Radio frequency thawing device and refrigeration equipment

Abstract

The application discloses a radio frequency thawing device and a refrigeration equipment. The radio frequency thawing device comprises a box body, a power amplifier module, a power amplifier circuit board and a heat dissipation structure. The circuit board of the power amplifier circuit board has a front surface and a back surface. The power amplifier element is arranged on the front surface, the front surface faces one side of a thawing cavity, and the power supply plug-in terminal is arranged on the back surface. The heat dissipation structure is arranged on the side of the power amplifier circuit board away from the thawing cavity, the heat dissipation structure faces the back surface to dissipate heat for the power amplifier circuit board, and the heat dissipation structure has a power supply accommodation hole, so that the power supply plug-in terminal passes through the heat dissipation structure and is connected with an external power supply. On the one hand, the power amplifier circuit board is arranged vertically to save space. On the other hand, the back surface of the power supply plug-in terminal is arranged and a straight connection path passing through the heat dissipation structure is arranged, so that the traditional bending and winding connection with the external power supply is avoided, the wiring and assembly process are simplified, the contact resistance and the fault point are reduced, the space utilization is improved, and the durability of the radio frequency thawing device is improved.

Description

Technical Field

[0001] This application relates to a radio frequency defrosting device, and more particularly to a refrigeration device having the radio frequency defrosting device. Background Technology

[0002] Currently, radio frequency (RF) defrosting technology is increasingly being applied to refrigeration equipment for the rapid and uniform defrosting of frozen foods. This technology applies radio frequency energy to the food within the defrosting chamber, offering advantages over traditional defrosting methods, including faster defrosting rates, less nutrient loss, and greater safety and hygiene.

[0003] Taking the application of refrigeration in refrigerators as an example, radio frequency (RF) defrosting technology places higher demands on the miniaturization and integration of various functional modules. The power amplifier module of an RF defrosting device generates a large amount of heat during operation, requiring a heat dissipation structure. This structure is typically designed to face outwards for heat dissipation, while the power connectors on the power amplifier circuit board are often located on the same side as the amplifier components, facing inwards. External power cables need to be bent around the external heat dissipation structure and the power amplifier circuit board to connect to the power connectors. This makes the assembly complex, and the bending of the wiring can easily lead to aging or even breakage, causing signal interference. Furthermore, it increases the assembly size, hindering the miniaturization of the device. Summary of the Invention

[0004] The purpose of this application is to provide a radio frequency defrosting device and refrigeration equipment that improves integration and space utilization.

[0005] To achieve the above objectives, one embodiment of this application provides a radio frequency defrosting device, which includes:

[0006] The box has a defrosting chamber and a functional chamber arranged adjacent to each other along its length;

[0007] A power amplifier module is disposed within the functional cavity, and the power amplifier module includes:

[0008] The power amplifier circuit board includes a circuit board, power amplifier components, and power connectors. The circuit board has a front side and a back side. The front side faces the side where the defrosting chamber is located and is provided with the power amplifier components. The power connectors are provided on the back side.

[0009] A heat dissipation structure is provided on the side of the power amplifier circuit board away from the defrosting chamber, and has a power clearance hole so that the power plug-in terminal can pass through the heat dissipation structure to connect to an external power source.

[0010] As a further improvement of this application, the heat dissipation structure covers the power amplifier circuit board in a direction perpendicular to the plane of the circuit board.

[0011] As a further improvement of this application, the power amplifier module also includes a shielding cover, which is disposed on the side of the front facing the defrosting chamber;

[0012] The shielding cover and the heat dissipation structure together form a shielding cavity, and the circuit board and the power amplifier components are housed within the shielding cavity;

[0013] The power connector extends away from the shielding cavity.

[0014] As a further improvement of this application, the circuit board is arranged along the height direction of the housing, the power plug terminal is elongated and arranged along the height direction of the housing, and the outline of the power clearance hole matches the outer outline of the power plug terminal.

[0015] As a further improvement of this application, the heat dissipation structure includes a heat dissipation substrate and a plurality of heat dissipation fins connected to the heat dissipation substrate, and the power amplifier circuit board is disposed on the side of the heat dissipation substrate away from the heat dissipation fins.

[0016] As a further improvement of this application, the plurality of heat dissipation fins include a middle fin and edge fins located on both sides of the middle fin along the width of the housing, and the power clearance hole is disposed on one of the edge fins away from the middle fin.

[0017] The enclosure includes a back panel, the edge fins abut against the back panel on the side away from the heat dissipation substrate, and there is a gap between the middle fins and the back panel.

[0018] As a further improvement of this application, the rear panel has a plug hole, which is arranged opposite to the power supply clearance hole along the length direction of the housing.

[0019] As a further improvement of this application, the power amplifier element is aligned along the length of the enclosure within the projection area between the two edge fins.

[0020] As a further improvement of this application, the radio frequency defrosting device includes a heat dissipation fan disposed in the functional cavity, a first air duct disposed between the heat dissipation fins, and a second air duct connecting the first air duct and the defrosting cavity. The heat dissipation fan drives airflow through the first air duct and the second air duct into the defrosting cavity.

[0021] To achieve one of the above objectives, one embodiment of this application provides a refrigeration device, including the radio frequency defrosting device described above.

[0022] Compared with commonly used technologies, this application has the following advantages: The radio frequency defrosting device sets the power amplifier components on the front of the power amplifier circuit board and faces the defrosting chamber, and sets the power plug terminals on the back. On the one hand, the power amplifier circuit board is set vertically, saving space and making it suitable for the compact environment of refrigeration equipment; on the other hand, the power plug terminals are set on the back and have a straight connection path through the heat dissipation structure, avoiding the bending and detour of traditional external power supply connections, simplifying the wiring and assembly process, reducing contact resistance and failure points, improving space utilization, and enhancing the durability of the radio frequency defrosting device. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the structure of a radio frequency defrosting device according to an embodiment of this application;

[0024] Figure 2 This is a top sectional view of a radio frequency defrosting device according to an embodiment of this application;

[0025] Figure 3 This is an exploded view of a radio frequency defrosting device according to an embodiment of this application;

[0026] Figure 4 This is a rear view of the radio frequency defrosting device according to an embodiment of this application after the back panel has been removed;

[0027] Figure 5 This is another exploded view of a radio frequency defrosting device according to an embodiment of this application;

[0028] Figure 6 This is a side sectional view of a radio frequency defrosting device according to an embodiment of this application;

[0029] Figure 7 This is a cross-sectional view of the drawer assembly of a radio frequency defrosting device according to an embodiment of this application pulled out;

[0030] Figure 8 This is a schematic diagram of the structure of an integrated unit according to an embodiment of this application;

[0031] Figure 9 This is an exploded view of an integrated unit according to an embodiment of this application;

[0032] Figure 10 This is an exploded view of a power amplifier module according to an embodiment of this application;

[0033] Figure 11 This is a cross-sectional view of a power amplifier module according to an embodiment of this application;

[0034] Figure 12 This is an exploded view of a tuning module according to an embodiment of this application.

[0035] Figure 13 This is a circuit schematic diagram of an embodiment of this application;

[0036] Figure 14 This is a schematic diagram of the circuit structure of an embodiment of this application from one perspective;

[0037] Figure 15 This is a top view of a fixed capacitor and a variable capacitor according to an embodiment of this application;

[0038] Figure 16 This is a top view of a variable capacitor with its capacitance value at its maximum according to an embodiment of this application;

[0039] Figure 17 This is a top view of an embodiment of the present application where the variable capacitor value is at its minimum.

[0040] Among them, 1000, radio frequency defrosting device; 1001, radio frequency component; 100, housing; 101, defrosting chamber; 102, functional chamber; 1021, third air duct; 103, radio frequency space; 110, outer shell; 111, upper wall; 1111, first air outlet; 1112, second air outlet; 112, lower wall; 1121, first limiting part; 1122, second limiting part; 113, side wall; 114, second opening; 115, third opening; 120, back panel; 121, second ventilation port; 130, cover plate; 131, second air duct; 132, air guide rib; 1321, radial rib; 1322, extension rib; 140, door frame; 141, first opening; 200, power amplifier module; 201, first... 202. Air duct; 210. Shielding cavity; 211. Power amplifier circuit board; 212. Circuit board; 213. Power connector terminal; 214. RF output terminal; 215. Front view; 216. Back view; 220. Heat dissipation structure; 221. Heat dissipation board; 2211. Power clearance hole; 2212. RF clearance hole; 2213. First clearance hole; 222. Heat dissipation fins; 2221. Middle fin; 2222. Edge fin; 223. Heat dissipation side wing; 230. Shielding cover; 231. Shielding board; 2311. Perforation; 232. Shielding side wing; 240. Heat dissipation fan; 241. Fan bracket; 242. Support component; 300. Tuning module; 310. Fixed capacitor; 311. First capacitor section; 3111. Electrical... Capacitor body; 3112, extension; 312, second capacitor section; 3121, first plate; 3122, second plate; 3123, connecting section; 3120, capacitor cavity; 320, variable capacitor; 320a, interdigitated capacitor; 321, fixed capacitor section; 322, movable capacitor section; 330, inductor; 331, connecting piece; 340, drive mechanism; 341, motor; 3411, fixing component; 342, transmission section; 3421, gear; 3422, rack; 34221, guide groove; 350, flexible wire; 360, limiting bracket; 3601, positioning cavity; 3602, receiving cavity; 3603, heat dissipation hole; 361, cover; 3611, top cover; 362, base; 3621, raised rib; 3 622, Support plate; 3623, Dielectric filling part; 3624, Receiving groove; 363, Limiting part; 364, Guide part; 364a, Guide groove; 3641, First protrusion; 3642, Second protrusion; 36421, Guide slope; 365, Crossbar; 3651, Coil groove; 366, Guide rib; 367, Guide groove; 368, Limiting cover; 370, Partition; 371, First vent; 372, Limiting rib; 400, RF antenna; 500, De-freezing capacitor; 510, Base; 511, First mounting part; 512, First upper surface; 513, Opening; 520, Second mounting part; 521, First positioning part; 5211, Second recess; 5212, Power amplifier support part;522. Second positioning part; 523. Second upper surface; 600. Drawer assembly; 610. Door body; 620. Shielding component; 621. Shielding recess; 622. Extended covering edge; 623. Connecting reinforcement; 630. Drawer body; 631. Body recess; 700. Detection part; 800. Slide rail; T1. Longitudinal; T2. Lateral; T3. Vertical. Detailed Implementation

[0041] The present application will now be described in detail with reference to the specific embodiments shown in the accompanying drawings. However, these embodiments do not limit the present application, and any structural, methodological, or functional modifications made by those skilled in the art based on these embodiments are included within the scope of protection of this application.

[0042] It should be understood that terms such as “above,” “over,” “below,” and “under” used herein to indicate spatial relative position are for illustrative purposes to describe the relationship of one unit or feature relative to another unit or feature as shown in the accompanying drawings. The terms “spatial relative position” may be intended to include different orientations of the equipment in use or operation other than those shown in the figures.

[0043] One embodiment of this application provides a radio frequency defrosting device and refrigeration equipment that improves integration and space utilization.

