A tool for TO-can flip

Abstract

The application relates to the technical field of TO die bonding tools, in particular to a tool for overturning a TO base, which comprises a base, a rotating part rotatably mounted on the base, the rotating part being provided with a mounting structure for mounting one or more TO bases; the rotating part has a base mounting position and a chip mounting position in a rotating stroke; the rotating part can be used for mounting a TO base when being in the base mounting position, and can be used for mounting a chip when being in the chip mounting position; a position locking structure is arranged on the base and used for locking the rotating part when the rotating part moves to the base mounting position and the chip mounting position; through the tool, a mounting surface on the TO base for mounting a chip can be overturned, so that a die bonding device can mount the chip on the mounting surface from top to bottom.

Description

Technical Field

[0001] This application relates to the field of tools for TO die bonding, and more specifically to a tool for flipping a TO substrate. Background Technology

[0002] TO (Transistor Outline) die bonding is a crucial process in semiconductor packaging, precisely fixing chips onto a TO (Transistor Outline) substrate (also called a TO socket). One feasible mounting method involves using tungsten copper pillars on the TO substrate, with one side plane of the pillar forming the mounting surface for chip fixation. Traditional die bonding equipment mounts chips from top to bottom. If the aforementioned TO substrate is directly mounted on the worktable of a traditional die bonding equipment, the mounting surface for chip fixation will be vertical, making it impossible for the die bonding equipment to mount the chip from top to bottom onto this vertical mounting surface. Utility Model Content

[0003] This application provides a tool for flipping a TO substrate, enabling a die bonding device to mount a chip onto the TO substrate from top to bottom.

[0004] This application provides a tool for flipping a TO base, including: Base, the base being used for mounting on the worktable of the die bonding equipment; A rotating component is rotatably mounted on the base, and the rotating component has a mounting structure for mounting one or more TO bases; the rotating component has a base mounting position and a chip mounting position during its rotation stroke; the rotating component can be used to mount TO bases when it is in the base mounting position, and can be used to mount chips when it is in the chip mounting position. A positioning locking structure is provided on the base for locking the rotating component when it moves to the base mounting position and the chip mounting position.

[0005] In one embodiment, the positioning locking structure includes a first positioning stop structure, a second positioning stop structure, and a locking structure. The first positioning stop structure is used to stop the rotating member when it rotates to the base mounting position to prevent the rotating member from continuing to rotate. The second positioning stop structure is used to stop the rotating member when it rotates to the chip mounting position to prevent the rotating member from continuing to rotate. The locking structure is used to lock the rotating member at the base mounting position and the chip mounting position.

[0006] In one embodiment, the rotating member is provided with a stop groove, and the base is provided with a stop block extending into the stop groove. One side of the stop block constitutes a first positioning stop structure, which is used to stop and cooperate with one side of the groove wall of the stop groove. The other side of the stop block constitutes a second positioning stop structure, which is used to stop and cooperate with the other side of the groove wall of the stop groove.

[0007] In one embodiment, the locking structure is a top screw threaded onto the base.

[0008] In one embodiment, when the rotating member is in the chip mounting position, the mounting surface of the TO base mounted on the rotating member for mounting the chip is in a horizontal state.

[0009] In one embodiment, the mounting structure is a mounting groove. The rotating member has intersecting first and second side surfaces. The groove opening of the mounting groove is located on the first side surface. The first and second side surfaces are parallel to or coincide with the rotation axis of the rotating member. The first side surface has a first side line and a second side line spaced apart. The second side surface has a third side line and a fourth side line spaced apart. The first side line coincides with the third side line. The rotation axis of the rotating member is closer to the first side line and farther from the second side line, and closer to the third side line and farther from the fourth side line, so that the rotation axis of the rotating member is eccentrically set.

[0010] In one embodiment, the cross-section of the rotating member perpendicular to the rotation axis is fan-shaped or triangular.

[0011] In one embodiment, the mounting structure is a mounting slot for inserting the TO base, and the tool for flipping the TO base further includes a limiting structure disposed on the rotating member to prevent the TO base from falling out of the mounting slot.

[0012] In one embodiment, the limiting structure is a pressure plate rotatably mounted on the rotating member. The pressure plate has a blocking position and a clearance position during its rotational stroke. In the blocking position, the pressure plate blocks part of the groove opening of the mounting groove. In the clearance position, the pressure plate clears the groove opening of the mounting groove.

