Medical endoscope host

CN224820723UActive Publication Date: 2026-10-09GUANGZHOU SOFTLINK MEDICAL INNOVATION CO LTO
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Patent Information

Application Number
CN202621252670.7
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2026-08-13
Publication Date
2026-10-09
Estimated Expiration
2036-08-13

AI Technical Summary

Technical Problem

[0002]现阶段传统医用内窥镜设备采用分体式单一信号处理架构,设备主要分为光学镜头内窥镜与电子镜头内窥镜两类,两类镜头的信号传输方式与处理参数存在较大差异,无法兼容同一台主机设备

Benefits of technology

[0016]在一些实施方式中,电池仓布置于第一容纳腔中,电源电路模块布置在电池仓的左侧区域,图像处理电路模块布置在电池仓的右侧区域;电池仓作为物理隔断结构分隔于电源电路模块与图像处理电路模块之间,电源电路模块的走线区域与图像处理电路模块的走线区域相互隔离布设;壳体的背部侧板上还设有独立外接电源接口,外接电源接口与电源电路模块电性连接。由此,可以进一步避免电源电路模块的交变电流对高清图像信号产生电磁干扰。

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Abstract

The utility model discloses a medical endoscope host computer, it includes the casing, and the casing inside defines first accommodating cavity, first accommodating cavity is equipped with the circuit with two -way MIPI image receiving function, and this circuit is connected with the optical endoscope interface and electronic endoscope interface of setting on the casing, and the battery module of setting in first accommodating cavity, the circuit with two -way MIPI image receiving function includes the power supply circuit module and image processing circuit module respectively setting in the both sides of battery module, the inside of casing is formed to the first accommodating cavity protrudingly, forms the battery compartment, and the battery compartment is used to accommodate battery module. Thus make optical endoscope and electronic endoscope can share a medical endoscope host computer, improve equipment integration, and can avoid the electromagnetic interference of alternating current of power supply circuit module to high -definition image signal through the battery compartment, thereby avoid the noise point, the jam, distortion etc. of medical endoscope 4K image transmission, guarantee the diagnosis and treatment picture definition.
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Description

Technical Field

[0001] This utility model relates to the field of medical endoscope technology, specifically to a medical endoscope host. Background Technology

[0002] Currently, traditional medical endoscopes adopt a split-type single signal processing architecture. The equipment is mainly divided into two categories: optical lens endoscopes and electronic lens endoscopes. The signal transmission methods and processing parameters of the two types of lenses are quite different, and they cannot be compatible with the same host device.

[0003] The current industry-standard solution requires each of the two types of lenses to be equipped with a separate dedicated processing host, which has problems such as high equipment procurement costs, large equipment space occupation, cumbersome departmental equipment management, and poor equipment versatility.

[0004] Moreover, the medical endoscopes currently on the market are prone to problems such as noise, stuttering, and distortion, which affect the clarity of the diagnostic images. Utility Model Content

[0005] To address at least one of the aforementioned problems, according to one aspect of the present invention, a medical endoscope host is provided.

[0006] The medical endoscope main unit includes a housing, the interior of which defines a first receiving cavity; the first receiving cavity is provided with a circuit having dual-channel MIPI image receiving function, the circuit being connected to an optical endoscope interface and an electronic endoscope interface disposed on the housing; and a battery module disposed in the first receiving cavity; wherein, the circuit having dual-channel MIPI image receiving function includes a power circuit module and an image processing circuit module respectively disposed on both sides of the battery module; the housing protrudes toward the interior of the first receiving cavity to form a battery compartment for accommodating the battery module.

[0007] Because the circuit of this invention with dual-channel MIPI image receiving function can simultaneously connect to the optical endoscope interface and the electronic endoscope interface, the optical endoscope and the electronic endoscope can share a single medical endoscope host, improving the integration of the equipment. Moreover, because this invention has a battery compartment between the power supply circuit module and the image processing circuit module that can accommodate the battery module, the alternating current of the power supply circuit module can be separated from the image processing circuit module to avoid electromagnetic interference to the high-definition image signal, thereby avoiding problems such as noise, stuttering, and distortion in the transmission of 4K images from the medical endoscope and ensuring the clarity of the diagnostic and treatment images.

