A spray tooling

Abstract

The application relates to a spraying tool, comprising a mask; the mask is provided with a spraying hole penetrating in a first direction; a first wall surface is formed on one side of the mask along the first direction; a groove is formed in the first wall surface; the spraying hole is communicated with the groove; and the projection of the spraying hole on the first wall surface is located in the projection range of the groove on the first wall surface. The surface of a substrate is shielded by the mask, a cavity communicated with the spraying hole is formed between the mask and the substrate, the cavity can be used for exhaust pressure relief during the spraying process, the situation of gas rebound and turbulence is relieved, the uniformity of the thickness of the coating deposited on the surface of the substrate is improved, and the product quality is improved.

Description

Technical Field

[0001] This application relates to the field of spraying fixture technology, specifically to a spraying tooling. Background Technology

[0002] Substrate coating technology (such as copper coating on aluminum substrates) imparts specific properties to a substrate by depositing metallic or non-metallic coatings, and is suitable for applications requiring conductivity, corrosion resistance, mechanical strength, or thermal management.

[0003] When a coating is formed by spraying on the area to be coated on the substrate surface, the area that does not need to be coated needs to be masked by the mask of the spraying fixture. The mask is provided with spray holes and is attached to the surface of the substrate. The spray holes correspond to the area to be coated. After the material powder is sprayed by the spraying equipment, the material powder can pass through the spray holes to form the corresponding coating on the substrate surface.

[0004] However, during the spraying process, issues such as gas rebound and turbulence affect powder deposition, leading to uneven coating thickness and consequently impacting product quality. Utility Model Content

[0005] The purpose of this application is to provide a spraying fixture that masks the surface of a substrate, thereby mitigating gas rebound and turbulence during the spraying process, improving the uniformity of the coating thickness deposited on the substrate surface, and enhancing product quality.

[0006] To solve the above-mentioned technical problems, this application provides a spraying fixture, including a mask; the mask is provided with a spray hole through it along a first direction, and a first wall is formed on one side wall of the mask along the first direction; a groove is provided on the first wall, the spray hole communicates with the groove, and the projection of the spray hole on the first wall is located within the projection range of the groove on the first wall.

[0007] When the substrate and the spraying fixture are installed, there is a gap between the bottom wall of the tank and the area to be sprayed along the first direction of the mask, and a cavity is formed here. The cavity is connected to the spray hole and forms a spraying channel. The cross-sectional area of ​​the cavity is larger than the cross-sectional area of ​​the spray hole. The spray hole has a shape and size corresponding to the area to be sprayed, and the inner wall of the spray hole can bind the copper powder passing through.

[0008] The spraying equipment sprays copper powder from the side of the mask away from the substrate. When the copper powder passes through the nozzle, it can be constrained by the inner wall of the nozzle, so that the copper layer formed at the preset position on the substrate surface has a preset shape and size. The cavity is located on the side close to the substrate, and the cross-sectional area of ​​the cavity is relatively large. When the copper powder is sprayed onto the surface of the substrate, the gas in the nozzle and cavity can diffuse outward from the cavity. High-pressure gas can be discharged, which facilitates pressure relief, reduces the probability of substrate deformation, and can also alleviate gas rebound, gas turbulence or copper powder rebound during copper spraying, reduce the impact on copper powder deposition, improve the thickness uniformity of the copper layer, and thus improve product quality.

[0009] Optionally, the mask is provided with a plurality of spray holes, each spray hole being spaced apart, and the groove is connected to at least two of the spray holes.

[0010] Optionally, the first wall surface is provided with at least two spaced-apart grooves.

[0011] Optionally, the projection of the end of the nozzle facing the first wall onto the first wall is a first projection, and the projection of the end of the nozzle away from the first wall onto the first wall is a second projection. The first projection is within the second projection, and the first projection is located within the projection range of the groove on the first wall.

[0012] Optionally, the nozzle includes a first segment and a second segment arranged along its axial direction, the first segment being located on the side of the second segment facing the first wall, the projection of the first segment onto the first wall being the first projection, and the projection of the end of the second segment away from the first segment onto the first wall being the second projection.

[0013] Optionally, the second segment is gradually widened from the end facing the first segment to the end away from the first segment.

[0014] Optionally, the first wall surface is further provided with a first relief groove, which is used to accommodate a first protrusion structure provided on the surface of the substrate.

