Clean type square substrate transfer finger mechanism

Abstract

The utility model belongs to the technical field of semiconductor wafer process processing equipment, concretely is a kind of clean square substrate conveying finger mechanism, including fixed finger main part and moving clamping finger.The other end of fixed finger main part's length direction is provided with at least two installation convex edges A, clamping top column A is equipped on each installation convex edge A, moving clamping finger is provided with at least two installation convex edges B, clamping top column B is equipped on each installation convex edge B.The clean square substrate conveying finger mechanism proposed in the utility model can form point contact when supporting and clamping square substrate, substantially reduce the contact area between square substrate, effectively reduce the damage to square substrate, further reduce the generated particle, improve the cleanliness of square substrate after completing process.The utility model can absorb the structure of vacuum suction particle to absorb and draw away, further ensure the cleanliness of square substrate.

Description

Technical Field

[0001] This utility model belongs to the technical field of semiconductor wafer processing equipment, specifically a clean square substrate transfer finger mechanism. Background Technology

[0002] Currently, the fingers used to transfer square substrates typically have a fixed gripping end and a movable gripping end to hold the square substrate. The contact method between the fingers and the square substrate is usually surface contact, which has a large contact area and can easily damage the square substrate and generate more particles, thus affecting the cleanliness of the square substrate. Utility Model Content

[0003] To address the aforementioned problems, the purpose of this utility model is to provide a clean square substrate finger transfer mechanism.

[0004] The objective of this utility model is achieved through the following technical solution: A clean-type square substrate conveying finger mechanism includes a fixed finger body and a movable clamping finger. The fixed finger body is fixedly connected to an external structure, and the movable clamping finger is connected to an external linear drive. The external linear drive drives the movable clamping finger to move in a direction parallel to the length direction of the fixed finger body, so that the movable clamping finger and the fixed finger body are used to jointly clamp the square substrate. The fixed finger body has at least two mounting protrusions A, each mounting protrusion A having a clamping top post A. The movable clamping finger has at least two mounting protrusions B, each mounting protrusion B having a clamping top post B. The axial center lines of all clamping top posts A and all clamping top posts B are parallel to the length direction of the fixed finger body. Each clamping top post A has a spherical head at one end near the square substrate, and each clamping top post B has a spherical head at one end near the square substrate. The spherical head of each clamping top post A is used to abut against the same side of the square substrate, and the spherical head of each clamping top post B is used to abut against the other side of the square substrate.

[0005] The mounting protrusion B is provided on each side of the fixed finger body along its length direction, at least one of which is provided.

[0006] Each clamping top post A has an external thread A at one end away from the square substrate, and each clamping top post A is connected to the corresponding mounting flange A through the external thread A of the clamping top post A; each clamping top post B has an external thread B at one end away from the square substrate, and each clamping top post B is connected to the corresponding mounting flange B through the external thread B of the clamping top post B.

[0007] The fixing finger body is provided with support pads A near each of the mounting protrusions A, and each support pad A has a substrate bottom edge support protrusion A protruding on its top surface; the fixing finger body is provided with support pads B near each of the mounting protrusions B, and each support pad B has a substrate bottom edge support protrusion B protruding on its top surface; all the substrate bottom edge support protrusions A are used to support one edge of the bottom surface of the square substrate, and all the substrate bottom edge support protrusions B are used to support the other edge of the bottom surface of the square substrate.

[0008] Each of the support pads A has at least two substrate bottom edge support protrusions A protruding from its top surface, and each of the support pads B has at least two substrate bottom edge support protrusions B protruding from its top surface. The length direction of all substrate bottom edge support protrusions A and all substrate bottom edge support protrusions B are parallel to the length direction of the fixing finger body. The top of each substrate bottom edge support protrusion A gradually slopes downward from the side away from the square substrate to the side closer to the square substrate, and the top of each substrate bottom edge support protrusion B gradually slopes downward from the side away from the square substrate to the side closer to the square substrate.