[0008] In some embodiments, the battery compartment opening is connected to a first opening on the back of the housing; the battery module can be inserted into or removed from the battery compartment through the first opening; the battery compartment is provided with electrical connection contacts, through which the battery module installed in the battery compartment is electrically connected to the circuit with dual-channel MIPI image reception function. Therefore, it is convenient to install or remove the battery module without disassembling other protective panels of the housing except for the back panel. In some embodiments, the battery module can be a button battery, so as to supply power to the circuit with dual-channel MIPI image reception function when the power supply is not providing power to the circuit with dual-channel MIPI image reception function.

[0009] In some embodiments, the housing includes two sets of side plates arranged opposite each other, at least one of which is a perforated heat dissipation side plate with multiple arrays of heat dissipation holes. The perforated heat dissipation side plate and the internal space of the housing enclose a through-flow convection heat dissipation channel. Traditional medical endoscope main units operate continuously for long periods, resulting in high heat generation from internal circuits and power modules. Traditional equipment has thin side plate structures and lacks dedicated heat dissipation channel design, leading to low heat dissipation efficiency, which can easily cause the equipment to overheat and reduce its frequency, aging of components, and reduced equipment lifespan. This utility model improves the heat dissipation efficiency of the equipment by setting multiple arrays of heat dissipation holes on the side plates of the housing and forming a through-flow convection heat dissipation channel by enclosing the internal space of the housing with the perforated heat dissipation side plate.

[0010] In some embodiments, the medical endoscope main unit also includes a cooling fan; the cooling fan is fixedly installed inside the first receiving cavity, near the perforated heat dissipation side plate; the exhaust side of the cooling fan is oriented towards the heat dissipation holes of the perforated heat dissipation side plate, and the cooling fan is used to direct the hot airflow accumulated inside the housing towards the heat dissipation holes, forming a transversely continuous convection heat dissipation channel with the heat dissipation holes of the perforated heat dissipation side plate. Therefore, the cooling fan can accelerate the airflow speed in and out of the first receiving cavity through the heat dissipation holes, thereby further improving heat dissipation efficiency.

[0011] In some embodiments, a first guide rail is horizontally arranged on the inner wall of the perforated heat dissipation side plate, on both the upper and lower sides of the heat dissipation hole area, with the two first guide rails arranged parallel to each other. A second, transversely penetrating opening is provided at the side end of the perforated heat dissipation side plate, aligned with the ends of the two first guide rails. A dust filter is also included, with first sliders at its upper and lower ends that slide with the two first guide rails. The dust filter is pulled laterally into the perforated heat dissipation side plate through the second opening along the first guide rails, completely covering the heat dissipation holes. Thus, the dust filter can intercept large particles of dust, hair, lint, and other solid debris, preventing large impurities from entering the equipment at the source and avoiding blockage of the heat dissipation holes. Furthermore, the arrangement of the upper and lower sets of first guide rails and first sliders ensures smooth and stable movement of the dust filter relative to the perforated heat dissipation side plate, preventing the dust filter from flipping over during movement. Additionally, the presence of a first guide rail at the top and bottom of the perforated heat dissipation side plate also increases its strength.

[0012] In some embodiments, the medical endoscope main unit also includes an activated carbon layer; a second guide rail is horizontally arranged on both the upper and lower sides of the dust filter, and the dust filter also has a third opening on the same side as the second opening; the second guide rail is parallel to the first guide rail; the activated carbon layer has second sliders adapted to the second guide rails on both the upper and lower sides, and the activated carbon layer is configured to be able to be pulled into the dust filter along the second guide rail through the third opening, and the activated carbon layer can correspond to all the heat dissipation holes. Thus, the activated carbon layer can adsorb fine dust, odors, and small particulate matter in the air through its adsorption properties, further purifying the air entering the machine and preventing fine dust from adhering to the surface of precision components such as the circuit board, chips, and interfaces, thus protecting the stable operation of the circuit system.

[0013] In some embodiments, an activated carbon layer is disposed on the side of the dust filter facing the first receiving cavity. Therefore, the activated carbon layer can further adsorb fine dust on top of the dust filter's filtration, protecting the stable operation of the circuit system.

[0014] In some embodiments, a snap-fit ​​structure is provided at the end of the dust filter facing away from the first receiving cavity. The snap-fit ​​structure is used to engage and limit the dust filter with the perforated heat dissipation side plate. This prevents the dust filter from loosening and slipping off due to airflow vibration during operation.

