Self-circulation cooling mechanism of paint grinding vibration machine
Patent Information
- Application Number
- CN202521965520.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-12
- Publication Date
- 2026-10-09
- Estimated Expiration
- 2035-09-12
AI Technical Summary
[0003]本实用新型针对现有高频振动研磨机自然散热或单风冷系统无法满足高功率研磨的散热需求从而影响涂料研发进度的问题，提供一种涂料研磨振动机的自循环降温机构
1.本实用新型将半导体制冷、强制风冷循环与液冷辅助散热三者结合，构成了一个高效的复合降温系统，半导体制冷片提供了主动冷源，强制风冷循环将研磨机内部的热空气定向抽至冷端进行冷却后再送回，实现了研磨机内空气封闭式自循环，同时，液冷辅助散热装置极大地提升了半导体制冷片热端的散热效率，确保了其持续稳定的制冷性能，整体散热能力远超传统的自然散热或单风冷系统，能够满足高功率、长时间连续研磨的苛刻散热需求。
Smart Images
Figure CN224822766U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of coating grinding equipment, specifically to a self-circulating cooling mechanism for a coating grinding vibratory machine. Background Technology
[0002] In the research and development of coatings, laboratory-level sample preparation is crucial. The main processes employed are high-speed dispersion (high-speed agitation) and grinding. High-speed agitation typically involves a double-walled tank with a cooling water circulation system, effectively controlling material temperature during stirring to significantly reduce diluent evaporation and ensure the stability of heat-sensitive materials. In contrast, grinding utilizes a specialized vibratory mill. A sample container filled with the sample and grinding media is placed inside the machine, where high-frequency, high-amplitude vibrations mix and grind the materials to achieve the required fineness. Currently, some laboratory-grade high-frequency vibratory mills, for cost control reasons, have relatively simple cooling systems, often employing natural convection or a single air-cooling system. These heat dissipation methods have significant drawbacks: low heat dissipation efficiency; natural heat dissipation relies entirely on air convection, resulting in extremely limited heat dissipation capacity; single-air cooling systems merely exchange air between the machine's interior and exterior, making their heat dissipation efficiency highly susceptible to ambient temperature and unable to provide active cooling; and during continuous high-power operation of the grinder, heat accumulation far exceeds heat dissipation. They also affect sample quality; if the heat generated during vibration grinding cannot be dissipated promptly, it can cause a significant increase in the temperature inside the grinding jar, leading to chemical degradation, cross-linking, or deterioration of many heat-sensitive resins (such as acrylic and polyurethane resins), resulting in sample failure and experimental failure. This not only wastes expensive raw materials but also delays research and development progress. Furthermore, they reduce equipment efficiency; to avoid overheating and damage to the equipment or samples, operators must frequently interrupt the grinding process, waiting for the equipment to cool naturally before resuming work. This intermittent "work-pause-cooling" operating mode significantly prolongs the total grinding time, severely slowing down project progress. Utility Model Content
[0003] This invention addresses the problem that existing high-frequency vibratory grinding machines cannot meet the heat dissipation requirements of high-power grinding using natural heat dissipation or single air cooling systems, thus affecting the progress of coating research and development. It provides a self-circulating cooling mechanism for a coating grinding vibratory grinding machine.
[0004] To achieve the above objectives, the present invention adopts the following technical solution.
[0005] This utility model provides a self-circulating cooling mechanism for a paint grinding vibratory machine, including a cooling device fixedly installed on the rear side of the paint grinding vibratory machine; The cooling device is divided into a cooling chamber, a heat dissipation chamber, and a power chamber by a T-shaped partition. A semiconductor cooling chip is embedded in the middle of the vertical plate of the T-shaped partition. The cold end of the semiconductor cooling chip is located in the cooling chamber, and its hot end is located in the heat dissipation chamber. A liquid cooling auxiliary heat dissipation device is also installed in the heat dissipation chamber. A DC power supply is installed in the power chamber. A PLC controller is installed on the right side of the cooling device shell. Several heat dissipation holes are opened on the front side of the cooling device shell. The sample tank area of the coating grinding vibratory machine has an exhaust hole and an air inlet hole respectively on the left and right sides of the outer shell. The exhaust hole is connected to the inlet of the first fan through the air inlet pipe. The outlet of the first fan is connected to the top of the cooling chamber. The bottom of the cooling chamber is connected to the second fan. The outlet of the second fan is connected to the air inlet hole through the air outlet pipe. The first fan, the second fan, the semiconductor cooling chip, and the DC power supply are all electrically connected to the PLC controller.
