Bonding head device and die bonder

Abstract

The utility model is suitable for semiconductor processing technical field provides a kind of bonding head device and die bonder, above-mentioned bonding head device includes bonding head mounting seat, fixed frame group, adsorption mechanism, drive mechanism and pressure detection unit, pressure detection unit is set between bonding head mounting seat and fixed frame group, adsorption mechanism is movably set on fixed frame group, drive mechanism is used to drive adsorption mechanism reciprocating motion along first direction, die bonder includes above-mentioned bonding head device. Between bonding head mounting seat and fixed frame group, there is pressure detection unit, when adsorption mechanism is under the action of drive mechanism and applies pressure to chip, can detect the reaction force that fixed frame group and adsorption mechanism are received by pressure detection unit, to judge the size of pressure that adsorption mechanism applies to chip, and according to the data of detection to adjust the size of pressure, guarantee the precision of die bonding.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor processing technology, and in particular relates to a die bonding device and a die bonding machine. Background Technology

[0002] A die bonder is a piece of equipment used in semiconductor device manufacturing, its function being to connect semiconductor wafers to other components. In the operation of a die bonder, a die-feeding platform typically supports the die ring, then a die-attaching device picks up the chip from the die ring, and a drive mechanism moves the die-attaching device to a designated position. Finally, the die-attaching device presses and fixes the chip onto the substrate. However, most existing die-attaching devices have the problem of not being able to detect the pressure applied to the chip during die bonding, which seriously affects the accuracy of the bonding process. Utility Model Content

[0003] The purpose of this invention is to provide a die bonding device and a die bonding machine, which aims to solve the technical problem that existing die bonding devices cannot detect the pressure applied to the chip during die bonding.

[0004] This utility model is implemented as follows: Firstly, a chip attaching device is provided, which includes a chip attaching base, a fixing frame assembly, an adsorption mechanism, a driving mechanism, and a pressure detection unit. The pressure detection unit is disposed between the chip attaching base and the fixing frame assembly. The adsorption mechanism is movably disposed on the fixing frame assembly. The adsorption mechanism is used to pick up chips, and the driving mechanism is used to drive the adsorption mechanism to reciprocate along a first direction.

[0005] In an optional embodiment, the adsorption mechanism includes a lifting connector, an adsorption shaft assembly, and an angle adjustment component. The lifting connector is disposed on the fixed frame assembly and has a degree of freedom to move in a first direction relative to the fixed frame assembly. The first end of the adsorption shaft assembly is rotatably connected to the lifting connector, the second end of the adsorption shaft assembly is used to adsorb the chip, and the angle adjustment component is used to drive the adsorption shaft assembly to rotate around its own axis.

[0006] In an optional embodiment, the angle adjustment assembly includes a rotation drive unit and a rotating sleeve. The rotating sleeve is rotatably mounted on the fixed frame assembly. The adsorption shaft assembly passes through the rotating sleeve and is coaxially arranged with the rotating sleeve. The adsorption shaft assembly has only one degree of freedom of movement along its own axis relative to the rotating sleeve. The rotation drive unit is also mounted on the fixed frame assembly. The drive end of the rotation drive unit is connected to the rotating sleeve via a transmission connection. The rotation drive unit is used to drive the rotating sleeve to rotate, thereby causing the adsorption shaft assembly to rotate together.

[0007] In one optional embodiment, a limiting groove is provided on the outer periphery of the adsorption shaft assembly, the limiting groove being arranged in a direction parallel to the axis of the adsorption shaft assembly, and a protruding structure is provided on the inner wall of the rotating sleeve, the protruding structure being slidably disposed within the limiting groove.

[0008] In an optional embodiment, the lifting connector has a working cavity for communicating with an external pipeline, the suction shaft assembly includes a connecting shaft and a suction nozzle assembly, the first end of the connecting shaft is rotatably inserted into the working cavity, and the first end of the connecting shaft is sealed to the lifting connector, the suction nozzle assembly is disposed at the second end of the connecting shaft, and the connecting shaft also has a connecting channel for connecting the suction nozzle assembly to the working cavity.

[0009] In an optional embodiment, the driving mechanism includes a one-way pushing unit and an elastic buffer. The one-way pushing unit is disposed on the fixing frame assembly and is used to apply a pushing force toward the chip to the adsorption mechanism. The elastic buffer is disposed between the fixing frame assembly and the adsorption mechanism and is used to apply an elastic force away from the chip to the adsorption mechanism.