[0044] The specific solution is as follows: a radio frequency defrosting device, comprising: a housing having a defrosting chamber and a functional chamber arranged adjacent to each other along its length; a power amplifier module disposed within the functional chamber, the power amplifier module comprising: a power amplifier circuit board including a circuit board, a power amplifier component, and a power connector, the circuit board having a front and a back, the front facing the side where the defrosting chamber is located and having the power amplifier component disposed thereon, the power connector being disposed on the back; and a heat dissipation structure disposed on the side of the power amplifier circuit board away from the defrosting chamber, and having a power clearance hole for the power connector to pass through the heat dissipation structure and connect to an external power source.

[0045] Together with the aforementioned power amplifier components, it is responsible for providing the radio frequency signal and amplifying it before outputting the radio frequency signal.

[0046] The tuning module 300 includes a variable capacitor 320, the value of which is adjustable. When the object to be thawed (such as food) is placed in the thawing chamber 101, the dielectric constant of the thawing capacitor changes, causing a change in the thawing capacitance. To tune the impedance matching between the power amplifier module 200 and the RF antenna 400 and avoid RF power reflection and waste, this application dynamically compensates for this change in load capacitance by adjusting the capacitance value of the variable capacitor 320. This dynamic matching ensures that RF energy can be efficiently transferred to the food, achieving uniform and rapid thawing.

[0047] The specific process is as follows: the power amplifier module 200 outputs an RF signal to the tuning module 300, and the variable capacitor 320 dynamically adjusts its capacitance value according to the detected load changes (such as monitoring the reflected power through the coupler in the power amplifier module 200). For example, when the food causes an increase in the defrosting capacitance, the capacitance value of the variable capacitor 320 is reduced to compensate for the load change in the reverse, ensuring that the impedance remains basically constant, thereby maximizing the RF energy transmission efficiency.

[0048] The radio frequency defrosting device 1000, through the aforementioned structure and adjustment mechanism, achieves both higher integration and efficient impedance matching. The dynamic compensation function of the variable capacitor 320 significantly reduces power reflection, saves energy consumption, improves defrosting uniformity and speed, and avoids localized overheating or undefrosted areas, thus meeting users' needs for rapid defrosting.

[0049] In one embodiment, the housing 100 includes an outer shell 110. The outer shell 110 is a metal component. A defrosting chamber 101 and a functional chamber 102 are located within the outer shell 110. A defrosting capacitor is formed between the radio frequency antenna 400 and a first wall of the outer shell 110. Figure 6 As shown. When the defrosting capacitor is energized, it generates an alternating electromagnetic field to heat the object to be defrosted, which is placed between the radio frequency antenna 400 and the first wall.

[0050] The use of a metal casing 110 primarily provides structural support for the radio frequency defrosting device 1000. The casing 110 can be made of stainless steel or aluminum alloy, providing good electromagnetic shielding and structural strength.

[0051] Secondly, on the one hand, it provides a shielded space for radio frequency energy, effectively reducing electromagnetic radiation leakage and ensuring user safety. On the other hand, by directly forming a defrosting capacitor with the radio frequency antenna 400 and the inner wall of the housing 110, an additional capacitor component is eliminated. For example, compared with the traditional structure that uses two electrodes to form a defrosting capacitor, this embodiment only requires one radio frequency antenna 400 as an electrode, and the other electrode is reused from the housing 110, thus reducing one electrode, simplifying the structure, and lowering costs.

[0052] Ultimately, the uniform distribution of the electromagnetic field inside the defrosting capacitor enables three-dimensional and uniform heating of the food, avoiding the problems of localized overheating or uneven defrosting in traditional defrosting methods.

[0053] In one embodiment, the housing 110 is configured as a cuboid structure. The housing 110 has an upper wall 111 and a lower wall 112 oppositely disposed, and two oppositely disposed side walls 113 connecting the upper wall 111 and the lower wall 112. The area of ​​the upper wall 111 and the lower wall 112 is larger than that of the side walls 113. The main body of the radio frequency antenna 400 is parallel to and opposite to the upper wall 111. This allows for the accommodation of a larger radio frequency antenna 400. The opposite arrangement of the radio frequency antenna 400 and the first wall results in a larger surface area opposite the defreezing capacitor.

[0054] There are two possible implementation methods: the radio frequency antenna 400 is located near the lower wall 112 to form a defrosting capacitor with the upper wall 111; or the radio frequency antenna 400 is located near the upper wall 111 to form a defrosting capacitor with the lower wall 112.

[0055] In this embodiment, as Figure 6 As shown, the radio frequency antenna 400 is placed near the lower wall 112 to form a defrosting capacitor with the upper wall 111, ensuring that the food receives consistent energy throughout the defrosting area, avoiding defrosting dead zones, and improving overall defrosting efficiency.

[0056] The following text is a detailed description of four parts: base 500, drawer assembly 600, power amplifier module 200, and tuning module 300.

[0057] Base 500

[0058] like Figure 5 , 6 As shown in Figures 8 and 9, the radio frequency defrosting device 1000 also includes a base 500. The base 500 extends longitudinally T1 within the housing 110. In this embodiment, the base 500 is disposed on the lower wall 112 of the housing 110 and is used to assemble the radio frequency antenna 400 and the radio frequency component 1001, so that the base 500, the radio frequency antenna 400, and the radio frequency component 1001 can be integrated into a single, installable unit.

[0059] The integrated unit solution solves the problems of complex and inefficient installation of the RF component 1001 and RF antenna 400. The base 500, made of engineering plastic injection molding, extends longitudinally T1 (front-to-back direction) and is located at the bottom of the housing 110. The length of the base 500 covers approximately the entire length of the defrosting chamber 101 and the functional chamber 102. The base 500 is used to fix the RF antenna 400 and the RF component 1001.

[0060] During assembly, the RF antenna 400 is first embedded in the front of the base 500, then the RF component 1001 is fixed to the rear, and then the whole assembly is inserted into the bottom of the housing 110 and locked with screws.

[0061] The integrated unit can be pre-assembled, for example, after electrical connection testing is completed in the factory, the base 500, RF antenna 400 and RF component 1001 can be directly assembled into an independent module, which will be assembled with the housing 110 later.

[0062] The integration of the base 500 with the RF antenna 400 and RF component 1001 enables modular integration of components, simplifies the installation process, reduces the number of steps required for independent installation of each component, improves production efficiency, avoids the complexity and high risk of installing multiple parts separately on the assembly line, and reduces the probability of omissions or incorrect installations. Furthermore, during later maintenance, when repair or replacement of the RF component 1001 is required, the entire integrated unit can be quickly disassembled and replaced, greatly facilitating after-sales service.

[0063] In one embodiment, the base 500 includes a first mounting portion 510 and a second mounting portion 520. For example... Figure 8 As shown, the first mounting part 510 is located on one side of the thawing chamber 101, and the radio frequency antenna 400 is mounted on the first mounting part 510. Figure 9 As shown, the second mounting part 520 is located on one side of the functional cavity 102, and the radio frequency assembly 1001 is mounted on the second mounting part 520.

[0064] The base 500 is disposed adjacent to the first wall of the housing 110. In this embodiment, the first wall is the lower wall of the housing 110. Of course, as another feasible approach, the base 500 may also be disposed adjacent to other walls of the housing 110, as long as it facilitates the layout of the base 500, the radio frequency antenna 400 and the radio frequency component 1001.

[0065] In this embodiment, the radio frequency antenna 400 is disposed on the side of the first mounting portion 510 facing away from the defrosting chamber 101. The radio frequency assembly 1001 is mounted on the side of the second mounting portion 520 facing the functional cavity 102. The base 500 is also provided with an opening 513 connecting the first mounting portion 510 and the second mounting portion 520. The radio frequency antenna 400 has a main body fixed to the first mounting portion 510 and a connecting line connecting the main body. The connecting line passes through the opening 513 to connect with the radio frequency assembly 1001.

[0066] like Figure 9 As shown, the second mounting portion 520 includes a first positioning portion 521 and a second positioning portion 522. The first positioning portion 521 and the second positioning portion 522 are arranged along a transverse direction T2 within the functional cavity 102. The power amplifier module 200 is fixed to the first positioning portion 521. The tuning module 300 is fixed to the second positioning portion 522. The first positioning portion 521 and the second positioning portion 522 are arranged along the transverse direction T2 of the enclosure to accommodate the dimensions of the functional cavity 102. The first positioning portion 521 and the second positioning portion 522 are engaged with the RF assembly 1001 via clips and screws to ensure installation stability.

[0067] The partitioned structure of the first mounting section 510 and the second mounting section 520 optimizes the component layout, enabling separate installation of the RF antenna 400 and the RF component 1001, and reducing electromagnetic interference. Simultaneously, the horizontal T2 arrangement of the first positioning section 521 and the second positioning section 522 along the housing provides ample installation space for the RF component 1001, improving assembly convenience, reducing installation errors, and enhancing impedance matching stability. This results in a well-organized internal layout of the entire RF defrosting device 1000, which is beneficial for heat dissipation and signal transmission.

[0068] In one embodiment, the power amplifier module 200 is arranged vertically. The first positioning part 521 also includes a power amplifier support part 5212. The power amplifier support part 5212 extends upward and abuts against the side wall 113 of the power amplifier module 200 to provide lateral support for the power amplifier module 200. Figure 7 As shown, the power amplifier support 5212 extends along the height direction of the power amplifier module 200 and is in close contact with the side wall 113, which can enhance the stability of the power amplifier module 200 and prevent lateral displacement.

[0069] In one embodiment, such as Figure 8 and 9 As shown, the first mounting portion 510 includes a first upper surface 512 facing the defrosting chamber 101 and a first recess 511 disposed opposite to the first upper surface 512. The first recess 511 is formed by recessing from the first mounting portion 510 in a direction away from the first wall. The radio frequency antenna 400 is mounted in the first recess 511, that is, disposed on the side of the first mounting portion 510 opposite to the defrosting chamber 101.

[0070] like Figure 9 As shown, the second mounting portion 520 includes a second upper surface 523 facing the functional cavity 102. The first upper surface 512 is higher than the second upper surface 523. The radio frequency antenna 400 is at a height greater than a preset distance from the upper surface of the lower wall 112.

[0071] The base 500 sits on the upper surface of the lower wall 112. The radio frequency antenna 400 maintains a height greater than a preset distance from the upper surface of the lower wall 112. In this embodiment, this preset distance can be no less than 20% of the overall height of the cavity (i.e., the distance between the upper wall 111 and the lower wall 112), for example, a total height of 20cm. The distance between the radio frequency antenna 400 and the lower wall 112 is no less than 4cm. This height setting allows for a reasonable distribution of the electric field, preventing excessive concentration of electric field energy below the radio frequency antenna 400, thus effectively ensuring the electric field energy in the upper part of the thawing cavity 101.

[0072] Especially when food is placed in the upper part of the defrosting chamber 101, the capacitance value of the defrosting capacitor formed between the RF antenna 400 and the upper wall 111 increases. Combined with this preset height, the capacitance value of the defrosting capacitor is ensured to be greater than the capacitance value of the capacitor formed between the RF antenna 400 and the lower wall 112, thus fully utilizing the electric field energy in the upper part of the RF antenna 400. This embodiment balances the utilization of the upper storage space with guaranteed defrosting performance.

