A semiconductor device package structure

Abstract

The utility model relates to technical field of semiconductor device, disclose a kind of semiconductor device packaging structure, including base and the top seat of being placed in the top of base, the top of base is fixedly connected with sealing gasket, the inside equidistance fixed connection of base has pin, the inside of base is equipped with placement groove, the inside four corners of base are all fixedly connected with limit cylinder, the inside four corners of top seat are all installed with positioning assembly.The utility model semiconductor device is packaged, positioning assembly is inserted into limit cylinder, positioning block is inserted into card slot using silica gel plate counterthrust force supercharging, quickly fixed top seat and base, without a large number of auxiliary materials, simplify chip and packaging structure fixed process, improve production efficiency, reduce cost, and silica gel plate abutment chip enhances its stability, when maintenance or replacement component, press release assembly pressure plate, positioning block retracts, can easily take down top seat, easy to operate, avoid damaging chip and other components, packaging structure can be recycled, reduce resource waste.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor device technology, and more specifically to a semiconductor device packaging structure. Background Technology

[0002] In the manufacturing process of semiconductor devices, packaging is a crucial step. Traditional semiconductor device packaging structures have several problems in practical applications. On the one hand, fixing the chip to the packaging structure during packaging is not convenient or efficient enough, and the operation process is relatively cumbersome, resulting in low production efficiency and increased production costs. For example, some packaging structures require a large amount of adhesive and other auxiliary materials to fix the chip, which not only increases material costs but also prolongs the production cycle due to the curing time of the adhesive. On the other hand, when it is necessary to repair or replace components of the packaged semiconductor device, disassembling the packaging structure is extremely difficult. Traditional packaging often adopts an integrated design or a connection method that is difficult to disassemble. Disassembly can easily damage the chip or other components, making the packaging structure difficult to reuse and resulting in resource waste. Utility Model Content

[0003] In order to overcome the above-mentioned defects of the prior art, the present invention provides a semiconductor device packaging structure to solve the problems existing in the background art.

[0004] The utility model provides the following technical solution: a semiconductor device packaging structure, including a base and a top seat placed directly above the base. A sealing gasket is fixedly connected to the top of the base. Pins are fixedly connected at equal intervals inside the base. A placement groove is opened inside the base. Limiting cylinders are fixedly connected to the four corners inside the base. Positioning components are installed at the four corners inside the top seat. A circular groove is opened through the center of the surface of the top seat. A pressure relief component is installed inside the circular groove. The output end of the pressure relief component is connected to the output end of the positioning component. The positioning component is inserted into the inside of the limiting cylinder. A silicone plate is fixedly connected to the end of the pressure relief component.

[0005] Furthermore, the inner wall of the limiting cylinder is provided with a slot, and the positioning component includes an insert rod fixedly connected to the bottom of the top seat. The center of the insert rod is provided with a connecting groove that communicates with the inside of the vent pipe. The insert rod is fixedly connected with connecting pipes that communicate with the inside of the connecting groove at equal intervals. The insert rod is provided with limiting grooves that communicate with the inside of the connecting pipe at equal intervals. A sealing plate is slidably connected to the inside of the limiting groove. A positioning block is fixedly connected to the center of the surface of the sealing plate. A spring is movably sleeved on the outer surface of the positioning block.

[0006] Furthermore, the pressure relief assembly includes a fixed seat that is sealed and fixedly connected to the inner wall of the circular groove. The fixed seat has a sliding groove inside, and a sealing disc is slidably connected inside the sliding groove. A second spring is fixedly installed inside the sliding groove. A connecting column is fixedly connected to the bottom center of the sealing disc. The end of the connecting column away from the sealing disc is fixedly connected to the center of the surface of the silicone plate. A communicating cavity is longitudinally opened at the center of the fixed seat. A third spring is fixedly installed inside the communicating cavity. A blocking plate is slidably connected inside the communicating cavity. A connecting rod is fixedly connected to the top center of the blocking plate. A pressure plate is fixedly connected to the top of the connecting rod. The end of the vent pipe away from the insert rod is fixedly connected to the inside of the fixed seat and communicates with the inside of the communicating cavity.