[0015] Optionally, the spraying fixture further includes a base, which is detachably connected to the mask, and in the connected state, the mask and the base enclose a positioning cavity to accommodate the substrate to be sprayed.

[0016] Optionally, the mask is further provided with a protrusion on the side facing the first wall. The protrusion is arranged circumferentially along the first wall and surrounds to form a first positioning groove. The first wall forms the bottom wall of the first positioning groove. The side wall of the base facing the mask is further provided with a second positioning groove. In the connected state, the mask is fixed to the base circumferentially. The first positioning groove and the second positioning groove are connected to form the positioning cavity.

[0017] Optionally, the base is further provided with a second clearance groove communicating with the positioning cavity, the second clearance groove being used to accommodate a second protrusion structure provided on the surface of the substrate.

[0018] Optionally, the spraying fixture further includes a seal, which is arranged circumferentially along the second relief groove. One end of the seal abuts against the base, and the other end abuts against the substrate. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the structure of the mask for the spraying fixture provided in the embodiments of this application; Figure 2 This is a schematic diagram of the mask's structure from another perspective; Figure 3 It is a cross-sectional view of the spraying fixture and the substrate in the installed state; Figure 4 yes Figure 3 Enlarged view of A in the middle; Figure 5 It is an exploded view of the spraying fixture and the substrate; Figure 6 This is another cross-sectional view of the spraying fixture and the substrate in the installed state.

[0020] Appendix Figures 1-6 The reference numerals in the attached figures are explained as follows: 1 Mask, 11 Spray hole, 111 First section, 112 Second section, 12 First wall, 13 Second wall, 14 Groove, 15 Protrusion, 16 First positioning groove, 17 First fixing hole, 18 First clearance groove; 2 cavity; 3. Base, 31. Second positioning groove, 32. Second clearance groove, 33. Second fixing hole, 34. Sealing groove; 4. Substrate, 41. Area to be coated, 42. Copper layer, 43. First protrusion structure, 44. Second protrusion structure; 5. Sealing components. Detailed Implementation

[0021] To enable those skilled in the art to better understand the technical solutions of this application, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0022] Substrate coating technology (such as copper coating on aluminum substrates) imparts specific properties to a substrate by depositing metallic or non-metallic coatings, and is suitable for applications requiring conductivity, corrosion resistance, mechanical strength, or thermal management.

[0023] This application provides a spraying fixture, such as... Figure 1 As shown, the spraying fixture includes a mask 1 with spray holes 11. During the spraying process on the substrate 4, the mask 1 is attached to the surface of the substrate 4, and the spray holes 11 are correspondingly set with the area 41 to be sprayed on the surface of the substrate 4. The spraying equipment is located on the side of the mask 1 away from the substrate 4. After the spraying equipment sprays the material powder, the material powder can pass through the spray holes 11 to form a coating on the surface of the substrate 4.

[0024] The material of substrate 4 is not limited, nor is the powder material. For ease of explanation, the following description will take the aluminum plate used to prepare the liquid cooling plate as substrate 4, the copper powder sprayed onto the surface of substrate 4 by the spraying device, and the copper powder forming a copper layer 42 on the surface of substrate 4 through the spray hole 11 as an example. The copper layer 42 can be used to weld and connect with other copper parts. The area on the surface of substrate 4 other than the area to be sprayed 41 is the non-sprayed area. The non-sprayed area is covered by the spraying fixture.

[0025] If the copper layer 42 on the surface of substrate 4 has poor uniformity in thickness, with some areas having a larger thickness and others a smaller thickness, the solder paste or solder pads will be hindered from spreading during soldering, resulting in poor wettability and consequently poor soldering and product quality. Since the spraying equipment operates along a linear path, during the spraying process, factors such as gas rebound within the nozzle 11, copper powder rebound, and gas turbulence may affect the deposition of copper powder on the surface of substrate 4, impacting the uniformity of the copper layer 42 thickness and consequently affecting soldering quality and product quality.

[0026] like Figure 1 and Figure 2 As shown, the mask 1 has two opposite sidewalls forming a first wall 12 and a second wall 13 along the first direction. The nozzle 11 is disposed through the first wall 12 and the second wall 13 along the first direction. The first wall 12 has a groove 14, and the nozzle 11 communicates with the groove 14. The projection of the nozzle 11 on the first wall 12 is located within the projection range of the groove 14 on the first wall 12.