[0015] In some embodiments, the outer wall of the front panel of the housing is provided with an optical endoscope interface, an electronic endoscope interface, a cold light source interface, a device switch, and a display screen. The optical endoscope interface, electronic endoscope interface, cold light source interface, and device switch are arranged in the left side area of ​​the front panel, and the display screen is embedded in the right side area of ​​the front panel. The cold light source interface is equipped with a cold light source module, which is electrically connected to the power supply circuit module to provide illumination for the external endoscope probe. The optical endoscope interface and electronic endoscope interface are electrically connected to a circuit with dual-channel MIPI image receiving function, respectively, and are connected to the probes of the optical endoscope and electronic endoscope. The display screen is electrically connected to the circuit with dual-channel MIPI image receiving function for real-time display of endoscope images and touch-sensitive adjustment of device parameters. This not only ensures the compact structure of the medical endoscope host, but also facilitates operation by providing convenient access to the interfaces, switches, and display screen.

[0016] In some embodiments, the battery compartment is arranged in the first receiving cavity, the power circuit module is arranged in the left area of ​​the battery compartment, and the image processing circuit module is arranged in the right area of ​​the battery compartment. The battery compartment acts as a physical partition separating the power circuit module and the image processing circuit module, and the wiring areas of the power circuit module and the image processing circuit module are arranged in isolation from each other. An independent external power interface is also provided on the back panel of the housing, and the external power interface is electrically connected to the power circuit module. This further avoids electromagnetic interference from the alternating current of the power circuit module to the high-definition image signal. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of a medical endoscope host according to one embodiment of this application; Figure 2 for Figure 1 A schematic diagram of the structure of the medical endoscope main unit from another perspective; Figure 3 for Figure 2 The diagram shows another view of the structure of the medical endoscope main unit. Figure 4 for Figure 2 The diagram shows the structure of the medical endoscope main unit along the AA direction. Figure 5 This is a schematic diagram of the structure of a medical endoscope main unit according to one embodiment of this application, omitting the top cover; Figure 6 This is a schematic diagram showing the disassembled state of the dust filter and activated carbon layer of a medical endoscope host according to an embodiment of this application. Figure 7 This is a schematic diagram of the module structure of a circuit with dual-channel MIPI image receiving function according to an embodiment of this application; Figure 8 for Figure 7 The diagram shows a schematic of the module structure of one embodiment of a circuit with dual-channel MIPI image receiving function. Figure 9 This is a schematic diagram of the circuit structure of a dedicated circuit channel for an optical endoscope according to one embodiment of this application. Figure 10 This is a schematic diagram of the circuit structure of a dedicated circuit channel for an electronic endoscope according to one embodiment of this application. Figure 11 This is a schematic diagram of the circuit structure of a power supply noise suppression module according to an embodiment of this application; Reference numerals: 11. Housing; 111. First receiving cavity; 112. Optical endoscope interface; 113. Electronic endoscope interface; 114. First opening; 115. Second opening; 116. Cold light source interface; 1161. Cold light source module; 117. Display screen; 118. Device switch; 119. External power supply interface; 12. Circuit with dual-channel MIPI image receiving function; 121. Power circuit module; 122. Image processing circuit module; 13. Battery compartment; 14. Cooling fan; 15. Side plate; 151. Heat dissipation hole; 152. First guide rail; 16. Dust filter; 161. First slider; 162. Second guide rail; 163. Third opening; 17. Activated carbon layer; 171. Second slider; 18. Data interface; 20. Vision processing unit; 21. Optical endoscope dedicated circuit channel; 22. Electronic endoscope dedicated circuit channel; 31. First analog power supply; 32. Second analog power supply; 40. Power supply noise suppression module; 41. Isolation element; 42. Power supply filter capacitor. Detailed Implementation

[0018] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other.

[0019] It should also be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising" or "including" include not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Unless otherwise specified, an element defined by the phrase "comprising..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element. The terminology used herein is generally that commonly used by those skilled in the art; in case of any discrepancy with commonly used terminology, the terminology used herein shall prevail.

[0020] Furthermore, for ease of description, spatial relative terms such as “below,” “under,” “lower,” “above,” and “upper” may be used herein to describe the relationship between one element or component and another (or other elements or components) as shown in the figure. In addition to the orientations shown in the figure, spatial relative terms are intended to include different orientations of the device during use or operation. The device may be oriented in other ways (rotated 90 degrees or in other orientations), and the spatial relative descriptors used herein can be interpreted accordingly.