[0009] The top cross-sectional shape of the top of each of the bottom edge support protrusions A of the substrate is an upwardly convex arc shape, and the outer contour size of the top of each of the bottom edge support protrusions A of the substrate gradually decreases from the side away from the square substrate to the side closer to the square substrate; the top cross-sectional shape of the top of each of the bottom edge support protrusions B of the substrate is an upwardly convex arc shape, and the outer contour size of the top of each of the bottom edge support protrusions B of the substrate gradually decreases from the side away from the square substrate to the side closer to the square substrate.

[0010] The fixed finger body is provided with support pad A and support pad B, which are respectively provided with corresponding inlay grooves. Each support pad A and each support pad B is respectively embedded in the corresponding inlay groove. The support protrusion A on the bottom edge of the substrate of each support pad A and the support protrusion B on the bottom edge of the substrate of each support pad B are respectively higher than the corresponding inlay groove.

[0011] The support pad A and support pad B are respectively installed on the fixed finger body by fixing screws.

[0012] Each mounting protrusion B has several vacuum holes on one side near the square substrate. The movable clamping finger has a vacuum channel inside, which is connected to all the vacuum holes. The movable clamping finger is equipped with a vacuum tube connector, which is connected to the vacuum channel and an external vacuum device.

[0013] Each vacuum hole on the mounting flange B is located on the underside of the clamping top post B on the mounting flange B.

[0014] The advantages and positive effects of this utility model are as follows: 1. The clean-type square substrate conveying finger mechanism proposed in this utility model can form point contact when supporting and clamping the square substrate, which greatly reduces the contact area between the finger and the square substrate, effectively reduces damage to the square substrate, thereby reducing the generated particles and improving the cleanliness of the square substrate after the process is completed.

[0015] 2. This utility model can absorb and remove particles generated by the contact and collision between the clamping top post B and the square substrate through a vacuum absorption structure, thereby further ensuring the cleanliness of the square substrate.

[0016] 3. The structure of this utility model is relatively simple, easy to disassemble, maintain and replace, and has high reliability. Attached Figure Description

[0017] Figure 1 This is a three-dimensional structural diagram of the present invention. Figure 2 This is a schematic cross-sectional view of the overall structure of this utility model; Figure 3 This is one of the schematic diagrams showing the usage state of this utility model; Figure 4 This is the second schematic diagram of the usage state of this utility model; Figure 5 This is a schematic diagram of the structure of the other end of the fixed finger body in the length direction of this utility model; Figure 6 for Figure 4 Enlarged view of point A.

[0018] In the diagram: 1 is the main body for fixing the finger, 101 is the mounting protrusion A, 102 is the inlay groove, 2 is the movable clamping finger, 201 is the mounting protrusion B, 202 is the vacuum hole, 3 is the clamping top post A, 4 is the clamping top post B, 5 is the support pad A, 501 is the support protrusion A on the bottom edge of the substrate, 6 is the support pad B, 601 is the support protrusion B on the bottom edge of the substrate, 7 is the fixing screw, and 8 is the vacuum tube connector. 001 is a square substrate. Detailed Implementation

[0019] The following is in conjunction with the appendix Figures 1-6 The present invention will be described in further detail.

[0020] A clean-type square substrate finger transfer mechanism, such as Figures 1-6As shown, this embodiment includes a fixed finger body 1 and a movable clamping finger 2. One end of the fixed finger body 1 along its length is fixed to an external structure (such as an equipment frame or a semiconductor process robot) via screws. The end of the movable clamping finger 2 closest to the fixed finger body 1 along its length is connected to an external linear drive (such as a linear cylinder). The connection method between the fixed finger body 1 and the external structure, and the connection method between the movable clamping finger 2 and the external linear drive, are the same as in the prior art. The external linear drive drives the movable clamping finger 2 to move in a direction parallel to the length of the fixed finger body 1, so that the movable clamping finger 2 and the fixed finger body 1 are used to jointly clamp the square substrate 001.

