Compatible wafer fixing device

Abstract

The utility model provides a kind of compatible wafer fixing device, comprising: supporting plate, positioning mechanism and air path control mechanism, the supporting plate is provided with passageway area, the positioning mechanism is slidably installed on the supporting plate, the air path control mechanism is connected with the passageway area by pipeline.For multiple different size specifications of wafer to be detected, a compatible wafer fixing device is designed, and the on-off of compatible mechanical mechanism and air path is achieved to fix multiple size wafers respectively. Multiple size wafers are fixed using the same fixing mechanism. Without multiple semiconductor equipment, multiple size wafers can be fixed and subsequent semiconductor process applications. Without disassembly and replacement of semiconductor fixing mechanism, multiple size wafers can be fixed. The equipment cost and labor replacement cost of wafer fixing are reduced.

Description

Technical Field

[0001] This utility model relates to the field of wafer fixing equipment technology, and in particular to a compatible wafer fixing device. Background Technology

[0002] With the continuous development of semiconductor technology, increasingly stringent requirements are being placed on the compatibility of semiconductor equipment. Especially at the end-user level, end-users often want to achieve the desired performance for multiple applications at minimal cost. Traditional semiconductor wafer mounting methods fall into two categories: one is to use different semiconductor devices for each wafer size, meaning one semiconductor device is only suitable for a single wafer size application, and different semiconductor devices are selected for subsequent semiconductor processes based on the wafer size; the other is to use different mounting mechanisms, that is, to install mounting mechanisms for different wafer sizes on the semiconductor device, thereby enabling different sized wafers to complete semiconductor-related processes on the same semiconductor device.

[0003] Both traditional semiconductor wafer mounting methods have significant drawbacks. The first method, which increases the number of semiconductor devices, primarily increases equipment costs. The second method, which involves changing the mounting structure, requires skilled operators, and each time the mechanism is changed, manual training of the semiconductor equipment is necessary, increasing time costs. Utility Model Content

[0004] The technical problem to be solved by this utility model is to provide a compatible wafer fixing device to address the shortcomings of the existing technology.

[0005] The technical solution of this utility model to solve the above-mentioned technical problems is as follows: A compatible wafer fixing device includes: a tray, a positioning mechanism and a gas path control mechanism. The tray is provided with a channel area, the positioning mechanism is slidably mounted on the tray, and the gas path control mechanism is connected to the channel area through a pipeline.

[0006] The beneficial effects of this utility model's technical solution are as follows: A compatible wafer fixing device is designed for multiple wafers of different sizes and specifications to be tested. Through compatible mechanical mechanisms and gas path switching, it achieves the effect of fixing wafers of various sizes separately. This allows multiple sizes of wafers to be fixed using the same fixing mechanism. It eliminates the need for multiple semiconductor devices, enabling the fixing of multiple sizes of wafers and subsequent semiconductor process applications. It also eliminates the need to disassemble and replace the semiconductor fixing mechanism, thus reducing the equipment cost and labor replacement cost for wafer fixing.

[0007] Furthermore, the channel area includes at least one first channel, at least one second channel, at least one third channel, at least one fourth channel, and at least one fifth channel. The first channel, the second channel, the fourth channel, and the fifth channel are all arc-shaped grooves, and the third channel is an annular groove. The first channel and the second channel have the same radius, and the fourth channel and the fifth channel have the same radius. The third channel is located in the middle of the support plate. The fourth channel and the fifth channel both surround the outside of the third channel. The first channel surrounds the outside of the fifth channel, and the second channel surrounds the outside of the fourth channel. The gas path control mechanism is connected to the first channel, the second channel, the third channel, the fourth channel, and the fifth channel respectively through pipelines.

[0008] The beneficial effects of adopting the above-mentioned further technical solutions are: 8-inch wafers are fixed using the first, second, third, fourth, and fifth channels. 6-inch wafers are fixed using the first, third, fourth, and fifth channels. 4-inch wafers are fixed using the first, third, and fifth channels.

[0009] Furthermore, the gas circuit control mechanism is equipped with a first switch, a second switch, a third switch, a release switch, a positive pressure connection terminal, and a negative pressure connection terminal. The first switch is connected to the first channel, the second channel, the third channel, the fourth channel, and the fifth channel via pipelines. The second switch is connected to the first channel, the third channel, the fourth channel, and the fifth channel via pipelines. The third switch is connected to the first channel, the third channel, and the fifth channel via pipelines. The release switch is connected to the first channel, the second channel, the third channel, the fourth channel, and the fifth channel via pipelines. The negative pressure connection terminal is connected to the first switch, the second switch, and the third switch via pipelines. The positive pressure connection terminal is connected to the release switch via pipelines.