[0073] The second upper surface 523 is lower than the first upper surface 512, which maximizes the use of the space in the functional cavity 102, satisfying both the defrosting requirements of the defrosting capacitor and the installation requirements of the tuning module 300. This layout allows the RF antenna 400 and the RF component 1001 to be staggered in the longitudinal T1 space, achieving efficient space utilization.

[0074] Drawer assembly 600

[0075] In one embodiment, such as Figure 3 , 5 As shown, the defrosting chamber 101 has a first opening 141 located away from the functional chamber 102. As Figure 4 As shown, the functional cavity 102 has a second opening 114 located away from the defrosting cavity 101. (As indicated...) Figure 2 , 3 As shown in Figure 5-7, the drawer assembly 600 extends into or out of the defrosting chamber 101 from the first opening 141. The cabinet 100 includes a back panel 120 that closes the second opening 114.

[0076] The drawer assembly 600 includes a door 610, a shield 620, and a drawer body 630. When the drawer assembly 600 is moved into the defrosting chamber 101, the shield 620 covers the first opening 141. This first opening 141 can also be referred to as the entry or exit point of the drawer assembly 600. Both the back panel 120 and the shield 620 are provided with metal components. The shield 620, the outer shell 110, and the back panel 120 enclose a shieldable radio frequency space 103.

[0077] In this embodiment, the defrosting chamber 101 and the functional chamber 102 are completely surrounded from six directions: front, back, top, bottom, left, and right. The radio frequency space 103 can confine radio frequency energy inside and prevent external leakage; or, during the radio frequency defrosting process, the radiation leakage is controlled below the standard by the radio frequency space 103 formed by the enclosure.

[0078] This enclosed structure also allows for drawer-style operation, maintaining shielding integrity and facilitating user operation. Furthermore, the metal components enhance structural strength, ensuring the widespread adoption of radiofrequency defrosting technology in home environments.

[0079] In this embodiment, the outer shell 110 and the back panel 120 are separate components. Alternatively, the back panel 120 can be integrally formed with the outer shell 110 and then bent from one side wall of the outer shell 110, thus achieving the purpose of this application.

[0080] The drawer assembly 600 and the shield 620 improve user convenience by making it easier to pull out the defrosted food from the defrosting chamber 101. On the other hand, after the drawer assembly returns to the defrosting chamber 101, it forms a closed radio frequency space 103, which enhances the safety and practicality of the device.

[0081] In one embodiment, such as Figure 3 and 5 As shown, the outer casing 110 encloses a third opening 115. The housing 100 also includes a door frame 140 fixedly connected to the outer casing 110. The door frame 140 is made of metal and covers the third opening 115. The door frame 140 is fixedly connected to the outer casing 110. The door frame 140 surrounds a first opening 141. The size of the first opening 141 is smaller than that of the third opening 115. The door frame 140 at least partially covers the gap between the outer casing 110 and the shielding member 620.

[0082] The door frame 140 is connected to the housing 110 by clips and screws. Since the base 500 forms the bottom of the new drawer, the gap between the base 500 and the lower wall 112 is sealed by the door frame 140, preventing large electromagnetic leakage gaps between the drawer and the housing 110. The metal door frame 140 also enhances shielding integrity and reduces gap leakage.

[0083] like Figure 5 and 6 As shown, the shielding member 620 includes a shielding recess 621. The shielding recess 621 extends into the defrosting chamber 101. When the drawer assembly 600 is moved into the defrosting chamber 101, the shielding recess 621 extends into the first opening 141 to reduce the gap between the shielding member 620 and the door frame 140.

[0084] The shielding recess 621 is a structure inwardly recessed from front to back in the door body 610. When the drawer assembly 600 is moved in, the shielding member 620 is embedded in the door frame 140. The shielding recess 621 reduces the gap between the shielding member 620 and the door frame 140, enhancing the shielding effect.

[0085] like Figure 6As shown, the drawer assembly 600 also includes a drawer body 630. The drawer body 630 includes a main body recess 631 adjacent to the door. A shielding recess 621 extends into the main body recess 631. When the drawer assembly is moved into the defrosting chamber 101, the main body recess 631 extends into the first opening 141 and is located within the door frame. The drawer body 630 is also embedded inside the door frame 140 through the main body recess 631, thereby facilitating the embedding of the shielding member 620 located on the front side of the drawer body 630 into the first opening 141.

[0086] In one embodiment, the shielding recess 621, the main body recess 631, and the first opening 141 all have the same outline shape. When the drawer assembly 600 is moved into the defrosting chamber 101, the shielding recess 621, the main body recess 631, and the door frame 140 are stacked sequentially, forming a labyrinthine gap between the shielding recess 621 and the door frame 140 to prevent electromagnetic leakage. The first opening 141 has a rectangular outline, such as... Figure 6 As shown, stacking creates multiple non-linear paths with gaps distributed in a labyrinthine pattern. These labyrinthine gaps extend the electromagnetic wave path and reduce leakage.

[0087] In one embodiment, the shielding member 620 further includes an extended covering edge 622. The extended covering edge 622 extends outward around the shielding recess 621. The extended covering edge 622 covers at least a portion of the door frame 140 in the projection along the longitudinal direction T1.

[0088] like Figure 6 As shown, the extended covering edge 622 is a flat metal sheet that extends along the edge of the shield 620. When the drawer assembly is moved into the defrosting chamber 101, it overlaps with the surface of the door frame 140. That is, the shield 620 not only covers the first opening 141, but also has a certain overlap area with the door frame 140 outside the first opening 141. The extended covering edge 622 increases the shielding area and reduces gap exposure.

[0089] In one embodiment, such as Figure 5 As shown, the radio frequency defrosting device 1000 includes a pair of slide rails 800. The pair of slide rails 800 are configured as a telescopic structure. The pair of slide rails 800 are arranged laterally T2 on both sides of the drawer assembly 600. One end of each slide rail 800 is connected to the side wall 113 of the housing 110, and the other end is connected to the shielding member 620. The slide rails 800 are metal telescopic components, such as three-section rails. Both ends of the slide rails 800 are fixed to the inner side of the housing 110 and the outer side of the drawer body 630, respectively, supporting the movement of the drawer assembly 600 and providing stable movement support.

[0090] like Figure 5 and 7As shown, the shielding component 620 is connected to the slide rail 800 via the connecting reinforcement component 623. The connecting reinforcement component 623 is made of metal. A metal component is installed on the slide rail 800. The connecting reinforcement component 623 is electrically connected to the housing 110 via the slide rail 800, forming a conductive path between the shielding component 620 and the housing 110, which is grounded.

[0091] The connecting reinforcement 623 is fixed between the shield 620 and the slide rail 800. The grounding terminal connects the housing 110 to the ground wire, and the grounding path forms a Faraday cage effect, allowing for a larger gap and reducing leakage.

[0092] Specifically, the left and right sides of the shielding component 620 are electrically connected to the aforementioned connecting reinforcement 623 via screws, rivets, or welding, meaning there is a pair of connecting reinforcement 623 on each side. The other end of the connecting reinforcement 623 is electrically connected to the metal part of the slide rail 800 via screws, rivets, or welding. The metal part of the slide rail 800 is a conductive track, electrically connected to the side wall 113 of the housing 110 via metal screws. The housing 110 is grounded to the equipment ground wire. The connecting reinforcement 623 provides multiple conductive paths, forming a Faraday cage grounding mode. Even with a large gap between the shielding component 620 and the housing 110, it still effectively shields radiation. Compared to ungrounded systems that require completely sealing small gaps, the grounding method of the shielding component 620 reduces the requirements for precise gaps, avoiding the risk of poor contact and leakage caused by deformation. Furthermore, the metal connecting reinforcement 623 enhances mechanical strength, improves the bonding strength between the shielding component 620 and the slide rail 800, reduces vibration or deformation during use, and overall improves shielding reliability and device durability.

[0093] like Figure 5 and 10 As shown, the radio frequency defrosting device 1000 also includes a detection unit 700. The detection unit 700 detects the state of the drawer assembly 600 being moved in and out.

[0094] In this embodiment, the detection unit 700 is exposed at least partially through the shield 230 within the defrosting chamber 101 to detect the position of the drawer assembly 600. The detection unit 700 may employ a Hall sensor or a microswitch. When the drawer assembly 600 is opened, the detection unit 700 detects an increase in distance from the drawer; when closed, it detects a minimum distance, until the minimum value is reached, indicating that the drawer is fully closed.

[0095] By accurately judging the status of the drawer assembly through the detection unit 700, the control system can automatically stop or not start the defrosting function to prevent radiation leakage when the drawer assembly is opened, thus ensuring the safety of equipment operation and improving overall reliability and user trust.

[0096] Power Amplifier Module 200

[0097] 200 power amplifier modules Figure 2 , 4 As shown in Figures 7, 9, 10, and 11. For the specific structure of the power amplifier module 200, please refer to [reference needed]. Figure 10 and 11 The system includes a power amplifier circuit board 210, a heat dissipation structure 220, and a shielding cover 230. The heat dissipation structure 220 dissipates heat from the power amplifier circuit board 210. The heat dissipation structure 220 includes a heat dissipation substrate 221 and heat dissipation fins 222 connected to one side of the heat dissipation substrate 221. The power amplifier circuit board 210 is disposed on the side of the heat dissipation substrate 221 opposite to the heat dissipation fins 222.

[0098] The heat dissipation structure 220 uses an aluminum heat dissipation base plate 221 and heat dissipation fins 222. The heat dissipation fins 222 extend rearward along the longitudinal direction T1 of the enclosure 100. The power amplifier circuit board 210 adopts a vertical arrangement T3 to improve space utilization.

[0099] like Figure 10 As shown, the power amplifier circuit board 210 includes at least a circuit board 211, power amplifier components disposed on the circuit board 211, and power connector terminals 212. The circuit board 211 has a front side 214 and a back side 215. The front side 214 faces the side where the defrosting chamber 101 is located. The power amplifier components are disposed on the front side 214. The back side 215 faces the heat dissipation structure 220. The power connector terminals 212 are disposed on the back side 215. The heat dissipation structure 220 is disposed on the side of the power amplifier circuit board 210 away from the defrosting chamber 101. The heat dissipation structure 220 is disposed adjacent to the back side 215 of the circuit board 211 to dissipate heat from the power amplifier circuit board 210.

[0100] The heat dissipation structure 220 has a power clearance hole 2211 for the power plug terminal 212 to pass through the heat dissipation structure 220 and connect to an external power source.

[0101] The power amplifier components may include a power amplifier chip, a driver, a directional coupler, a control chip, an AC / DC converter chip, and an RF output terminal 213. A power connector 212 extends from the back surface 215 of the circuit board 211, passes through a power clearance hole 2211 on the heat dissipation structure 220, and connects to an external power supply. The RF output terminal 213 is also connected to the back surface of the circuit board 211. The heat dissipation structure 220 also has an RF clearance hole 2212. The RF clearance hole 2212 allows the RF output terminal 213 to pass through the heat dissipation structure 220 and connect in series with the tuning module 300.