[0010] In an optional embodiment, the head-binding device further includes a guide rod, the axis of which is parallel to the first direction, and the guide rod is connected to one of the fixing frame assembly or the adsorption mechanism. The other of the fixing frame assembly or the adsorption mechanism is provided with a guide hole coaxial with the guide rod, and the guide rod slides through the guide hole.

[0011] In an optional embodiment, the adsorption device further includes a height detection unit for detecting the displacement of the adsorption mechanism relative to the fixing frame assembly along the first direction, and the height detection unit is disposed on the adsorption mechanism and / or the fixing frame assembly.

[0012] In an optional embodiment, the pressure detection unit is a cantilever pressure sensor, which is arranged along a second direction that is perpendicular to the first direction. The first end of the cantilever pressure sensor is connected to the head mounting base, and the second end of the cantilever pressure sensor is connected to the fixing frame assembly.

[0013] In a second aspect, a die bonder is provided, comprising the die bonding device described in any of the preceding claims.

[0014] The first aspect of this invention provides the following technical advantages: In use, the die bonding head is mounted on the drive end of the drive device, and a pressure detection unit is positioned between the die bonding head mounting head and the mounting bracket. Simultaneously, the adsorption mechanism is movably mounted on the mounting bracket, and the drive mechanism is also mounted on the mounting bracket. The drive mechanism can drive the adsorption mechanism to reciprocate along a first direction. Compared to existing die bonding devices, this invention uses a drive mechanism to drive the adsorption mechanism to reciprocate along a first direction, coordinating with the adsorption mechanism's adsorption of the chip to achieve chip removal or placement. Furthermore, during chip bonding, the drive mechanism can apply pressure to the adsorption mechanism and the chip, making the connection between the chip and the substrate more stable. Additionally, a pressure detection unit is provided between the die bonding head mounting head and the mounting bracket. When the adsorption mechanism applies pressure to the chip under the action of the drive mechanism, the pressure detection unit can detect the reaction force on the mounting bracket and the adsorption mechanism, thereby determining the magnitude of the pressure applied by the adsorption mechanism and adjusting the pressure based on the detected data, thus ensuring the accuracy of chip bonding.

[0015] It is understandable that the beneficial effects of the second aspect mentioned above can be found in the relevant descriptions in the first aspect mentioned above, and will not be repeated here. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments of this utility model or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the structure of the head-gluing device provided in this embodiment of the utility model; Figure 2 This is a cross-sectional structural schematic diagram of the head-gluing device provided in an embodiment of this utility model; Figure 3 yes Figure 2 Enlarged structural diagram at point A; Figure 4 yes Figure 2 A magnified structural diagram at point B in the middle.

[0018] Explanation of reference numerals in the attached figures: 1. Head mounting base; 2. Fixing frame assembly; 3. Adsorption mechanism; 31. Lifting connector; 311. Working chamber; 32. Adsorption shaft assembly; 321. Connecting shaft; 322. Nozzle mounting sleeve; 323. Connecting channel; 324. Limiting slide groove; 33. Angle adjustment assembly; 331. Rotating sleeve; 332. Rotation drive unit; 333. Transmission structure; 334. Protruding structure; 4. Drive mechanism; 41. One-way push unit; 411. One-way cylinder; 42. Elastic buffer; 421. Spring; 5. Guide rod; 6. Pressure detection unit; 61. Cantilever pressure sensor; 7. Height detection unit; 8. Rotating bearing. Detailed Implementation

[0019] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model. In the description of this utility model, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In this embodiment, according to Figure 1 The XYZ Cartesian coordinate system established in the diagram is defined as follows: the Z-axis can be the first direction, the X-axis can be the second direction, and the Y-axis can be the third direction. The side located in the positive direction of the X-axis is defined as front, and the side located in the negative direction of the X-axis is defined as back; the side located in the positive direction of the Y-axis is defined as right, and the side located in the negative direction of the Y-axis is defined as left; the side located in the positive direction of the Z-axis is defined as down, and the side located in the negative direction of the Z-axis is defined as up.

[0020] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified. In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0021] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments.

[0022] Please refer to Figures 1 to 4 As shown in the present invention, a chip attaching device is provided, including a chip attaching base 1, a fixing frame group 2, an adsorption mechanism 3, a driving mechanism 4, and a pressure detection unit 6. The pressure detection unit 6 is disposed between the chip attaching base 1 and the fixing frame group 2. The adsorption mechanism 3 is movably disposed on the fixing frame group 2. The adsorption mechanism 3 is used to pick up chips. The driving mechanism 4 is used to drive the adsorption mechanism 3 to reciprocate along a first direction.