[0027] The first direction refers to, for example, Figure 1 , Figure 3 and Figure 4 In the direction indicated by the middle arrow, in the installed state, the mask 1 and the substrate 4 are arranged side by side along the first direction, which is the thickness direction of the substrate 4, or it can be the thickness direction of the mask 1.

[0028] When spraying coating onto the surface of substrate 4, mask 1 covers the surface of substrate 4, and the first wall 12 of mask 1 is attached to the side surface of substrate 4 to be sprayed. The spray nozzle 11 corresponds to the area 41 to be sprayed on the surface of substrate 4. Figure 3 and Figure 4 As shown, a gap is left between the bottom wall of the groove 14 and the area 41 to be sprayed along the first direction of the mask 1, and a cavity 2 is formed here. The cavity 2 is connected to the nozzle 11 and forms a spraying channel. The cross-sectional area of ​​the cavity 2 is larger than the cross-sectional area of ​​the nozzle 11. The nozzle 11 has a shape and size corresponding to the area 41 to be sprayed. The inner wall of the nozzle 11 can bind the copper powder passing through.

[0029] The spraying equipment sprays copper powder from the side of the mask 1 away from the substrate 4. When the copper powder passes through the nozzle 11, it can be constrained by the inner wall of the nozzle 11, so that the copper layer 42 formed at the preset position on the surface of the substrate 4 has a preset shape and size. The cavity 2 is located on the side close to the substrate 4, and the cross-sectional area of ​​the cavity 2 is relatively large. When the copper powder is sprayed onto the surface of the substrate 4, the gas in the nozzle 11 and the cavity 2 can diffuse outward from the cavity 2, and the high-pressure gas can be discharged, which facilitates pressure relief, reduces the probability of substrate 4 deformation, and can also alleviate the situation of gas rebound, gas turbulence or copper powder rebound during copper spraying, reduce the impact on copper powder deposition, improve the thickness uniformity of the copper layer 42, and thus improve product quality.

[0030] When copper powder passes through cavity 2, some of the copper powder may diffuse outward along cavity 2 to other non-sprayed areas on the surface of substrate 4 with the gas. Because the diffusion speed of this part of copper powder decreases after diffusion, it cannot reach the deposition speed, so the bonding force between it and the surface of substrate 1 is relatively weak. This part of copper powder can be cleaned up later.

[0031] The surface of the substrate 4 with the area to be sprayed 41 can be a planar structure or a structure with partial protrusions. The first wall 12 is adapted to and fits against the surface of the substrate 4. The groove 14 is provided so that there is a gap between the bottom of the groove 14 and the surface of the area to be sprayed 41. That is, there is a gap between the end face of the spray hole 11 facing the first wall 12 and the surface of the area to be sprayed 41, so as to form a cavity 2 during the spraying process, which facilitates exhaust and pressure relief.

[0032] When the first protrusion structure 43 is provided on the side surface of the substrate 4 facing the mask 1, such as Figure 2 As shown, the first wall 12 of the mask 1 is also provided with a first clearance groove 18. The first clearance groove 18 is used to make way for the first protrusion structure 43. In the installation state, the first protrusion structure 43 is located in the first clearance groove 18 to facilitate smooth installation.

[0033] When multiple copper layers 42 need to be formed on the surface of substrate 4, there are multiple areas 41 to be sprayed on the surface of substrate 4. Mask 1 can be provided with multiple spray holes 11, each spray hole 11 is spaced apart, and each spray hole 11 is respectively provided with the location of each area 41 to be sprayed.

[0034] Each groove 14 is connected to at least two nozzles 11. When two rows of copper layers 42 need to be sprayed onto the surface of the substrate 4, such as Figure 2 The mask 1 shown is provided with two rows of spray holes 11, and the first wall surface 12 is provided with two grooves 14. The two grooves 14 are respectively connected to the two rows of spray holes 11. In this way, the structure of the mask 1 can be simplified and the processing operation can be facilitated. In addition, each groove 14 is connected to at least two spray holes 11, which increases the space of the groove 14, that is, increases the space of the cavity 2. During the spraying process, each spraying channel can be connected through the cavity 2, the space for gas diffusion is larger, which is more conducive to pressure relief and alleviates gas rebound and turbulence, thereby improving product quality.

[0035] The spraying equipment moves back and forth in a preset direction relative to the mask 1 and can perform multiple sprayings to form a copper layer 42 of preset thickness on the surface of the substrate 4. At the same time, the spraying equipment passes through some of the spray holes 11, and the copper powder enters the spray holes 11 and compresses the air to diffuse from the cavity 2 to other areas, and is discharged through other spray holes 11 connected to the cavity 2, resulting in better exhaust effect.