[0013] In one embodiment, a force-applying structure is provided between the pressure plate and the rotating member, the force-applying structure applying force to the pressure plate to keep the pressure plate in the blocked position.

[0014] According to the tool for flipping the TO base in the above embodiment, when performing TO die bonding, the tool for flipping the TO base can be installed on the die bonding equipment so that the rotating part is in the base mounting position. Then, the TO base is installed on the rotating part through the mounting structure. After that, the rotating part can be rotated to the chip mounting position to adjust the orientation of the mounting surface on the TO base for mounting the chip. In this way, the chip can be mounted from top to bottom on the mounting surface on the TO base for mounting the chip through the die bonding equipment. Attached Figure Description

[0015] Figure 1 This is an isometric view of a tool for flipping a TO base in some embodiments of this application; Figure 2 This is an exploded view of the structure of the tool used for flipping the TO base in some embodiments of this application; Figure 3 This is an axonometric view from another perspective of the tool used for flipping the TO base in some embodiments of this application; Figure 4 This is a schematic diagram of the rotating component of a tool for flipping a TO base in some embodiments of this application; Figure 5 A schematic diagram of a stop block provided on the base of a tool for flipping a TO base in some embodiments of this application; Figure 6 for Figure 4 Enlarged view of a portion of point A in the middle; Figure 7 This is a schematic diagram of the structure of the second rotating shaft of the tool used for flipping the TO base in some embodiments of this application; Figure 8 This is a schematic diagram of the pressure plate of the tool used for flipping the TO base in some embodiments of this application; Figure 9 This is a schematic diagram of the tightening screw of the tool used for flipping the TO base in some embodiments of this application.

[0016] List of feature names corresponding to the labels in the figure: 1. Base; 11. Base plate; 12. Mounting seat; 121. Mounting hole; 122. Threaded through hole; 13. Clearance groove; 2. Rotating component; 21. Mounting structure; 22. Stop groove; 221. First side groove wall; 222. Second side groove wall; 23. Tightening groove; 24. Countersunk hole; 25. Mounting groove; 26. First side surface; 261. First side edge line; 262. Second side edge line; 27. Second side surface; 271. Third side edge line; 272. Fourth side edge line; 28. Positioning groove; 29. ​​Groove; 3. Position locking structure; 31. Stop block; 311. First side; 312. Second side; 32. Tightening screw; 321. Threaded section; 322. Tightening section; 4. First rotating shaft; 5. Pressure plate; 51. Plate body; 52. Connecting arm; 521. Connecting hole; 53. Clearance hole; 6. Second rotating shaft; 61. Large diameter section; 62. Small diameter section; 63. Threaded hole; 7. Screws.

[0017] Explanation of reference numerals in parentheses in the accompanying drawings: The feature referred to by the reference numerals in parentheses in the accompanying drawings is the feature represented by both the number inside the parentheses and the number outside the parentheses. Detailed Implementation

[0018] The present application will now be described in further detail with reference to specific embodiments and accompanying drawings. Similar elements in different embodiments are referred to by related similar element reference numerals. In the following embodiments, many details are described to facilitate a better understanding of the present application. However, those skilled in the art will readily recognize that some features may be omitted in different situations, or may be replaced by other elements, materials, or methods. In some cases, certain operations related to the present application are not shown or described in the specification. This is to avoid obscuring the core parts of the present application with excessive description. For those skilled in the art, detailed description of these related operations is not necessary; they can fully understand the related operations based on the description in the specification and general technical knowledge in the art.

[0019] Furthermore, the features, operations, or characteristics described in the specification can be combined in any suitable manner to form various embodiments, and the operational steps involved in each embodiment can also be rearranged or adjusted in a manner that is obvious to those skilled in the art. Therefore, the specification and drawings are only for clearly describing a particular embodiment and do not imply that they represent the necessary components and / or order.

[0020] The serial numbers assigned to components in this document, such as "first" and "second," are used only to distinguish the described objects and have no sequential or technical meaning. The terms "connection" and "linkage" used in this application, unless otherwise specified, include both direct and indirect connections (linkages).

[0021] TO (Transistor Outline) die bonding involves using die bonding equipment to mount chips onto TO (Transistor Outline) substrates, also known as transistor housing substrates or TO sockets. Traditional TO substrates have a horizontal mounting surface for chip placement. Such substrates allow direct top-down chip mounting using the die bonding equipment. However, this requires a 45° lens. Another feasible solution is to incorporate tungsten copper pillars on the TO substrate, with the sides of these pillars forming a vertical mounting surface for chip placement. This eliminates the need for a 45° lens. Newer die bonding equipment for such TO substrates features a gripping and flipping mechanism. This mechanism grips and flips one TO substrate at a time, turning the vertical mounting surface horizontal to allow top-down chip mounting. However, traditional die bonding equipment lacks this gripping and flipping mechanism, making it unsuitable for mounting chips onto TO substrates with vertical mounting surfaces.