[0023] Specifically, the connector mounting base 1 refers to a component with a certain volume. The connector mounting base 1 can be block-shaped, plate-shaped, or a combination of various shapes. The connector mounting base 1 can be installed onto the drive end of the connector drive device by means of fasteners, etc., and the position of the connector device can be adjusted by the connector drive device.

[0024] The fixed frame assembly 2 refers to a support component with a certain volume. The fixed frame assembly 2 can be block-shaped, plate-shaped, or a combination of various shapes. The fixed frame assembly 2 can be connected to the connector mounting base 1 via the pressure detection unit 6. Alternatively, the fixed frame assembly 2 can be movably connected to the connector mounting base 1 in other ways, and the specific installation position and method of the pressure detection unit 6 can be selected according to its specific operating mode.

[0025] The pressure detection unit 6 refers to a device component that can detect the pressure magnitude and convert the pressure signal into a readable or transmittable electrical signal. The pressure detection unit 6 can be electrically connected to the control unit to realize the transmission and analysis of the pressure signal, enabling the equipment to take corresponding actions based on the pressure magnitude.

[0026] The adsorption mechanism 3 refers to a component structure that can adsorb chips and drive their movement. The adsorption mechanism 3 can be composed of multiple parts. The adsorption mechanism 3 can adsorb chips through negative pressure, clamping, or magnetic attraction. For example, the adsorption mechanism 3 may include a connecting rod and a suction nozzle. The suction nozzle can be connected to a negative pressure pipeline to generate negative pressure at the end of the suction nozzle to pick up the chip. The suction nozzle is connected to the fixing frame assembly 2 through the connecting rod.

[0027] The drive mechanism 4 refers to a component or assembly that can drive an object to move in a straight line. The drive mechanism 4 can drive the object to reciprocate through a single component, such as a cylinder, electric push rod, or hydraulic cylinder. The drive mechanism 4 can also be a combination of multiple components. For example, a one-way cylinder 411 can be used to drive the object to move in the forward direction, and then an elastic component can be used to apply a reverse elastic force to the object. The purpose of driving the object to reciprocate is achieved through the cooperation of the one-way cylinder 411 and the elastic component. The choice can be made according to production needs, which will not be elaborated here.

[0028] In addition, it should be noted that when the bonding device is performing crystal bonding work, the driving mechanism 4 generally drives the adsorption mechanism 3 to move in the vertical direction, that is, the first direction mentioned in this article can refer to the vertical direction.

[0029] The die-bonding device provided in this embodiment of the invention is used by mounting the die-bonding mounting base 1 on the drive end of the drive device, then placing the pressure detection unit 6 between the die-bonding mounting base 1 and the fixing frame group 2, and simultaneously movably mounting the adsorption mechanism 3 on the fixing frame group 2. The drive mechanism 4 is also mounted on the fixing frame group 2, and the drive mechanism 4 can drive the adsorption mechanism 3 to reciprocate along a first direction. Compared with the die-bonding device in the prior art, the drive mechanism 4 drives the adsorption mechanism 3 to reciprocate along the first direction, and cooperates with the adsorption mechanism 3 to adsorb the chip to achieve chip picking or placement. Furthermore, during the chip fixing process, the drive mechanism 4 can apply a certain die-bonding pressure to the adsorption mechanism 3 and the chip, making the connection between the chip and the substrate or other products more stable. In addition, a pressure detection unit 6 is provided between the bonding head mounting base 1 and the fixing frame group 2. When the adsorption mechanism 3 applies pressure to the chip under the action of the driving mechanism 4, the pressure detection unit 6 can detect the reaction force on the fixing frame group 2 and the adsorption mechanism 3, thereby determining the magnitude of the pressure applied to the chip by the adsorption mechanism 3. This can achieve the purpose of real-time monitoring of the pressure during each die bonding, thereby ensuring the die bonding accuracy of the chip.

[0030] In one embodiment, see Figure 1 and Figure 2The adsorption mechanism 3 includes a lifting connector 31, an adsorption shaft assembly 32, and an angle adjustment component 33. The lifting connector 31 is mounted on the fixed frame assembly 2 and has a degree of freedom of movement along a first direction relative to the fixed frame assembly 2. The first end of the adsorption shaft assembly 32 is rotatably connected to the lifting connector 31, and the second end of the adsorption shaft assembly 32 is used to adsorb chips. The adsorption shaft assembly 32 can be movably connected to the fixed frame assembly 2 or not. The angle adjustment component 33 is used to drive the adsorption shaft assembly 32 to rotate around its own axis.