[0010] The beneficial effects of adopting the above-mentioned further technical solution are as follows: The wafer is fixed by opening the corresponding switch according to its size. When the wafer needs to be removed, the corresponding size switch is closed, and the release switch is opened, allowing the wafer to be removed. Opening the release switch establishes electrical connection between the back of the wafer and the internal components of the device, achieving an isobaric state, thereby disconnecting the wafer from its fixation, allowing the wafer to be removed. The first switch corresponds to fixing an 8-inch wafer, the second switch to fixing a 6-inch wafer, and the third switch to fixing a 4-inch wafer.

[0011] Furthermore, the tray is equipped with a first channel output terminal, a second channel output terminal, a third channel output terminal, a fourth channel output terminal, and a fifth channel output terminal. These output terminals are connected to the first, second, third, fourth, and fifth channels respectively via pipelines. The gas path control mechanism is equipped with a first channel input terminal, a second channel input terminal, a third channel input terminal, a fourth channel input terminal, and a fifth channel input terminal. These input terminals are connected to the first, second, third, fourth, and fifth channel output terminals respectively via pipelines. The system has a first switch connected to the first channel input, the second channel input, the third channel input, the fourth channel input, and the fifth channel input via conduits. The second switch is connected to the first channel input, the third channel input, the fourth channel input, and the fifth channel input via conduits. The third switch is connected to the first channel input, the third channel input, and the fifth channel input via conduits. The release switch is connected to the first channel input, the second channel input, the third channel input, the fourth channel input, and the fifth channel input via conduits.

[0012] The beneficial effects of adopting the above-mentioned further technical solutions are: the setting of the output end and the input end facilitates the detachable connection between the channel and the gas path control mechanism, facilitates the installation and maintenance of components, and simplifies the structure.

[0013] Furthermore, the first switch, the second switch, the third switch, and the release switch are all manual valves, and quick-connect couplings are installed on the first channel output terminal, the second channel output terminal, the third channel output terminal, the fourth channel output terminal, the fifth channel output terminal, the first channel input terminal, the second channel input terminal, the third channel input terminal, the fourth channel input terminal, the fifth channel input terminal, the positive pressure connection terminal, and the negative pressure connection terminal.

[0014] The beneficial effects of adopting the above-mentioned further technical solutions are: the manual valve allows users to manually adjust the switch according to actual needs; the quick-connect coupling facilitates detachable connections between pipelines and components, and facilitates the installation and maintenance of pipelines and components.

[0015] Furthermore, one-way valves are installed via quick-connect couplings on the pipelines between the first channel and the first switch, the second switch and the third switch, the second channel and the release switch, the third channel and the first switch, the second switch and the third switch, the fourth channel and the first switch and the second switch, and the fifth channel and the first switch, the second switch and the third switch.

[0016] The beneficial effects of adopting the above-mentioned further technical solution are: the one-way valve allows the gas in the pipeline to flow in one direction, improving the stability and reliability of the device.

[0017] Furthermore, the positioning mechanism includes: a pair of first positioning members and a second positioning member; a pair of first sliding grooves and a second sliding groove are provided on the pallet; both of the first positioning members are L-shaped plates; the pair of first positioning members are slidably installed in the first sliding groove; and the second positioning member is slidably installed in the second sliding groove.

[0018] The beneficial effects of adopting the above-mentioned further technical solution are as follows: the first positioning element is used to fix 6-inch and 4-inch wafers, and the second positioning element is used to fix 8-inch wafers. Different positioning elements are used for positioning wafers of different sizes. The wafer slides back and forth along the groove of the positioning element, and when the flat edge of the positioning element is in complete contact with the flat edge of the wafer, the positioning effect is achieved. At this point, turning on the switch completes the fixing of the wafer.

[0019] Furthermore, the positioning mechanism includes an auxiliary positioning component, which is an arc plate, and is placed on the support plate.

[0020] The beneficial effects of adopting the above-mentioned further technical solutions are that the 6-inch and 4-inch models are also equipped with separate auxiliary positioning components, which improves stability and reliability.

[0021] Furthermore, the tray is connected to a base plate, and the base plate is connected to the air circuit control mechanism.

[0022] The beneficial effect of adopting the above-mentioned further technical solution is that the base plate is used to support the tray, which facilitates the connection between the tray and the air circuit control mechanism.

[0023] Furthermore, the pallet is provided with a pair of pick-up and drop-off slots.

[0024] The beneficial effects of adopting the above-mentioned further technical solution are: the setting of the pick-and-place slot facilitates the pick-and-place of wafers on the pallet, improving the user experience.

[0025] The advantages of this invention in its additional aspects will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0026] To more clearly illustrate the technical solutions of the embodiments of this utility model, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 This is one of the structural schematic diagrams of the compatible wafer fixing device provided in the embodiments of this utility model.