[0007] Furthermore, the interior of the chute is connected to the interior of the connecting cavity, and the top end of the third spring is fixedly connected to the inner wall of the connecting cavity. Under normal conditions, the top end of the third spring abuts against the bottom of the sealing plate, and the elasticity of the third spring causes the sealing plate to slide upward and seal against the inner wall of the connecting cavity.

[0008] Furthermore, the top of the connecting cavity extends to the upper surface of the fixed base, the diameter of the middle section of the connecting cavity is larger than the diameters of the two ends, and the diameter of the sealing plate is smaller than the diameter of the middle section of the connecting cavity.

[0009] Furthermore, the surface of the positioning block away from the sealing plate is inclined, the interior of the limiting groove and the communicating cavity is under high pressure, the bottom of the silicone plate abuts against the top of the chip, the outer surface of the insert is inserted into the interior of the limiting cylinder, the outer surface of the positioning block is engaged in the interior of the slot, and the lower half of the insert passes through the sealing gasket and extends to the outside of the sealing gasket.

[0010] The technical effects and advantages of this utility model are as follows:

[0011] 1. In the packaging process, by inserting the positioning component into the limiting cylinder, the internal space of the positioning component is pressurized by the counter-pushing force of the silicone plate, thereby causing the positioning block to extend and engage in the slot of the limiting cylinder, thus completing the rapid fixation of the top seat and the base. This eliminates the need for a large amount of glue and other auxiliary materials, greatly simplifying the chip and packaging structure fixing process, improving production efficiency, and reducing production costs. At the same time, the silicone plate's contact with the chip surface enhances the stability of the chip inside the packaging structure, ensuring the reliability of the semiconductor device during use.

[0012] 2. In this utility model, when it is necessary to repair or replace components of the packaged semiconductor device, simply press the pressure plate of the pressure relief component to move the sealing plate down, connect the connecting cavity to the outside, and the high-pressure gas in the positioning component can be discharged. The positioning block retracts under the action of the spring, and the top seat can be easily removed from the base. The operation is simple and convenient, effectively avoiding damage to the chip or other components during the disassembly process, making the packaging structure reusable and reducing resource waste. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the chip after packaging in this utility model;

[0014] Figure 2 This is an exploded view of the present invention;

[0015] Figure 3 This is a schematic diagram showing the connection between the limiting cylinder and the positioning component in this utility model;

[0016] Figure 4 This is a cross-sectional view of the positioning component in this utility model;

[0017] Figure 5 This is a cross-sectional view of the pressure relief component in this utility model;

[0018] Figure 6 for Figure 5 Enlarged view of point A in the middle.

[0019] The attached diagram is labeled as follows: 1. Base; 2. Sealing gasket; 3. Top seat; 4. Pin; 5. Placement groove; 6. Limiting cylinder; 61. Slot; 7. Positioning assembly; 71. Insert rod; 72. Connecting groove; 73. Connecting pipe; 74. Limiting groove; 75. Spring one; 76. Sealing plate; 77. Positioning block; 79. Vent pipe; 8. Circular groove; 9. Pressure relief assembly; 91. Fixed seat; 92. Sliding groove; 93. Spring two; 94. Sealing disc; 95. Connecting column; 97. Connecting cavity; 98. Spring three; 99. Sealing plate; 910. Connecting rod; 911. Pressure plate; 10. Silicone plate. Detailed Implementation

[0020] The present invention will be further described below with reference to specific embodiments. However, those skilled in the art should understand that the detailed description given here with reference to the accompanying drawings is for better explanation. The structure of the present invention may exceed the limited embodiments described herein. Some equivalent alternatives or common means will not be described in detail here, but they still fall within the protection scope of this application.

[0021] Figures 1-6 This is the preferred embodiment of the present invention, which is described below in conjunction with the appendix. Figures 1-6 The present invention will be further described below.

[0022] A semiconductor device packaging structure includes a base 1 and a top seat 3 placed directly above the base 1. A sealing gasket 2 is fixedly connected to the top of the base 1. Pins 4 are fixedly connected at equal intervals inside the base 1, and the end faces of the pins 4 extend to the outside of the base 1. A placement groove 5 is opened inside the base 1. Limiting cylinders 6 are fixedly connected to the four corners inside the base 1. Positioning components 7 are installed at the four corners inside the top seat 3. A circular groove 8 is opened through the center of the surface of the top seat 3. A pressure relief component 9 is installed inside the circular groove 8. The output end of the pressure relief component 9 is connected to the output end of the positioning component 7. The positioning component 7 is inserted into the inside of the limiting cylinder 6. A silicone plate 10 is fixedly connected to the end of the pressure relief component 9.