[0102] This structure employs a design where the power amplifier circuit board 210 has its front 214 facing forward and its back 215 connecting to the power supply, avoiding the problems of complex bends or excessive vertical T1 space required by traditional solutions. The power connector 212 passes directly through the heat dissipation structure 220 from the back 215 of the power amplifier module 200, achieving an efficient and simple electrical connection. Furthermore, through the design of the power clearance hole 2211, the power connector 212 can pass directly through the heat dissipation structure 220, while the area of ​​the circuit board 211 outside the power connector 212 remains in close contact with the heat dissipation structure 220, maximizing the contact area and thus improving heat conduction efficiency. In addition, this structure simplifies assembly and maintenance. The power connection of the power amplifier module 200 is completed from the rear, allowing the entire module to be installed and disassembled as an independent unit, reducing installation complexity and facilitating subsequent maintenance and replacement. Therefore, this structure not only improves product reliability and production efficiency but also reduces manufacturing costs.

[0103] In one embodiment, such as Figure 7 As shown, the heat dissipation structure 220 completely covers the power amplifier circuit board 210 in a direction perpendicular to the plane of the circuit board 211. This ensures that the heat generated by the power amplifier circuit board 210 can be fully absorbed and conducted by the heat dissipation structure 220, improving the overall heat dissipation efficiency and eliminating local heat accumulation.

[0104] A shielding cover 230 is installed on the front 214 of the power amplifier circuit board 210, that is, the side facing the defrosting cavity 101. The shielding cover 230 and the heat dissipation structure 220 together form a shielding cavity 202. The circuit board 211 and the power amplifier components are housed within the shielding cavity 202. The power connector 212 extends away from the shielding cavity 202. The shielding cover 230 and the heat dissipation structure 220 together form the shielding cavity 202, which improves the electromagnetic shielding effectiveness and reduces radiation leakage. In this way, although the power amplifier module 200 is located inside the radio frequency space 103, the shielding cavity 202 shields against radio frequency interference, allowing the power amplifier module 200 to be installed inside the refrigerator.

[0105] This embodiment reuses the heat dissipation structure 220, simultaneously achieving multiple functions of heat dissipation and shielding, thus saving device costs. Although the circuit board 211 is a passive device, it can still transmit electromagnetic interference. This embodiment forms a shielding cavity 202 between the shielding substrate 231 and the heat dissipation substrate 221, completely accommodating the circuit board 211 and the power amplifier components. This ensures electromagnetic shielding of the entire circuit board 211 and the power amplifier components, and also ensures that the circuit board 211 does not transmit electromagnetic interference. This allows the power amplifier module 200 to be independently housed within the RF space 103, preventing external electromagnetic interference from affecting the sensitive components inside the power amplifier module 200, and ensuring that the power amplifier module 200 can operate stably and reliably during RF de-freezing.

[0106] In one embodiment, the heat dissipation structure 220 and / or the shielding cover 230 are connected to ground, and the grounding connection eliminates static electricity accumulation and electromagnetic interference. In this embodiment, the heat dissipation structure 220 and / or the shielding cover 230 are mainly grounded to the metal outer shell 110 of the enclosure 100 through conductive structures, thereby improving its safety and its ability to shield against electromagnetic interference.

[0107] In one embodiment, the shielding cavity 202 is configured to isolate electromagnetic interference outside the shielding cavity 202.

[0108] By reducing gaps through the shielding cover 230 and heat dissipation structure 220, filling the seams with conductive sealing strips, and coating the inner wall of the shielding cavity 202 with wave-absorbing material, the shielding cavity 202 forms an electromagnetic "Faraday cage," ensuring its ability to shield electromagnetic fields and effectively blocking external electromagnetic waves from entering, or attenuating interference signals within the shielding cavity 202 to below the background noise level. This ensures that the power amplifier module 200 operates stably and reliably in complex electromagnetic environments.

[0109] like Figure 10 As shown, the heat dissipation structure 220 includes heat dissipation wing 223 connected to the heat dissipation substrate 221. In this embodiment, a heat dissipation wing 223 is connected to each of the two lateral sides of the heat dissipation substrate 221. The power amplifier circuit board 210 is disposed between the heat dissipation wing 223 and the heat dissipation substrate 221, and the heat dissipation wing 223 and the heat dissipation fin 222 extend backwards.

[0110] After absorbing heat from the power amplifier circuit board 210, the heat dissipation substrate 221 diffuses some of the heat backward through the heat dissipation fins 222, and some heat diffuses forward and to the sides through the heat dissipation wing 223. The heat dissipation wing 223 on both sides provides additional heat dissipation channels and surface area. The heat dissipation fins 222, the heat dissipation substrate 221, and the pair of heat dissipation wing 223 together form a three-dimensional heat sink, allowing heat to diffuse in multiple directions, significantly improving heat dissipation efficiency compared to traditional single-fin designs. In addition, the heat dissipation wing 223 encloses the power amplifier circuit board 210, and the heat dissipation wing and heat dissipation substrate 221 on both sides create a U-shaped space. This U-shaped enclosed design provides additional mechanical support for the power amplifier circuit board 210 while enhancing vibration resistance and structural strength, reducing the risk of deformation of the power amplifier circuit board 210 due to external forces during transportation or use. This heat dissipation structure 220 provides an efficient and stable heat dissipation solution for the application of the RF defrosting device 1000 in refrigeration equipment.

[0111] In one embodiment, the density of the heat dissipation fins 222 is adjusted according to the heat generation at different locations on the power amplifier circuit board 210 to match the thermal load.

[0112] The heat sink fins 222 are made of aluminum alloy and are distributed on the back side 215 of the heat sink substrate 221. The fin density is higher in high-heat areas of the circuit board, such as where the power amplifier is located. This is achieved by increasing the number of fins or reducing the spacing to achieve a denser arrangement, while the fin density is lower in low-heat areas to match the heat load distribution. This targeted density distribution optimizes heat dissipation, avoids localized overheating in high-heat areas, saves material, and improves overall heat dissipation efficiency.

[0113] like Figure 10 As shown, the shielding cover 230 includes a shielding substrate 231 disposed opposite to the heat dissipation substrate 221 and shielding side wings 232 connected to the shielding substrate 231. In this embodiment, a pair of shielding side wings 232 are provided, and are respectively connected to both sides of the shielding substrate 231 in the vertical direction T3. Figure 11 As shown, the shielding substrate 231, the heat dissipation substrate 221, the shielding wing 232, and the heat dissipation wing 223 together form the shielding cavity 202. The shielding substrate 231 and the shielding wing 232 are precisely matched with the heat dissipation substrate 221 and the heat dissipation wing 223, forming a complete shielding space through a tight connection, ensuring comprehensive electromagnetic protection for the power amplifier module 200.

[0114] In one embodiment, a pair of shielding wing 232 are spaced apart in the vertical direction, and a pair of heat dissipation wing 223 are spaced apart in the horizontal direction. They are detachably connected to each other to enclose a cuboid space. The heat dissipation structure 220 is fixedly connected to the shielding cover 230 by the connection of the pair of shielding wing 232 and the pair of heat dissipation wing 223.

[0115] The detachable connection methods include screws, snaps, or sliding structures, which not only facilitates rapid assembly on the production line, but also allows for easy disassembly of the shield 230 when the equipment needs maintenance or replacement of internal components, thus improving maintenance convenience.

[0116] like Figure 10 As shown, the shielding cover 230 has a through hole 2311. The main body of the detection unit 700 is fixed to the side of the circuit board 211 facing the thawing chamber 101. The detection end of the detection unit 700 extends into the thawing chamber 101 through the through hole 2311.

[0117] The main body of the detection unit 700 is securely fixed inside the shielding cover 230, while only the detection end protrudes through the through hole 2311 to detect the opening and closing status of the defrosting drawer. This layout allows the shielding cavity 202 to shield the main body of the detection unit 700 at the same time, and also makes it easier for the detection unit 700 to be directly connected to the power amplifier circuit board 210 at a closer distance.

[0118] like Figure 11As shown, the power connector 212 is elongated and positioned vertically along T3. The outline of the power clearance hole 2211 matches the outer outline of the power connector 212. This ensures that the connector can smoothly pass through the heat dissipation structure 220 and connect to the external power supply, while minimizing the opening area on the heat dissipation structure 220 to improve heat dissipation.

[0119] like Figure 7 and 10 As shown, multiple heat dissipation fins 222 extend along the height direction of the housing 100, and include a middle fin 2221 and edge fins 2222 located on both sides of the middle fin 2221 in the transverse direction T2.

[0120] A power clearance hole 2211 is located on the side of an edge fin 2222 away from the middle fin 2221. The side of the edge fin 2222 away from the heat dissipation substrate 221 abuts against the rear back plate 120, and there is a gap between the middle fin 2221 and the rear back plate 120. The airflow channel between adjacent middle fins 2221 is connected through the gap. Therefore, the extension length of the edge fin 2222 in the longitudinal direction T1 of the housing is greater than the extension length of the middle fin 2221, causing the rear edge of the middle fin 2221 to be recessed inside the edge fin 2222.

[0121] The radio frequency defrosting device includes a first air duct 201 extending along the height direction of the housing 100 and a second air duct 131 connecting the first air duct 201 and the defrosting chamber 101.

[0122] The first air duct 201 is disposed adjacent to the heat dissipation structure 222. In this embodiment, a plurality of heat dissipation fins 222 are arranged at intervals along the width direction of the housing 100, thereby forming an airflow channel between adjacent heat dissipation fins 222. This airflow channel is the first air duct 201 in this application, so that the heat of the heat dissipation structure 220 is transferred through the first air duct 201. The second air duct 131 is disposed at the top of the housing 100 and extends from above the functional cavity 102 to above the defrosting cavity 101, and is provided with an air outlet communicating with the defrosting cavity 101.

[0123] In this embodiment, the rear backplate 120 covers all the heat dissipation fins 222, thereby shielding the rear side of the first air duct 201 and preventing heat from being transferred to the rear. In addition, a space is left between the middle fin 2221 and the rear backplate 120, and the first air duct 201 is formed between the edge fins 2222 on both sides, the heat dissipation substrate 221, and the rear backplate 120, which is conducive to airflow and heat dissipation.

[0124] In one embodiment, the rear panel 120 has a plug-in hole. The plug-in hole is disposed opposite to the power clearance hole 2211 along the longitudinal direction T1. After the power plug-in terminal 212 passes through the power clearance hole 2211 of the heat dissipation structure 220, it can directly pass through the plug-in hole of the rear panel 120 to realize the connection with the external power supply, further simplifying the installation process.

[0125] The radio frequency defrosting device 1000 also includes a cooling fan 240 disposed within the functional cavity. The cooling fan 240 drives airflow along the airflow channels between the heat dissipation fins 222, enhancing convective heat dissipation, accelerating heat dissipation, avoiding insufficient natural heat dissipation and local overheating, significantly improving the cooling speed and reducing the circuit board temperature.

[0126] In one embodiment, the power amplifier elements are aligned along the length of the housing 100 within the projected area between two edge fins 2222. Since the heat generated by the power amplifier module is primarily dissipated through these power amplifier elements, this arrangement facilitates centralized heat dissipation.

[0127] In one embodiment, the cooling fan 240 is an axial flow fan. Multiple heat dissipation fins 222 are arranged at intervals along a transverse direction T2. ​​Each heat dissipation fin 222 extends vertically. The cooling fan 240 is fixedly connected to the heat dissipation substrate 221. The cooling fan 240 is positioned above, below, or between the multiple heat dissipation fins 222. The air outlet direction of the cooling fan 240 faces the airflow channel, i.e., the first air duct 201. In this embodiment, the cooling fan 240 is positioned near the lower side of the heat dissipation fins, and its air outlet direction is the same as that of the first air duct 201.