[0006] Furthermore, several guide plates are inclinedly arranged inside the cooling cavity, with the guide plates positioned opposite to the cold end of the semiconductor cooling chip.
[0007] Furthermore, the liquid-cooled auxiliary heat dissipation device includes a liquid cooling head, a micro pump, and a heat dissipation radiator. The liquid cooling head is tightly disposed at the hot end of the semiconductor cooling chip, the micro pump is fixed to the inner wall of the cooling device housing, and the heat dissipation radiator is installed at the heat dissipation holes. The liquid cooling head, micro pump, and heat dissipation radiator are sequentially connected through liquid cooling pipes, and the circuit is filled with cooling medium. The micro pump is electrically connected to the PLC controller.
[0008] Furthermore, a fan is installed between the heat sink and the heat dissipation hole, and the fan is electrically connected to the PLC controller.
[0009] Furthermore, a temperature sensor is installed inside the cooling chamber, and the temperature sensor is electrically connected to the PLC controller.
[0010] Furthermore, a cover plate can be detachably installed on the outer shell of the cooling device. The cover plate corresponds to the power chamber and is used to seal the power chamber, facilitating the charging or replacement of the DC power supply.
[0011] Compared with the prior art, the beneficial technical effects of this utility model are as follows: 1. This utility model combines semiconductor cooling, forced air cooling circulation, and liquid cooling auxiliary heat dissipation to form a highly efficient composite cooling system. The semiconductor cooling chip provides an active cold source, and the forced air cooling circulation directionally draws the hot air inside the grinder to the cold end for cooling before returning it, realizing a closed-loop self-circulation of air inside the grinder. At the same time, the liquid cooling auxiliary heat dissipation device greatly improves the heat dissipation efficiency of the hot end of the semiconductor cooling chip, ensuring its continuous and stable cooling performance. The overall heat dissipation capacity far exceeds that of traditional natural heat dissipation or single air cooling systems, and can meet the demanding heat dissipation requirements of high-power, long-term continuous grinding.
[0012] 2. This invention, through continuous and efficient cooling, can stably control the temperature inside the grinder within a safe range, effectively preventing resin degradation and deterioration caused by overheating, ensuring the purity and quality of experimental samples, and avoiding the loss of raw materials and time due to sample scrapping; it enables the vibratory grinder to work continuously without interruption, eliminating the waiting time due to equipment overheating shutdown for cooling, significantly shortening the total grinding time of a single sample, thereby accelerating the progress of the entire coating research and development project and improving the work efficiency of the laboratory.
[0013] 3. This utility model can achieve intelligent operation through PLC controller and temperature sensor. It can automatically start and stop cooling, adjust fan speed or cooling power according to real-time temperature monitoring, thereby improving temperature control capability.
[0014] 4. The entire cooling mechanism of this utility model is integrated into an independent device, which can be easily installed on the rear side of an existing vibratory grinder without requiring complex structural modifications to the grinder body. Attached Figure Description
[0015] Figure 1 A perspective view of a self-circulating cooling mechanism for a paint grinding vibratory machine; Figure 2 This is a front view of a self-circulating cooling mechanism for a paint grinding vibratory mill; Figure 3 A left sectional view of a self-circulating cooling mechanism for a paint grinding vibratory machine; Reference numerals: 1-Coating grinding vibratory machine, 2-Inlet pipe, 3-Outlet pipe, 4-Cooling device, 5-First fan, 6-Second fan, 7-T-shaped partition, 8-Semiconductor cooling chip, 9-Guide plate, 10-Power supply, 11-Liquid cooling head, 12-Micro pump, 13-Radiator, 14-Fan, 15-Liquid cooling pipe, 16-Heat dissipation hole, 17-Cover plate, 18-PLC controller, 19-Temperature sensor. Detailed Implementation
[0016] To more clearly illustrate the technical solution and effects of this utility model, the present utility model will be clearly and completely described below with reference to the accompanying drawings and embodiments. It should be understood that the embodiments described herein are merely some embodiments of this utility model, not all embodiments, and the technical features involved in the various embodiments of this utility model described below can be combined with each other as long as they do not conflict with each other.