[0023] In this embodiment, the sealing gasket 2 ensures the seal between the base 1 and the top seat 3, preventing external impurities and moisture from entering the encapsulation structure and protecting internal components such as chips. The pins 4 are used to realize the electrical connection between the semiconductor device and the external circuit, enabling the chip to work normally and transmit signals. The placement slot 5 provides a placement space for the chip, positioning and supporting it, facilitating operations such as soldering the chip to the pins 4. The limiting cylinder 6 cooperates with the positioning component 7 to accurately position the top seat 3 and the base 1, ensuring the accuracy of their installation positions and enhancing the stability of the encapsulation structure. The positioning component 7 interacts with the limiting cylinder 6 to achieve rapid fixation of the top seat 3 and the base 1, simplifying the encapsulation process. The circular groove 8 provides installation space for the pressure relief component 9, ensuring that the pressure relief component 9 can be installed and work normally. The pressure relief component 9 is connected to the positioning component 7, allowing the pressure inside the positioning component 7 to be released when disassembly is required, facilitating the removal of the top seat 3. The silicone plate 10, on the one hand, uses its counter-force to pressurize and fix the positioning component 7 during encapsulation, and on the other hand, it abuts against the top of the chip, enhancing the stability of the chip inside the encapsulation structure.

[0024] Specifically, the inner wall of the limiting cylinder 6 is provided with a slot 61, and the positioning component 7 includes a rod 71 fixedly connected to the bottom of the top seat 3. The center of the rod 71 is provided with a connecting groove 72 that communicates with the inside of the vent pipe 79. The inside of the rod 71 is fixedly connected with a connecting pipe 73 that communicates with the inside of the connecting groove 72 at equal intervals. The inside of the rod 71 is provided with a limiting groove 74 that communicates with the inside of the connecting pipe 73 at equal intervals. The inside of the limiting groove 74 is sealed and slidably connected with a sealing plate 76. The center of the surface of the sealing plate 76 is fixedly connected with a positioning block 77. The outer surface of the positioning block 77 is movably sleeved with a spring 75.

[0025] In this embodiment, the slot 61 cooperates with the positioning block 77. When the positioning block 77 is engaged in the slot 61, it can firmly fix the top seat 3 and the base 1, preventing displacement or loosening during use. The insertion rod 71, as the main structure of the positioning component 7, connects the top seat 3 and cooperates with the limiting cylinder 6, ensuring that the positioning component 7 can be accurately inserted into the limiting cylinder 6. The connecting groove 72, the connecting pipe 73, and the vent pipe 79 are interconnected, forming a gas transmission channel, so that the pressure generated by the pressure relief component 9 can be transmitted to the limiting groove 74. The positioning block 77 is driven by the limiting groove 74, which provides sliding space for the sealing plate 76 and the positioning block 77, while limiting their movement direction. This ensures that the positioning block 77 can extend and retract accurately. The sealing plate 76 slides in the limiting groove 74 to ensure the sealing of the limiting groove 74. This allows the gas pressure to effectively push the positioning block 77. Under the action of gas pressure, the positioning block 77 extends and is engaged in the slot 61, realizing the quick fixation of the top seat 3 and the base 1. The spring 75 provides a restoring force when the positioning block 77 retracts, facilitating disassembly.

[0026] Specifically, the pressure relief assembly 9 includes a fixed seat 91 that is sealed and fixedly connected to the inner wall of the circular groove 8. The fixed seat 91 has a sliding groove 92 inside, and a sealing disc 94 is slidably connected inside the sliding groove 92. A second spring 93 is fixedly installed inside the sliding groove 92. A connecting post 95 is fixedly connected to the bottom center of the sealing disc 94. The end of the connecting post 95 away from the sealing disc 94 is fixedly connected to the center of the surface of the silicone plate 10. A communicating cavity 97 is longitudinally opened at the center of the fixed seat 91. A third spring 98 is fixedly installed inside the communicating cavity 97. A sealing plate 99 is slidably connected inside the communicating cavity 97. A connecting rod 910 is fixedly connected to the top center of the sealing plate 99. A pressure plate 911 is fixedly connected to the top of the connecting rod 910. The end of the vent pipe 79 away from the insert rod 71 is fixedly connected to the inside of the fixed seat 91 and communicates with the inside of the communicating cavity 97.