[0022] In response, this application provides a tool for flipping a TO substrate. This tool is used in conjunction with a die bonding device to flip the vertical mounting surface on the TO substrate into a horizontal surface, so that the die bonding device can mount the chip on the mounting surface from top to bottom.

[0023] Please refer to Figure 1 , Figure 2 and Figure 3 The tool for flipping the TO base includes a base 1 and a rotating component 2 rotatably mounted on the base 1. Rotational mounting means that the rotating component 2 is rotatably mounted on the base 1 about a defined rotation axis, so that the rotation direction of the rotating component 2 is defined.

[0024] In use, the base 1 is mounted on the worktable of the die bonding equipment. The die bonding equipment is existing technology, and its structure and operation will not be described in detail here. By mounting the base 1 on the worktable of the die bonding equipment, the tool for flipping the TO base is mounted on the die bonding equipment. Thus, the rotation of the rotating part 2 relative to the base 1 is actually the rotation of the rotating part 2 relative to the die bonding equipment.

[0025] The basic working principle of the tool for flipping the TO substrate in this application is to change the position of the mounting surface on the TO substrate for mounting the chip by rotating the rotating member 2 relative to the die bonding equipment. Therefore, a mounting structure 21 is provided on the rotating member 2, through which the TO substrate can be mounted on the rotating member 2, so that the rotating member 2 can rotate the TO substrate relative to the die bonding equipment. The rotating member 2 has a substrate mounting position and a chip mounting position in its rotation stroke. In the substrate mounting position, the TO substrate can be easily mounted on the rotating member 2. In the chip mounting position, the rotating member 2 flips the vertical mounting surface on the TO substrate for mounting the chip to a horizontal state, so that the die bonding equipment can mount the chip on the mounting surface of the TO substrate from top to bottom.

[0026] To ensure that the rotating component 2 can be accurately rotated to the base mounting position and the chip mounting position, please refer to... Figure 3 The base 1 is also provided with a positioning locking structure 3, which enables the rotating part 2 to rotate accurately to the base mounting position and the chip mounting position, and locks the rotating part 2 relative to the base 1 after the rotating part 2 rotates to the base mounting position and the chip mounting position, so that the rotating part 2 can reliably maintain its position in the base mounting position and the chip mounting position.

[0027] In some embodiments, the positioning locking structure 3 includes a first positioning stop structure, a second positioning stop structure, and a locking structure. The first positioning stop structure is used to stop the rotating member 2 when it rotates to the base mounting position, thereby preventing the rotating member 2 from continuing to rotate. The second positioning stop structure is used to stop the rotating member 2 when it rotates to the chip mounting position, thereby preventing the rotating member 2 from continuing to rotate. The locking structure is used to lock the rotating member 2 at both the base mounting position and the chip mounting position.

[0028] In some embodiments, please refer to Figure 3 , Figure 4 and Figure 5 The rotating component 2 is provided with a stop groove 22. The positioning locking structure 3 includes a stop block 31 disposed on the base 1. The stop block 31 extends into the stop groove 22. One side of the stop block 31, namely the first side 311, constitutes a first positioning stop structure, which is used to stop and cooperate with one side wall of the stop groove 22, namely the first side wall 221. The other side of the stop block 31, namely the second side 312, constitutes a second positioning stop structure, which is used to stop and cooperate with the other side wall of the stop groove 22, namely the second side wall 222. The stop groove 22 is an arc-shaped groove, and the first side wall 221 and the second side wall 222 are the groove walls at both ends in the length direction of the stop groove 22. In some other embodiments, the positioning locking structure 3 includes a stop groove 22 disposed on the base 1 and a stop block 31 disposed on the rotating component 2.

[0029] When the first side 311 engages with the first side groove wall 221, the rotating member 2 is in the base mounting position, allowing the TO base to be inserted into the rotating member 2 from top to bottom. When the second side 312 engages with the second side groove wall 222, the rotating member 2 is in the chip mounting position, ensuring that the mounting surface on the TO base is horizontal. In some embodiments, the rotating member 2 rotates 90° from the base mounting position to reach the chip mounting position.