[0028] Figure 2 This is the second schematic diagram of the compatible wafer fixing device provided in the embodiment of this utility model.

[0029] Figure 3 The third schematic diagram of the compatible wafer fixing device provided in the embodiment of this utility model.

[0030] Figure 4 The fourth schematic diagram of the compatible wafer fixing device provided in the embodiment of this utility model.

[0031] Figure 5 The fifth schematic diagram of the compatible wafer fixing device provided in the embodiment of this utility model.

[0032] Figure 6 This is the sixth schematic diagram of the compatible wafer fixing device provided in the embodiment of this utility model.

[0033] Figure 7 The seventh schematic diagram of the compatible wafer fixing device provided in the embodiment of this utility model.

[0034] Figure 8 This is the eighth schematic diagram of the compatible wafer fixing device provided in the embodiment of this utility model.

[0035] Figure 9 This is the ninth structural schematic diagram of the compatible wafer fixing device provided in the embodiment of this utility model.

[0036] Figure 10 The tenth schematic diagram of the compatible wafer fixing device provided in the embodiment of this utility model.

[0037] Figure 11 This is 11 of the structural schematic diagrams of the compatible wafer fixing device provided in the embodiments of this utility model.

[0038] Figure 12 The 12th schematic diagram of the compatible wafer fixing device provided in the embodiment of this utility model.

[0039] Figure 13 A schematic flowchart illustrating the compatible wafer fixing method provided in this embodiment of the utility model.

[0040] Reference numerals: 1. Tray; 2. Positioning mechanism; 3. Pneumatic control mechanism; 4. Channel area; 5. First channel; 6. Second channel; 7. Third channel; 8. Fourth channel; 9. Fifth channel; 10. First switch; 11. Second switch; 12. Third switch; 13. Release switch; 14. Positive pressure connection end; 15. Negative pressure connection end; 16. First channel output end; 17. Second channel output end; 18. Third channel output end; 19. Fourth channel output end; 20. Fifth channel output end; 21. First channel input end; 22. Second channel input end; 23. Third channel input end; 24. Fourth channel input end; 25. Fifth channel input end; 26. Check valve; 27. First positioning element; 28. Second positioning element; 29. ​​Auxiliary positioning element; 30. Base plate; 31. Pick-up and drop-off slot. Detailed Implementation

[0041] The principles and features of this utility model are described below with reference to the accompanying drawings. The embodiments described are only used to explain this utility model and are not intended to limit the scope of this utility model.

[0042] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0043] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0044] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0045] In the description of the embodiments of this utility model, it should be noted that if terms such as "upper," "lower," "horizontal," or "inner" are used to indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the utility model product is usually placed during use, they are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0046] In the description of the embodiments of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0047] like Figures 1 to 12 As shown, this utility model embodiment provides a compatible wafer fixing device, including: a tray 1, a positioning mechanism 2, and a gas path control mechanism 3. The tray 1 is provided with a channel area 4, the positioning mechanism 2 is slidably mounted on the tray 1, and the gas path control mechanism 3 is connected to the channel area 4 through a pipeline.

[0048] The beneficial effects of this utility model's technical solution are as follows: A compatible wafer fixing device is designed for multiple wafers of different sizes and specifications to be tested. Through compatible mechanical mechanisms and gas path switching, it achieves the effect of fixing wafers of various sizes separately. This allows multiple sizes of wafers to be fixed using the same fixing mechanism. It eliminates the need for multiple semiconductor devices, enabling the fixing of multiple sizes of wafers and subsequent semiconductor process applications. It also eliminates the need to disassemble and replace the semiconductor fixing mechanism, thus reducing the equipment cost and labor replacement cost for wafer fixing.

[0049] Among them, the gas circuit control mechanism 3 can be a purely manually controlled gas circuit control mechanism.

[0050] This utility model relates to semiconductor wafer carriers. For multiple wafers of different sizes to be inspected, a compatible wafer fixing mechanism (compatible wafer fixing device) is configured to fix them before semiconductor processing or wafer inspection processes. This utility model embodiment is illustrated using compatibility with three wafer sizes as an example. Through compatible mechanical mechanisms and differentiated pneumatic control methods, the effect of fixing the three wafer sizes is achieved separately. It should be noted that this utility model embodiment includes, but is not limited to, fixing three wafer sizes. Currently, common compatible mechanisms are compatible with 12-inch and 8-inch wafers, 8-inch and 6-inch wafers, and 6-inch and 4-inch wafers, etc., for adjacent wafer sizes. In special cases requiring compatibility with three adjacent wafer sizes, a separate design is required. Here, "inch" refers to the unit of measurement for wafers.