[0031] Specifically, the lifting connector 31 refers to a component with a certain volume, which can be block-shaped, plate-shaped, or a combination of various shapes. The lifting connector 31 can be directly slidably connected to the fixed frame assembly 2, or it can be connected to the drive end of the drive mechanism 4, thus achieving connection between the drive mechanism 4 and the fixed frame assembly 2. The adsorption shaft assembly 32 refers to a component composed of multiple parts and having a certain length. The second end of the adsorption shaft assembly 32 can be provided with an adsorption structure for adsorbing chips. For example, the adsorption shaft assembly 32 may include a connecting shaft 321 and a suction nozzle assembly for adsorbing chips. The suction nozzle assembly can be located at one end of the connecting shaft 321 to achieve the purpose of adsorbing chips, and the other end of the connecting shaft 321 can be rotatably connected to the lifting connector 31.

[0032] Angle adjustment component 33 refers to a component that can drive an object to rotate. Angle adjustment component 33 can be a servo motor, and a transmission structure 333 for transmitting torque is provided between the output shaft of the servo motor and the adsorption shaft assembly 32. The transmission structure 333 can be a belt drive, gear drive, or chain drive, etc.

[0033] In this embodiment, the lifting connector 31 is mounted on the fixed frame assembly 2, and the lifting connector 31 has a degree of freedom to move along the first direction relative to the fixed frame assembly 2. Simultaneously, the first end of the adsorption shaft assembly 32 is rotatably connected to the lifting connector 31, and the second end of the adsorption shaft assembly 32 is used to adsorb the chip. In use, the driving end of the driving mechanism 4 is connected to the lifting connector 31, driving the lifting connector 31 to move along the first direction. Simultaneously, the first end of the adsorption shaft assembly 32 is rotatably connected to the lifting connector 31. While the adsorption shaft assembly 32 moves along the first direction with the lifting connector 31, it can also rotate around its own axis under the action of the angle adjustment component 33. Therefore, after a chip is adsorbed at the second end of the adsorption shaft assembly 32, the orientation of the chip can be adjusted by rotating the adsorption shaft assembly 32, thereby avoiding deviations during chip installation and making chip bonding more precise.

[0034] In one embodiment, see Figure 2 and Figure 3The angle adjustment component 33 includes a rotary drive unit 332 and a rotary sleeve 331. The rotary sleeve 331 is rotatably mounted on the fixed frame assembly 2. The adsorption shaft assembly 32 passes through the rotary sleeve 331 and is coaxially mounted with the rotary sleeve 331. The adsorption shaft assembly 32 has only one degree of freedom of movement along its own axis relative to the rotary sleeve 331. The rotary drive unit 332 is also mounted on the fixed frame assembly 2. The drive end of the rotary drive unit 332 is connected to the rotary sleeve 331. The rotary drive unit 332 is used to drive the rotary sleeve 331 to rotate, so as to drive the adsorption shaft assembly 32 to rotate together.

[0035] Specifically, the rotating sleeve 331 refers to a cylindrical component of a certain length, with an installation channel running through it along its own axis. The adsorption shaft assembly 32 passes through this installation channel. A corresponding structure (e.g., a spline structure) can be provided between the inner wall of the installation channel and the adsorption shaft assembly 32, allowing the adsorption shaft assembly 32 to have only one degree of freedom of movement along its own axis relative to the rotating sleeve 331. A mounting hole can be provided on the fixing frame assembly 2, allowing the rotating sleeve 331 to be rotatably mounted within it. A rotary bearing 8 can also be provided between the rotating sleeve 331 and the inner wall of the mounting hole to facilitate the rotation of the rotating sleeve 331. The rotary drive unit 332 refers to a component or assembly capable of outputting torque. The rotary drive unit 332 can be a servo motor or a hydraulic motor, etc. The drive end of the rotary drive unit 332 and the rotating sleeve 331 can be connected via a transmission structure 333.