[0036] Of course, the first wall surface 12 may also have multiple grooves 14, with each nozzle 11 corresponding to one groove 14, and the grooves 14 may not be connected to each other. Alternatively, the first wall surface 12 may have only one groove 14, which may be connected to all nozzles 11.

[0037] When there are a large number of nozzles 11, two or more slots 14 can be provided, and each slot 14 can be connected to at least two nozzles 11. This arrangement can simplify the structure of the mask 1 while enhancing the structural strength and stability of the mask 1 and avoiding deformation after long-term use.

[0038] like Figure 4As shown, the depth D of the groove 14 is in the range of 1mm-3mm. Of course, the depth of the groove 14 can also be set to 0.5mm, 4mm, 5mm, etc. When the depth of the groove 14 is set in the range of 1mm-3mm, when the mask 1 is attached to the surface of the substrate 4, a cavity 2 with a thickness of 1mm-3mm can be formed, such as 1mm, 2mm, 3mm, etc., so that the high-pressure gas can be smoothly discharged during the spraying process, achieving a better pressure relief effect, thereby reducing the impact of gas rebound, copper powder rebound, and gas turbulence on the spraying quality, reducing the deformation of the substrate 4, and at the same time, it can also make the nozzle 11 fully exert its function of restricting copper powder to form a copper layer 42 with a preset shape and size, reducing copper powder diffusion.

[0039] During the spraying process, copper powder may be deposited on the inner peripheral wall of the spray hole 11. If there is a lot of copper powder deposited on the inner peripheral wall of the spray hole 11, it may affect the copper layer 42 that is finally formed on the surface of the substrate 4.

[0040] In this embodiment, the structure of the nozzle 11 is not limited. For example, it can be configured to have the same cross-sectional area at all points along the axial direction. Alternatively, the projection of the end of the nozzle 11 facing the first wall surface 12 onto the first wall surface 12 can be designated as a first projection, which is located within the projection range of the cavity 2 on the first wall surface 12. The projection of the end of the nozzle 11 away from the first wall surface 12 onto the first wall surface 12 can be designated as a second projection, which is within the second projection. The diameter of the end of the nozzle 11 facing the first wall surface 12 should be smaller than the diameter of the end away from the first wall surface 12. The position, shape, and size of the end of the nozzle 11 facing the first wall surface 12 should correspond to the position, shape, and size of the area to be sprayed 41, and should be able to restrict the passage of copper powder. The diameter of the end of the nozzle 11 away from the first wall surface 12 should be relatively larger. This configuration can reduce the impact of copper powder deposited on the inner wall of the nozzle 11 on the copper layer 42 during the spraying process. After prolonged use, the copper powder deposited on the inner wall of the nozzle 11 can be cleaned or the mask 1 can be replaced with a new one.

[0041] like Figure 4 As shown, the spray nozzle 11 includes a first segment 111 and a second segment 112 arranged along its axial direction (i.e., a first direction), wherein the first segment 111 is located on the side of the second segment 112 facing the first wall surface 12, and the spraying channel includes the second segment 112, the first segment 111, and the cavity 2 arranged sequentially. The projection of the first segment 111 onto the first wall surface 12 is the first projection described above, and the projection of the end of the second segment 112 away from the first segment 111 onto the first wall surface 12 forms the second projection described above. When spraying copper powder, the spraying equipment passes sequentially through the second segment 112, the first segment 111, and the cavity 2 to reach the surface of the substrate 4.

[0042] The position and size of the first segment 111 are set according to the position and size of the copper layer 42. The first segment 111 can restrict the copper powder passing through. The first segment 111 has a certain axial length, which can improve the structural strength of the substrate 4 on the side facing the first wall 12 at the nozzle 11, reduce the probability of the substrate 4 deforming at the nozzle 11, and ensure the position and size accuracy of the copper layer 42.

[0043] like Figure 4 As shown, the axial length of the first segment 111 is in the range of 1mm-3mm. Of course, in this embodiment, the axial length of the first segment 111 is not limited. It can also be 0.5mm, 0.8mm, 4mm, 5mm, etc. Setting the axial length of the first segment 111 in the range of 1mm-3mm, such as 1mm, 2mm, 3mm, etc., can improve the structural strength of the substrate 4 at the nozzle 11 while reducing the impact of copper powder deposited on the inner wall of the first segment 111 on the copper layer 42, thereby improving product quality.