[0051] This invention relates to a compatible wafer fixing device. It can accommodate wafers of various sizes, and with the help of a pneumatic control method, it can fix wafers of different sizes, facilitating subsequent semiconductor processes or testing. This reduces the number of semiconductor devices required, thereby reducing their cost. It eliminates the need to replace the wafer fixing mechanism, reducing labor costs. It also lowers the skill requirements for operators, further reducing labor costs.

[0052] The compatible structure (compatible wafer fixing device) described in this embodiment of the utility model is designed for manual loading and unloading, so the air path control method will also be described in terms of manual control.

[0053] If the gas path control adopts automatic control, the operation in the application of this utility model is to manually place the wafer and operate the corresponding adsorption gas path through the computer operation interface, that is, the computer controls the opening and closing of the switch to realize automatic switch control.

[0054] In this application, the operation steps are simpler and more convenient: manually place the wafer and manually open the valve (switch) of the corresponding size (the manual valve is located next to the wafer placement position).

[0055] like Figures 1 to 12As shown, further, the channel region 4 includes: at least one first channel 5, at least one second channel 6, at least one third channel 7, at least one fourth channel 8, and at least one fifth channel 9. The first channel 5, the second channel 6, the fourth channel 8, and the fifth channel 9 are all arc-shaped grooves, and the third channel 7 is an annular groove. The first channel 5 and the second channel 6 have the same radius, and the fourth channel 8 and the fifth channel 9 have the same radius. The third channel 7 is located in the middle of the support plate 1. The fourth channel 8 and the fifth channel 9 are both surrounding the outside of the third channel 7. The first channel 5 surrounds the outside of the fifth channel 9, and the second channel 6 surrounds the outside of the fourth channel 8. The air path control mechanism 3 is connected to the first channel 5, the second channel 6, the third channel 7, the fourth channel 8, and the fifth channel 9 respectively through pipelines.

[0056] The beneficial effects of adopting the above-mentioned further technical solutions are: 8-inch wafers are fixed using the first, second, third, fourth, and fifth channels. 6-inch wafers are fixed using the first, third, fourth, and fifth channels. 4-inch wafers are fixed using the first, third, and fifth channels.

[0057] Channel 5, Channel 6, Channel 7, Channel 8, and Channel 9 are all independent and do not communicate with each other.

[0058] 1. When placing an 8-inch wafer, channels 5, 6, 7, 8, and 9 are all covered. At this time, turn on the first switch 10, and the 8-inch wafer will be attracted and fixed.

[0059] 2. When placing a 6-inch wafer, the first channel 5, the third channel 7, the fourth channel 8, and the fifth channel 9 are covered. At this time, turn on the second switch 11, and the 6-inch wafer can be fixed.

[0060] 3. When placing a 4-inch wafer, the first channel 5, the third channel 7, and the fifth channel 9 are covered. At this time, turn on the third switch 12, and the 4-inch wafer can be fixed.

[0061] When it is necessary to remove the wafer, turn off the switch of the corresponding size and turn on the release switch 13 (vacuum break switch) to remove the wafer.

[0062] like Figures 1 to 12As shown, the gas circuit control mechanism 3 is further equipped with a first switch 10, a second switch 11, a third switch 12, a release switch 13, a positive pressure connection terminal 14, and a negative pressure connection terminal 15. The first switch 10 is connected to the first channel 5, the second channel 6, the third channel 7, the fourth channel 8, and the fifth channel 9 via pipelines. The second switch 11 is connected to the first channel 5, the third channel 7, the fourth channel 8, and the fifth channel 9 via pipelines. The third switch 12 is connected to the first channel 5, the third channel 7, and the fifth channel 9 via pipelines. The release switch 13 is connected to the first channel 5, the second channel 6, the third channel 7, the fourth channel 8, and the fifth channel 9 via pipelines. The negative pressure connection terminal 15 is connected to the first switch 10, the second switch 11, and the third switch 12 via pipelines. The positive pressure connection terminal 14 is connected to the release switch 13 via pipelines.

[0063] The beneficial effects of adopting the above-mentioned further technical solution are as follows: The wafer is fixed by opening the corresponding switch according to its size. When the wafer needs to be removed, the corresponding size switch is closed, and the release switch is opened, allowing the wafer to be removed. Opening the release switch establishes electrical connection between the back of the wafer and the internal components of the device, achieving an isobaric state, thereby disconnecting the wafer from its fixation, allowing the wafer to be removed. The first switch corresponds to fixing an 8-inch wafer, the second switch to fixing a 6-inch wafer, and the third switch to fixing a 4-inch wafer.

[0064] Release switch 13 corresponds to all wafers on tray 1. An air inlet is provided in the groove of the channel. Negative pressure specifically refers to a low vacuum state. The gas flows from the open end (channel) into the negative pressure generation section of the device (gas path control mechanism). Since the back of the wafer covers the air inlet at the open end, a low vacuum is formed on the back of the wafer, achieving the effect of fixation.