[0027] In this embodiment, the fixing seat 91 is used to fix and support other components of the pressure relief assembly 9, ensuring the stability of the entire assembly and enabling it to work normally. The slide groove 92 provides sliding space for the sealing disc 94, allowing it to slide up and down under the reaction force of the silicone plate 10, thereby controlling the gas pressure. The sealing disc 94 slides and seals within the slide groove 92, ensuring the sealing performance of the slide groove 92 and allowing the gas to form pressure within the slide groove 92, which in turn pushes the positioning block 77 of the positioning assembly 7. The second spring 93 provides a certain buffer and reset force when the sealing disc 94 slides upward, making the entire structure more stable and preventing the sealing disc 94 from sliding excessively. The connecting column 95 connects the sealing disc 94 and the silicone plate 10, distributing the reaction force on the silicone plate 10. The thrust is transmitted to the sealing disc 94 to achieve pressure transmission. The connecting cavity 97 serves as a channel for gas transmission and pressure regulation, connecting the slide groove 92 and the vent pipe 79, enabling pressure to be transmitted throughout the system. Under normal conditions, the spring 98 keeps the sealing plate 99 sealed against the inner wall of the connecting cavity 97 to prevent gas leakage and ensure pressure stability within the positioning assembly 7. When the pressure plate 911 is pressed, it provides a restoring force to the sealing plate 99. Under the action of the spring 98, the sealing plate 99 can control the opening and closing of the connecting cavity 97, achieving sealing and release of pressure within the positioning assembly 7. The connecting rod 910 and the pressure plate 911 cooperate to facilitate pressing by the operator. By pressing the pressure plate 911, the sealing plate 99 is moved downward to achieve pressure relief. The operation is simple and convenient.

[0028] Specifically, the interior of the slide groove 92 is connected to the interior of the connecting cavity 97. The top end of the spring 98 is fixedly connected to the inner wall of the connecting cavity 97. The top end of the spring 98 abuts against the bottom of the sealing plate 99. Under normal conditions, the elasticity of the spring 98 causes the sealing plate 99 to slide upward and seal against the inner wall of the connecting cavity 97.

[0029] In this embodiment, the slide 92 is connected to the connecting cavity 97, ensuring that gas can flow freely between them. This allows the pressure generated by the counter-thrust of the silicone plate 10 to be smoothly transmitted to the limiting groove 74 of the positioning component 7, thereby extending and fixing the positioning block 77. At the same time, during disassembly, the gas in the positioning component 7 can also be discharged through the connecting cavity 97. The elasticity of the spring 98 is crucial. Under normal conditions, it keeps the sealing plate 99 sealed against the inner wall of the connecting cavity 97, preventing gas leakage and ensuring that the high pressure state in the positioning component 7 is maintained, thus ensuring a stable connection between the top seat 3 and the base 1. When pressure relief is required, pressing the pressure plate 911 overcomes the elastic force of the spring 98, causing the sealing plate 99 to move down and the connecting cavity 97 to open for pressure relief. Afterward, the spring 98 can reset the sealing plate 99 for easy reuse next time.

[0030] Specifically, the top of the connecting cavity 97 extends to the upper surface of the fixed seat 91, the diameter of the middle section of the connecting cavity 97 is larger than the diameter of the two ends, and the diameter of the sealing plate 99 is smaller than the diameter of the middle section of the connecting cavity 97.

[0031] In this embodiment, the top of the connecting cavity 97 extends to the upper surface of the fixed seat 91, providing a channel for gas discharge. This facilitates the smooth discharge of the high-pressure gas in the positioning component 7 when the top seat 3 is disassembled, allowing the positioning block 77 to retract and separating the top seat 3 from the base 1. The diameter of the middle section of the connecting cavity 97 is larger than that of the two ends, which, when combined with the sealing plate 99, allows for better sealing when the sealing plate 99 slides upward, preventing gas leakage. When the pressure plate 911 is pressed to move the sealing plate 99 downward, the larger diameter of the middle section allows the gas to discharge more smoothly, improving the pressure relief efficiency.

