Wafer pre-treatment heating and uniformity platform

Abstract

The utility model is suitable for the technical field of semiconductor processing, provides a kind of wafer pretreatment heating uniform temperature platform, including pre-warming storehouse;Four groups of L-shaped guide plates are uniformly fixed in pre-warming storehouse inner bottom surface;Several wafer bearing discs are slidably arranged between four groups of L-shaped guide plates;Wafer bearing disc opposite two sides are fixed with ear plate symmetrically;Pre-warming storehouse inner bottom surface is symmetrically provided with the clamping part for clamping corresponding wafer bearing disc;Clamping part includes the clamping piece fixedly installed in pre-warming storehouse inner bottom surface and the sliding piece slidably arranged in pre-warming storehouse inner bottom surface, the device is placed to four groups of L-shaped guide plates between from top to bottom in turn by each group of wafer bearing disc, and the stacking feeding of wafer bearing disc is completed, the linkage cooperation of clamping piece and sliding piece is realized, the synchronous clamping of clamping piece to each group of wafer bearing disc is realized, the jacking of each group of wafer bearing disc is completed, so that heat exchange space is formed between adjacent wafer bearing disc, and the pre-warming efficiency of wafer is improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor processing technology, and more specifically, it relates to a wafer pretreatment heating and homogenization platform. Background Technology

[0002] In existing technologies, the preheating method for wafers is mostly to continuously introduce hot / cold air into the preheating chamber through hot / cold air inlet pipes to achieve preheating / precooling of the wafer.

[0003] However, most existing technologies stack multiple wafer carriers in a preheating chamber, which causes the multi-layer wafers to block each other when preheating / precooling simultaneously, affecting the uniformity of heat exchange and thus reducing the wafer preprocessing efficiency. Utility Model Content

[0004] To address the shortcomings of existing technologies, the purpose of this utility model is to provide a wafer pre-processing heating and equalization platform. An external robotic arm places each set of wafer carrier trays sequentially from top to bottom between four sets of L-shaped guide plates, completing the stacking and loading of the wafer carrier trays. Through the coordinated operation of clamping and sliding components, the clamping components synchronously clamp each set of wafer carrier trays and simultaneously lift each set of wafer carrier trays, creating a heat exchange space between adjacent wafer carrier trays and improving the pre-temperature efficiency of the wafers.

[0005] To achieve the above objectives, the present invention provides the following technical solution: A wafer pre-processing heating and homogenization platform includes a preheating chamber; four sets of L-shaped guide plates are uniformly fixed on the bottom surface of the preheating chamber; a plurality of wafer carrier plates are slidably arranged from top to bottom between the four sets of L-shaped guide plates; ear plates are symmetrically fixed on opposite sides of the wafer carrier plates; clamping parts for clamping the corresponding wafer carrier plates are symmetrically arranged on the bottom surface of the preheating chamber; the clamping parts include clamping members fixedly installed on the bottom surface of the preheating chamber and sliding members slidably arranged on the bottom surface of the preheating chamber.

[0006] The present invention is further configured such that: the clamping member includes a fixing plate fixedly installed on the bottom surface of the preheating chamber; U-shaped seats are symmetrically fixed on the surface of the fixing plate; a plurality of lifting blocks are slidably arranged from top to bottom between the two U-shaped seats; a sliding rod is slidably arranged through the inside of the lifting block; a slide rail is fixed on the outer wall of the sliding rod; a sliding hole is opened inside the lifting block to slide with the sliding rod; a sliding groove is opened on the inner wall of the sliding hole to slide with the slide rail.

[0007] The present invention is further configured such that: one end of the slide rod is fixed with a U-shaped clamp plate that is inserted and engaged with the corresponding ear plate; an extension rod is fixed on the bottom surface of the U-shaped clamp plate; a ball head is fixed at the bottom end of the extension rod; and support plates are fixed on the sides of the two U-shaped seats near their bottoms.