[0036] In this embodiment, the rotating sleeve 331 is rotatably mounted on the fixed frame assembly 2, and the adsorption shaft assembly 32 is inserted into the rotating sleeve 331 and coaxially arranged with it. Simultaneously, the adsorption shaft assembly 32 has only one degree of freedom of movement relative to the rotating sleeve 331, moving along its own axis. The driving end of the rotating drive unit 332 is connected to the rotating sleeve 331 via a transmission connection. The rotating sleeve 331 can be driven to rotate by the rotating drive unit 332, thereby causing the adsorption shaft assembly 32 to rotate together, without affecting the sliding of the adsorption shaft assembly 32 along its own axis (i.e., the first direction). This makes driving the adsorption shaft assembly 32 to rotate around its own axis more convenient while maintaining the simplicity of the angle adjustment component 33 structure.

[0037] It should be noted that in this embodiment, the adsorption shaft assembly 32 is limited by a rotating sleeve 331, ensuring that the adsorption shaft assembly 32 can only slide along its own axial direction. During die bonding, the axial direction of the adsorption shaft assembly 32 can be kept perpendicular to the die bonding plane (e.g., the axis of the adsorption shaft assembly 32 is vertical), thereby enabling the drive mechanism 4 to drive the adsorption shaft assembly 32 to move vertically up and down. Compared with the traditional swing arm drive method, this avoids the movement direction of the adsorption shaft assembly 32 from deviating from the die bonding plane on the product, improving the flatness of the die bonding plane, and achieving a die bonding flatness within 3µm.

[0038] In an optional embodiment, please refer to Figure 3 The transmission structure 333 may include a first pulley, a second pulley, and a transmission belt. The first pulley may be fitted onto the outside of the rotating sleeve 331, the second pulley may be installed on the drive end of the rotary drive unit 332, and the transmission belt may be fitted onto the outside of the first pulley and the second pulley. The transmission structure 333 adopts belt drive, which makes the position setting of the rotary drive unit 332 more flexible.

[0039] In one embodiment, see Figure 3 The outer periphery of the adsorption shaft assembly 32 is provided with a limiting groove 324, which is arranged in a direction parallel to the axis of the adsorption shaft assembly 32. The inner wall of the rotating sleeve 331 is provided with a protruding structure 334, which is slidably disposed in the limiting groove 324 and can move with the adsorption shaft assembly 32.

[0040] Specifically, the protruding structure 334 refers to a component with a certain height, which can be arranged in a direction parallel to the axis of the adsorption shaft assembly 32. The protruding structure 334 can be a separate component, installed on the inner wall of the rotating sleeve 331 by means of snap-fit, welding, or insertion. Alternatively, the protruding structure 334 can be integrally formed with the rotating sleeve 331, for example, by machining. The limiting groove 324 refers to a groove structure with a certain depth, which is also arranged in a direction parallel to the axis of the adsorption shaft assembly 32.

[0041] In this embodiment, a protruding structure 334 is provided on the inner wall of the rotating sleeve 331, and a limiting groove 324 is provided on the outer wall of the adsorption shaft assembly 32. When the adsorption shaft assembly 32 passes through the interior of the rotating sleeve 331, the protruding structure 334 can be slidably disposed within the limiting groove 324 to form a spline shaft structure. Without affecting the free sliding of the adsorption shaft assembly 32 along its own axial direction, the adsorption shaft assembly 32 can rotate together with the rotating sleeve 331, making the rotation of the adsorption shaft assembly 32 more convenient.

[0042] Furthermore, in this embodiment, a protrusion structure 334 is provided on the inner wall of the rotating sleeve 331, and a limiting groove 324 is provided on the outer wall of the adsorption shaft assembly 32. When the adsorption shaft assembly 32 passes through the interior of the rotating sleeve 331, the protrusion structure 334 can be slidably disposed in the limiting groove 324 to form a spline shaft structure, which can make the rotation accuracy of the adsorption shaft assembly 32 higher, and the rotation accuracy can reach ±0.1°.

[0043] In one embodiment, see Figure 2 and Figure 4 The lifting connector 31 has a working cavity 311 for communicating with an external pipeline. The suction shaft assembly 32 includes a connecting shaft 321 and a suction nozzle assembly (not shown in the figure). The first end of the connecting shaft 321 is rotatably inserted into the working cavity 311, and the first end of the connecting shaft 321 is sealed to the lifting connector 31. The suction nozzle assembly is disposed at the second end of the connecting shaft 321. The connecting shaft 321 also has a connecting channel 323 for connecting the suction nozzle assembly to the working cavity 311.

