A solder resist four-side frame leaving package substrate and manufacturing device

Abstract

The utility model relates to a kind of packaging substrate of solder resist four edges keep edge and manufacturing device, belong to the technical field of semiconductor integrated circuit packaging substrate;Packaging substrate, including substrate body, the substrate body four edges are provided with first keep edge area, second keep edge area, third keep edge area and fourth keep edge area, the first keep edge area and second keep edge area are located substrate body left and right sides, the third keep edge area and fourth keep edge area are located substrate body upper and lower sides;Manufacturing device, including coating roller, the length of the coating roller is consistent with the length of first keep edge area and second keep edge area inboard, the most outside 3mm place of the coating roller reduces 300um texture width;Can effectively avoid ink waste and after-process production difficult problem.

Description

Technical Field

[0001] This utility model relates to a packaging substrate with solder resist edges on all four sides and a manufacturing apparatus, belonging to the field of semiconductor integrated circuit packaging substrate technology. Background Technology

[0002] Packaging substrates are typically manufactured using large-board designs with a length > 600mm and a width > 500mm. Under this industry standard, solder mask application usually employs a three-sided full-side application method, i.e., leaving one side unpainted. This method can accommodate packaging substrates of various sizes, such as... Figure 1 As shown. However, this type of edge-leaving method has the following disadvantages:

[0003] 1. Ink waste: Applying ink to all three sides results in a significant waste of ink;

[0004] 2. Difficulties in subsequent production processes: After ink is applied to three sides, the ink on the board edges will affect the gripping of the clamping points of the subsequent equipment, increasing the risk of board falling (the gripping points will be gripped by the ink, reducing the adsorption capacity). At the same time, ink overflow from the board edges will also contaminate subsequent equipment, and the contaminated equipment may also contaminate the products in the later production process, leading to abnormalities such as missing solder resist and foreign objects.

[0005] For example, Chinese Patent Publication No. CN116053145A discloses a process method for preventing solder overflow during the brazing of an AMB substrate. The specific steps include: S1. First, a ceramic groove is pre-formed around the edge of the AMB ceramic copper-clad laminate substrate; S2. The AMB ceramic copper-clad laminate substrate is cleaned and dried to obtain a ceramic sheet with a clean surface morphology; S3. Active solder is screen-printed onto the surface of the ceramic sheet to obtain an active brazing layer with a uniform active solder metal powder structure; S4. Oxygen-free copper foil is attached to the surface of the ceramic sheet, covering the ceramic groove and positioning the oxygen-free copper foil; S5. During the brazing process, the oxygen-free copper foil, the active brazing layer, and the AMB ceramic copper-clad laminate substrate are fully brazed and fused; S6. The ceramic groove blocks the diffusion path of the active solder, and the ceramic groove provides a buffer for the flow of molten solder, preventing solder overflow. However, solder differs from ink, and the groove is complex to manufacture. Utility Model Content

[0006] The main purpose of this utility model is to provide a packaging substrate with four-sided solder resist edge and manufacturing device, which can effectively avoid ink waste and difficulties in subsequent production processes.

[0007] To achieve the above objectives, the technical solution adopted by this utility model is as follows:

[0008] A solder mask packaging substrate with four-sided edge protection includes a substrate body. The substrate body has a first edge protection area, a second edge protection area, a third edge protection area and a fourth edge protection area on its four sides. The first edge protection area and the second edge protection area are located on the left and right sides of the substrate body, and the third edge protection area and the fourth edge protection area are located on the top and bottom sides of the substrate body.

[0009] By setting edge areas on all four sides of the substrate body, a clear operating boundary and spatial layout are provided for the subsequent solder mask process. This effectively prevents the solder mask ink from overflowing beyond the substrate edge during the coating process, improving the processing accuracy and quality stability of the packaging substrate. At the same time, it facilitates other processing operations on the substrate edge, ensuring the smooth progress of the entire packaging substrate production process.

[0010] Preferably, the width of the first, second, third, and fourth margin areas is 8mm.

[0011] Setting the width of the four-sided margin area to a uniform 8mm provides a standardized dimensional specification for the solder resist process. This allows for more precise control of the ink coating range during production, ensuring consistency across batches, reducing quality issues caused by inconsistent margin dimensions, and improving production efficiency and product qualification rate.

[0012] Of course, depending on the different substrate sizes, the width of the four-sided margin area can also be set to other sizes, such as 2mm, 10mm, 20mm, etc.

[0013] Preferably, an ink collection area is provided on the inner side of both the first and second edge areas, and the width of the ink collection area is 6mm, with the outermost 3mm having a reduced texture width of 300um.

[0014] A specific ink collection area is set inside the first and second edge areas, and the texture width is reduced by 300um at the outermost 3mm of the ink collection area. This design can effectively collect excess ink during the coating process, prevent uneven ink accumulation at the edge of the edge area, make the ink distribution more uniform, further improve the quality of the solder resist layer, reduce defects caused by ink accumulation, and improve the performance of the packaging substrate.