[0008] The present invention is further configured such that: a guide ball is fixed to the other end of the slide rod; a return spring sleeved on the slide rod is connected between the guide ball and the lifting block; L-shaped seats are symmetrically fixed to the sides of the two U-shaped seats near their tops; a winding roller is rotatably arranged between the two L-shaped seats; a connecting rope is wound on the winding roller; one end of the connecting rope is fixedly connected to the surface of the uppermost lifting block; adjacent lifting blocks are connected by pull ropes.

[0009] The present invention is further configured such that: the sliding member includes a sliding plate that slides in cooperation with the bottom surface of the preheating chamber; a guide rod that slides through the preheating chamber is fixed on the side of the sliding plate; a connecting plate is fixed between the ends of the two guide rods; a first electric push rod is fixed on the side of the preheating chamber; and the telescopic end of the first electric push rod is fixedly connected to the side of the connecting plate.

[0010] The present invention is further configured such that: a gear is fixed to the end of the take-up roller; a guide plate is fixed to the surface of the slide plate; an inclined guide plate is fixed to the side of the guide plate; and a toothed plate that meshes with the gear is fixed to the side of the guide plate.

[0011] The present invention is further configured such that: a lifting rod is symmetrically and slidably arranged through the bottom surface of the preheating chamber; a lifting plate is fixed between the top ends of the two lifting rods; an installation base is fixedly installed on the bottom surface of the preheating chamber; a second electric push rod is fixedly installed on the surface of the installation base; a support platform is fixedly installed at the telescopic end of the second electric push rod; and the bottoms of the two lifting rods are fixedly installed on the surface of the support platform.

[0012] The present invention is further configured such that: the inner wall of the preheating chamber is provided with a heat insulation layer; the top of the preheating chamber is provided with a sealing cover; and a hot air inlet pipe and a cold air inlet pipe are sequentially connected to the side of the preheating chamber.

[0013] The advantages of this utility model are: This invention uses an external robotic arm to place each set of wafer carrier trays sequentially from top to bottom between four sets of L-shaped guide plates, completing the stacking and loading of the wafer carrier trays. Through the coordinated operation of the clamping and sliding components, the clamping components synchronously clamp each set of wafer carrier trays, while simultaneously lifting each set of wafer carrier trays, thus creating a heat exchange space between adjacent wafer carrier trays and improving the preheating efficiency of the wafers. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the structure of a wafer pretreatment heating and homogenization platform according to the present invention.

[0015] Figure 2 For the present utility model Figure 1 A structural diagram from a frontal viewpoint.

[0016] Figure 3 For the present utility model Figure 1 A structural diagram from a top-down perspective.

[0017] Figure 4 This is a schematic diagram of the wafer carrier disk and sliding component assembly of this utility model.

[0018] Figure 5 For the present utility model Figure 4 A structural diagram from a top-down perspective.

[0019] Figure 6 This is a schematic diagram of the structure of the wafer carrier disk of this utility model.

[0020] Figure 7 This is a schematic diagram of the clamping part of this utility model.

[0021] Figure 8 For the present utility model Figure 7 Enlarged view of region A.

[0022] Figure 9 For the present utility model Figure 7 A structural diagram from a frontal viewpoint.

[0023] In the diagram: 1. Preheating chamber; 2. L-shaped guide plate; 3. Wafer carrier plate; 4. Ear plate; 5. Clamping part; 6. Clamping component; 7. Sliding component; 8. Fixing plate; 9. U-shaped seat; 10. Lifting block; 11. Slide rod; 12. Slide rail; 13. Slide groove; 14. U-shaped clamping plate; 15. Extension rod; 16. Ball head; 17. Support plate; 18. Guide ball; 19. Return spring; 20. L-shaped seat; 21. Take-up roller; 22. Connecting rope; 23. Slide plate; 24. Guide rod; 25. Connecting plate; 26. First electric push rod; 27. Gear; 28. Guide plate; 29. ​​Inclined guide plate; 30. Gear plate; 31. Lifting rod; 32. Lifting plate; 33. Mounting seat; 34. Second electric push rod; 35. Support platform; 36. Hot air inlet pipe; 37. Cold air inlet pipe. Detailed Implementation

[0024] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0025] It should be noted that, unless otherwise specified, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains.