[0065] Positive pressure generally refers to compressed air (CDA). Here, a compressed air source can be connected, or it can be connected to the atmosphere. When the positive pressure valve is opened (remove switch 13), the two ends of the positive pressure valve (one end is the back side of the wafer, and the other end is positive pressure air or the inside of the free end device) are connected and the pressure is equal, thereby disconnecting the negative pressure on the back side of the wafer.

[0066] 1. The positive pressure connector (positive pressure connection end 14) is connected at one end to the release valve (release switch 13) inside the module (gas circuit control mechanism 3), and the other end is left open. The negative pressure connector (negative pressure connection end 15) is connected at one end to the three fixed valves (first switch 10, second switch 11 and third switch 12) inside the module (gas circuit control mechanism 3) via a 1 to 4 connector, and the remaining 1 line of the connector is sealed with a plug, and the other end is connected to the negative pressure pipeline at the end of the equipment (gas circuit control mechanism 3).

[0067] 2. Negative pressure gas is used to adsorb the back side of the wafer, thereby fixing the wafer. Positive pressure can be connected to compressed air, but it is not connected here (open end, in contact with the air inside the equipment). It is used to release the wafer from negative pressure fixation. During operation, first close the corresponding size negative pressure valves (first switch 10, second switch 11, and third switch 12), and then open the positive pressure valve (release switch 13) to achieve communication between the back side of the wafer and the air inside the equipment (gas path control mechanism 3), realizing an isobaric state, thereby disconnecting the wafer from fixation.

[0068] like Figures 1 to 12As shown, further, the tray 1 is equipped with a first channel output terminal 16, a second channel output terminal 17, a third channel output terminal 18, a fourth channel output terminal 19, and a fifth channel output terminal 20. The first channel output terminal 16, the second channel output terminal 17, the third channel output terminal 18, the fourth channel output terminal 19, and the fifth channel output terminal 20 are connected to the first channel 5, the second channel 6, the third channel 7, the fourth channel 8, and the fifth channel 9 respectively via pipelines. The gas path control mechanism 3 is equipped with a first channel input terminal 21, a second channel input terminal 22, a third channel input terminal 23, a fourth channel input terminal 24, and a fifth channel input terminal 25. The first channel input terminal 21, the second channel input terminal 22, the third channel input terminal 23, the fourth channel input terminal 24, and the fifth channel input terminal 25 are connected to the first channel output terminal 16, the second channel output terminal 17, the third channel output terminal 18, the fourth channel output terminal 19, and the fifth channel output terminal 20 respectively via pipelines. The two-channel output terminal 17, the third-channel output terminal 18, the fourth-channel output terminal 19, and the fifth-channel output terminal 20 are connected. The first switch 10 is connected to the first-channel input terminal 21, the second-channel input terminal 22, the third-channel input terminal 23, the fourth-channel input terminal 24, and the fifth-channel input terminal 25 via conduits. The second switch 11 is connected to the first-channel input terminal 21, the third-channel input terminal 23, the fourth-channel input terminal 24, and the fifth-channel input terminal 25 via conduits. The third switch 12 is connected to the first-channel input terminal 21, the third-channel input terminal 23, and the fifth-channel input terminal 25 via conduits. The release switch 13 is connected to the first-channel input terminal 21, the second-channel input terminal 22, the third-channel input terminal 23, the fourth-channel input terminal 24, and the fifth-channel input terminal 25 via conduits.

[0069] The beneficial effects of adopting the above-mentioned further technical solutions are: the setting of the output end and the input end facilitates the detachable connection between the channel and the gas path control mechanism, facilitates the installation and maintenance of components, and simplifies the structure.

[0070] Figure 8 The dotted lines in the diagram represent the channels inside the tray. Each of the first channel 5, second channel 6, third channel 7, fourth channel 8, and fifth channel 9 can be equipped with an air inlet. The output end 16 of the first channel is connected to the air inlet of the first channel 5 through the channel inside the tray. The output end 17 of the second channel is connected to the air inlet of the second channel 6 through the channel inside the tray. The output end 18 of the third channel is connected to the air inlet of the third channel 7 through the channel inside the tray. The output end 19 of the fourth channel is connected to the air inlet of the fourth channel 8 through the channel inside the tray. The output end 20 of the fifth channel is connected to the air inlet of the fifth channel 9 through the channel inside the tray.

[0071] Figure 12 The arrows in the diagram represent the direction and trajectory of gas flow.

[0072] After the fixed switches (first switch 10, second switch 11 and third switch 12) are combined into one line, they are connected to the negative pressure pipeline of the equipment (gas control mechanism 3). The connection method is gas pipe + connector.