[0044] Specifically, the connecting shaft 321 refers to a rod-shaped component of a certain length, and the working cavity 311 refers to the accommodating space inside the lifting connector 31. The lifting connector 31 may also be provided with a pipeline structure for connecting the working cavity 311 to an external pipeline. The lifting connector 31 also has an installation channel communicating with the working cavity 311, through which the connecting shaft 321 can be inserted into the working cavity 311. A sealing ring may be provided between the connecting shaft 321 and the inner wall of the working cavity 311 to ensure a sealed connection between the first end of the connecting shaft 321 and the lifting connector 31. The connecting channel 323 refers to a channel structure of a certain length. The suction nozzle assembly refers to a component that can suck up chips through negative pressure. The structure of the suction nozzle assembly is conventional technology well known to those skilled in the art and will not be described in detail here.

[0045] In this embodiment, a working cavity 311 is provided on the lifting connector 31, and the adsorption shaft assembly 32 is divided into at least two parts: a connecting shaft 321 and a suction nozzle assembly. The first end of the connecting shaft 321 can be rotatably inserted into the working cavity 311, and the first end of the connecting shaft 321 is sealed to the lifting connector 31. The suction nozzle assembly is disposed at the second end of the connecting shaft 321, and the connecting shaft 321 also has a connecting channel 323 for connecting the suction nozzle assembly to the working cavity 311. In use, the working cavity 311 is connected to an external negative pressure pipeline, so that the connecting shaft 321 and the suction nozzle assembly can rotate while maintaining connection to the negative pressure pipeline, thus making the use of the adsorption shaft assembly 32 more convenient.

[0046] In an optional embodiment, please refer to Figure 4A rotating bearing 8 is also provided between the first end of the connecting shaft 321 and the lifting connecting member 31, which makes the rotation of the connecting shaft 321 more convenient.

[0047] In one embodiment, see Figure 2 A nozzle mounting sleeve 322 can also be provided between the nozzle assembly and the connecting shaft 321, through which the nozzle assembly and the connecting shaft 321 can be connected. Specifically, the nozzle mounting sleeve 322 refers to a cylindrical structure with a certain length. One end of the nozzle mounting sleeve 322 is fitted onto the end of the connecting shaft 321, and the nozzle assembly can be inserted into the other end of the nozzle mounting sleeve 322, making the installation of the nozzle assembly more convenient.

[0048] In one embodiment, see Figure 1 and Figure 2 The driving mechanism 4 includes a one-way pushing unit 41 and an elastic buffer 42. The one-way pushing unit 41 is disposed on the fixed frame assembly 2 and is used to apply a pushing force toward the chip to the adsorption mechanism 3. The elastic buffer 42 is disposed between the fixed frame assembly 2 and the adsorption mechanism 3 and is used to apply a spring force away from the chip to the adsorption mechanism 3. Specifically, the one-way pushing unit 41 refers to a component or assembly that can apply a pushing force in a single direction to an object. The elastic buffer 42 refers to a component with a certain elasticity, such as a spring 421, a tension spring, or a rubber component. In this embodiment, a one-way pushing unit 41 is disposed between the fixed frame assembly 2 and the adsorption mechanism 3. The driving end of the one-way pushing unit 41 can be abutted against the lifting connector 31, and a pushing force toward the chip is applied to the adsorption mechanism 3 through the one-way pushing unit 41. At the same time, an elastic buffer 42 is disposed between the fixed frame assembly 2 and the adsorption mechanism 3, and the elastic buffer 42 can apply a spring force away from the chip to the adsorption mechanism 3. During the die bonding operation, the unidirectional pushing unit 41 applies a pushing force towards the chip to the adsorption mechanism 3, allowing the chip to approach the substrate or other products. After the chip contacts the product, a certain pressure is applied to the chip. Then, after die bonding is complete, the unidirectional pushing unit 41 stops working. Finally, the elastic buffer 42 applies a spring force away from the chip to the adsorption mechanism 3, causing the adsorption mechanism 3 to move away from the chip, completing the die bonding operation. The cooperation of the unidirectional pushing unit 41 and the elastic buffer 42 simplifies the structure of the driving mechanism 4 and makes driving the adsorption mechanism 3 more convenient.

[0049] In an optional embodiment, please refer to Figure 2The one-way pushing unit 41 can be a one-way cylinder 411, and the elastic buffer 42 can be a spring 421. The one-way cylinder 411 is a component that can be driven in one direction by a pneumatic system. The pneumatic system and spring 421 work together to drive the adsorption mechanism 3, resulting in smoother and more flexible linear control of the adsorption mechanism 3 when picking up or placing chips, thus improving die bonding accuracy. Furthermore, the one-way cylinder 411 can apply a wider range of die bonding pressure to the chip during die bonding, with a fixed pressure range from 300g to 3000g, improving the flexibility of die bonding.

