A self-positioning soldered lead frame

Abstract

The utility model relates to the technical field of semiconductor, especially a lead frame of self-positioning welding, it includes several frame main parts, several frame main parts are connected through several connecting pieces, the frame main part is provided with chip base island through several fixed rods, the inner wall of frame main part is provided with several pins respectively, the utility model discloses the tapering piece of pin top front end can guide the automatic convergence of solder to the center of chip pin when welding, realizes the self-calibration of welding position by surface tension, effectively reduces the welding defects such as false welding, short circuit, improves the welding quality.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and in particular to a self-positioning soldering lead frame. Background Technology

[0002] In the field of semiconductor packaging, lead frames serve as a crucial carrier connecting chips to external circuits, and their soldering accuracy and stability directly affect the performance of electronic products. Traditional lead frames rely heavily on manual labor or complex mechanical fixtures for positioning during chip assembly, resulting in low efficiency, large positioning deviations, and a tendency to cause soldering defects such as cold solder joints and short circuits, thereby reducing product yield. Utility Model Content

[0003] The purpose of this invention is to provide a self-positioning welding lead frame to solve the problems mentioned in the background art.

[0004] To achieve the above objectives, this utility model provides the following technical solution, which includes several frame bodies connected to each other by several connectors. A chip base island is provided inside each frame body by several fixing rods, and several pins are respectively provided on the inner wall of each side of the frame body.

[0005] As a preferred embodiment of this utility model, a tapered part is provided at the top front end of each pin.

[0006] As a preferred embodiment of this utility model, L-shaped limiting angles are provided at the top four corners of the chip base island, and the outer surface of each L-shaped limiting angle is provided with a molybdenum disulfide (MoS2)-epoxy resin composite coating.

[0007] As a preferred embodiment of this utility model, hollow ceramic microspheres with a diameter of 0.5 μm are uniformly dispersed in the molybdenum disulfide (MoS2)-epoxy resin composite coating.

[0008] As a preferred embodiment of this utility model, the chip base island has a mounting slot at its center, and each mounting slot is provided with a magnetic block, with a shielding layer on top of the magnetic block.

[0009] In a preferred embodiment of this utility model, the shielding layer is a soft magnetic material.

[0010] Compared with the prior art, the above-mentioned technical solution of this utility model has the following beneficial technical effects: This invention utilizes L-shaped limiting angles at the four corners of the chip base island, combined with a molybdenum disulfide (MoS2)-epoxy resin composite coating and hollow ceramic microspheres, to achieve rapid pre-positioning of the chip, reduce friction during placement, and allow the chip to smoothly slide into the accurate position. At the same time, the magnetic block at the center of the chip base island attracts the corresponding magnetic components of the chip, further ensuring automatic alignment between the chip and the lead frame, thus improving positioning accuracy and efficiency.

[0011] This invention uses a tapered component at the front end of the pin to guide the solder to automatically converge towards the center of the chip pin during welding. It utilizes surface tension to achieve self-calibration of the welding position, effectively reducing welding defects such as cold solder joints and short circuits, and improving welding quality.

[0012] This invention uses a soft magnetic material shielding layer on top of the magnetic block to confine the magnetic lines of force generated by the magnetic block inside, thereby avoiding electromagnetic interference to the chip circuit and ensuring the normal operation of the chip. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is a schematic diagram of the main frame structure of this utility model; Figure 3 for Figure 2 Enlarged view of point A in the middle; Figure 4 for Figure 2 Enlarged view at point B in the middle; Figure 5 This is a schematic diagram of the structure of the magnetic block when it is unfolded according to this utility model.

[0014] Reference numerals: Frame body 1, mounting groove 10, magnetic block 11, shielding layer 12, fixing rod 2, chip base island 3, pin 4, tapered part 40, L-shaped limiting angle 5, molybdenum disulfide (MoS2)-epoxy resin composite coating 6, connector 7. Detailed Implementation

[0015] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to specific embodiments and accompanying drawings. It should be understood that these descriptions are merely exemplary and not intended to limit the scope of this utility model. Furthermore, descriptions of well-known structures and technologies are omitted in the following description to avoid unnecessarily obscuring the concept of this utility model.

[0016] like Figures 1-5 As shown, the present invention proposes a self-positioning soldering lead frame, which includes multiple frame bodies 1, and the frame bodies 1 are connected by connectors 7. It can be disassembled after production. The frame body 1 is provided with a chip base island 3, which is supported by a fixing rod 2, and pins 4 are distributed on the inner walls around it. Each pin 4 has a tapered part 40 at the top front end. During soldering, the tapered part 40 can use the surface tension of the solder to guide the solder to automatically converge towards the center of the chip pin 4, realizing the self-calibration of the soldering position and effectively reducing soldering defects such as cold solder joints and short circuits. L-shaped limiting angles 5 are welded to the top four corners of the chip base island 3 to mechanically position the chip. The outer surface of the L-shaped limiting angles 5 is coated with a molybdenum disulfide (MoS2)-epoxy resin composite coating 6. Hollow ceramic microspheres are dispersed in the coating to reduce the friction when the chip is placed, so that the chip can slide into the limiting angle more smoothly and accurately reach the preset position. A mounting slot 10 is opened in the center of the chip base island 3, a magnetic block 11 is embedded and fixed with glue, and a shielding layer 12 made of soft magnetic material is covered on the top of the magnetic block 11. The shielding layer 12 is attached by electroplating process. The magnetic block 11 and the magnetic components at the corresponding positions of the chip attract each other, realizing the automatic alignment of the chip and the lead frame. The soft magnetic shielding layer 12 can constrain the magnetic lines of force and prevent the magnetic field generated by the magnetic block 11 from interfering with the normal operation of the chip circuit.

[0017] It should be understood that the specific embodiments described above are merely illustrative or explanatory of the principles of this utility model and do not constitute a limitation thereof. Therefore, any modifications, equivalent substitutions, improvements, etc., made without departing from the spirit and scope of this utility model should be included within its protection scope. Furthermore, the appended claims are intended to cover all variations and modifications falling within the scope and boundaries of the appended claims, or equivalent forms of such scope and boundaries.

Claims

1. A self-positioning welded lead frame, comprising a plurality of frame bodies (1), wherein the plurality of frame bodies (1) are connected to each other by a plurality of connectors (7), characterized in that: The chip base island (3) is provided inside the frame body (1) by several fixing rods (2), and several pins (4) are provided on each side inner wall of the frame body (1). Each of the pins (4) has a tapered part (40) at the top front end. The chip base island (3) is provided with L-shaped limiting angles (5) at the top four corners, and each L-shaped limiting angle (5) is provided with a molybdenum disulfide (MoS2)-epoxy resin composite coating (6) on its outer surface. Hollow ceramic microspheres with a diameter of 0.5 μm are uniformly dispersed in the molybdenum disulfide (MoS2)-epoxy resin composite coating (6); The chip base island (3) has a mounting slot (10) in the center, and a magnetic block (11) is provided in each mounting slot (10). A shielding layer (12) is provided on the top of the magnetic block (11).

2. The self-positioning welded lead frame according to claim 1, characterized in that: The shielding layer (12) is made of soft magnetic material.

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