[0032] Specifically, the surface of the positioning block 77 away from the sealing plate 76 is inclined, the interior of the limiting groove 74 and the connecting cavity 97 is under high pressure, the bottom of the silicone plate 10 abuts against the top of the chip, the outer surface of the insertion rod 71 is inserted into the interior of the limiting cylinder 6, the outer surface of the positioning block 77 is snapped into the interior of the slot 61, and the lower half of the insertion rod 71 passes through the sealing pad 2 and extends to the outside of the sealing pad 2.

[0033] In this embodiment, the surface of the positioning block 77 away from the sealing plate 76 is inclined. When the insert rod 71 is inserted into the limiting cylinder 6, the positioning block 77 can slide more easily on the inner wall of the limiting cylinder 6 until it is engaged in the slot 61, which facilitates the quick installation and fixation of the top seat 3 and the base 1. The strong pressure state inside the limiting groove 74 and the connecting cavity 97 is the key to realizing the extension and engagement of the positioning block 77 and maintaining the stable connection between the top seat 3 and the base 1, thus ensuring the reliability of the packaging structure. The bottom of the silicone plate 10 abuts against the top of the chip, which, on the one hand, uses its reverse thrust to pressurize and fix the positioning component 7 during packaging, and on the other hand, enhances the stability of the chip inside the packaging structure. To reduce chip shaking during use and ensure the normal operation of semiconductor devices, the outer surface of the insert 71 is inserted into the inside of the limiting cylinder 6, and works with the positioning block 77 and the slot 61 to accurately position the relative position of the top seat 3 and the base 1, ensuring the accuracy and stability of the packaging structure. The outer surface of the positioning block 77 is engaged inside the slot 61, firmly fixing the top seat 3 and the base 1 and preventing relative displacement between them during use. The lower half of the insert 71 passes through the sealing gasket 2 and extends to the outside of the sealing gasket 2, further enhancing the tightness and stability of the connection between the top seat 3 and the base 1, and also helping the sealing gasket 2 to better perform its sealing function.

[0034] The working principle and usage process of this utility model are as follows: When packaging a chip, the chip is placed inside the placement slot 5 and soldered to the input terminal of pin 4. Then, the positioning component 7 is inserted into the limiting cylinder 6. When the bottom of the silicone plate 10 abuts against the chip surface, due to the counter-thrust, the silicone plate 10 drives the sealing plate 94 to slide upward through the connecting post 95. At this time, the top of the slide groove 92 is under high pressure, and the pressure inside the limiting groove 74 is increased through the connecting cavity 97, the vent pipe 79, the connecting groove 72, and the connecting pipe 73. At this time, the sealing plate 76 drives the positioning... As block 77 slides outward, spring 75 is compressed. Positioning block 77 extends to the outside of insert 71. When insert 71 continues to slide deeper into the limiting cylinder 6, the outer surface of positioning block 77 slides on the inner wall of the limiting cylinder 6 until the outer surface of positioning block 77 is engaged with the inner wall of slot 61. At this time, insert 71 is fixed inside the limiting cylinder 6. Top seat 3 is sealed and attached to the top of base 1 by sealing gasket 2, completing the rapid encapsulation of chip. The contact of the chip surface by silicone plate 10 also enhances the stability of chip inside sealing gasket 2.

[0035] When it is necessary to disassemble the top seat 3, press down the pressure plate 911. The pressure plate 911 drives the sealing plate 99 to slide down through the connecting rod 910. When the top of the sealing plate 99 is not connected to the inner wall of the connecting cavity 97, the elasticity of the spring 75 causes the sealing plate 76 to drive the positioning block 77 to slide closer to the connecting groove 72. The strong pressure inside the limiting groove 74 is released from the top of the connecting cavity 97 through the connecting pipe 73, the connecting groove 72 and the vent pipe 79. After the positioning block 77 is disengaged from the slot 61, the top seat 3 can be directly removed from the top of the base 1 for quick disassembly. The disassembled encapsulation structure can be reused.

