Wafer cassette gripping mechanism

Abstract

The utility model relates to wafer production equipment technical field, the technical problem that the utility model solves is low efficiency, great labor intensity. In order to solve the above technical problem, the utility model provides a wafer box clamping mechanism. The utility model includes: swing subassembly, including swing arm, clamping subassembly, including clamping main part, clamping power part, two clamping claws and two clamping pieces, the other end of clamping main part with swing arm swing connection, clamping power part with clamping main part is connected, the output of clamping power part with two clamping claws is connected, is used for driving two clamping claws reverse movement, clamping claw with clamping piece is connected, the inside of the bottom of clamping piece is equipped with C type groove, C type groove with product top flange cooperation, wherein, one end of swing arm with clamping main part of clamping subassembly swing connection. The utility model clamps more firmly, avoids wafer box to drop, improves efficiency, reduces labor intensity.

Description

Technical Field

[0001] This utility model relates to the field of wafer manufacturing equipment technology, and in particular to a wafer box clamping mechanism. Background Technology

[0002] In semiconductor manufacturing, wafer transport is crucial. To minimize wafer contamination during transport between different processes, various standard transport containers are used in production, such as front-opening unified pods (FOUPs).

[0003] During the production process, wafer cells need to be handled. In existing technologies, manual handling is often used, which is inefficient and labor-intensive. Utility Model Content

[0004] Therefore, the technical problem to be solved by this utility model is to overcome the above-mentioned problems existing in the prior art.

[0005] To solve the above-mentioned technical problems, this utility model provides a wafer cassette gripping mechanism, comprising:

[0006] Oscillating components, including a swing arm;

[0007] The clamping assembly includes a clamping body, a clamping power unit, two grippers, and two clamping parts; the clamping body is movably connected to the other end of the swing arm; the clamping power unit is connected to the clamping body; the output end of the clamping power unit is connected to the two grippers for driving the two grippers to move in opposite directions; the grippers are connected to the clamping parts; the bottom inner side of the clamping parts is provided with a C-shaped groove; the C-shaped groove mates with the flange on the top of the product.

[0008] One end of the swing arm is movably connected to the gripping body of the gripping assembly.

[0009] In one embodiment of this utility model, a roller is rotatably connected to the clamping member.

[0010] In one embodiment of this utility model, the surface of the roller is provided with a soft pad.

[0011] In one embodiment of this utility model, the clamping component is equipped with a sensor for determining whether to clamp a wafer cassette.

[0012] In one embodiment of this utility model, the length of the clamping component is greater than the length of the flange.

[0013] In one embodiment of the present invention, the clamping component includes a first connecting plate, a second connecting plate, and two end plates; the first connecting plate and the second connecting plate are arranged in parallel and staggered vertically; the ends of the first connecting plate and the second connecting plate are connected by the end plates; the bottom of the end plates is provided with a bearing portion; the lower surface of the first connecting plate, the inner surface of the second connecting plate, and the upper surface of the bearing portion form a C-shaped groove.

[0014] In one embodiment of this utility model, the clamping body includes a main connecting plate and two connecting ears; the two connecting ears are symmetrically arranged on both sides of the main connecting plate; the connecting ears are rotatably connected to the swing arm.

[0015] In one embodiment of the present invention, the swing assembly further includes a swing power unit; the output end of the swing power unit is connected to the other end of the swing arm.

[0016] The above-mentioned technical solution of this utility model has the following advantages compared with the prior art:

[0017] The wafer cassette gripping mechanism of this invention utilizes a swing component to change the three-dimensional coordinate position of the entire gripping mechanism, thereby facilitating the movement of the wafer cassette from the previous process to the target position for turnover. This results in a more compact and simpler structure. Furthermore, this invention uses two grippers moving in opposite directions to clamp the flat flange, facilitating gripping while minimizing damage to the wafer cassette. Additionally, this invention includes a C-groove that mates with the flange, further ensuring a more secure grip and preventing the wafer cassette from falling during the swinging process. Therefore, using this invention for wafer cassette gripping provides a more reliable grip, prevents wafer cassette drops, enhances safety and convenience, improves efficiency, reduces labor intensity, and lowers costs. Attached Figure Description

[0018] To make the content of this utility model easier to understand, the present utility model will be further described in detail below with reference to specific embodiments and accompanying drawings, wherein:

[0019] Figure 1 This is a schematic diagram of the structure of a wafer cassette gripping mechanism in a preferred embodiment of the present invention;

[0020] Figure 2 yes Figure 1 The diagram shows the structure of the clamping component in the wafer cassette clamping mechanism.

[0021] Explanation of reference numerals in the instruction manual:

[0022] 100. Swing assembly; 110. Swing arm;

[0023] 200. Clamping assembly; 210. Clamping body; 211. Main connecting plate; 212. Connecting ear; 220. Clamping power unit; 230. Gripper; 240. Clamping component; 241. C-groove; 242. Roller; 243. First connecting plate; 244. Second connecting plate; 245. End plate; 246. Bearing unit;

[0024] 300. Wafer box; 310. Flange. Detailed Implementation

[0025] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, so that those skilled in the art can better understand and implement the present invention. However, the embodiments are not intended to limit the present invention.

[0026] Reference Figures 1-2 As shown, this embodiment of the present invention provides a wafer cassette gripping mechanism, comprising:

[0027] The swing assembly 100 includes a swing power unit and a swing arm 110, with the output end of the swing power unit connected to one end of the swing arm 110.