[0026] In this utility model, unless otherwise stated, the orientations used, such as "up" and "down", usually refer to the direction shown in the accompanying drawings, or to the vertical, perpendicular, or gravitational direction; similarly, for ease of understanding and description, "left" and "right" usually refer to the left and right shown in the accompanying drawings; "inner" and "outer" refer to the inner and outer contours of each component itself, but the above directional terms are not used to limit this utility model.

[0027] Example 1, please refer to Figure 1-9 The present invention provides the following technical solution: Specifically, it refers to a wafer pre-processing heating and homogenization platform, including a preheating chamber 1; four sets of L-shaped guide plates 2 are uniformly fixed on the bottom surface of the preheating chamber 1; a number of wafer carrier plates 3 are slidably arranged from top to bottom between the four sets of L-shaped guide plates 2; ear plates 4 are symmetrically fixed on opposite sides of the wafer carrier plates 3; clamping parts 5 for clamping the corresponding wafer carrier plates 3 are symmetrically arranged on the bottom surface of the preheating chamber 1; the clamping parts 5 include clamping members 6 fixedly installed on the bottom surface of the preheating chamber 1 and sliding members 7 slidably arranged on the bottom surface of the preheating chamber 1.

[0028] The specific application of this embodiment is as follows: an external robotic arm places each set of wafer carrier trays 3 from top to bottom between four sets of L-shaped guide plates 2 to complete the stacking and loading of wafer carrier trays 3. Through the linkage of clamping member 6 and sliding member 7, the clamping member 6 synchronously clamps each set of wafer carrier trays 3 and simultaneously lifts each set of wafer carrier trays 3, so that heat exchange space is formed between adjacent wafer carrier trays 3, thereby improving the preheating efficiency of the wafers.

[0029] Example 2, please refer to Figure 1-9 This second embodiment is an improvement on the first embodiment. Specifically, the clamping member 6 includes a fixed plate 8 fixedly installed on the bottom surface of the preheating chamber 1; U-shaped seats 9 are symmetrically fixed on the surface of the fixed plate 8; a plurality of lifting blocks 10 are slidably arranged from top to bottom between the two U-shaped seats 9; a sliding rod 11 is slidably arranged through the inside of the lifting block 10; a slide rail 12 is fixed on the outer wall of the sliding rod 11; a sliding hole is opened inside the lifting block 10 to slide with the sliding rod 11; a sliding groove 13 is opened on the inner wall of the sliding hole to slide with the slide rail 12.

[0030] One end of the slide bar 11 is fixed with a U-shaped clamp 14 that is inserted into the corresponding ear plate 4; an extension rod 15 is fixed to the bottom surface of the U-shaped clamp 14; a ball head 16 is fixed to the bottom end of the extension rod 15; and a support plate 17 is fixed to the sides of the two U-shaped seats 9 near their bottom.

[0031] A guide ball 18 is fixed to the other end of the slide rod 11; a return spring 19 sleeved on the slide rod 11 is connected between the guide ball 18 and the lifting block 10; L-shaped seats 20 are symmetrically fixed on the sides of the two U-shaped seats 9 near their tops; a winding roller 21 is rotatably arranged between the two L-shaped seats 20; a connecting rope 22 is wound on the winding roller 21; one end of the connecting rope 22 is fixedly connected to the surface of the uppermost lifting block 10; adjacent lifting blocks 10 are connected by a pull rope.

[0032] The sliding component 7 includes a sliding plate 23 that slides in cooperation with the bottom surface of the preheating chamber 1; a guide rod 24 that slides through the preheating chamber 1 is fixed on the side of the sliding plate 23; a connecting plate 25 is fixed between the ends of the two guide rods 24; a first electric push rod 26 is fixed on the side of the preheating chamber 1; the telescopic end of the first electric push rod 26 is fixedly connected to the side of the connecting plate 25.