[0015] An apparatus for manufacturing a solder resist four-sided encapsulation substrate, as described above, includes a coating roller. The length of the coating roller is consistent with the length of the inner side of the first and second edge areas. The outermost 3mm of the coating roller has a reduced texture width of 300µm.

[0016] The coating roller in the fabrication device has the same length as the inner length of the first and second edge areas, and the texture width is reduced by 300um at the outermost 3mm. This design allows the coating roller to accurately correspond to the coating requirements of the substrate edge area, ensuring that the ink is evenly coated in the edge area. At the same time, in conjunction with the design of the ink collection area, it can better control the amount and distribution of ink coating, and improve the quality and production efficiency of the solder resist layer.

[0017] Preferably, it also includes a bottom scraper, which is located in front of the fourth margin area. The bottom scraper cuts down at a position 8mm below the bottom edge of the substrate body to scrape off the ink in the fourth margin area.

[0018] The bottom scraper is located on the front side of the fourth edge area and scrapes off the ink in the fourth edge area 8mm below the substrate body. This allows for precise control of the ink thickness and edge neatness in the fourth edge area, removing excess ink and preventing ink buildup in the fourth edge area from affecting the quality of the packaging substrate. This makes the ink treatment on all four sides of the substrate more uniform and consistent, improving the overall quality of the product.

[0019] Preferably, the angle between the bottom scraper and the substrate body is selected as 5-45°.

[0020] To achieve optimal ink removal, the angle between the bottom scraper and the substrate surface should be selected between 5-45°. This ensures that the ink is removed evenly and effectively in the fourth edge area, while minimizing damage to the substrate and improving the controllability of the production process and the stability of product quality.

[0021] Preferably, the pressure exerted between the bottom scraper and the substrate body is 0.5-3.0 kg / cm². 2 .

[0022] The pressure exerted between the bottom scraper and the substrate body is controlled at 0.5-3.0 kg / cm². 2 Within this range, the scraping force of the squeegee on the ink can be precisely controlled, which can effectively remove excess ink while avoiding damage to the substrate due to excessive pressure or incomplete ink removal due to insufficient pressure. This ensures the ink processing quality of the fourth edge area and improves the product qualification rate and production efficiency.

[0023] Preferably, the bottom scraper is made of synthetic rubber.

[0024] The bottom scraper is made of synthetic rubber, which has good elasticity, wear resistance and corrosion resistance. It can reduce scratches on the substrate body during the process of scraping ink in contact with the substrate body, while ensuring the service life of the scraper itself, reducing production costs, improving the reliability and stability of the entire manufacturing device, and facilitating long-term stable production.

[0025] The beneficial effects of this utility model are as follows:

[0026] This utility model discloses a four-sided solder resist packaging substrate and its manufacturing apparatus. The four-sided edge areas provide boundaries and specifications for the solder resist process, and the uniform width ensures product consistency. The inner ink collection area works in conjunction with a specific coating roller to ensure uniform ink distribution. The bottom scraper precisely cuts in the fourth edge area, with adjustable angle and pressure, effectively and flexibly removing excess ink. Made of synthetic rubber, it reduces damage to the substrate and extends its own lifespan. The overall design improves the quality of the solder resist layer, production efficiency, and product yield, ensuring a smooth and stable packaging substrate production process; it effectively avoids ink waste and difficulties in subsequent production processes. Attached Figure Description

[0027] Figure 1 The background technology describes a typical production method for solder resist ink application, which involves ink application to all three sides, i.e., leaving one side untreated.

[0028] Figure 2 This is a schematic diagram of the structure of a solder resist packaging substrate with four-sided edge retention as described in this utility model;

[0029] Figure 3 This is a schematic diagram of the structure of a coating roller according to the present invention;

[0030] Figure 4 This is a structural block diagram of a bottom scraper according to the present invention;

[0031] Figure 5 This is a structural block diagram of the bottom scraper in operation according to the present invention;

[0032] Figure 6 This is a schematic diagram showing the ink application process on the packaging substrate.

[0033] In the figure: 1. Substrate body; 2. First edge area; 3. Second edge area; 4. Third edge area; 5. Fourth edge area; 6. Ink collection area; 7. Coating roller; 8. Bottom scraper; 9. Solder resist ink application area; 10. Area to reduce 300um texture width. Detailed Implementation

[0034] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the following description, in conjunction with the accompanying drawings, further elaborates on this utility model.

[0035] Example 1

[0036] like Figure 2As shown, this embodiment discloses a packaging substrate with solder mask left on all four sides, including a substrate body 1. The substrate body 1 has a first left edge area 2, a second left edge area 3, a third left edge area 4 and a fourth left edge area 5 on its four sides. The first left edge area 2 and the second left edge area 3 are located on the left and right sides of the substrate body 1, and the third left edge area 4 and the fourth left edge area 5 are located on the top and bottom sides of the substrate body 1.

[0037] The width of the first margin area 2, the second margin area 3, the third margin area 4, and the fourth margin area 5 is 8mm.

[0038] The first edge area 2 and the second edge area 3 are both provided with ink collection areas 6. The width of each ink collection area 6 is 6mm, and the outermost 3mm part has a reduced texture width of 300um.