[0073] In practical applications, if positive pressure is applied using positive pressure gas (when the wafer is disconnected, the fixed switch is closed, and the release switch is opened, positive pressure gas is blown towards the back of the wafer to achieve the release effect), the connection method is a gas pipe + connector. If, in application, the gas pipe is only connected to the inside of the equipment, then the end of the release switch is an open end.

[0074] like Figures 1 to 12 As shown, furthermore, the first switch 10, the second switch 11, the third switch 12, and the release switch 13 are all manual valves. Quick-connect couplings are installed on the first channel output terminal 16, the second channel output terminal 17, the third channel output terminal 18, the fourth channel output terminal 19, the fifth channel output terminal 20, the first channel input terminal 21, the second channel input terminal 22, the third channel input terminal 23, the fourth channel input terminal 24, the fifth channel input terminal 25, the positive pressure connection terminal 14, and the negative pressure connection terminal 15. One-way valves 26 are installed via quick-connect couplings on the pipelines between the first channel 5 and the first switch 10, the second switch 11, and the third switch 12; on the pipelines between the second channel 6 and the release switch 13; on the pipelines between the third channel 7 and the first switch 10, the second switch 11, and the third switch 12; on the pipelines between the fourth channel 8 and the first switch 10 and the second switch 11; and on the pipelines between the fifth channel 9 and the first switch 10, the second switch 11, and the third switch 12.

[0075] The beneficial effects of adopting the above-mentioned further technical solutions are as follows: the manual valve allows users to manually adjust the switch according to actual needs. The quick-connect coupling facilitates detachable connections between pipelines and components, simplifying installation and maintenance. The check valve ensures unidirectional gas flow within the pipeline, improving the stability and reliability of the device.

[0076] The first switch 10, the second switch 11, the third switch 12, and the release switch 13 can be manual valves or circuit-controlled automatic valves. Since the wafers are manually loaded and unloaded in the end application, a manual valve was chosen.

[0077] 1. One end of the first channel input terminal 21, the second channel input terminal 22, the third channel input terminal 23, the fourth channel input terminal 24, and the fifth channel input terminal 25 is connected to the first channel output terminal 16, the second channel output terminal 17, the third channel output terminal 18, the fourth channel output terminal 19, and the fifth channel output terminal 20, respectively, and the other end is connected to the pneumatic module adapter (pneumatic control mechanism 3). The pneumatic module adapter has five pneumatic paths, which are connected to the connectors respectively.

[0078] 2. The connector end that connects to the pneumatic module adapter has multiple numbers of interfaces, specifically: the first air path has 4 interfaces, the second air path has 2 interfaces, the third air path has 4 interfaces, the fourth air path has 3 interfaces, and the fifth air path has 4 interfaces.

[0079] 3. Connect the interface to the gas tube (pipeline) in the previous step. Connect the negative pressure pipeline (negative pressure connection end 15) and the vacuum breaking pipeline (positive pressure connection end 14) according to the adsorption fixation and defixation.

[0080] like Figures 1 to 12 As shown, the positioning mechanism 2 further includes a pair of first positioning members 27 and a second positioning member 28. The pallet 1 is provided with a pair of first sliding grooves and a second sliding groove. The pair of first positioning members 27 are both L-shaped plates. The pair of first positioning members 27 are slidably installed in the first sliding groove, and the second positioning member 28 is slidably installed in the second sliding groove.

[0081] The beneficial effects of adopting the above-mentioned further technical solution are as follows: the first positioning element is used to fix 6-inch and 4-inch wafers, and the second positioning element is used to fix 8-inch wafers. Different positioning elements are used for positioning wafers of different sizes. The wafer slides back and forth along the groove of the positioning element, and when the flat edge of the positioning element is in complete contact with the flat edge of the wafer, the positioning effect is achieved. At this point, turning on the switch completes the fixing of the wafer.

[0082] The first positioning element and the second positioning element are installed on the wafer fixing mechanism fixing plate (plate 1).

[0083] The first positioning element is used to fix 6-inch and 4-inch wafers, and the second positioning element is used to fix 8-inch wafers. There are guide strips below the two positioning elements. The contact areas with the wafers of 6-inch and 4-inch wafers are flat (the flat area is set on the first positioning element), and the 8-inch positioning element (the second positioning element) is a small round triangle that matches the wafer notch. A notch is a special-shaped notch cut into the wafer.

[0084] like Figures 1 to 12 As shown, the positioning mechanism 2 further includes an auxiliary positioning element 29, which is an arc plate, and is placed on the support plate 1.

[0085] The beneficial effects of adopting the above-mentioned further technical solutions are that the 6-inch and 4-inch models are also equipped with separate auxiliary positioning components, which improves stability and reliability.

[0086] Furthermore, the tray 1 is connected to a base plate 30, and the base plate 30 is connected to the air circuit control mechanism 3; a pair of pick-up and drop-off slots 31 are provided on the tray 1.