[0033] A gear 27 is fixed to the end of the take-up roller 21; a guide plate 28 is fixed to the surface of the slide plate 23; an inclined guide plate 29 is fixed to the side of the guide plate 28; and a toothed plate 30 that meshes with the gear 27 is fixed to the side of the guide plate 28.

[0034] A lifting rod 31 is symmetrically and slidably installed through the bottom surface of the preheating chamber 1; a lifting plate 32 is fixed between the top ends of the two lifting rods 31; an installation base 33 is fixedly installed on the bottom surface of the preheating chamber 1; a second electric push rod 34 is fixedly installed on the surface of the installation base 33; a support platform 35 is fixed to the telescopic end of the second electric push rod 34; and the bottoms of the two lifting rods 31 are fixedly installed on the surface of the support platform 35.

[0035] The mounting base 33 is equipped with a controller, which controls each group of electrical components. By controlling the activation of the second electric push rod 34, the support platform 35 is connected to the two sets of lifting rods 31 and slides upward, thereby driving the lifting plate 32 to lift and unload the wafer carrier disk 3.

[0036] The inner wall of the preheating chamber 1 is provided with an insulation layer; the top of the preheating chamber 1 is provided with a sealing cover; and the side of the preheating chamber 1 is connected to a hot air inlet pipe 36 and a cold air inlet pipe 37 in sequence.

[0037] Hot air / cold air is continuously supplied into the preheating chamber 1 through hot air inlet pipe 36 / cold air inlet pipe 37 to complete the preheating / precooling of the wafer.

[0038] One specific application of this embodiment is: After the stacking and loading of the wafer carrier 3 is completed, the lowest ball head 16 presses on the surface of the support plate 17, and the other groups of ball heads 16 press on the surface of the U-shaped clamps 14 below. Each group of U-shaped clamps 14 corresponds to the ear plate 4 on the side of the wafer carrier 3.

[0039] Under the elastic action of the return spring 19, each group of guide balls 18 abuts against the inclined side of the inclined guide plate 29. By controlling the start of the first electric push rod 26, it is retracted, causing each group of guide balls 18 to slide from the inclined guide plate 29 to the side of the guide plate 28. During this process, each group of guide balls 18 is squeezed by the inclined guide plate 29, thereby driving the slide rod 11 to move along the lifting block 10 towards the direction close to the wafer carrier disk 3. The corresponding return spring 19 is compressed. When the guide ball 18 slides to the side of the guide plate 28, each group of ear plates 4 is inserted into the corresponding U-shaped clamping plate 14, and the gear 27 meshes with the toothed plate 30.

[0040] The first electric push rod 26 continues to retract, causing the slide plate 23, guide plate 28 and toothed plate 30 to move together. At this time, the guide ball 18 slides relative to the side of the guide plate 28. At the same time, the movement of the toothed plate 30 drives the gear 27 meshing with it to rotate, which in turn drives the winding roller 21 to rotate, thereby winding up the connecting rope 22. This pulls the uppermost lifting block 10 to slide up along the inner wall of the two U-shaped seats 9. Through the connection of each set of pull ropes, each set of lifting blocks 10 is pulled in sequence, so that each set of lifting blocks 10 slides up, thereby realizing the rise of each set of wafer carrier disks 3. This completes the lifting and separation between adjacent wafer carrier disks 3, forming a heat exchange space between adjacent wafer carrier disks 3, and improving the preheating efficiency of the wafers.

[0041] Obviously, the embodiments described above are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of this utility model.

[0042] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0043] It should be noted that the terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in sequences other than those illustrated or described herein.

[0044] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

[0045] The above description is merely a preferred embodiment of this utility model. The protection scope of this utility model is not limited to the above embodiments. All technical solutions falling within the scope of this utility model's concept are protected. It should be noted that for those skilled in the art, any improvements and modifications made without departing from the principle of this utility model should also be considered within the protection scope of this utility model.