[0128] The axial fan, combined with the first air duct formed between the heat dissipation fins, enables the directional airflow to effectively improve heat exchange efficiency and avoid turbulence losses. For example, the airflow velocity is evenly distributed, and the heat dissipation uniformity is improved, making it suitable for the compact functional cavity 102 environment.

[0129] like Figure 4 , 10 As shown in Figure 11, the cooling fan 240 drives airflow to introduce heat from surrounding heat-generating or heat-dissipating components into the defrosting chamber 101. Specifically... Figure 11 In the middle, the cooling fan 240 drives the airflow through the first air duct 201 between the cooling fins 222, which enhances the heat dissipation capacity of the power amplifier module 200 by forced air delivery, and reuses the waste heat of the power amplifier module 200 and introduces it into the defrosting chamber 101 to assist in defrosting food, thus achieving efficient use of energy. Furthermore, due to the utilization of this heat, the impact on the internal temperature of the refrigerator is reduced.

[0130] In one embodiment, a plurality of cooling fans 240 are provided. The plurality of cooling fans 240 are arranged side-by-side along the transverse direction T2. ​​In this embodiment, the number of cooling fans 240 is the maximum number required to satisfy the width distance requirement between the edge fins 2222 on both sides. Figure 9-11 As shown, two cooling fans 240 are set up to cover the entire fin area by being installed side by side, maximizing the coverage of the first air duct 201, resulting in a more uniform airflow distribution. In particular, the heat is carried away from the areas where the power amplifier components generate concentrated heat, avoiding insufficient local cooling caused by a single fan, and improving the overall heat dissipation efficiency and thermal circulation efficiency.

[0131] like Figure 4 As shown, the radio frequency defrosting device 1000 also includes a fan bracket 241. The fan bracket 241 includes a plurality of fan holes. Each fan hole houses a cooling fan 240. The fan bracket 241 is fixedly connected to the side of the heat dissipation substrate 221 away from the defrosting chamber 101 and is located below the intermediate fins 2221. A certain gap is formed between the bottom end of the heat dissipation fins 222 and the bottom wall of the functional chamber 102, thereby forming a circulating air duct below the cooling fan 240.

[0132] The radio frequency defrosting device 1000 also includes a support member 242. The support member 242 is fixedly connected to the heat dissipation substrate 221, and the support member 242 supports the fan bracket 241 upward.

[0133] The fan bracket 241 is fixed to the rear end of the heat sink 221 by welding or screws. The fan bracket 241 rests on the support member 242. The combination of the fan bracket 241 and the support member 242 achieves stable installation of the fan, ensuring that the fan remains stable during high-speed operation and reducing vibration and noise. Moreover, this modular design allows the cooling fan 240 and the fan bracket 241 to be pre-assembled as a whole, and then integrated with the power amplifier module 200 for subsequent assembly on the production line.

[0134] A second recess 5211 is provided on the base 500 for positioning the heat dissipation structure 220. The heat dissipation wing 223 is detachably connected to the base 500. The detachable connection can be made by screws, clips, or sliding structures. The matching shape of the second recess 5211 provides precise positioning, reduces assembly deviations, and the detachable connection facilitates maintenance.

[0135] In this embodiment, the heat dissipation structure 220 and the shielding cover 230 are combined into a whole and then installed in the second recess 5211. In this way, the power amplifier module 200 can be pre-assembled into a complete unit and then easily installed on the base 500 as a whole module. This greatly simplifies the production process, reduces assembly difficulty and error rate, and also facilitates future maintenance and replacement, thus improving the overall maintainability of the product.

[0136] The second air duct 131 is located at the top of the housing 100 and extends horizontally. The second air duct 131 connects the first air duct 201 and the defrosting chamber 101. While the radio frequency antenna 400 outputs radio frequency energy, the cooling fan 240 drives the airflow to flow sequentially through the first air duct 201 and the second air duct 131 into the defrosting chamber 101.

[0137] Combining the first air duct 201 extending vertically along T3 (i.e., in the up-down direction), and the functional cavity 102 located behind the defrosting cavity 101, the airflow flows upward from the rear to the second air duct 131, then forward along the second air duct 131, and finally downward towards the defrosting cavity 101. Since the items to be defrosted in the defrosting cavity 101 are placed in a drawer and generally do not touch the upper wall 111, they do not obstruct the airflow from the second air duct 131, allowing the airflow to be more evenly distributed downwards. The airflow path is as follows... Figure 6 As shown.

[0138] This planned airflow avoids turbulence caused by direct airflow collisions, ensuring that the heat generated by the heat dissipation structure 220 smoothly enters the defrosting chamber 101 with the hot air, thus improving heat transfer stability. In this way, the RF defrosting device 1000 not only defrosts using RF energy but also recovers and reuses the heat generated by the power amplifier module 200 for defrosting, reducing energy waste. The power amplifier module 200's function is reused, achieving better defrosting results with a smaller footprint. This makes the overall structure of the RF defrosting device 1000 more compact, suitable for refrigeration equipment such as refrigerators, improving the device's reliability and user experience.

[0139] In one embodiment, such as Figure 6 As shown, the second air duct 131 is formed by the upper wall 111 and the cover plate 130 located at the top of the housing 100. A first air outlet 1111 and a second air outlet 1112 are provided on the upper wall 111. The first air outlet 1111 connects the first air duct 201 and the second air duct 131. The second air outlet 1112 connects the second air duct 131 and the defrosting chamber 101.

[0140] like Figure 3 and 5 As shown, multiple second air outlets 1112 are spaced apart along both the transverse direction T2 and the longitudinal direction T1. Multiple air guide ribs 132 are provided on the cover plate 130. The air guide ribs 132 guide the airflow from the first air outlet 1111 to the multiple second air outlets 1112.

[0141] The air guide ribs 132 are raised ribs distributed along the inner surface of the cover plate 130, guiding the airflow to disperse to each air outlet. The air guide ribs 132 can optimize airflow distribution, avoid local overheating, and make the hot airflow cover the entire top surface as much as possible, improving the uniformity of defrosting.

[0142] In one embodiment, the plurality of air guide ribs 132 include radial ribs 1321 and extending ribs 1322. Each radial rib 1321 has one end facing the first air outlet 1111 and the other end extending radially. Each extending rib 1322 is aligned with the end of one of its radial ribs 1321 furthest from the first air outlet 1111. The extending ribs 1322 are evenly spaced and extend longitudinally along T1. A plurality of second air outlets 1112 are provided between adjacent extending ribs 1322. From the defrosting chamber 101 towards the functional chamber 102, the opening area of ​​the second air outlets 1112 increases.

[0143] Radial ribs 1321 diffuse from the air outlets to the entire upper surface of the defrosting chamber 101. Extending ribs 1322 guide the airflow along the longitudinal direction T1, with the orifices designed to be smaller at the front and larger at the back. The gradual change in orifice size and the guide ribs 132 work together to ensure that the airflow is evenly distributed from front to back, enhancing the defrosting effect. In particular, as the airflow in the second air duct 131 blows forward, the airflow at the very front stops moving forward after encountering the front wall, and tends to accumulate at the front and blow downwards. However, the opening area of ​​the second air outlet 1112 increases as it moves further back, making it easier for the airflow at the rear to blow downwards. This achieves a balancing effect, resulting in more even airflow from front to back.

[0144] like Figure 4 , 5 As shown in Figure 9, the tuning module 300 includes a partition 370. The partition 370 separates the defrosting chamber 101 and the functional chamber 102. A first vent 371 is provided on the partition 370 to allow airflow communication between the defrosting chamber 101 and the functional chamber 102. An airflow loop is formed between the first air duct 201, the second air duct 131, the defrosting chamber 101, and the functional chamber 102.

[0145] The first vent 371 allows airflow to return from the thawing chamber 101 to the functional chamber 102, thus, as Figure 6 As shown, an airflow flows from front to back between the defrosting chamber 101 and the functional chamber 102, and an airflow flows from back to front above the defrosting chamber 101 and the functional chamber 102, i.e., within the second air duct 131. During this airflow circulation, there are no areas where the airflows conflict with each other. This complete circulating airflow also ensures that the heat generated by the tuning module 300 and other components can be carried away and used to assist in defrosting.

[0146] The heat from the functional cavity 102 is introduced into the defrosting cavity 101 by the cooling fan 240, and then the airflow from the defrosting cavity 101 is introduced into the functional cavity 102 through the first vent 371, thus forming a complete airflow loop. In the process of forming the airflow loop, the heat generated by the tuning module 300 (such as the heat from the inductor 330, variable capacitor 320, and fixed capacitor 310 mentioned below) can also be brought into the defrosting cavity 101, making fuller use of thermal energy.

[0147] In one embodiment, a cooling fan 240 is disposed below a first air duct 201. The first air duct 201 is disposed on one side of a functional cavity 102. A first vent 371 is disposed on the other side of the functional cavity 102, near the top. The air inlet of the cooling fan 240 and the first vent 371 are arranged diagonally within the functional cavity 102 and are interconnected by airflow within the functional cavity 102, thereby forming a third air duct 1021 within the functional cavity 102 connecting the first vent 371 and the air inlet of the cooling fan 240. The tuning module 300 is disposed on the air path between the first vent 371 and the air inlet of the cooling fan 240.

[0148] Functional cavity 102 has a rectangular structure, such as Figure 4 As shown, the first vent 371 is located in the upper left corner, and the air inlet of the cooling fan 240 is located in the lower right corner. In this way, the third air duct 1021 can blow through the entire area of ​​the functional cavity 102. The limiting bracket 360 not only fixes the inductor 330, the fixed capacitor 310, and the variable capacitor 320, but also constrains the third air duct 1021.

[0149] In one embodiment, the housing 110 includes a first limiting portion 1121 and a second limiting portion 1122. For example... Figure 4 As shown, the rear end of the longitudinal section T1 of the integrated unit abuts against the first limiting part 1121, and the front end of the longitudinal section T1 abuts against the second limiting part 1122. The second limiting part 1122 protrudes upward from the bottom of the housing 110. The first limiting part 1121 is a rear end stop, and the second limiting part 1122 is a front protrusion, aligned with the front end of the integrated unit to form a positioning. The first limiting part 1121 and the second limiting part 1122 ensure the precise installation of the integrated unit.

[0150] In one embodiment, a second vent 121 is provided on the rear panel 120 of the housing 100. A first vent 371 is disposed opposite to the second vent 121 along the direction from the defrosting chamber 101 to the functional chamber 102.

[0151] When the radio frequency defrosting device 1000 is integrated into a refrigeration device, such as a refrigerator, the refrigeration device includes a cold air duct and a damper, and the radio frequency defrosting device 1000 has a defrosting state and a refrigeration state.

[0152] When in the defrosting state, the damper is closed to prevent cold air from entering the defrosting chamber 101 and affecting the defrosting effect.

[0153] In the cooling state, the damper is open, and the cold air path is connected to the airflow in the defrosting chamber 101. The cold airflow passes through the second vent 121, the functional chamber 102, and the first vent 371 in sequence before being blown into the defrosting chamber 101, thereby achieving the cooling function in the defrosting chamber 101.