[0021] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0022] Figures 1 to 11 The illustration schematically shows a medical endoscope host according to one embodiment of the present invention.

[0023] Combination Figures 3 to 5 As shown, the medical endoscope main unit includes a housing 11, a circuit 12 with dual-channel MIPI image receiving function, and a battery module; wherein, the housing 11 is integrally formed or machined to form a first receiving cavity 111; the circuit 12 with dual-channel MIPI image receiving function is disposed in the first receiving cavity 111, and the circuit is connected to an optical endoscope interface 112 and an electronic endoscope interface 113 disposed on the housing 11; the battery module is disposed in the first receiving cavity 111; the circuit 12 with dual-channel MIPI image receiving function includes a power circuit module 121 and an image processing circuit module 122 respectively disposed on both sides of the battery module; the housing 11 has a battery compartment 13 protruding into the first receiving cavity 111, and the battery compartment 13 is used to accommodate the battery module.

[0024] Because the circuit 12 of this invention, which has dual-channel MIPI image receiving function, can simultaneously connect the optical endoscope interface 112 and the electronic endoscope interface 113, the optical endoscope and the electronic endoscope can share a single medical endoscope host, improving the integration of the equipment. Moreover, because this invention has a battery compartment between the power circuit module 121 and the image processing circuit module 122 that can accommodate the battery module, the power circuit module 121 and the image processing circuit module 122 are separated by the battery compartment. This can prevent the alternating current of the power circuit module 121 from causing electromagnetic interference to the high-definition image signal, thereby avoiding problems such as noise, stuttering, and distortion in the transmission of 4K images from the medical endoscope and ensuring the clarity of the diagnostic and treatment images.

[0025] In some preferred embodiments, combined with Figures 3 to 5 As shown, the opening of the battery compartment 13 is connected to the first opening 114 on the back of the housing 11; the battery module can be installed or removed from the battery compartment 13 through the first opening 114; the battery compartment 13 is provided with electrical connection points, and the battery module installed in the battery compartment 13 is electrically connected to the circuit 12 with dual-channel MIPI image receiving function through the electrical connection points. Traditional equipment battery modules are mostly built-in and hidden, requiring disassembly of the entire housing and internal components for battery replacement and maintenance, which is cumbersome, time-consuming, and labor-intensive, greatly reducing the efficiency of later equipment maintenance. This utility model, by reserving a disassembly and assembly opening on the housing 11, allows users and maintenance personnel to directly disassemble and replace the battery module from the back of the equipment without disassembling the main unit housing or moving internal circuits and components, greatly simplifying the battery module replacement process, improving the convenience of daily maintenance and emergency power supply replacement, and meeting the needs of rapid clinical maintenance.

