 31, a driving cylinder 32, a mounting plate 33, and several suction nozzles 34. The connecting plate 31 is slidably connected to the first linear module 4. The driving cylinder 32 is connected to the connecting plate 31, and the mounting plate 33 is connected to the driving cylinder 32. Several telescopic cylinders 7 are provided at the bottom of the mounting plate 33, and the telescopic cylinders 7 are connected to a fixed plate 14. The suction nozzles 34 are connected to the fixed plate 14. This facilitates adjustment of the suction nozzle position, thereby enabling precise picking up of chips from the conveyor belt.

[0034] Specifically, see Figure 1-4 The reverse buffers 12 are arranged in a matrix.

[0035] The present invention provides a feeding device for an IC bonding machine for crystal oscillator processing. By setting a reverse buffer on the conveyor belt, the reverse buffer includes a spring and a limiting plate. When the suction nozzle picks up the chip, the spring applies a reaction force to the limiting plate, making the chip fit more evenly with the suction nozzle. This ensures that the suction nozzle can accurately pick up the chip for feeding, thereby improving the feeding accuracy and feeding success rate.

[0036] Therefore, this embodiment has the following advantages compared to the prior art:

[0037] A feeding device for IC bonding machine in crystal oscillator processing solves the problem that when the chip size is reduced to the millimeter or even sub-millimeter level, the contact area between the nozzle and the chip is greatly reduced, resulting in a quadratic decrease in vacuum adsorption force. Due to uneven suction force distribution, local air leakage or adsorption angle deviation often occurs, resulting in a feeding success rate of less than 70%.

[0038] Example 2:

[0039] See Figure 1-4 The figure shows a feeding device for an IC bonding machine for crystal oscillator processing provided in Embodiment 2 of this utility model. Based on the above embodiments, this embodiment further improves upon the following technical solution: a second linear module 8 is provided on the support frame 6, and the slider 5 is slidably connected to the second linear module 8. This facilitates the picking mechanism in picking up the chip and sending it to another workstation.

[0040] Example 3:

[0041] See Figure 1-4 The figure shows a feeding device for an IC bonding machine for crystal oscillator processing provided in Embodiment 3 of this utility model. Based on the above embodiments, this embodiment further makes the following improved technical solutions: The reverse buffer 12 includes a plurality of springs 121 and a limiting plate 122. The plurality of springs 121 are located in the connecting groove 2, and the limiting plate 122 is connected to the plurality of springs 121.

[0042] Example 4:

[0043] See Figure 1-4 The figure shows a feeding device for an IC bonding machine for crystal oscillator processing provided in Embodiment 3 of this utility model. Based on the above embodiments, the following technical solutions are further improved: the fixed plate 14 and the connecting plate 31 are both L-shaped in cross section.

[0044] Example 5:

[0045] See Figure 1-4The figure shows a feeding device for an IC bonding machine for crystal oscillator processing provided in Embodiment 3 of this utility model. Based on the above embodiments, this embodiment further makes the following improved technical solutions: the conveyor belt 11 is sleeved on the connecting shaft 9, the connecting shaft 9 is connected to the support plate 10, and the drive motor 13 passes through the support plate 10 and is connected to the connecting shaft 9.

[0046] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A feeding device for an IC bonding machine used in crystal oscillator processing, characterized in that, include: The conveying mechanism (1) includes a conveyor belt (11) and a plurality of reverse buffers (12). The conveyor belt (11) is provided with a plurality of connecting grooves (2), and the plurality of reverse buffers (12) are located in the connecting grooves (2). The material handling mechanism (3) is located on one side of the conveying mechanism (1). The material handling mechanism (3) is connected to the first linear module (4), which is connected to the slider (5). The slider (5) is movably connected to the support frame (6).

2. The IC bonding machine feeding device for crystal oscillator processing according to claim 1, characterized in that, The material handling mechanism (3) includes a connecting plate (31), a driving cylinder (32), a mounting plate (33), and several suction nozzles (34). The connecting plate (31) is slidably connected to the first linear module (4). The driving cylinder (32) is connected to the connecting plate (31). The mounting plate (33) is connected to the driving cylinder (32). Several telescopic cylinders (7) are provided at the bottom of the mounting plate (33). The telescopic cylinders (7) are connected to the fixed plate (14). Several suction nozzles (34) are connected to the fixed plate (14).

3. The IC bonding machine feeding device for crystal oscillator processing according to claim 1, characterized in that, Several of the reverse buffers (12) are arranged in a matrix.

4. The IC bonding machine feeding device for crystal oscillator processing according to claim 1, characterized in that, The support frame (6) is provided with a second linear module (8), and the slider (5) is slidably connected to the second linear module (8).

5. The IC bonding machine feeding device for crystal oscillator processing according to claim 1, characterized in that, The reverse buffer (12) includes a plurality of springs (121) and a limiting plate (122). The plurality of springs (121) are located in the connecting groove (2), and the limiting plate (122) is connected to the plurality of springs (121).

6. The IC bonding machine feeding device for crystal oscillator processing according to claim 2, characterized in that, Both the fixing plate (14) and the connecting plate (31) have L-shaped cross sections.

7. The IC bonding machine feeding device for crystal oscillator processing according to claim 1, characterized in that, The conveyor belt (11) is fitted on the connecting shaft (9), which is connected to the support plate (10). The drive motor (13) passes through the support plate (10) and is connected to the connecting shaft (9).

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