[0021] In this embodiment, two mounting flanges A 101 protrude from the other end of the fixed finger body 1 along its length direction. Each mounting flange A 101 is provided with a clamping top post A 3. Two mounting flanges B 201 protrude from the movable clamping finger 2. One mounting flange B 201 is provided on each side of the fixed finger body 1 along its length direction. Each mounting flange B 201 is provided with a clamping top post B 4, which can ensure uniform and stable clamping. In this embodiment, a U-shaped opening is formed at one end of the fixed finger body 1 along its length direction, and a mounting flange A 101 is provided on each side of the U-shaped opening, which can reduce the overall weight. The axial center lines of all clamping top posts A 3 and all clamping top posts B 4 are parallel to the length direction of the fixed finger body 1. A spherical head is formed at the end of each clamping top post A 3 near the square substrate 001, and a spherical head is formed at the end of each clamping top post B 4 near the square substrate 001. The spherical head of each clamping top post A 3 is used to abut against the same side of the square substrate 001, and the spherical head of each clamping top post B 4 is used to abut against the other side of the square substrate 001. By setting the clamping top posts A 3 and B 4 with spherical heads, point contact can be formed when the moving clamping finger 2 and the fixed finger body 1 jointly clamp the square substrate 001, which greatly reduces the contact area, effectively reduces damage to the square substrate 001, and thus reduces the particles generated by clamping collisions, improving the cleanliness of the square substrate 001 after the process is completed.

[0022] Specifically, in this embodiment, each clamping post A3 has an external thread A at its end furthest from the square substrate 001. Each clamping post A3 is connected to its corresponding mounting flange A101 via this external thread A. Similarly, each clamping post B4 has an external thread B at its end furthest from the square substrate 001. Each clamping post B4 is connected to its corresponding mounting flange B201 via this external thread B. By connecting the clamping posts A3 and B4 to their respective mounting flanges A101 and B201 via threads, fine-tuning the positions of the clamping posts A3 and B4 is convenient, ensuring clamping accuracy and facilitating assembly and disassembly. In this embodiment, both external threads A and B are self-locking threads, ensuring reliable operation. In this embodiment, the clamping posts A3 and B4 can be made to the same size for easy processing and replacement.

[0023] Specifically, such as Figure 1 , Figure 5 and Figure 6 As shown, in this embodiment, the finger-fixing body 1 is provided with support pads A5 near each mounting protrusion A101, and each support pad A5 has a substrate bottom edge support protrusion A501 protruding on its top surface; the finger-fixing body 1 is provided with support pads B6 near each mounting protrusion B201, and each support pad B6 has a substrate bottom edge support protrusion B601 protruding on its top surface. All substrate bottom edge support protrusions A501 are used to support one edge of the bottom surface of the square substrate 001, and all substrate bottom edge support protrusions B601 are used to support the other edge of the bottom surface of the square substrate 001. In this embodiment, the support pads A5 and B6 can be set to the same size for easy processing and replacement.

[0024] like Figure 1 , Figure 5 and Figure 6As shown, in this embodiment, each support pad A 5 has two substrate bottom edge support protrusions A 501 protruding from its top surface, and each support pad B 6 has two substrate bottom edge support protrusions B 601 protruding from its top surface. The length direction of all substrate bottom edge support protrusions A 501 and all substrate bottom edge support protrusions B 601 are parallel to the length direction of the fixed finger body 1. The top of each substrate bottom edge support protrusion A 501 gradually slopes downward from the side away from the square substrate 001 to the side close to the square substrate 001. The top of each substrate bottom edge support protrusion B 601 gradually slopes downward from the side away from the square substrate 001 to the side close to the square substrate 001. The cross-sectional shape of the top of each bottom edge support protrusion A 501 of the substrate is an upwardly convex arc shape. The outer contour size of the top of each bottom edge support protrusion A 501 of the substrate gradually decreases from the side away from the square substrate 001 to the side closer to the square substrate 001. The cross-sectional shape of the top of each bottom edge support protrusion B 601 of the substrate is an upwardly convex arc shape. The outer contour size of the top of each bottom edge support protrusion B 601 of the substrate gradually decreases from the side away from the square substrate 001 to the side closer to the square substrate 001. This allows the square substrate 001 falling on the top surface of the bottom edge support protrusion A 501 and the top surface of the bottom edge support protrusion B 601 of the substrate to have a certain positioning and centering effect. It can also form point contact, which greatly reduces the contact area required to support the square substrate 001 and effectively reduces damage to the square substrate 001.