[0026] In some preferred embodiments, such as Figure 1 , Figure 3 , Figure 5 and Figure 6 As shown, the housing 11 includes two sets of side plates 15 arranged opposite each other, at least one of which is a perforated heat dissipation side plate. Multiple sets of arrayed heat dissipation holes 151 are provided on the perforated heat dissipation side plate. The perforated heat dissipation side plate and the internal space of the housing 11 enclose a through-flow convection heat dissipation channel. Traditional medical endoscope main units operate continuously for long periods, resulting in high heat generation from internal circuits and power modules. Traditional equipment has a thin side plate structure and lacks a dedicated heat dissipation channel design, leading to low heat dissipation efficiency, which easily causes high temperature throttling, component aging, and reduced equipment lifespan. This invention improves the heat dissipation efficiency of the equipment by providing multiple sets of arrayed heat dissipation holes 151 on the side plate of the housing 11, and by forming a through-flow convection heat dissipation channel through the perforated heat dissipation side plate and the internal space of the housing 11. Further preferably, as... Figure 6 As shown, the medical endoscope main unit also includes a cooling fan 14; the cooling fan 14 is fixedly installed inside the first receiving cavity 111, near the perforated heat dissipation side plate; the air outlet side of the cooling fan 14 is positioned facing the heat dissipation hole 151 of the perforated heat dissipation side plate, and the cooling fan 14 is used to direct the hot airflow accumulated inside the housing 11 towards the heat dissipation hole 151, forming a transversely penetrating convection heat dissipation channel with the heat dissipation hole 151 of the perforated heat dissipation side plate, so as to accelerate the airflow speed of the first receiving cavity 111 from the heat dissipation hole 151 through the cooling fan 14, thereby further improving the heat dissipation efficiency. Further preferably, as... Figure 6As shown, a first guide rail 152 is horizontally arranged on the upper and lower sides of the heat dissipation hole 151 area on the inner wall of the hollow heat dissipation side plate, and the two first guide rails 152 are arranged in parallel; a second opening 115 is opened horizontally through the side end of the hollow heat dissipation side plate, and the second opening 115 is aligned with the end positions of the two first guide rails 152; it also includes a dust filter 16, and the upper and lower ends of the dust filter 16 are respectively provided with first sliders 161 that are slidably adapted to the two first guide rails 152. The dust filter 16 is pulled horizontally into the hollow heat dissipation side plate through the second opening 115 along the first guide rails 152, and The dust filter 16 completely covers the heat dissipation holes 151, intercepting large particles of dust, hair, lint, and other solid debris, preventing large impurities from entering the equipment at the source and avoiding clogging of the heat dissipation holes 151. Furthermore, the arrangement of the upper and lower sets of first guide rails 152 and first sliders 161 ensures the smooth and stable movement of the dust filter 16 relative to the perforated heat dissipation side plate, preventing the dust filter 16 from flipping over during movement. Additionally, the presence of a first guide rail 152 at the top and bottom of the perforated heat dissipation side plate further enhances its strength. As one implementation of the dust filter 16, it can be made of high-density fiber material. More preferably, such as… Figure 6 As shown, the medical endoscope main unit also includes an activated carbon layer 17; a second guide rail 162 is horizontally arranged on the upper and lower sides of the dust filter 16, and the dust filter 16 also has a third opening 163 arranged on the same side as the second opening 115; the second guide rail 162 is arranged parallel to the first guide rail 152; the activated carbon layer 17 has a second slider 171 adapted to the second guide rail 162 on the upper and lower sides, and the activated carbon layer 17 is configured to be able to be pulled into the dust filter 16 along the second guide rail 162 through the third opening 163, and the activated carbon layer 17 can correspond to all the heat dissipation holes 151. Thus, the activated carbon layer 17 can adsorb fine dust, odors, and small particulate matter in the air through its adsorption properties, further purifying the air entering the machine body, preventing fine dust from adhering to the surface of precision components such as the circuit board, chips, and interfaces, and protecting the stable operation of the circuit system. Further preferably, as... Figure 6 As shown, the activated carbon layer 17 is disposed on the side of the dust filter 16 facing the first receiving cavity 111, so that the activated carbon layer 17 can further adsorb micro-dust on the basis of the filtration of the dust filter 16, protecting the stable operation of the circuit system. More preferably, the end of the dust filter 16 facing away from the first receiving cavity 111 is provided with a snap-fit ​​structure, which is used to engage and limit the dust filter 16 with the perforated heat dissipation side plate. This prevents the dust filter 16 from loosening and slipping due to airflow vibration during operation.

[0027] In some embodiments, the outer wall of the front panel of the housing 11 is provided with an optical endoscope interface 112, an electronic endoscope interface 113, a cold light source interface 116, a device switch 118, and a display screen 117. The optical endoscope interface 112, the electronic endoscope interface 113, the cold light source interface 116, and the device switch 118 are arranged in the left side area of ​​the front panel of the housing 11, and the display screen 117 is embedded in the right side area of ​​the front panel. The cold light source interface 116 is equipped with a cold light source module 1161, which is electrically connected to the power circuit module 121 and is used to provide illumination for the external endoscope probe. The optical endoscope interface 112 and the electronic endoscope interface 113 are electrically connected to the circuit 12 with dual-channel MIPI image receiving function, respectively, and are connected to the probes of the optical endoscope and the electronic endoscope. The display screen 117 is electrically connected to the circuit 12 with dual-channel MIPI image receiving function and is used for real-time display of endoscope images and touch adjustment of device parameters. This not only ensures the compact structure of the medical endoscope host, but also facilitates operation by providing convenient access to the various interfaces, switches, and display screen 117.