[0017] It should be noted that, unless otherwise explicitly specified and limited, the terms “installation,” “connection,” “linking,” and “setting” should be interpreted broadly. For example, they can refer to fixed connection or setting, detachable connection or setting, or integral connection or setting; they can refer to direct connection or indirect connection through an intermediate medium; and they can refer to the internal connection of two components.
[0018] Example This embodiment provides a self-circulating cooling mechanism for a paint grinding vibratory mill, including a cooling device 4 fixedly installed on the rear side of the paint grinding vibratory mill 1. The cooling device 4 is internally divided into a cooling chamber, a heat dissipation chamber, and a power chamber by a T-shaped partition 7. A semiconductor cooling chip 8 is embedded in the middle of the vertical plate of the T-shaped partition 7. The cold end of the semiconductor cooling chip 8 is located in the cooling chamber, and its hot end is located in the heat dissipation chamber. A liquid-cooled auxiliary heat dissipation device is also provided in the heat dissipation chamber. A DC power supply 10 is provided in the power chamber. A PLC controller is installed on the right side of the outer shell of the cooling device 4. The cooling device 4 has several heat dissipation holes 16 on its front side. The sample tank area of the paint grinding vibrator 1 has exhaust holes and air inlets on its left and right sides respectively. The exhaust holes are connected to the inlet of the first fan 5 through the air inlet pipe 2. The outlet of the first fan 5 is connected to the top of the cooling chamber. The bottom of the cooling chamber is connected to the second fan 6. The outlet of the second fan 6 is connected to the air inlet through the air outlet pipe 3. The first fan 5, the second fan 6, the semiconductor cooling chip 8, and the DC power supply 10 are all electrically connected to the PLC controller 18.
[0019] Specifically, the liquid-cooled auxiliary heat dissipation device includes a liquid cooling head 11, a micro pump 12, and a heat dissipation radiator 13. The liquid cooling head 11 is tightly disposed at the hot end of the semiconductor cooling chip 8. The micro pump 12 is fixed to the inner wall of the cooling device 4 housing. The heat dissipation radiator 13 is installed at the heat dissipation hole 16. The liquid cooling head 11, the micro pump 12, and the heat dissipation radiator 13 are sequentially connected through a liquid cooling pipe 15. The micro pump 12 is electrically connected to the PLC controller 18. A fan 14 is also installed between the heat dissipation radiator 13 and the heat dissipation hole 16. The fan 14 is electrically connected to the PLC controller 18.
[0020] Specifically, a temperature sensor 19 is provided inside the cooling chamber, and the temperature sensor 19 is electrically connected to the PLC controller 18.
[0021] In this embodiment, a laboratory-grade grinding vibratory mill of model ZHM-1A is modified by drilling holes on the left and right sides of the outer shell corresponding to the sample tank area of the ZHM-1A laboratory-grade grinding vibratory mill to form two exhaust holes and two air inlets; the cooling device 4 is fixed to the back of the grinding vibratory mill, and the exhaust hole and the first fan 5 are connected through the air inlet pipe 2, and the air inlet and the second fan 6 are connected through the air outlet pipe 3.
[0022] In this embodiment, the PLC controller 18 is a Siemens S7-1200 series, such as model S7-1214C DC / DC / DC; the temperature sensor 19 is an NTC thermistor, DS18B20 digital temperature sensor, or PT100; the DC power supply 10 is preferably a lithium-ion battery pack, whose output voltage should match the system requirements, such as 12V or 24V DC, and the capacity is preferably not less than 10Ah to ensure sufficient battery life. The first fan 5 and the second fan 6 are both DC fans, with an airflow range preferably of 10-50 CFM; the micro pump 12 is a 12V DC pump with a flow rate ≥2L / min and a head ≥1.5m, driving the circulation of the cooling medium, which can be a 50% ethylene glycol solution. The liquid cooling head 11 is a miniature copper cooling head with a contact area of not less than 20cm². 2 The miniature copper cooling head features internal microchannels for enhanced heat exchange, and the heat sink 13 is made of aluminum. Its dimensions can be designed according to the heat load, for example, the heat dissipation area should be no less than 0.5m². 2 To improve heat dissipation efficiency, fan 14 is selected as a DC cooling fan, whose size matches that of the heat sink 13, and whose airflow is preferably not less than 30 CFM. The cooling power of the thermoelectric cooler 8 (TEC) should be selected according to the heat output of the grinder, preferably a model with a cooling power between 50W and 200W, and its operating voltage is 12V.