[0050] In one embodiment, see Figure 2 The head-binding device also includes a guide rod 5. The axis of the guide rod 5 is parallel to the first direction. The guide rod 5 is connected to one of the fixing frame group 2 or the adsorption mechanism 3. The other fixing frame group 2 or the adsorption mechanism 3 is provided with a guide hole coaxial with the guide rod 5, and the guide rod 5 slides through the guide hole. Specifically, the guide rod 5 refers to a component with a certain length. The guide rod 5 can be connected to one of the fixing frame group 2 or the adsorption mechanism 3 by means of insertion, snap-fit, or threaded connection. The guide hole refers to a hole structure with a certain depth. In this embodiment, the axis of the guide rod 5 is set parallel to the first direction, and the guide rod 5 is connected to one of the fixing frame group 2 or the adsorption mechanism 3. In addition, the other fixing frame group 2 or the adsorption mechanism 3 is provided with a guide hole coaxial with the guide rod 5, and the guide rod 5 slides through the guide hole. The limiting effect of the guide rod 5 ensures that the fixing frame group 2 and the adsorption mechanism 3 can only move relative to each other along the first direction, thereby making the relative movement between the fixing frame group 2 and the adsorption mechanism 3 more stable.

[0051] In one specific embodiment, please refer to Figure 2 One end of the guide rod 5 is fixedly connected to the adsorption mechanism 3 by a thread, and the guide hole is set on the fixed frame group 2, and the guide rod 5 slides through the guide hole.

[0052] Based on the aforementioned feature guide rod 5, please refer to Figure 1 The elastic buffer 42 can be a spring 421, and the spring 421 can be fitted onto the outside of the guide rod 5, which makes the installation of the spring 421 more convenient and stable.

[0053] In one embodiment, see Figure 2The die bonding device also includes a height detection unit 7, used to detect the displacement of the adsorption mechanism 3 relative to the fixing frame group 2 along a first direction. The height detection unit 7 is disposed on the adsorption mechanism 3 and / or the fixing frame group 2. Specifically, the height detection unit 7 refers to a component or assembly that can detect the relative distance between two objects. The height detection unit 7 can convert the detected data into an electrical signal. The height detection unit 7 can be electrically connected to the control unit so that the control unit can adjust the movement state of the device according to the data detected by the height detection unit 7. In this embodiment, by providing a height detection unit 7 on the adsorption mechanism 3 and / or the fixing frame group 2, the displacement of the adsorption mechanism 3 relative to the fixing frame group 2 along the first direction can be detected, and the height of the die bonding can be precisely controlled, making the die bonding operation more accurate. At the same time, when the chip mounting height changes, for example, when multiple chips are mounted at the same position on the substrate, the working height of the adsorption mechanism 3 can be adjusted by detecting the height of the chip. In addition, the height detection unit 7 can also be used to reversely determine the number of chip stacks at the same position, thereby analyzing the number of chip stacks during die bonding.

[0054] In one embodiment, see Figure 1 The pressure detection unit 6 is a cantilever pressure sensor 61, which is positioned along a second direction perpendicular to the first direction. The first end of the cantilever pressure sensor 61 is connected to the mounting base 1, and the second end is connected to the fixed frame assembly 2. The cantilever pressure sensor 61 is a pressure measuring device based on the principle of mechanical deformation, with its core structure being a columnar or rod-shaped component of a certain length. The first direction can be vertical, and the second direction can be horizontal. When external pressure is applied to the fixed frame assembly 2, the cantilever pressure sensor 61 undergoes bending deformation. The mechanical deformation is converted into an electrical signal output through strain gauges or piezoresistive effects within the cantilever pressure sensor 61. In this embodiment, by using a cantilever pressure sensor 61, the connection between the bonding head mounting base 1 and the fixing frame group 2 can be made convenient and secure, while also making the pressure detection more accurate, thereby improving the precision of the bonding head device in die bonding.

[0055] In an optional embodiment, please refer to Figure 1There are two cantilever pressure sensors 61, which are located on opposite sides of the fixing frame assembly 2 along a third direction. The third direction is perpendicular to the first direction. In this embodiment, by placing the two cantilever pressure sensors 61 on opposite sides of the fixing frame assembly 2 along a third direction, the connection between the fixing frame assembly 2 and the mounting base 1 is made more secure, and the force on the fixing frame assembly 2 in the horizontal direction is more balanced.