[0030] For the locking structure, please refer to [reference needed] in some embodiments. Figure 3 The locking structure is a screw 32 threaded onto the base 1. To lock the rotating part 2 in place, the screw 32 is screwed into the rotating part 2, so that one end of the screw 32 facing the rotating part 2 presses against it, thus maintaining its position. To release the locking structure, the screw 32 is unscrewed relative to the rotating part 2. The rotating part 2 has an arc-shaped clamping groove 23. In the locked state, the end of the screw 32 extends into the clamping groove 23 and clamps against the rotating part 2.

[0031] In some other embodiments, the locking structure may also be a locking pin. Correspondingly, a through hole for inserting the locking pin is provided on the base 1, and a first locking hole and a second locking hole are provided on the rotating member 2. In the chip mounting position, the first locking hole is aligned with the through hole, and the locking pin in the through hole is also inserted into the first locking hole to lock the rotating member 2 in the chip mounting position. In the base mounting position, the second locking hole is aligned with the through hole, and the locking pin in the through hole is also inserted into the second locking hole to lock the rotating member 2 in the base mounting position.

[0032] Regarding the structure of the rotating component 2 and the mounting structure 21, please refer to some embodiments. Figure 2 and Figure 4 The end of the rotating part 2 has a countersunk hole 24, which is used to install the first rotating shaft 4. The rotating part 2 is rotatably mounted on the base 1 through the first rotating shaft 4, and the central axis of the countersunk hole 24 is the rotation axis of the rotating part 2.

[0033] The cross section of the vertical rotation axis of the rotating component 2 is fan-shaped. The mounting structure 21 is a mounting groove 25. The rotating component 2 has an intersecting first side 26 and a second side 27. The groove opening of the mounting groove 25 is located on the first side 26. The first side 26 and the second side 27 are both parallel to the rotation axis of the rotating component 2. In some other embodiments, the first side 26 and the second side 27 can both pass through the rotation axis of the rotating component 2 and be orthographically projected along the rotation axis of the rotating component 2. The lines formed by the projections of the first side 26 and the second side 27 respectively constitute the two radii of the fan shape.

[0034] The first side surface 26 has a first side line 261 and a second side line 262 spaced apart and opposite to each other. The second side surface 27 has a third side line 271 and a fourth side line 272 spaced apart and opposite to each other. The first side line 261 coincides with the third side line 271. The rotation axis of the rotating member 2 is closer to the first side line 261 and farther away from the second side line 262, and closer to the third side line 271 and farther away from the fourth side line 272, so that the rotation axis of the rotating member 2 is eccentrically set. When the first rotating shaft 4 and the stop groove 22 are also provided on the rotating member 2, the eccentric setting of the rotation axis can reduce the space occupied by the rotating member 2 when it rotates. The groove of the mounting groove 25 is provided on the first side surface 26 near the first side line 261. In some other embodiments, the cross section of the rotating member 2 perpendicular to its rotation axis can also be triangular.

[0035] To improve die bonding efficiency, in some embodiments, the mounting structure 21 includes multiple mounting slots 25, enabling the flipping and mounting of multiple TO substrates simultaneously. In some embodiments, the mounting structure 21 includes thirteen mounting slots 25. In other embodiments, the number of mounting slots 25 can be more than thirteen, and the multiple mounting slots 25 can be arranged in multiple rows, such as three rows with six mounting slots 25 in each row. Of course, the number of mounting slots 25 can also be less than thirteen, such as six or eight. The mounting structure 21 can also have only one mounting slot 25. Please refer to [reference needed]. Figure 6 To ensure that all TO bases face the same direction, the rotating part 2 is also provided with a positioning groove 28 that communicates with the mounting groove 25. By cooperating with the corresponding protrusion on the TO base, the positioning groove 28 can make the TO bases face the same direction.

[0036] Regarding the specific form of the mounting structure 21, in some other embodiments, the mounting structure 21 may also be a locking structure provided on the rotating member 2. The locking structure includes two opposing claws, with a space between the two claws for placing the TO base, and the TO base is locked onto the rotating member 2 by the two claws.