[0087] The beneficial effects of adopting the above-mentioned further technical solution are: the base plate supports the tray, facilitating the connection between the tray and the gas path control mechanism; the placement and removal slots facilitate the placement and removal of wafers on the tray, improving the user experience.

[0088] The tray has multiple screw holes, and the tray can be connected to the base plate with screws.

[0089] The wafer is placed onto the wafer holding mechanism tray (tray 1). Different wafer sizes are positioned in different areas of the tray, with different positioning devices used for each size. The corresponding fixing switch is then activated to secure the wafer according to its size.

[0090] like Figure 13 As shown, in addition, this utility model also provides a compatible wafer fixing method. Based on the compatible wafer fixing device described in any of the above claims, the compatible wafer fixing method includes: placing the wafer on a tray; positioning the wafer by a positioning mechanism; and fixing the wafer by a pneumatic control mechanism.

[0091] The beneficial effects of this utility model's technical solution are as follows: A compatible wafer fixing device is designed for multiple wafers of different sizes and specifications to be tested. Through compatible mechanical mechanisms and gas path switching, it achieves the effect of fixing wafers of various sizes separately. This allows multiple sizes of wafers to be fixed using the same fixing mechanism. It eliminates the need for multiple semiconductor devices, enabling the fixing of multiple sizes of wafers and subsequent semiconductor process applications. It also eliminates the need to disassemble and replace the semiconductor fixing mechanism, thus reducing the equipment cost and labor replacement cost for wafer fixing.

[0092] Further, before the step of placing the wafer onto the pallet, the process includes: assembling a compatible wafer fixing device; the step of positioning the wafer using the positioning mechanism includes: positioning the wafer using a first positioning element when wafers of the first and second sizes are placed on the pallet; positioning the wafer using a second positioning element when wafers of the third size are placed on the pallet; the step of fixing the wafer using the pneumatic control mechanism includes: fixing the wafer of the first size by turning on a first switch; fixing the wafer of the second size by turning on a second switch; fixing the wafer of the third size by turning on a third switch; after the step of fixing the wafer using the pneumatic control mechanism, the process includes: performing wafer processing or wafer testing on the wafer; turning off the first, second, and third switches, and turning on the release switch to release the wafer.

[0093] The beneficial effects of adopting the above-mentioned further technical solution are as follows: The first positioning component is used to fix 6-inch and 4-inch wafers, and the second positioning component is used to fix 8-inch wafers. Different positioning components are used for positioning wafers of different sizes. The wafer slides back and forth along the groove of the positioning component. When the flat edge of the positioning component is in complete contact with the flat edge of the wafer, the positioning effect is achieved. At this time, the switch is turned on to complete the wafer fixing. The first switch corresponds to fixing the 8-inch wafer, the second switch corresponds to fixing the 6-inch wafer, and the third switch corresponds to fixing the 4-inch wafer. Opening the release switch connects the back of the wafer to the inside of the device, achieving an isobaric state, thereby disconnecting the back of the wafer from the fixing, allowing the wafer to be removed. By using a gas path differentiation control method, the effect of fixing wafers of different sizes can be achieved.

[0094] The first size can be 4 inches, the second size can be 6 inches, and the third size can be 8 inches.

[0095] 1. This device (compatible wafer fixing device) needs to be assembled and the gas pipeline (pipeline) connected before use.

[0096] 2. Place the wafer fixing mechanism mounting plate (plate 1) onto the wafer fixing mechanism base plate (base plate 30) and fix it in place.

[0097] 3. Connect the gas pipelines according to the corresponding relationships.

[0098] 4. The air pipes inside the air circuit control box (air circuit control mechanism 3) are connected to the air pipes (pipelines) according to the corresponding relationship.

[0099] 5. This utility model is illustrated using three sizes of wafers as examples. When a wafer of the first size is placed on the wafer fixing mechanism fixing plate (plate 1), the first positioning member 27 is used to position the wafer, and the first switch 10 is turned on to fix the wafer of that size.

[0100] 6. When the wafer of the second size is placed on the wafer fixing mechanism fixing tray (tray 1), the first positioning member 27 is used to position the wafer, and the second switch 11 is turned on to fix the wafer of that size.

[0101] 7. When the wafer of the third size is placed on the wafer fixing mechanism fixing tray (tray 1), the second positioning component is used to position the wafer, and the third switch is turned on to fix the wafer of that size.

[0102] 8. After the wafers in steps 5, 6, and 7 have completed the relevant processes or tests, turn off the corresponding switches, turn on the release switches, and remove the wafers.

[0103] Repeating the above steps allows for the multiple fixing of multiple wafers of various sizes. In this multiple fixing process, each wafer only needs to be fixed once, and only one wafer can be fixed at a time.