[0154] In this way, when not defrosting, the defrosting chamber 101 can function as a refrigeration compartment of the refrigerator, while during defrosting, it becomes a defrosting compartment. This intelligent airflow control ensures the independent operation of the radio frequency defrosting and conventional refrigeration functions, avoiding mutual interference between functions and improving the overall performance of the equipment.

[0155] Tuning Module 300

[0156] Tuning module 300 Figure 2 , 4 As shown in Figures 7, 9, 12-17, the tuning module 300 includes a variable capacitor 320, a fixed capacitor 310, and an inductor 330. The fixed capacitor 310 includes a first capacitor section 311 and a second capacitor section 312. The first capacitor section 311 is directly and fixedly connected to the RF output terminal 213 of the power amplifier module 200. The inductor 330 is connected in series between the second capacitor section 312 and the RF antenna 400. The variable capacitor 320 is connected in series between the second capacitor section 312 and the ground terminal.

[0157] See circuit schematic. Figure 13 As shown, the power amplifier module 200 is connected in series with the input terminal of the fixed capacitor 310. The output terminal of the fixed capacitor 310 is connected to the input terminals of the inductor 330 and the variable capacitor 320, respectively. The output terminal of the inductor 330 is connected in series with the radio frequency antenna 400. The output terminal of the variable capacitor 320 is grounded. The radio frequency antenna 400 and the first wall of the housing 110 (the upper wall 111 in this embodiment) form a defrosting capacitor. The housing 110 is grounded.

[0158] In this embodiment, the fixed capacitor 310 is not a standard capacitor purchased directly, but rather two separate capacitor plates arranged opposite each other. This eliminates the need for the fixed capacitor 310 to be fixed to the intermediate circuit board, thus eliminating the need for the RF cable connecting the intermediate circuit board and the power amplifier circuit board 210. In other words, this embodiment eliminates the need for traditional RF cables and intermediate circuit boards. Furthermore, considering the high cost of RF cables, this embodiment reduces manufacturing costs. Simultaneously, this direct fixed connection method optimizes impedance matching and improves the efficiency of RF energy transmission.

[0159] The first capacitor section 311 of the fixed capacitor 310 is made of a metal plate. For example... Figure 14 As shown, the first capacitor section 311 is directly connected to the RF output terminal 213 of the power amplifier module 200 by welding or screws, and the connection point uses conductive pads to ensure low-impedance contact. The second capacitor section 312 is separated from the first capacitor section 311 by an insulating layer, forming a fixed capacitance value.

[0160] like Figure 15As shown, the second capacitor section 312 includes a first plate 3121, a second plate 3122, and a connecting section 3123. The first plate 3121 and the second plate 3122 are disposed opposite to each other. A capacitor cavity 3120 is formed between the first plate 3121 and the second plate 3122, and the first capacitor section 311 is inserted into the capacitor cavity 3120.

[0161] The first capacitor section 311 is spaced apart from the first plate 3121, the second plate 3122 and the connecting section 3123 and does not contact each other. The first capacitor section 311, the first plate 3121 and the second plate 3122 form a parallel plate capacitor structure.

[0162] In one embodiment, such as Figure 12 As shown, the first capacitor section 311 includes a capacitor body 3111 and an extension section 3112. (As...) Figure 13 As shown, the extension 3112 is directly and fixedly connected to the RF output terminal 213 of the power amplifier module 200.

[0163] The radio frequency (RF) defrosting device 1000 is directly and fixedly connected to the RF output terminal 213 of the power amplifier module 200 via the extension 3112 of the first capacitor section 311 of the fixed capacitor 310. This significantly improves performance and economy, eliminates the use of traditional RF cables, reduces material costs, and shortens the connection path, improving signal transmission stability and reducing RF energy loss due to electromagnetic interference or poor contact. Furthermore, this design simplifies the circuit structure, facilitates modular integration, improves assembly efficiency, and enhances the reliability and durability of the device through direct connection, providing an economical and effective solution for the large-scale application of RF defrosting technology in refrigeration equipment.

[0164] In one embodiment, the capacitor body 3111 and the extension 3112 are configured as a single integral part or as separate parts. Here, a single integral part refers to being made of the same material and then connected together after one molding process, or being made of different materials and then connected together after one or two molding processes; a separate part is configured as being molded separately and then electrically connected by other electrical connectors.

[0165] Taking the integrated molding as an example, the capacitor body 3111 and the extension 3112 are integrally molded by stamping or injection molding process and made of conductive materials such as aluminum or copper. The extension 3112 extends naturally from one side of the capacitor body 3111, with a smooth and seamless surface. The integral molding reduces connection points and improves the mechanical strength and electrical connection stability of the capacitor structure.

[0166] In one embodiment, the RF output terminal 213 includes a conductive sheet. The extension 3112 is electrically connected to the conductive sheet, for example, by direct fixed connection. Figure 14 In the middle, two sheet-like structures are connected together by welding or by screws, rivets, or other means.

[0167] In one embodiment, the second capacitor portion 312 extends vertically. The fixed capacitor portion 321 of the variable capacitor 320 extends horizontally T2. The bottom surface of the second capacitor portion 312 is flush with the bottom surface of the fixed capacitor portion 321, and the vertical height of the second capacitor portion 312 is greater than that of the fixed capacitor portion 321.

[0168] The fixed capacitor 310 adopts a vertical T3 layout, which reduces the horizontal T2 occupation and makes room for the horizontal T2 movement of the movable capacitor section 322 of the variable capacitor 320.

[0169] In this embodiment, the first plate 3121, the second plate 3122, and the first capacitor section 311 are all elongated sheet structures extending in a direction perpendicular to the bottom surface of the housing 100. The vertical T3 layout of the fixed capacitor 310 also facilitates the installation of the inductor 330. Specifically, as Figure 4 , 9 As shown in Figure 14, the power amplifier module 200, the fixed capacitor 310 and the variable capacitor 320 are arranged sequentially along the horizontal direction T2 of the enclosure 100, and the inductor 330 is spirally arranged along the horizontal direction T2. ​​The compact layout of the horizontal T2 arrangement makes full use of the space of the outer shell 110 in the width direction and optimizes the space utilization of the functional cavity 102.

[0170] Inductor 330 is positioned above variable capacitor 320. The lowest point of inductor 330 is lower than the highest point of fixed capacitor 310. Furthermore, the distance between inductor 330 and variable capacitor 320 is greater than a sensing distance threshold, which is a safe distance to avoid or minimize the influence between inductor 330 and variable capacitor 320. Figure 4 and Figure 14 The sum of the height of the variable capacitor 320, the height of the inductor 330, and the safety distance between them is less than the height of the fixed capacitor 310, further demonstrating the effect of the vertical T3 arrangement of the fixed capacitor 310 on improving space utilization.

[0171] The inductor 330 has a spiral coil structure, which is wound with enameled copper wire. It is fixed to the second capacitor 312 and the radio frequency antenna 400 through electrode plates to ensure a stable signal transmission path.

[0172] like Figure 12 , 15 As shown in Figure -17, the variable capacitor 320 and the fixed capacitor 310 are arranged along the width of the enclosure, with the variable capacitor 320 located on the side of the fixed capacitor 310 away from the power amplifier module 200 to provide sufficient adjustment space for the variable capacitor 320. The variable capacitor 320 includes a fixed capacitor section 321 and a movable capacitor section 322. The fixed capacitor section 321 is disposed adjacent to the fixed capacitor 310, and the movable capacitor section 322 is disposed opposite to the fixed capacitor section 321 on the side away from the fixed capacitor 310.

[0173] The tuning module 300 includes a drive mechanism 340, which drives the movable capacitor section 322 to move relative to the fixed capacitor section 321. By changing the cross-over overlap area between the fixed capacitor section 321 and the movable capacitor section 322, the capacitance value of the variable capacitor 320 is adjusted.

[0174] In this embodiment, the variable capacitor 320 is an interdigital capacitor 320a. The fixed capacitor section 321 and the movable capacitor section 322 are two sets of electrodes for the interdigital capacitor. The two sets of electrodes are arranged alternately like the teeth of a comb, that is, they are spaced apart by multiple interdigital electrode plates that cross each other without touching. The multiple interdigital electrode plates of the fixed capacitor section 321 and the movable capacitor section 322 are parallel to each other. The interdigital capacitor 320a is as follows: Figure 12 , 14 As shown in Figure 17, by arranging two sets of comb-shaped metal electrodes alternately on the same plane, the capacitance density per unit area can be increased by increasing the length of the electrode edges, and the capacitance value can be adjusted by moving the comb-shaped metal electrodes along their extension direction.

[0175] In this embodiment, both the fixed capacitor portion 321 and the movable capacitor portion 322 of the variable capacitor 320 extend laterally T2 along the housing 100, that is, along the width direction of the housing 100. Therefore, the movable capacitor portion 322, driven by the driving mechanism 340, can move along the width direction of the housing 100 to adjust the capacitance value of the variable capacitor 320. The width direction of the housing 100 is the same as the length direction of the functional cavity 102.

[0176] When an increase in defrosting capacitance caused by food ingredients is detected, the movable capacitor section 322 moves away from the fixed capacitor section 321, thereby adjusting the capacitance value of the variable capacitor 320 to compensate for load changes and maintain impedance matching. See [link to movable capacitor section 322 movement instructions] for details. Figure 16 and 17 As shown in the figure, the states of the movable capacitor section 322 being closest to and furthest from the fixed capacitor section 321 are respectively shown.

[0177] The second capacitor part 312 and the fixed capacitor part 321 are integrally formed or separately provided. Here, the integrally formed part refers to the part made of the same material and connected together after being formed at the same time, or the part made of different materials and connected together after being formed at the same time or at the same time. The separate part is provided to be formed separately and then electrically connected by other electrical connectors.

[0178] Specifically, taking a unibody molded part as an example, such as Figure 14 and 15As shown, the second capacitor section 312 and the fixed capacitor section 321 are made of the same metal sheet and are integrally formed by stamping or cutting. This integrally formed structure can ensure the stability of electrical connection, eliminate the independent connection points between the second capacitor section 312 and the fixed capacitor section 321, reduce contact resistance and assembly errors, improve the reliability and durability of the capacitor structure, simplify the manufacturing process, reduce production costs, and compared with fixing the second capacitor section 312 and the fixed capacitor section 321 separately, the second capacitor section 312 and the fixed capacitor section 321 are integrally formed, which is larger in volume and easier to position.

[0179] In one embodiment, such as Figure 14 and 15 As shown, the second capacitor section 312 and the interdigitated electrode plate of the fixed capacitor section 321 extend backwards. Figure 15 The second capacitor section 312 extends to the right along the transverse direction T2, while the fixed capacitor section 321 extends to the left along the transverse direction T2, forming a 180° back-to-back layout. This avoids electric field interference on the basis of integral molding, optimizes the spatial layout, facilitates the compact integration of the tuning module 300, and improves the efficiency and stability of the radio frequency defrosting device 1000.

[0180] In addition, such as Figure 14 and 15 As shown, the tuning module 300 also includes a connecting piece 331 that connects the inductor 330 and the fixed capacitor part 321. The connecting piece 331 and the fixed capacitor part 321 are integrally formed or separately formed.