[0028] In some embodiments, the battery compartment is arranged in the first receiving cavity 111, the power circuit module 121 is arranged in the left side region of the battery compartment, and the image processing circuit module 122 is arranged in the right side region of the battery compartment. The battery compartment acts as a physical partition structure separating the power circuit module 121 and the image processing circuit module 122, and the wiring areas of the power circuit module 121 and the image processing circuit module 122 are arranged in an isolated manner. The back side panel of the housing 11 is also provided with an independent external power interface 119 and a data interface 18, and the external power interface 119 is electrically connected to the power circuit module 121. Thus, the alternating current of the power circuit module 121 can be further prevented from causing electromagnetic interference to the high-definition image signal.

[0029] In some preferred embodiments, such as Figure 7 As shown, the circuit 12 with dual-channel MIPI image receiving function includes a vision processing unit 20, which has an optical endoscope dedicated circuit channel 21 that can be connected to an optical endoscope, an electronic endoscope dedicated circuit channel 22 that can be connected to an electronic endoscope; a first analog power supply 31 that is electrically connected only to the power supply terminal of the optical endoscope dedicated circuit channel 21; a second analog power supply 32 that is electrically connected only to the power supply terminal of the electronic endoscope dedicated circuit channel 22; and a power supply noise suppression module 40, whose input terminal is connected to an external power supply and whose output terminal is connected to a common power supply node. The common power supply node leads out the input terminals of the first analog power supply 31 and the second analog power supply 32 respectively, for filtering out ripple noise introduced by the external power supply.

[0030] By incorporating dedicated circuit channels 21 for optical endoscopes, 22 for electronic endoscopes, a first analog power supply 31, a second analog power supply 32, and a power supply noise suppression module 40, not only can the optical endoscopes and electronic endoscopes connected to dedicated circuit channels 21 and 22 for electronic endoscopes be used simultaneously, solving the problems of equipment redundancy and high procurement and maintenance costs, but the power supply noise suppression module 40 can also completely isolate digital power supply ripple interference.

[0031] In some embodiments, such as Figure 9 As shown, the dedicated circuit channel 21 for the optical endoscope includes a first data transmission pin group and a first auxiliary control pin group. The first data transmission pin group includes a 4-lane MIPI differential clock pin and four differential data pins, all of which are connected to the MIPI_RX0 interface of the vision processing unit 20. The first auxiliary control pin group includes a first independent sensor clock pin, a first line synchronization pin, a first frame synchronization pin, and a first sensor reset pin. Each pin is used for the transmission of its corresponding signal. This maximizes the image transmission bandwidth, meeting the high-speed transmission requirements of high-definition image data.

[0032] In some embodiments, such as Figure 10 As shown, the dedicated circuit channel 22 for the electronic endoscope includes a second data transmission pin group and a second auxiliary control pin group. The second data transmission pin group includes a 2-lane MIPI differential clock pin and two differential data pins. The 2-lane MIPI differential clock pin and the two differential data pins are all connected to the MIPI_RX1 interface of the vision processing unit 20. The second auxiliary control pin group includes a second independent sensor clock pin, a second line synchronization pin, a first frame synchronization pin, and a second sensor reset pin. Each pin is used for the transmission of the corresponding signal.

[0033] In some preferred embodiments, the two MIPI differential traces are designed with strict 100Ω differential impedance in terms of board material, trace width, trace spacing, and reference layer; the P / N (positive / negative) signal lines in the same differential pair are strictly routed with equal length, and the data channels in different lanes are constrained to be of equal length within the group to avoid high-speed signal integrity degradation caused by impedance abrupt changes and timing offsets, and to achieve standard impedance control from the PCB physical layer.