[0025] In this embodiment, support pads A5 and B6 are provided on the finger fixing body 1, each with a corresponding inlay groove 102. Each support pad A5 and each support pad B6 is embedded in the corresponding inlay groove 102. The support protrusions A501 on the bottom edge of the substrate of each support pad A5 and B6 on the bottom edge of the substrate of each support pad B6 are higher than the corresponding inlay groove 102, which can reduce the overall height and reduce space occupation. In this embodiment, support pads A5 and B6 are installed on the finger fixing body 1 by fixing screws 7, which is convenient for disassembly and assembly.

[0026] Specifically, such as Figure 2 and Figure 4As shown, in this embodiment, each mounting protrusion B 201 has several vacuum holes 202 on its side near the square substrate 001. A vacuum channel is provided inside the movable clamping finger 2, and the vacuum channel is connected to all the vacuum holes 202. The movable clamping finger 2 is equipped with a vacuum tube connector 8, which is connected to both the vacuum channel and an external vacuum device. In this embodiment, the specific method of opening the vacuum channel adopts existing technology, and the vacuum tube connector 8 is a commercially available product. The vacuum tube connector 8 is connected to the external vacuum device via a pipe. In this embodiment, the external vacuum device adopts a common vacuum device setup in semiconductor equipment, and its operation is controlled by the overall equipment control system. During the clamping of the square substrate 001, the external vacuum device can be activated to allow the vacuum channel to remove generated particles, further ensuring the cleanliness of the square substrate 001. Each vacuum hole 202 on each mounting flange B 201 is located below the clamping top post B 4 on the mounting flange B 201, so as to fully ensure the absorption of particles falling due to the collision between the clamping top post B 4 and the square substrate 001.

[0027] In the use of the clean-type square substrate conveying finger mechanism proposed in this utility model, the external device places the square substrate 001 between the fixed finger body 1 and the movable clamping finger 2. Each support pad A 5 and each support pad B 6 supports the square substrate 001. At this time, one side of the square substrate 001 is relatively close to or directly abuts against each clamping top post A 3. The external linear drive drives the movable clamping finger 2 to move towards the square substrate 001, and then the clamping top post B 4 contacts the other side of the square substrate 001 to complete the clamping. The possibility of generating particles from the contact and collision between the clamping top post B 4 and the square substrate 001 is relatively greater than that from the clamping top post A 3. The possibility of generating particles between the clamping top post A 3 and the square substrate 001 is almost negligible. Therefore, in this embodiment, only the movable clamping finger 2 is provided with a vacuum absorption structure. If a higher degree of cleanliness is required, a similar vacuum absorption structure can also be provided on the fixed finger body 1.

Claims

1. A clean-type square substrate conveying finger mechanism, comprising a fixed finger body (1) and a movable clamping finger (2), wherein the fixed finger body (1) is fixedly connected to an external structure, and the movable clamping finger (2) is connected to an external linear drive member, wherein the external linear drive member drives the movable clamping finger (2) to move in a direction parallel to the length direction of the fixed finger body (1) so that the movable clamping finger (2) and the fixed finger body (1) are used to jointly clamp the square substrate (001); Its features are: The fixed finger body (1) is provided with at least two mounting protrusions A (101), and each mounting protrusion A (101) is provided with a clamping top post A (3). The movable clamping finger (2) is provided with at least two mounting protrusions B (201), and each mounting protrusion B (201) is provided with a clamping top post B (4). The axial center lines of all clamping top posts A (3) and all clamping top posts B (4) are parallel to the length direction of the fixed finger body (1). A spherical head is formed at one end of each clamping top post A (3) near the square substrate (001), and a spherical head is formed at one end of each clamping top post B (4) near the square substrate (001). The spherical head of each clamping top post A (3) is used to abut against the same side of the square substrate (001), and the spherical head of each clamping top post B (4) is used to abut against the other side of the square substrate (001).