[0037] Since the TO base is inserted into the mounting slot 25, a limiting structure is also provided on the rotating component 2 to prevent the TO base from accidentally coming out of the mounting slot 25. In some embodiments, please refer to... Figure 1 , Figure 2 and Figure 3 The limiting structure is a pressure plate 5 rotatably mounted on the rotating part 2. The pressure plate 5 has a blocking position and a clearance position in its rotation stroke. In the blocking position, the pressure plate 5 blocks part of the groove opening of the mounting slot 25, constraining the TO base in the mounting slot 25. In the clearance position, the pressure plate 5 can clear the groove opening of the mounting slot 25 so that the TO base can be inserted into the mounting slot 25 or removed from the mounting slot 25 after the chip mounting is completed.

[0038] For the structure in which the pressure plate 5 is rotatably mounted on the rotating member 2, please refer to some embodiments. Figure 1 and Figure 3 The rotating part 2 has a groove 29, and a second rotating shaft 6 is rotatably mounted in the groove 29. Please refer to [reference needed]. Figure 7 The second rotating shaft 6 includes a large-diameter section 61 in the middle and small-diameter sections 62 at both ends. The second rotating shaft 6 is rotatably mounted on the rotating component 2 via the small-diameter sections 62 at both ends. The large-diameter section 61 is provided with threaded holes 63. Please refer to [reference needed]. Figure 8 The pressure plate 5 has a plate body 51 and a connecting arm 52 protruding relative to the plate body 51. The connecting arm 52 is provided with a connecting hole 521, in conjunction with a reference. Figure 1 and Figure 2 By screwing screw 7 through the connecting hole 521 and engaging it with the threaded hole 63, the pressure plate 5 is mounted on the second rotating shaft 6, thereby achieving the rotatable mounting of the pressure plate 5 on the rotating component 2. The plate body 51 has a clearance hole 53. In the blocked position, the clearance hole 53 is aligned with the mounting groove 25. The radial dimension of the clearance hole 53 is smaller than the radial dimension of the mounting groove 25. The pressure plate 5 passes through the hole of the clearance hole 53 to block the TO base, and the tungsten copper pillar on the TO base protrudes through the clearance hole 53.

[0039] To ensure that the pressure plate 5 can be reliably held in the blocking position and reliably constrain the TO base, in some embodiments, a force-applying structure exists between the pressure plate 5 and the rotating member 2. This force-applying structure applies force to the pressure plate 5 to reliably hold it in the blocking position. In some embodiments, a magnetic attraction structure exists between the pressure plate 5 and the rotating member 2. This magnetic attraction structure constitutes the force-applying structure, and the pressure plate 5 is reliably held in the blocking position by magnetic attraction. Regarding the specific arrangement of the magnetic attraction structure, a magnet can be embedded in the rotating member 2, and the pressure plate 5 can be made of a material that can be magnetically attracted. Alternatively, a magnet can be provided on the pressure plate 5, and the rotating member 2 can be made of a material that can be magnetically attracted. Of course, based on the structure in which the pressure plate 5 is rotatably mounted on the rotating member 2, the force-applying structure can also be a torsion spring mounted on the second rotating shaft 6. One end of the torsion spring abuts against the rotating member 2, and the other end abuts against the pressure plate 5. The torsion spring applies force to the pressure plate 5, pressing the pressure plate 5 tightly against the rotating member 2.

[0040] For the specific structure of base 1, please refer to... Figure 5 The base 1 includes a base plate 11 with a certain length. Two mounting seats 12 are provided at both ends of the base plate 11. An avoidance groove 13 is provided on the base plate 11 between the two mounting seats 12 to prevent interference with other structures around the base plate 11.

[0041] Each mounting base 12 is provided with a mounting hole 121 and a threaded through hole 122. The end of the first rotating shaft 4 away from the rotating component 2 is located in the mounting hole 121, enabling the rotating component 2 to be rotated on the base 1. A tightening screw 32 is screwed into the threaded through hole 122. Please refer to... Figure 9 The tightening screw 32 includes two sections. One section is a threaded section 321, through which the tightening screw 32 is screwed into the threaded through hole 122. The other section is a screwing section 322, which has a larger diameter and a pattern on its outer circumference to increase the roughness of the outer circumference of the screwing section 322, so that the operator can directly screw the tightening screw 32 through the screwing section 322.