[0034] As one embodiment of the vision processing unit 20, the vision processing unit 20 uses a chip of model SS928V100. In this embodiment, as... Figure 9As shown, the optical endoscope dedicated circuit channel 21 of the SS928V100 chip receives high-speed differential clock signals from an image sensor (such as an endoscope CMOS probe) via MIPI_RX0_CK0N [the negative / N pin of the 0th pair of clock signals in the 0th MIPI CSI-2 receiver interface, used to receive the high-speed differential clock signal], MIPI_RX0_CK0P (the positive pin of the 0th channel used to receive the 0th pair of MIPI differential clock signals from the endoscope image sensor), and MIPI_RX0_D0N [the 0th data lane of the 0th MIPI CSI-2 receiver interface (RX0)]. The negative / N pins of the MIPI receiver interface (0), MIPI_RX0_D0P (positive pin of data channel 0 of MIPI receiver interface 0), MIPI_RX0_D1N (negative pin of data channel 1 of MIPI receiver interface 0), MIPI_RX0_D1P (positive pin of data channel 1 of MIPI receiver interface 0), MIPI_RX0_D2N (negative pin of data channel 2 of MIPI receiver interface 0), MIPI_RX0_D2P (positive pin of data channel 2 of MIPI receiver interface 0), MIPI_RX0_D3N (negative pin of data channel 3 of MIPI receiver interface 0), and MIPI_RX0_D3P (positive pin of data channel 3 of MIPI receiver interface 0) are connected to the interface of the optical endoscope. In this embodiment, as shown... Figure 10 As shown, the dedicated electronic endoscope circuit channel 22 of the SS928V100 chip is connected to the interface of the electronic endoscope through the pins MIPI_RX1_CK0N (negative pin of the 0th pair of clock signals in the 1st MIPI receiver interface), MIPI_RX1_CK0P (positive pin of the 0th pair of clock signals in the 1st MIPI receiver interface), MIPI_RX1_D0N (negative pin of the 0th data channel of the 1st MIPI receiver interface), MIPI_RX1_D0P (positive pin of the 0th data channel of the 1st MIPI receiver interface), MIPI_RX1_D1N (negative pin of the 1st data channel of the 1st MIPI receiver interface), and MIPI_RX1_D1P (positive pin of the 1st data channel of the 1st MIPI receiver interface). As can be seen, this circuit is configured with two completely independent 4-lane (data channel) MIPI image receiving channels; the four sets of differential clocks and four sets of differential image data output from the optical endoscope are connected to the MIPI_RX0 pin; the differential clocks and differential image data output from the electronic endoscope are connected to the MIPI_RX1 pin. In this embodiment, as... Figure 11As shown, the first analog power supply 31 and the second analog power supply 32 of the SS928V100 chip are connected to the power supply noise suppression module 40 as follows: the AVDD18_MIPIRX1 (pin of the first MIPI receiver of the 1.8V analog power supply) and AVDD18_MIPIRX2 (pin of the second MIPI receiver of the 1.8V analog power supply) pins of the SS928V100 chip are both connected to the power supply noise suppression module 40.

[0035] As one embodiment of the power supply noise suppression module 40, combined with Figure 8 and Figure 11 As shown, the power supply noise suppression module 40 includes an isolation element 41 and a power supply filter capacitor 42. One end of the isolation element 41 is connected to a 1.8V system power supply network, and the other end is connected to a common power supply node. The common power supply node leads out a first analog power supply 31 and a second analog power supply 32. One end of the power supply filter capacitor 42 is connected to the common power supply node, and the other end is grounded. In one embodiment, the isolation element 41 uses a 0Ω resistor; in another embodiment, the isolation element 41 uses a ferrite bead, with the 1.8V system power supply network connected to the input terminal of the ferrite bead, and the output terminal of the ferrite bead connected to a common power supply node.

[0036] Since the first analog power supply 31 and the second analog power supply 32 respectively connect the optical endoscope dedicated circuit channel 21 and the electronic endoscope dedicated circuit channel 22 to the power supply noise suppression module 40, not only can the optical endoscope and the electronic endoscope connected to the optical endoscope dedicated circuit channel 21 and the electronic endoscope dedicated circuit channel 22 be used simultaneously, solving the problems of equipment redundancy and high procurement and maintenance costs; the power supply noise suppression module 40 can also completely isolate digital power supply ripple interference.

[0037] In this invention, the connection or installation is a fixed connection unless otherwise specified. A fixed connection can be implemented as a detachable or non-detachable connection commonly used in the prior art. A detachable connection can be implemented using existing technologies, such as threaded connections or keyed connections. A non-detachable connection can also be implemented using existing technologies, such as welding or adhesive bonding.

[0038] The above descriptions are merely some embodiments of this utility model. For those skilled in the art, various modifications and improvements can be made without departing from the inventive concept of this utility model, and all such modifications and improvements fall within the protection scope of this utility model.

Claims

1. A medical endoscope main unit, comprising a housing, wherein a first receiving cavity is defined inside the housing; the first receiving cavity is provided with a circuit having a dual-channel MIPI image receiving function, the circuit being connected to an optical endoscope interface and an electronic endoscope interface disposed on the housing; Its features are, Also includes: A battery module disposed in the first receiving cavity; wherein, The circuit with dual-channel MIPI image receiving function includes a power circuit module and an image processing circuit module respectively disposed on both sides of the battery module. The housing protrudes into the interior of the first receiving cavity to form a battery compartment, which is used to house the battery module.