[0181] Taking the integrated molding as an example, the second capacitor part 312, the connecting piece 331 and the fixed capacitor part 321 can be formed by stamping metal sheet in one step. This integrates more parts, reduces contact resistance and assembly errors, provides a stable connection path, and improves the reliability of impedance matching and signal transmission efficiency.

[0182] The end of inductor 330 furthest from connector 331 is connected in series with radio frequency antenna 400. Radio frequency antenna 400 is made of metal plate and outputs radio frequency energy to defrosting chamber 101.

[0183] The connecting piece 331 and the interdigitated electrode plate of the fixed capacitor part 321 extend in the same direction, for example... Figure 15 The middle part extends to the left along the horizontal direction T2, and the interdigitated electrode plate of the second capacitor part 312 extends to the right along the horizontal direction T2, so the spatial layout is reasonable.

[0184] In this embodiment, the first plate 3121 and the connecting piece 331 extend in opposite directions within the same plane. Figure 15 The first plate 3121 and the connecting piece 331 are integrally formed from metal sheets, which optimizes the structure and space utilization.

[0185] like Figure 12 and 14 As shown, the movable capacitor section 322 is connected to the outer shell 110 of the housing 100 via a flexible wire 350, and the outer shell 110 is grounded.

[0186] The flexible wire 350 has good conductivity and flexibility. One end is fixedly connected to the end of the movable capacitor part 322 away from the fixed capacitor part 321, and the other end is connected to the housing 110 through multiple screws and grounded through the housing 110. When the movable capacitor part 322 moves under the action of the drive mechanism 340, the flexible wire 350 deforms accordingly to maintain electrical connection.

[0187] In one embodiment, such as Figure 9 and 12 As shown, the tuning module 300 also includes a limiting bracket 360 fixed on the base 500, which fixes the inductor 330, the fixed capacitor 310, and the variable capacitor 320. The limiting bracket 360 is made of engineering plastic. The limiting bracket 360 has a positioning cavity 3601 and a receiving cavity 3602. The internal space of the positioning cavity 3601 is adapted to the variable capacitor 320. The internal space of the receiving cavity 3602 is adapted to the fixed capacitor 310. A limiting part 363 and a guiding part 364 are provided in the positioning cavity 3601. The limiting part 363 fixes the fixed capacitor part 321, and the guiding part 364 guides the movement direction of the movable capacitor part 322.

[0188] The limiting bracket 360 has a guide groove 367 near the defrosting chamber 101, and the aforementioned partition 370 separates the defrosting chamber 101 and the functional chamber 102. The partition 370 has a limiting rib 372 that inserts into the guide groove 367. The partition 370 also has a buckle, which is fixedly connected to the base 500. The guide groove 367 is a groove structure, and the limiting rib 372 is a raised strip, forming a sliding guide during insertion. The buckle is fixed to the base 500 by fastening. The guide groove 367 and the limiting rib 372 improve the installation accuracy of the partition 370.

[0189] like Figure 9 , 12 As shown in Figures 16 and 17, the limiting bracket 360 at least partially fills the gap between the first capacitor portion 311 and the second capacitor portion 312. The dielectric constant of the limiting bracket 360 is greater than the dielectric constant of air. In this embodiment, as... Figure 16 and 17 As shown, the limiting bracket 360 includes a dielectric filling part 3623. The dielectric filling part 3623 is disposed within the capacitor cavity 3120. The dielectric filling part 3623 is provided with a receiving groove 3624, and the first capacitor part 311 is installed in the receiving groove 3624.

[0190] The limiting bracket 360 is made of insulating material and fills the gaps to adjust the capacitance characteristics and enhance the uniformity of the electric field distribution. Filling the gaps increases the capacitance value of the fixed capacitor 310 and optimizes the impedance matching performance. Furthermore, the first capacitor section 311 is embedded in the capacitor cavity 3120, and the receiving groove 3624 is a through-hole structure with an shape that matches the internal shape of the capacitor cavity 3120. This not only provides more precise positioning for the first capacitor section 311, but also, by setting the dielectric filling section 3623 to almost fill the entire capacitor cavity 3120 without leaving any gaps, it also prevents external foreign objects from falling between the first capacitor section 311 and the second capacitor section 312.

[0191] In one embodiment, the limiting bracket 360 includes a plurality of limiting blocks extending into the receiving cavity 3602. The plurality of limiting blocks limit the first capacitor section 311 and the second capacitor section 312 in the length direction and the width direction of the housing 100.

[0192] The limiting block is a raised structure distributed inside the receiving cavity 3602. Its outer end abuts against the first capacitor part 311 and the second capacitor part 312 for fixation. The limiting block provides multi-directional support in front, back, left, and right, enhancing the stability of positioning and preventing shaking and deviation from the original position during transportation.

[0193] In one embodiment, such as Figure 12 As shown, the limiting bracket 360 includes a support plate 3622 disposed within the receiving cavity 3602. The support plate 3622 extends in the same direction as the first capacitor portion 311 to support the first capacitor portion 311. The support plate 3622 has a thin plate structure, providing lateral support for the first capacitor portion 311 and preventing the first capacitor portion 311 from tilting or deforming. In particular, since the first capacitor portion 311 in this case is arranged vertically (T3), it is more prone to tilting, and the support plate 3622 plays a protective role.

[0194] The limiting bracket 360 of this embodiment includes a cover 361 located above the receiving cavity 3602. The cover 361 covers the fixed capacitor 310, thereby preventing dust, condensation, or external interference from entering the fixed capacitor 310, providing protection for the fixed capacitor 310, especially preventing other impurities from entering between the first capacitor section 311 and the second capacitor section 312, changing the size of the fixed capacitor 310, and affecting impedance matching.

[0195] like Figure 16 As shown, in this embodiment, the limiting bracket 360 also has a base 362. The positioning cavity 3601 and the receiving cavity 3602 are disposed on the base 362, specifically formed between the base 362 and the cover 361. The limiting bracket 360 is fixed to the base 500 by screws and / or clips.

[0196] In one embodiment, such as Figure 9 and 12As shown, the limiting bracket 360 also includes a crossbeam 365. The crossbeam 365 is detachably connected to the cover 361 and is horizontally positioned above the positioning cavity 3601. The inductor 330 is fixed to the crossbeam 365 so that the distance between the inductor 330 and the variable capacitor 320 is greater than the sensing distance threshold. Multiple coil slots 3651 are provided on the crossbeam 365, and the inductor 330 is evenly wound in the multiple coil slots 3651.

[0197] The crossbar 365 is a plate-like structure made of insulating material. A pair of opposing mounting holes are provided on the cover 361. One end of the crossbar 365 is inserted into one mounting hole, and the other end is installed into the other mounting hole via a spring-loaded snap-fit ​​structure. The coil slots 3651 are grooves evenly spaced along the length of the crossbar 365, in which the inductor 330 coil is tightly wound. The distance between the upper crossbar 365 and the lower positioning cavity 3601 ensures the distance between the inductor 330 and the variable capacitor 320 to avoid induced interference, reduce electromagnetic coupling, and optimize the tuning performance of the tuning module 300.

[0198] like Figure 12 As shown, multiple heat dissipation holes 3603 are provided on both the base 362 and the cover 361. The heat dissipation holes 3603 are conducive to the dissipation of heat inside the tuning module 300, effectively reducing the operating temperature of the variable capacitor 320 and ensuring the stability of the circuit.

[0199] In this embodiment, several heat dissipation holes 3603 connect the positioning cavity 3601 and the third air duct 1021. Several heat dissipation holes 3603 also connect the receiving cavity 3602 and the third air duct 1021. The inductor 330 is located on the airflow channel of the third air duct 1021. The inductor 330 is suspended in the channel. When the airflow passes through the inductor 330, it carries away the heat from the inductor 330. The heat from the variable capacitor 320 and the fixed capacitor is carried away by the third air duct 1021 through the heat dissipation holes 3603, so that the heat generated by these devices can be effectively utilized.

[0200] like Figure 16 As shown, in this embodiment, multiple raised ribs 3621 are provided on the upper surface of the base 362. The raised ribs 3621 support the movable capacitor part 322, creating a gap between the movable capacitor part 322 and the upper surface of the base 362. This reduces the contact area between the movable capacitor part 322 and the base 362, reducing friction and making the movement of the movable capacitor part 322 smoother, thus reducing mechanical wear. Figure 16 Multiple raised ribs 3621 are arranged parallel to each other and at equal intervals along the transverse direction T2 to provide uniform support, ensuring smooth movement of the moving capacitor part 322.

[0201] The guide section 364 guides the movement direction of the movable capacitor section 322 to prevent deviation. For example... Figure 16 and 17As shown, the guide portion 364 in this embodiment includes a first protrusion 3641 and a second protrusion 3642 disposed on the upper surface of the base 362. The first protrusion 3641 and the second protrusion 3642 are spaced apart in the width direction of the housing 100. In this embodiment, multiple first protrusions 3641 and multiple second protrusions 3642 are provided, and the multiple first protrusions 3641 and the multiple second protrusions 3642 are equidistantly distributed along the longitudinal direction T1.

[0202] Lower guide grooves 364a are formed between adjacent first protrusions 3641 and between adjacent second protrusions 3642. The first protrusion 3641 has a limiting groove for accommodating and limiting the ends of the interdigitated electrode plates of the fixed capacitor section 321. The limiting groove encloses the ends of the electrode plates of the fixed capacitor section 321. At the end of the travel of the movable capacitor section 322 away from the fixed capacitor section 321, adjacent electrode plates of the movable capacitor section 322 are separated by the first protrusions 3641. A guide ramp 36421 is provided on the second protrusion 3642 towards the end of the movable capacitor section 322, and the guide ramp 36421 guides the electrode plates of the movable capacitor section 322 to insert between adjacent second protrusions 3642.

[0203] The outer width of the first protrusion 3641 is slightly smaller than the width between adjacent interdigitated electrode plates of the movable capacitor section 322. The inner width of the first protrusion 3641 is slightly larger than the width of the interdigitated electrode plates of the fixed capacitor section 321. The spacing between adjacent second protrusions 3642 is slightly larger than the width of the interdigitated electrode plates of the movable capacitor section 322. These dimensional constraints limit the movement range of the movable capacitor section 322, ensuring its accurate movement along the transverse direction T2. ​​The guide ramp 36421 guides the interdigitated electrode plates of the movable capacitor section 322 to insert between adjacent second protrusions 3642, ensuring a smooth movement path.

[0204] The distribution of the first protrusion 3641 and the second protrusion 3642 constrains the travel and guiding accuracy of the movable capacitor section 322, reduces mechanical wear, enhances the adjustment stability of the variable capacitor 320, and extends its service life.

[0205] In one embodiment, such as Figure 12 and 16 As shown, the drive mechanism 340 includes a motor 341 and a transmission unit 342. The motor 341 drives the transmission unit 342 to move the movable capacitor unit 322 closer to or away from the fixed capacitor unit 321 by rotating forward or in reverse. In one embodiment, the motor 341 may be a stepper motor 341 or a servo motor 341.

[0206] The transmission unit 342 is connected to the output shaft of the motor 341, driving the movable capacitor unit 322 to move closer to or further away from the fixed capacitor unit 321. For example, when rotating forward, the movable capacitor unit 322 moves closer to the fixed capacitor unit 321, increasing the capacitance value of the variable capacitor 320; when rotating in reverse, it moves further away, increasing the distance and decreasing the capacitance value of the variable capacitor 320.