2. The clean-type square substrate finger-transfer mechanism according to claim 1, characterized in that: The mounting protrusion B (201) is provided on each side of the fixed finger body (1) along its length direction, at least one of each.

3. The clean-type square substrate finger-transfer mechanism according to claim 1, characterized in that: Each of the clamping top posts A (3) has an external thread A at one end away from the square base plate (001), and each of the clamping top posts A (3) is connected to the corresponding mounting flange A (101) through the external thread A of the clamping top post A (3); each of the clamping top posts B (4) has an external thread B at one end away from the square base plate (001), and each of the clamping top posts B (4) is connected to the corresponding mounting flange B (201) through the external thread B of the clamping top post B (4).

4. The clean-type square substrate finger-transfer mechanism according to claim 1, characterized in that: The fixed finger body (1) is provided with support pads A (5) near each of the mounting protrusions A (101), and each of the support pads A (5) has a substrate bottom edge support protrusion A (501) protruding on its top surface; the fixed finger body (1) is provided with support pads B (6) near each of the mounting protrusions B (201), and each of the support pads B (6) has a substrate bottom edge support protrusion B (601) protruding on its top surface; all the substrate bottom edge support protrusions A (501) are used to support one edge of the bottom surface of the square substrate (001), and all the substrate bottom edge support protrusions B (601) are used to support the other edge of the bottom surface of the square substrate (001).

5. The clean-type square substrate finger-transfer mechanism according to claim 4, characterized in that: Each of the support pads A (5) has at least two substrate bottom edge support protrusions A (501) protruding from its top surface, and each of the support pads B (6) has at least two substrate bottom edge support protrusions B (601) protruding from its top surface. The length direction of all substrate bottom edge support protrusions A (501) and the length direction of all substrate bottom edge support protrusions B (601) are parallel to the length direction of the fixed finger body (1). The top of each substrate bottom edge support protrusion A (501) gradually slopes downward from the side away from the square substrate (001) to the side close to the square substrate (001). The top of each substrate bottom edge support protrusion B (601) gradually slopes downward from the side away from the square substrate (001) to the side close to the square substrate (001).

6. The clean-type square substrate finger-transfer mechanism according to claim 5, characterized in that: The top cross-sectional shape of the top of each of the bottom edge support protrusions A (501) of the substrate is an upwardly convex arc shape, and the outer contour size of the top of each of the bottom edge support protrusions A (501) of the substrate gradually decreases from the side away from the square substrate (001) to the side closer to the square substrate (001); the top cross-sectional shape of the top of each of the bottom edge support protrusions B (601) of the substrate is an upwardly convex arc shape, and the outer contour size of the top of each of the bottom edge support protrusions B (601) of the substrate gradually decreases from the side away from the square substrate (001) to the side closer to the square substrate (001).

7. A clean-type square substrate finger-transferring mechanism according to claim 4, characterized in that: The fixed finger body (1) is provided with support pad A (5) and support pad B (6) respectively with corresponding inlay grooves (102). Each support pad A (5) and each support pad B (6) is respectively embedded in the corresponding inlay groove (102). The support protrusion A (501) on the bottom edge of the substrate of each support pad A (5) and the support protrusion B (601) on the bottom edge of the substrate of each support pad B (6) are respectively higher than the corresponding inlay groove (102).

8. A clean-type square substrate finger-transferring mechanism according to claim 4, characterized in that: The support pad A (5) and support pad B (6) are respectively installed on the fixed finger body (1) by fixing screws (7).

9. A clean-type square substrate finger-transferring mechanism according to claim 1, characterized in that: Each mounting protrusion B (201) has several vacuum holes (202) on one side near the square substrate (001). The movable clamping finger (2) has a vacuum channel inside, which is connected to all the vacuum holes (202). The movable clamping finger (2) has a vacuum tube connector (8), which is connected to the vacuum channel and an external vacuum device.

10. A clean-type square substrate finger-transferring mechanism according to claim 9, characterized in that: Each vacuum hole (202) on each of the mounting flanges B (201) is located on the underside of the clamping top post B (4) on the mounting flange B (201).

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