2. The medical endoscope main unit according to claim 1, characterized in that, The opening of the battery compartment is connected to the first opening on the back of the housing; The battery module can be inserted into or removed from the battery compartment through the first opening; The battery compartment is provided with electrical connection points, and the battery module assembled in the battery compartment is electrically connected to the circuit with dual-channel MIPI image receiving function through the electrical connection points.

3. The medical endoscope main unit according to claim 1, characterized in that, The housing includes two sets of side plates arranged opposite each other, at least one of which is a perforated heat dissipation side plate, and the perforated heat dissipation side plate has multiple sets of heat dissipation holes arranged in an array; the perforated heat dissipation side plate and the internal space of the housing enclose a through convection heat dissipation channel.

4. The medical endoscope main unit according to claim 3, characterized in that, It also includes a cooling fan; The cooling fan is fixedly installed inside the first receiving cavity, near the hollowed-out heat dissipation side plate; The exhaust side of the cooling fan is positioned facing the heat dissipation holes of the hollow heat dissipation side plate. The cooling fan is used to direct the hot airflow accumulated inside the housing toward the heat dissipation holes, forming a horizontally through convection heat dissipation channel in conjunction with the heat dissipation holes of the hollow heat dissipation side plate.

5. The medical endoscope main unit according to claim 3, characterized in that, The inner wall of the hollow heat dissipation side plate has a first guide rail horizontally arranged on the upper and lower sides of the heat dissipation hole area, and the two first guide rails are arranged in parallel. The side end of the hollow heat dissipation side plate has a second opening that runs horizontally through it, and the second opening is aligned with the end positions of the two first guide rails. It also includes a dust filter, and the upper and lower ends of the dust filter are respectively provided with first sliders that slide and adapt to the two first guide rails. The dust filter is pulled horizontally into the hollow heat dissipation side plate through the second opening along the first guide rails, and the dust filter completely covers the heat dissipation holes.

6. The medical endoscope main unit according to claim 5, characterized in that, It also includes an activated carbon layer; The dust filter is provided with a second guide rail horizontally arranged on the upper and lower sides, and the second guide rail is parallel to the first guide rail. The dust filter is also provided with a third opening arranged on the same side as the second opening. The activated carbon layer is provided with second sliders on the upper and lower sides that are adapted to the second guide rail. The activated carbon layer is configured to be able to be pulled into the dust filter through the third opening along the second guide rail, and the activated carbon layer can correspond to all the heat dissipation holes.

7. The medical endoscope main unit according to claim 6, characterized in that, The activated carbon layer is disposed on the side of the dust filter facing the first receiving cavity.

8. The medical endoscope main unit according to claim 6, characterized in that, The dust filter is provided with a snap-fit ​​structure at the end opposite to the first receiving cavity. The snap-fit ​​structure is used to engage and limit the position of the hollow heat dissipation side plate.

9. The medical endoscope main unit according to any one of claims 1 to 8, characterized in that, The outer wall of the front panel of the housing is provided with the optical endoscope interface, the electronic endoscope interface, the cold light source interface, the device switch and the display screen. The optical endoscope interface, the electronic endoscope interface, the cold light source interface and the device switch are arranged in the left side area of ​​the front panel of the housing, and the display screen is embedded in the right side area of ​​the front panel. The cold light source interface is equipped with a cold light source module, which is electrically connected to the power circuit module and is used to provide illumination for the external endoscope probe. The optical endoscope interface and the electronic endoscope interface are electrically connected to the circuit with dual-channel MIPI image receiving function, respectively, and are connected to the probes of the optical endoscope and the electronic endoscope. The display screen is electrically connected to the circuit with dual-channel MIPI image receiving function and is used for real-time display of endoscope images and touch adjustment of equipment parameters.

10. The medical endoscope main unit according to claim 2, characterized in that, The battery compartment is arranged in the first receiving cavity, the power circuit module is arranged in the left side area of ​​the battery compartment, and the image processing circuit module is arranged in the right side area of ​​the battery compartment. The battery compartment serves as a physical partition separating the power circuit module and the image processing circuit module, with the wiring areas of the power circuit module and the image processing circuit module being isolated from each other. The back panel of the housing is also provided with an external power interface, which is electrically connected to the power circuit module.