[0042] The tool for flipping the TO base in this application is used in conjunction with a die bonding device. In use, the tool is mounted on the worktable of the die bonding device via the base 1. The rotating component 2 is rotated to the base mounting position, and the rotating component 2 is locked in the base mounting position by the tightening screw 32. The pressure plate 5 is then rotated to the clearance position. At this time, the slot of the mounting groove 25 faces upwards, and the TO base can be clamped by the mechanism of the die bonding device and inserted into the mounting groove 25 from top to bottom. Alternatively, the TO base can be manually inserted into the mounting groove 25. After the TO base is installed in place, the pressure plate 5 is rotated to the blocking position, and the tightening screw 32 is loosened. The rotating component 2 is then rotated to the chip mounting position. After setting, tighten the top screw 32 to lock the rotating part 2 in the chip mounting position. In the chip mounting position, the mounting surfaces of each TO base for chip mounting are horizontal, so that the die bonding equipment can mount the chip on the mounting surface of the TO base from top to bottom. In this way, the traditional die bonding equipment that cannot flip the TO base can be utilized. Of course, this tool for flipping the TO base can also be used with the die bonding equipment that can flip the TO base. However, it is no longer necessary to flip the TO base one by one to mount the chip through the die bonding equipment. Multiple TO bases can be loaded at one time and flipped as a whole to mount the chip, which improves the die bonding efficiency.

[0043] The above examples illustrate this application only to aid understanding and are not intended to limit its scope. Those skilled in the art to which this application pertains can make various simple deductions, modifications, or substitutions based on the ideas presented.

Claims

1. A tool for flipping a TO base, characterized in that, include: Base, the base being used for mounting on the worktable of the die bonding equipment; A rotating component is rotatably mounted on the base, and the rotating component has a mounting structure for mounting one or more TO bases; the rotating component has a base mounting position and a chip mounting position during its rotation stroke; the rotating component can be used to mount TO bases when it is in the base mounting position, and can be used to mount chips when it is in the chip mounting position. A positioning locking structure is provided on the base for locking the rotating component when it moves to the base mounting position and the chip mounting position.

2. The tool for flipping a TO base as described in claim 1, characterized in that, The positioning locking structure includes a first positioning stop structure, a second positioning stop structure, and a locking structure. The first positioning stop structure is used to stop the rotating component when it rotates to the base mounting position to prevent the rotating component from continuing to rotate. The second positioning stop structure is used to stop the rotating component when it rotates to the chip mounting position to prevent the rotating component from continuing to rotate. The locking structure is used to lock the rotating component at the base mounting position and the chip mounting position.

3. The tool for flipping a TO base as described in claim 2, characterized in that, The rotating component is provided with a stop groove, and the base is provided with a stop block extending into the stop groove. One side of the stop block constitutes the first positioning stop structure, which is used to stop and cooperate with one side of the groove wall of the stop groove. The other side of the stop block constitutes the second positioning stop structure, which is used to stop and cooperate with the other side of the groove wall of the stop groove.

4. The tool for flipping a TO base as described in claim 2, characterized in that, The locking structure is a screw threaded onto the base.

5. The tool for flipping a TO base as described in claim 1, characterized in that, When the rotating component is in the chip mounting position, it enables the mounting surface of the TO base mounted on the rotating component for mounting the chip to be in a horizontal state.

6. The tool for flipping a TO base as described in any one of claims 1-5, characterized in that, The mounting structure is a mounting groove. The rotating component has intersecting first and second side surfaces. The groove opening of the mounting groove is located on the first side surface. The first and second side surfaces are parallel to or coincide with the rotation axis of the rotating component. The first side surface has a first side line and a second side line spaced apart. The second side surface has a third side line and a fourth side line spaced apart. The first side line coincides with the third side line. The rotation axis of the rotating component is closer to the first side line and farther from the second side line, and closer to the third side line and farther from the fourth side line, so that the rotation axis of the rotating component is eccentrically set.

7. The tool for flipping a TO base as described in claim 6, characterized in that, The cross-section of the rotating component perpendicular to the axis of rotation is either fan-shaped or triangular.

8. The tool for flipping a TO base as described in any one of claims 1-5, characterized in that, The mounting structure is a mounting slot for inserting the TO base. The tool for flipping the TO base also includes a limiting structure, which is disposed on the rotating member to prevent the TO base from coming out of the mounting slot.

9. The tool for flipping a TO base as described in claim 8, characterized in that, The limiting structure is a pressure plate rotatably mounted on the rotating component. The pressure plate has a blocking position and a clearance position during its rotational stroke. In the blocking position, the pressure plate blocks part of the groove opening of the mounting slot. In the clearance position, the pressure plate clears the groove opening of the mounting slot.

10. The tool for flipping a TO base as described in claim 9, characterized in that, There is a force-applying structure between the pressure plate and the rotating member, and the force-applying structure applies force to the pressure plate so that the pressure plate is held in the blocking position.

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