[0056] Secondly, a die bonder is provided, including the bonding head device described in any of the preceding claims. The die bonder may further include a drive device that can drive the bonding head device to move. It is understood that the beneficial effects of the second aspect can be found in the relevant description in the first aspect above.

[0057] The above description is merely a preferred embodiment of the present utility model, and only specifically describes the technical principles of the present utility model. These descriptions are only for explaining the principles of the present utility model and should not be construed as limiting the scope of protection of the present utility model in any way. Based on this explanation, any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present utility model, as well as other specific embodiments of the present utility model that can be conceived by those skilled in the art without creative effort, should be included within the scope of protection of the present utility model.

Claims

1. A head-binding device, characterized in that, The device includes a mounting base, a mounting bracket assembly, an adsorption mechanism, a driving mechanism, and a pressure detection unit. The pressure detection unit is disposed between the mounting base and the mounting bracket assembly. The adsorption mechanism is movably disposed on the mounting bracket assembly. The adsorption mechanism is used to pick up chips, and the driving mechanism is used to drive the adsorption mechanism to reciprocate along a first direction.

2. The head-binding device as described in claim 1, characterized in that, The adsorption mechanism includes a lifting connector, an adsorption shaft assembly, and an angle adjustment component. The lifting connector is disposed on the fixed frame assembly and has a degree of freedom to move in a first direction relative to the fixed frame assembly. The first end of the adsorption shaft assembly is rotatably connected to the lifting connector, the second end of the adsorption shaft assembly is used to adsorb the chip, and the angle adjustment component is used to drive the adsorption shaft assembly to rotate around its own axis.

3. The head-binding device as described in claim 2, characterized in that, The angle adjustment assembly includes a rotary drive unit and a rotary sleeve. The rotary sleeve is rotatably mounted on the fixed frame assembly. The adsorption shaft assembly passes through the rotary sleeve and is coaxially arranged with the rotary sleeve. The adsorption shaft assembly has only one degree of freedom of movement along its own axis relative to the rotary sleeve. The rotary drive unit is also mounted on the fixed frame assembly. The drive end of the rotary drive unit is connected to the rotary sleeve. The rotary drive unit is used to drive the rotary sleeve to rotate, thereby causing the adsorption shaft assembly to rotate together.

4. The head-binding device as described in claim 3, characterized in that, The outer periphery of the adsorption shaft assembly is provided with a limiting groove, which is arranged in a direction parallel to the axis of the adsorption shaft assembly. The inner wall of the rotating sleeve is provided with a protruding structure, which is slidably disposed in the limiting groove.

5. The head-binding device as described in claim 2, characterized in that, The lifting connector has a working cavity for communicating with an external pipeline. The suction shaft assembly includes a connecting shaft and a suction nozzle assembly. The first end of the connecting shaft is rotatably inserted into the working cavity and is sealed to the lifting connector. The suction nozzle assembly is disposed at the second end of the connecting shaft. The connecting shaft also has a connecting channel for connecting the suction nozzle assembly to the working cavity.

6. The head-binding device as described in claim 1, characterized in that, The driving mechanism includes a one-way pushing unit and an elastic buffer. The one-way pushing unit is disposed on the fixing frame assembly and is used to apply a pushing force toward the chip to the adsorption mechanism. The elastic buffer is disposed between the fixing frame assembly and the adsorption mechanism and is used to apply an elastic force away from the chip to the adsorption mechanism.

7. The head-binding device as described in claim 6, characterized in that, The head-binding device further includes a guide rod, the axis of which is parallel to the first direction. The guide rod is connected to one of the fixing frame group or the adsorption mechanism. The other of the fixing frame group or the adsorption mechanism is provided with a guide hole coaxial with the guide rod, and the guide rod slides through the guide hole.

8. The head-binding device as claimed in claim 1, characterized in that, The adsorption device further includes a height detection unit for detecting the displacement of the adsorption mechanism relative to the fixing frame assembly along the first direction, and the height detection unit is disposed on the adsorption mechanism and / or the fixing frame assembly.

9. The head-binding device according to any one of claims 1 to 8, characterized in that, The pressure detection unit is a cantilever pressure sensor, which is arranged along a second direction that is perpendicular to the first direction. The first end of the cantilever pressure sensor is connected to the mounting base, and the second end of the cantilever pressure sensor is connected to the fixing frame assembly.

10. A die bonder, characterized in that, Includes the headgear as described in any one of claims 1 to 9.

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