[0036] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model in any other way. Any person skilled in the art may make changes or modifications to the disclosed technical content to create equivalent embodiments. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of this utility model without departing from its technical solution shall still fall within the protection scope of this utility model.

Claims

1. A semiconductor device packaging structure, comprising a base (1) and a top mount (3) placed directly above the base (1), characterized in that: A sealing gasket (2) is fixedly connected to the top of the base (1). Pins (4) are fixedly connected at equal intervals inside the base (1). A placement groove (5) is opened inside the base (1). Limiting cylinders (6) are fixedly connected to the four corners inside the base (1). Positioning components (7) are installed at the four corners inside the top seat (3). A circular groove (8) is opened through the center of the surface of the top seat (3). A pressure relief component (9) is installed inside the circular groove (8). The output end of the pressure relief component (9) is connected to the output end of the positioning component (7). The positioning component (7) is inserted into the inside of the limiting cylinder (6). A silicone plate (10) is fixedly connected to the end of the pressure relief component (9).

2. The semiconductor device packaging structure according to claim 1, characterized in that: The inner wall of the limiting cylinder (6) is provided with a slot (61). The positioning component (7) includes a rod (71) fixedly connected to the bottom of the top seat (3). The center of the rod (71) is provided with a connecting groove (72) that communicates with the inside of the vent pipe (79). The inside of the rod (71) is fixedly connected with a connecting pipe (73) that communicates with the inside of the connecting groove (72) at equal intervals. The inside of the rod (71) is provided with a limiting groove (74) that communicates with the inside of the connecting pipe (73) at equal intervals. The inside of the limiting groove (74) is sealed and slidably connected with a sealing plate (76). The center of the surface of the sealing plate (76) is fixedly connected with a positioning block (77). The outer surface of the positioning block (77) is movably sleeved with a spring (75).

3. A semiconductor device packaging structure according to claim 2, characterized in that: The pressure relief assembly (9) includes a fixed seat (91) that is sealed and fixedly connected to the inner wall of the circular groove (8). A sliding groove (92) is provided inside the fixed seat (91). A sealing disc (94) is slidably connected inside the sliding groove (92). A second spring (93) is fixedly installed inside the sliding groove (92). A connecting post (95) is fixedly connected to the center of the bottom of the sealing disc (94). One end of the connecting post (95) away from the sealing disc (94) is fixedly connected to the center of the surface of the silicone plate (10). A connecting cavity (97) is longitudinally opened at the center of the interior of (91). A spring (98) is fixedly installed inside the connecting cavity (97). A sealing plate (99) is slidably connected inside the connecting cavity (97). A connecting rod (910) is fixedly connected at the top center of the sealing plate (99). A pressure plate (911) is fixedly connected at the top of the connecting rod (910). The end of the vent pipe (79) away from the insert rod (71) is fixedly connected inside the fixed base (91) and communicates with the interior of the connecting cavity (97).

4. A semiconductor device packaging structure according to claim 3, characterized in that: The interior of the groove (92) is connected to the interior of the connecting cavity (97). The top end of the spring three (98) is fixedly connected to the inner wall of the connecting cavity (97). The top end of the spring three (98) abuts against the bottom of the sealing plate (99). Under normal conditions, the elasticity of the spring three (98) causes the sealing plate (99) to slide upward and seal against the inner wall of the connecting cavity (97).

5. A semiconductor device packaging structure according to claim 3, characterized in that: The top of the connecting cavity (97) extends to the upper surface of the fixing seat (91), the diameter of the middle section of the connecting cavity (97) is larger than the diameter of the two ends, and the diameter of the sealing plate (99) is smaller than the diameter of the middle section of the connecting cavity (97).

6. A semiconductor device packaging structure according to claim 3, characterized in that: The surface of the positioning block (77) away from the sealing plate (76) is inclined, the inside of the limiting groove (74) and the connecting cavity (97) is under high pressure, the bottom of the silicone plate (10) abuts against the top of the chip, the outer surface of the insert (71) is inserted into the inside of the limiting cylinder (6), the outer surface of the positioning block (77) is engaged in the inside of the slot (61), and the lower half of the insert (71) passes through the sealing pad (2) and extends to the outside of the sealing pad (2).

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