[0028] The clamping assembly 200 includes a clamping body 210, a clamping power unit 220, two grippers 230, and two clamping components 240. The clamping body 210 is movably connected to the other end of the swing arm 110. The clamping power unit 220 is connected to the clamping body 210. The output end of the clamping power unit 220 is connected to the two grippers 230 to drive the two grippers 230 to move in opposite directions. The grippers 230 are connected to the clamping components 240. A C-shaped groove 241 is provided on the inner side of the bottom of the clamping component 240. The C-shaped groove 241 cooperates with the flange 310 on the top of the wafer cassette 300.

[0029] Specifically, the swing assembly 100 of this application enables the change of the three-dimensional coordinate position of the entire clamping mechanism, thereby facilitating the movement of the wafer cassette 300 from the previous process to the target position for turnover, resulting in a more compact and simpler structure. Furthermore, this application uses two grippers 230 moving in opposite directions to clamp the flat flange 310, facilitating clamping while minimizing damage to the wafer cassette 300. Additionally, this application includes a C-groove 241 that mates with the flange 310, further ensuring a more secure clamping of the wafer cassette 300 and preventing it from falling during the swinging process. Therefore, using this application for clamping the wafer cassette 300 provides a more reliable clamping, prevents the wafer cassette 300 from falling, enhances safety and convenience, improves efficiency, reduces labor intensity, and lowers costs.

[0030] Furthermore, a roller 242 is rotatably connected to the support portion 246 of the gripper 240. The free end of the gripper 240 is rotatably connected to the roller 242 via a bearing.

[0031] Specifically, after the present application moves to the top of the wafer box 300, when the two grippers 230 move towards each other to grip the flange 310, the roller 242 first contacts the flange 310, thereby generating rolling friction, which facilitates the flange 310 to quickly enter the C-groove 241.

[0032] Furthermore, the surface of the roller 242 is provided with a soft pad.

[0033] Specifically, the pad in this embodiment can protect the flange 310 and prevent the flange 310 from wearing.

[0034] Furthermore, the gripper 240 is equipped with a sensor for determining whether to grip the wafer cassette 300. In some embodiments, the sensor is a contact sensor located at the position in the gripper 240 that contacts the wafer cassette 300. In other embodiments, the sensor is a pressure sensor located at the position in the gripper 240 that bears the weight of the wafer cassette 300.

[0035] Specifically, this embodiment uses sensors to identify whether the wafer cassette 300 is being gripped, making it more intelligent.

[0036] Furthermore, the length of the clamping component 240 is greater than the length of the flange 310.

[0037] Specifically, when clamping the wafer cassette 300, the entire flange 310 is kept within the clamping element 240 to ensure more stable and reliable clamping and prevent the wafer cassette 300 from falling.

[0038] Furthermore, the clamping component 240 includes a first connecting plate 243, a second connecting plate 244, and two end plates 245; the first connecting plate 243 and the second connecting plate 244 are arranged in parallel and staggered vertically; the ends of the first connecting plate 243 and the second connecting plate 244 are connected by the end plates 245; the bottom of the end plates 245 is provided with a bearing portion 246, and the roller 242 is disposed on the bearing portion 246; the lower surface of the first connecting plate 243, the inner surface of the second connecting plate 244, and the upper surface of the bearing portion 246 form a C-shaped groove 241.

[0039] Furthermore, the clamping body 210 includes a main connecting plate 211 and two connecting ears 212; the two connecting ears 212 are symmetrically arranged on both sides of the main connecting plate 211; the connecting ears 212 are rotatably connected to the swing arm 110.

[0040] Specifically, the connection structure in this embodiment is more stable and simpler.

[0041] Furthermore, this application also includes a control unit, which is connected to the swing assembly 100, the gripping assembly 200 and the sensor, thereby realizing the linkage between the swing and the gripping of the wafer box 300.

[0042] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the protection scope of this invention.

Claims

1. A wafer cassette gripping mechanism, characterized in that: include: Oscillating components, including a swing arm; The clamping assembly includes a clamping body, a clamping power unit, two grippers, and two clamping parts; The gripping body is movably connected to the other end of the swing arm; the gripping power unit is connected to the gripping body; the output end of the gripping power unit is connected to the two grippers, and is used to drive the two grippers to move in opposite directions. The gripper is connected to the gripping component; the bottom inner side of the gripping component is provided with a C-shaped groove; the C-shaped groove mates with the flange on the top of the product; One end of the swing arm is movably connected to the gripping body of the gripping assembly.

2. The wafer cassette gripping mechanism according to claim 1, characterized in that: A roller is rotatably connected to the clamping component.

3. The wafer cassette gripping mechanism according to claim 2, characterized in that: The surface of the roller is provided with a soft pad.

4. The wafer cassette gripping mechanism according to claim 1, characterized in that: The clamping component is equipped with a sensor to determine whether to clamp the wafer cassette.

5. The wafer cassette gripping mechanism according to claim 1, characterized in that: The length of the clamping component is greater than the length of the flange.

6. The wafer cassette gripping mechanism according to claim 1, characterized in that: The clamping component includes a first connecting plate, a second connecting plate, and two end plates; the first connecting plate and the second connecting plate are arranged in parallel and staggered vertically; the ends of the first connecting plate and the second connecting plate are connected by the end plates; the bottom of the end plates is provided with a bearing portion; the lower surface of the first connecting plate, the inner surface of the second connecting plate, and the upper surface of the bearing portion form a C-shaped groove.

7. The wafer cassette gripping mechanism according to claim 6, characterized in that: The clamping body includes a main connecting plate and two connecting ears; the two connecting ears are symmetrically arranged on both sides of the main connecting plate; the connecting ears are rotatably connected to the swing arm.

8. The wafer cassette gripping mechanism according to claim 1, characterized in that: The swing assembly also includes a swing power unit; the output end of the swing power unit is connected to the other end of the swing arm.

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