[0207] Compared to traditional capacitor regulation methods, which involve switching multiple capacitors and relays to create various control combinations, potentially resulting in a control mode that is not the optimal impedance matching value, this embodiment achieves near-stepless adjustment via motor 341. Matching is easily achieved by continuously adjusting the capacitance value of variable capacitor 320. During adjustment, the capacitance value of variable capacitor 320 is continuously changed until the optimal impedance matching point is found. This improved impedance matching reduces power reflection and enhances the efficiency and stability of RF defrosting.

[0208] like Figure 9-11 As shown, the motor 341 is housed within the shielded cavity 202, with its output shaft extending out of the cavity and connected to the transmission unit 342. The shielded cavity 202 is enclosed by a metal structure. The motor 341 is fixed inside the cavity, and its output shaft is connected externally to the transmission unit 342. This significantly improves the reliability and accuracy of the tuning module 300. The shielded cavity 202 shields against external radio frequency electromagnetic interference, ensuring the precise positioning of the moving capacitor 322 by the motor 341. The motor 341 utilizes the shielded cavity 202, reducing the need for external shielding, lowering manufacturing costs, and enhancing the adaptability of the variable capacitor 320 in the electromagnetic environment, thus providing a reliable guarantee for the stable operation of the radio frequency defrosting device 1000.

[0209] In one embodiment, a first clearance hole 2213 is provided on the heat dissipation substrate 221. The motor 341 extends into the shielding cavity 202 through the first clearance hole 2213. Figure 10 As shown, the shape of the first clearance hole 2213 matches the outer contour of the motor 341, allowing only the motor 341 to be inserted, thus preventing electromagnetic leakage into the shielding cavity 202.

[0210] The shielding cavity 202 shields the external fixed capacitor 310, inductor 330, RF antenna 400, and variable capacitor 320 from radio frequency electromagnetic interference. The shielding cavity 202 is grounded to form a Faraday cage, shielding the electromagnetic waves of each device from the outside.

[0211] In embodiments where motor 341 is a stepper motor 341, the stepper motor 341 is installed inside the shielded cavity 202, allowing for precise control of the step angle. If the stepper motor 341 is not installed inside the shielded cavity 202, the stepping commands input to the stepper motor 341 may be inaccurate due to electromagnetic interference, which could cause the moving capacitor 322 to move too much or too little, resulting in control difficulties.

[0212] like Figure 11 and 12 As shown, the drive mechanism 340 includes a fixing member 3411 for axially limiting the motor 341. The fixing member 3411 is located outside the shielding cavity 202. In this embodiment, the fixing member 3411 is fixedly connected to the motor 341. The fixing member 3411 is fixedly connected to the side of the heat dissipation structure 220 opposite to the shielding cavity 202. The fixing member 3411 includes a through hole through which the output shaft of the motor 341 passes. The output shaft of the motor 341 extends in the same direction as the heat dissipation fins 222. In this embodiment, the fixing member 3411 is a metal bracket, which is fixed to the heat dissipation base plate 221 by screws. The clearance hole and the fixing member 3411 ensure stable installation of the motor 341, and the through hole matches the output shaft.

[0213] like Figure 12 As shown, the transmission unit 342 includes a gear 3421 and a rack 3422. The motor 341 is connected to the gear 3421, the gear 3421 meshes with the rack 3422, and the rack 3422 is connected to the movable capacitor unit 322.

[0214] When the stepper motor rotates forward or reverse, gear 3421 drives rack 3422 to move laterally along T2, and the moving distance is controlled by the number of steps of motor 341. The meshing transmission of gear 3421 and rack 3422 provides high-precision linear movement, high transmission efficiency, reduces errors caused by mechanical backlash, and improves the accuracy of impedance matching and the uniformity of RF defrosting.

[0215] In one embodiment, the radio frequency defrosting device 1000 includes a limiting cover 368. The limiting cover 368 covers a gear 3421, preventing the gear 3421 from disengaging from the output shaft of the motor 341. Figure 12 As shown, the limiting cover 368 is fixedly connected to the cover body 361. The limiting cover 368 forms a semi-circular cavity, covering the top of the gear 3421. In this embodiment, the motor 341, gear 3421, and limiting cover 368 are arranged sequentially. When the gear 3421 tends to disengage backward, it is held in place by the limiting cover 368, preventing the gear 3421 from loosening and improving transmission reliability.

[0216] In one embodiment, the limiting bracket 360 includes a guide rib 366. The guide rib 366 extends along the moving direction of the rack 3422. The rack 3422 includes a guide groove 34221 that mates with the guide rib 366, and the guide rib 366 is inserted into the guide groove 34221.

[0217] like Figure 9 and 12 As shown, the base 362 and the cover 361 together form a strip-shaped cavity that encloses the rack 3422. The cross-section of this strip-shaped cavity is as follows: Figure 6As shown, guide ribs 366 are provided on both the base 362 and the cover 361, and the guide ribs 366 on the base 362 and the cover 361 are staggered. Guide grooves 34221 are provided on both the upward and downward sides of the rack 3422. The cooperation between the guide ribs 366 and the guide grooves 34221 restricts the movement direction of the rack 3422, preventing the rack 3422 from shifting laterally or tilting, ensuring the stability of the variable capacitor 320's adjustment movement, and this structure has a low probability of assembly errors.

[0218] The installation method of the radio frequency defrosting device 1000 in one embodiment includes the following steps:

[0219] The base 500, the RF antenna 400, and the RF component 1001 are assembled into an integrated unit;

[0220] The integrated unit is installed as a whole into the housing 110. After the integrated unit is pre-assembled, it is pushed in through the third opening 115 of the housing 110 and fixed in the designated position. Then the door frame 140 is closed, the drawer assembly 600 is inserted, and the back panel 120 is closed to complete the installation. The overall installation process is simplified and efficiency is improved.

[0221] The refrigeration device includes an inner liner and a pair of support rails. The pair of support rails are disposed opposite each other on the two inner walls of the inner liner in the transverse direction (T2) and extend along the longitudinal direction (T1). An elastic limiting part is provided on the bottom wall of the inner liner. When the radio frequency defrosting device 1000 is installed in a predetermined position inside the inner liner along the pair of support rails, the elastic limiting part engages with the second limiting part 1122 to form an interlocking structure.

[0222] When the radio frequency defrosting device 1000 is subsequently installed into the refrigeration equipment, the radio frequency defrosting device 1000 is pushed backward along the support rail as a whole. When it is pushed in, the elastic limiting part is squeezed and deformed by the bottom of the outer shell 110 until the radio frequency defrosting device 1000 is pushed into place. Then the elastic limiting part is locked into the second limiting part 1122 to enhance the fixation reliability.

[0223] During maintenance, the second limit part 1122 can be released by opening the elastic limit part, and the radio frequency defrosting device 1000 can be taken out. Disassembly and maintenance are very convenient.

[0224] Compared with commonly used technologies, this embodiment has the following advantages:

[0225] This radio frequency defrosting device features power amplifier components positioned on the front of the power amplifier circuit board, facing the defrosting chamber, and power connectors on the back. This vertical arrangement of the power amplifier circuit board saves space and is suitable for compact environments like those used in refrigeration equipment. Furthermore, the power connectors are positioned on the back and have a straight connection path through the heat dissipation structure, avoiding the bending and detours of traditional external power connections. This simplifies wiring and assembly, reduces contact resistance and potential failure points, improves space utilization, and enhances the durability of the radio frequency defrosting device.

[0226] It should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This way of describing the specification is only for clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

[0227] The detailed descriptions listed above are merely specific descriptions of feasible implementation methods of this application and are not intended to limit the scope of protection of this application. All equivalent implementation methods or modifications made without departing from the spirit of the art of this application should be included within the scope of protection of this application.

Claims

1. A radio frequency defrosting device (1000), characterized in that, include: The housing (100) has a defrosting chamber (101) and a functional chamber (102) arranged adjacent to each other along its length. A power amplifier module (200) is disposed within the functional cavity (102), and the power amplifier module (200) includes: The power amplifier circuit board (210) includes a circuit board (211), power amplifier components and power plug-in terminals (212). The circuit board (211) has a front side (214) and a back side (215). The front side (214) faces the side where the defrosting chamber (101) is located and is provided with the power amplifier components. The power plug-in terminals (212) are provided on the back side. A heat dissipation structure (220) is disposed on the side of the power amplifier circuit board (210) away from the defrosting chamber (101), and has a power clearance hole (2211) for the power plug terminal (212) to pass through the heat dissipation structure (220) and connect to an external power source.

2. The radio frequency defrosting device (1000) according to claim 1, characterized in that, In a direction perpendicular to the plane of the circuit board (211), the heat dissipation structure (220) covers the power amplifier circuit board (210).

3. The radio frequency defrosting device (1000) according to claim 2, characterized in that, The power amplifier module (200) also includes a shielding cover (230), which covers the side of the front (214) facing the defrosting chamber (101); The shielding cover (230) and the heat dissipation structure (220) together form a shielding cavity (202), and the circuit board (211) and the power amplifier components are housed in the shielding cavity; The power connector (212) extends away from the shielding cavity (202).

4. The radio frequency defrosting device (1000) according to claim 1, characterized in that, The circuit board (211) is arranged along the height direction of the housing (100), the power plug terminal (212) is elongated and arranged along the height direction of the housing (100), and the outline of the power clearance hole (2211) matches the outer outline of the power plug terminal (212).

5. The radio frequency defrosting device (1000) according to claim 1, characterized in that, The heat dissipation structure (220) includes a heat dissipation substrate (221) and a plurality of heat dissipation fins (222) connected to the heat dissipation substrate (221). The power amplifier circuit board (210) is disposed on the side of the heat dissipation substrate (221) away from the heat dissipation fins (222).

6. The radio frequency defrosting device (1000) according to claim 5, characterized in that, The plurality of heat dissipation fins (222) include a middle fin (2221) and edge fins (2222) located on both sides of the middle fin (2221) along the width of the housing (100), and the power clearance hole (2211) is provided on one of the edge fins (2222) away from the middle fin (2221); The enclosure (100) includes a back panel (120), the edge fins (2222) abut against the back panel (120) on the side away from the heat dissipation substrate (221), and there is a gap between the middle fins (2221) and the back panel (120).

7. The radio frequency defrosting device (1000) according to claim 6, characterized in that, The rear panel (120) has a plug hole, which is positioned opposite to the power supply clearance hole (2211) along the length of the housing (100).

8. The radio frequency defrosting device (1000) according to claim 6, characterized in that, The power amplifier element is aligned along the length of the enclosure (100) within the projection area between the two edge fins (2222).

9. The radio frequency defrosting device (1000) according to claim 5, characterized in that, The radio frequency defrosting device (1000) includes a heat dissipation fan (240) disposed in the functional cavity, a first air duct (201) disposed between the heat dissipation fins, and a second air duct (131) connecting the first air duct (201) and the defrosting cavity (101). The heat dissipation fan (240) drives airflow through the first air duct (201) and the second air duct (131) into the defrosting cavity (101).

10. A refrigeration device, characterized in that, Includes the radio frequency defrosting device (1000) as described in any one of claims 1 to 9.

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