[0039] The following two methods are used to leave four edges on the packaging substrate: innovative coating roller design 7 and addition of bottom scraper 8.

[0040] Innovative Coating Roller Design 7:

[0041] 1. Change the length of coating roller 7 to 16mm less than the product size, and reduce it by 8mm on each side;

[0042] By changing the length of the coating roller, the ink application area (i.e., the solder resist ink application area 9) can be changed most effectively, leaving the left and right sides of the packaging substrate empty and not ink applied, leaving an 8mm space on each side to reserve space for the grippers of subsequent equipment.

[0043] 2. Change the design of the 7-pattern width of the coating roller.

[0044] In conventional coating rollers 7, the overall texture width is uniform. In this embodiment, the texture width of the coating roller 7 is reduced by 300um at the outermost 3mm point (i.e., the texture width area of ​​300um is reduced by 10). After the texture of the coating roller 7 is reduced, the amount of ink applied by the coating roller 7 will also decrease. During subsequent equipment extrusion, the amount of ink overflowing can be effectively reduced, thus reducing contamination to subsequent equipment.

[0045] For example: Figure 3 As shown, the packaging substrate (i.e., substrate body 1) has dimensions of 513*623mm, an effective area of ​​485*595mm, and a coating roller 7 with a diameter of 497mm (8mm on each side). The coating roller 7 has a 300µm texture width reduced at its outermost 3mm position. The ink application on the packaging substrate is as follows. Figure 6 .

[0046] Added bottom scraper 8, such as Figure 4 As shown:

[0047] A bottom scraper 8 is added during the coating process. After the coating roller 7 applies ink, the ink at the bottom is scraped off to ensure that there is almost no ink on the bottom of the finished packaged substrate.

[0048] The bottom scraper 8 is made of synthetic rubber, which offers better elasticity and wear resistance.

[0049] The angle between the bottom scraper 8 and the board surface should be selected between 5-45° for optimal ink scraping effect.

[0050] The bottom scraper 8 exerts a pressure of 0.5-3.0 kg / cm on the board surface. 2 At this time, the board surface will not experience excessive stress that could lead to board damage.

[0051] The bottom scraper 8 cuts down at a position 8mm below the bottom edge of the packaging substrate to scrape off the ink in the 8mm area below the packaging substrate.

[0052] Specific illustrations are as follows: Figure 5 As shown: When the bottom scraper 8 is more than 8mm away from the lower edge of the plate, the bottom scraper 8 does not contact the packaging substrate and does not scrape ink. The scraping action is performed when the bottom of the packaging substrate is only 8mm away from the bottom scraper 8.

[0053] By adopting the new coating roller 7 and bottom scraper 8, the effect of leaving edges on all four sides was successfully achieved, which improved the convenience of post-processing board edge contact operation and reduced the failure rate of automated equipment board taking and unloading. It completely improved the post-processing cross-contamination caused by ink accumulation and overflow at the board edge, and reduced the scrap rate of products with foreign objects or discoloration defects. Reducing the coating area of ​​non-effective ink areas can improve the effective utilization rate of ink by more than 5%, saving costs.

[0054] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A solder resist four-sided encapsulation substrate, comprising a substrate body (1), characterized in that: The substrate body (1) has a first edge area (2), a second edge area (3), a third edge area (4) and a fourth edge area (5) on its four sides. The first edge area (2) and the second edge area (3) are located on the left and right sides of the substrate body (1), and the third edge area (4) and the fourth edge area (5) are located on the upper and lower sides of the substrate body (1). The widths of the first margin area (2), the second margin area (3), the third margin area (4) and the fourth margin area (5) are all 8mm; The first edge area (2) and the second edge area (3) are both provided with ink collection areas (6). The width of each ink collection area (6) is 6mm and the outermost 3mm is reduced by 300um texture width.

2. An apparatus for fabricating a solder resist packaging substrate with four-sided edge margins, used to fabricate the solder resist packaging substrate with four-sided edge margins as described in claim 1, comprising a coating roller (7), characterized in that: The length of the coating roller (7) is consistent with the length of the inner side of the first edge area (2) and the second edge area (3), and the texture width of the coating roller (7) is reduced by 300um at the outermost 3mm.

3. The apparatus for manufacturing a packaging substrate with solder resist edges on all four sides according to claim 2, characterized in that: It also includes a bottom scraper (8), which is located in front of the fourth margin area (5). The bottom scraper (8) cuts down at a position 8mm below the substrate body (1) to scrape off the ink in the fourth margin area (5).

4. The apparatus for manufacturing a packaging substrate with solder resist edges on all four sides according to claim 3, characterized in that: The angle between the bottom scraper (8) and the substrate body (1) is selected as 5-45°.

5. The apparatus for manufacturing a packaging substrate with solder resist edges on all four sides according to claim 3, characterized in that: The pressure exerted between the bottom scraper (8) and the substrate body (1) is 0.5-3.0 kg / cm².

6. The apparatus for manufacturing a packaging substrate with solder resist edges on all four sides according to claim 3, characterized in that: The bottom scraper (8) is made of synthetic rubber.

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