[0023] Optionally, several guide plates 9 are also inclinedly arranged inside the cooling chamber. The guide plates 9 are arranged opposite to the cold end of the semiconductor cooling chip 8 to enhance the cooling effect of the air in the cooling chamber. A cover plate 17 can also be detachably installed on the outer shell of the cooling device 4. The cover plate 17 corresponds to the power chamber and is used to close the power chamber to facilitate charging or replacement of the DC power supply 10.
[0024] The modified paint grinding vibratory machine in this embodiment operates as follows: The grinding vibratory machine is started to grind the paint. The first fan 5 draws the hot air in the paint grinding vibratory machine 1 into the cooling chamber, where it is cooled by the cold end of the semiconductor cooling chip 8. The second fan 6 blows the cold air in the cooling chamber into the paint grinding vibratory machine 1. The cooling medium is driven to flow by the micro pump 12. When the cooling medium flows through the liquid cooling head 11, it carries away the heat from the hot end of the semiconductor cooling chip 8 and dissipates the heat at the heat dissipation vent 13. The heat is also blown out of the heat dissipation hole 16 by the fan 14.
[0025] The above description is a preferred embodiment of the present utility model, used to explain the technical solution of the present utility model, and is not intended to limit the present utility model. Those skilled in the art can make conventional modifications, equivalent substitutions and improvements within the spirit and principles of the present utility model, all of which are still included within the protection scope of the present utility model.
Claims
1. A self-circulating cooling mechanism for a paint grinding vibratory mill, characterized in that: Including a cooling device fixedly installed on the rear side of the paint grinding vibratory machine; The cooling device is divided into a cooling chamber, a heat dissipation chamber, and a power chamber by a T-shaped partition. A semiconductor cooling chip is embedded in the middle of the vertical plate of the T-shaped partition. The cold end of the semiconductor cooling chip is located in the cooling chamber, and its hot end is located in the heat dissipation chamber. A liquid cooling auxiliary heat dissipation device is also installed in the heat dissipation chamber. A DC power supply is installed in the power chamber. A PLC controller is installed on the right side of the cooling device shell. Several heat dissipation holes are opened on the front side of the cooling device shell. The sample tank area of the coating grinding vibratory machine has an exhaust hole and an air inlet hole respectively on the left and right sides of the outer shell. The exhaust hole is connected to the inlet of the first fan through the air inlet pipe. The outlet of the first fan is connected to the top of the cooling chamber. The bottom of the cooling chamber is connected to the second fan. The outlet of the second fan is connected to the air inlet hole through the air outlet pipe. The first fan, the second fan, the semiconductor cooling chip, and the DC power supply are all electrically connected to the PLC controller.
2. The self-circulating cooling mechanism of a coating grinding vibratory mill according to claim 1, characterized in that: The liquid-cooled auxiliary heat dissipation device includes a liquid cooling head, a micro pump, and a heat dissipation radiator. The liquid cooling head is tightly disposed at the hot end of the semiconductor cooling chip. The micro pump is fixed to the inner wall of the cooling device housing. The heat dissipation radiator is installed at the heat dissipation holes. The liquid cooling head, micro pump, and heat dissipation radiator are sequentially connected through a liquid cooling pipe, and the circuit is filled with a cooling medium. The micro pump is electrically connected to the PLC controller.
3. The self-circulating cooling mechanism of a coating grinding vibratory mill according to claim 2, characterized in that: A fan is also installed between the heat sink and the heat dissipation hole, and the fan is electrically connected to the PLC controller.
4. The self-circulating cooling mechanism of a coating grinding vibratory mill according to claim 1, characterized in that: A temperature sensor is installed inside the cooling chamber, and the temperature sensor is electrically connected to the PLC controller.
5. The self-circulating cooling mechanism of a coating grinding vibratory mill according to claim 1, characterized in that: Several guide plates are also inclinedly arranged inside the cooling cavity, and the guide plates are arranged opposite to the cold end of the semiconductor cooling chip.
6. The self-circulating cooling mechanism of a coating grinding vibratory mill according to claim 1, characterized in that: A cover plate can also be detachably installed on the outer shell of the cooling device, and the cover plate corresponds to the power chamber.