Claims

1. A wafer pre-processing heating and homogenization platform, comprising a pre-temperature chamber (1); characterized in that: Four sets of L-shaped guide plates (2) are evenly fixed on the bottom surface of the preheating chamber (1); several wafer carrier disks (3) are slidably arranged between the four sets of L-shaped guide plates (2) from top to bottom. The wafer carrier disk (3) has ear plates (4) fixed symmetrically on both sides; the bottom surface of the preheating chamber (1) is symmetrically provided with clamping parts (5) for clamping the corresponding wafer carrier disk (3); the clamping parts (5) include clamping members (6) fixedly installed on the bottom surface of the preheating chamber (1) and sliding members (7) slidably installed on the bottom surface of the preheating chamber (1).

2. The wafer pretreatment heating and homogenization platform according to claim 1, characterized in that: The clamping component (6) includes a fixed plate (8) fixedly installed on the bottom surface of the preheating chamber (1); U-shaped seats (9) are symmetrically fixed on the surface of the fixed plate (8); a plurality of lifting blocks (10) are slidably arranged between the two U-shaped seats (9) from top to bottom; a sliding rod (11) is slidably arranged through the inside of the lifting block (10); a slide rail (12) is fixed on the outer wall of the slide rod (11); a sliding hole is opened inside the lifting block (10) to slide with the slide rod (11); a sliding groove (13) is opened on the inner wall of the sliding hole to slide with the slide rail (12).

3. The wafer pretreatment heating and homogenization platform according to claim 2, characterized in that: One end of the slide bar (11) is fixed with a U-shaped clamp (14) that is inserted into the corresponding ear plate (4); an extension rod (15) is fixed on the bottom surface of the U-shaped clamp (14); a ball head (16) is fixed at the bottom end of the extension rod (15); and a support plate (17) is fixed on the sides of the two U-shaped seats (9) near their bottom.

4. The wafer pretreatment heating and homogenization platform according to claim 3, characterized in that: A guide ball (18) is fixed to the other end of the slide rod (11); a return spring (19) sleeved on the slide rod (11) is connected between the guide ball (18) and the lifting block (10); L-shaped seats (20) are symmetrically fixed to the sides of the two U-shaped seats (9) near their tops; a winding roller (21) is rotatably arranged between the two L-shaped seats (20); a connecting rope (22) is wound on the winding roller (21); one end of the connecting rope (22) is fixedly connected to the surface of the uppermost lifting block (10); adjacent lifting blocks (10) are connected by a pull rope.

5. The wafer pretreatment heating and homogenization platform according to claim 4, characterized in that: The sliding component (7) includes a sliding plate (23) that slides in cooperation with the bottom surface of the preheating chamber (1); a guide rod (24) that slides through the preheating chamber (1) is fixed on the side of the sliding plate (23); a connecting plate (25) is fixed between the ends of the two guide rods (24); a first electric push rod (26) is fixed on the side of the preheating chamber (1); the telescopic end of the first electric push rod (26) is fixedly connected to the side of the connecting plate (25).

6. The wafer pretreatment heating and homogenization platform according to claim 5, characterized in that: The take-up roller (21) is fixed with a gear (27) at its end; a guide plate (28) is fixed on the surface of the slide plate (23); an inclined guide plate (29) is fixed on the side of the guide plate (28); and a toothed plate (30) that meshes with the gear (27) is fixed on the side of the guide plate (28).

7. The wafer pretreatment heating and homogenization platform according to claim 6, characterized in that: The preheating chamber (1) has a symmetrically sliding lifting rod (31) slidably installed on its inner bottom surface; a lifting plate (32) is fixed between the top ends of the two lifting rods (31); a mounting base (33) is fixedly installed on the bottom surface of the preheating chamber (1); a second electric push rod (34) is fixedly installed on the surface of the mounting base (33); a support platform (35) is fixed to the telescopic end of the second electric push rod (34); and the bottoms of the two lifting rods (31) are fixedly installed on the surface of the support platform (35).

8. The wafer pretreatment heating and homogenization platform according to claim 7, characterized in that: The preheating chamber (1) has an insulation layer on its inner wall; a sealing cover is provided on the top of the preheating chamber (1); and a hot air inlet pipe (36) and a cold air inlet pipe (37) are sequentially connected to the side of the preheating chamber (1).

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