[0104] Those skilled in the art will understand that all or part of the steps of the above-described method embodiments can be implemented by hardware related to program instructions. The aforementioned program can be stored in a computer-readable storage medium. When executed, the program performs the steps of the above-described method embodiments; and the aforementioned storage medium includes various media capable of storing program code, such as ROM, RAM, magnetic disks, or optical disks.

[0105] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.

Claims

1. A compatible wafer fixing device, characterized in that, include: The device includes a tray, a positioning mechanism, and an air path control mechanism. The tray has a channel area, the positioning mechanism is slidably mounted on the tray, and the air path control mechanism is connected to the channel area via a pipeline.

2. The compatible wafer fixing device according to claim 1, characterized in that, The channel area includes at least one first channel, at least one second channel, at least one third channel, at least one fourth channel, and at least one fifth channel. The first channel, the second channel, the fourth channel, and the fifth channel are all arc-shaped grooves, and the third channel is an annular groove. The first channel and the second channel have the same radius, and the fourth channel and the fifth channel have the same radius. The third channel is located in the middle of the support plate. The fourth channel and the fifth channel both surround the outside of the third channel. The first channel surrounds the outside of the fifth channel, and the second channel surrounds the outside of the fourth channel. The gas path control mechanism is connected to the first channel, the second channel, the third channel, the fourth channel, and the fifth channel respectively through pipelines.

3. The compatible wafer fixing device according to claim 2, characterized in that, The gas circuit control mechanism is equipped with a first switch, a second switch, a third switch, a release switch, a positive pressure connection terminal, and a negative pressure connection terminal. The first switch is connected to the first channel, the second channel, the third channel, the fourth channel, and the fifth channel via pipelines. The second switch is connected to the first channel, the third channel, the fourth channel, and the fifth channel via pipelines. The third switch is connected to the first channel, the third channel, and the fifth channel via pipelines. The release switch is connected to the first channel, the second channel, the third channel, the fourth channel, and the fifth channel via pipelines. The negative pressure connection terminal is connected to the first switch, the second switch, and the third switch via pipelines. The positive pressure connection terminal is connected to the release switch via pipelines.

4. A compatible wafer fixing device according to claim 3, characterized in that, The tray is equipped with a first channel output terminal, a second channel output terminal, a third channel output terminal, a fourth channel output terminal, and a fifth channel output terminal. These output terminals are connected to the first, second, third, fourth, and fifth channels respectively via pipelines. The gas path control mechanism is equipped with a first channel input terminal, a second channel input terminal, a third channel input terminal, a fourth channel output terminal, and a fifth channel input terminal. These input terminals are connected to the first channel output terminal, the second channel output terminal, the third channel input terminal, the fourth channel input terminal, and the fifth channel input terminal via pipelines. The first switch is connected to the first, second, third, fourth, and fifth channel input terminals via conduits. The second switch is connected to the first, third, fourth, and fifth channel input terminals via conduits. The third switch is connected to the first, third, and fifth channel input terminals via conduits. The release switch is connected to the first, second, third, fourth, and fifth channel input terminals via conduits.

5. A compatible wafer fixing device according to claim 4, characterized in that, The first switch, the second switch, the third switch, and the release switch are all manual valves. The first channel output terminal, the second channel output terminal, the third channel output terminal, the fourth channel output terminal, the fifth channel output terminal, the first channel input terminal, the second channel input terminal, the third channel input terminal, the fourth channel input terminal, the fifth channel input terminal, the positive pressure connection terminal, and the negative pressure connection terminal are all equipped with quick-change connectors.

6. A compatible wafer fixing device according to claim 4, characterized in that, One-way valves are installed on the pipelines between the first channel and the first switch, the second switch and the third switch, the second channel and the release switch, the third channel and the first switch, the second switch and the third switch, the fourth channel and the first switch and the second switch, and the fifth channel and the first switch, the second switch and the third switch via quick-connect couplings.

7. A compatible wafer fixing device according to claim 1, characterized in that, The positioning mechanism includes a pair of first positioning members and a second positioning member. The pallet is provided with a pair of first sliding grooves and a second sliding groove. The pair of first positioning members are both L-shaped plates. The pair of first positioning members are slidably installed in the first sliding groove, and the second positioning member is slidably installed in the second sliding groove.

8. A compatible wafer fixing device according to claim 7, characterized in that, The positioning mechanism includes an auxiliary positioning component, which is an arc plate, and is placed on the support plate.

9. A compatible wafer fixing device according to claim 1, characterized in that, The tray is connected to a base plate, and the base plate is connected to the air circuit control mechanism.

10. A compatible wafer fixing device according to claim 1, characterized in that, The pallet is provided with a pair of pick-up and drop-off slots.

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