[0044] In this embodiment, the second segment 112 is gradually widened from one end toward the first wall surface 12 to the end away from the first wall surface 12. The second segment 112 is similar to a trumpet-shaped structure. This arrangement can improve the structural strength of the nozzle 11 and also facilitates the cleaning of copper powder deposited on the inner wall surface of the nozzle 11 in the later stage.

[0045] Of course, in this embodiment, the first segment 111 and the second segment 112 can also form a stepped hole structure, or the nozzle 11 can be set to include only the second segment 112, and the second segment 112 can be a gradually expanding structure.

[0046] When the second segment 112 has a gradually expanding trumpet-shaped structure, such as Figure 4 As shown, the included angle α between the hole wall of the second segment 112 and the axis is in the range of 30°-60°. Of course, in this embodiment, the included angle α is not limited, and it can also be 15°, 20°, 80°, etc. Setting the included angle α between the hole wall of the second segment 112 and the axis in the range of 30°-60°, such as 30°, 40°, 50°, 60°, etc., can reduce the impact of copper powder deposition on the copper layer 42 while reducing the impact on the structural strength of the nozzle 11.

[0047] Along the first direction, the distance T between the first wall surface 12 and the second wall surface 13 is in the range of 2mm-7mm, and the sum of the axial length of the nozzle 11 and the depth of the groove 14 is in the range of 2mm-7mm. Of course, the thickness of the mask 1 can also be set to 1.2mm, 1.5mm, 1.8mm, or 8mm, 10mm, etc.

[0048] The larger the distance T between the first wall 12 and the second wall 13, the greater the structural strength and the better the resistance to deformation of the mask 1. Setting the distance T between the first wall 12 and the second wall 13 in the range of 2mm-7mm, such as 2mm, 3mm, 4mm, 5mm, 6mm, 7mm, etc., can make the mask 1 have high structural strength and resistance to deformation, while reducing the overall weight and improving economy.

[0049] like Figure 4 , Figure 5 and Figure 6 As shown, the spraying fixture also includes a base 3, which is detachably connected to the mask 1. In the connected state, the mask 1 and the base 3 form a positioning cavity, which is used to accommodate the substrate 4 to be sprayed. During spraying, the substrate 4 is placed between the mask 1 and the base 3, and the mask 1 and the base 3 are fixed to position the substrate 1, so that the spray nozzle 11 of the mask 1 corresponds to the area 41 to be sprayed on the surface of the substrate 4, ensuring the accuracy of the formation of the copper layer 42 on the surface of the substrate 4.

[0050] Of course, in this embodiment, the spraying fixture may not include the base 3. The mask 1 can be directly covered on the surface of the substrate 4, and the mask 1 can be fixed to the worktable to clamp the substrate 4. The base 3 can further improve the stability of fixing the substrate 4, and different masks 1 can be set for different substrates 4. The cooperation between the base 3 and the mask 1 can improve the flexibility of the cooperation.

[0051] like Figure 2 and Figure 4 As shown, the mask 1 also has a protrusion 15 on the side facing the first wall surface 12. This protrusion 15 is arranged circumferentially along the first wall surface 12 and encloses a first positioning groove 16. The first wall surface 12 forms the bottom wall of the first positioning groove 16. The thickness of the mask 1 does not include the thickness of the protrusion 15. Figure 5 As shown, the side wall of the base 3 facing the mask 1 is also provided with a second positioning groove 31. In the connected state, the protrusion 15 is fixed to the base 3, and the first positioning groove 16 and the second positioning groove 31 are connected and enclosed to form the positioning cavity. The protrusion 15 is fixed to the base 3, and the two can be directly abutting each other, or there can be a gap between the protrusion 15 and the base 3.

[0052] The first positioning groove 16 and the second positioning groove 31 facilitate the positioning of the substrate 4 during installation, enabling quick and easy installation. The groove walls of the first positioning groove 16 and the second positioning groove 31 limit the position of the substrate 4, thereby improving the positional stability of the substrate 4 within the positioning cavity. Alternatively, the substrate 4 can be provided with positioning holes, and the mask 1 can be provided with positioning posts that cooperate with the positioning holes to achieve positioning.

[0053] In this embodiment, there are no restrictions on the fixing method between the substrate 4 and the base 3, such as... Figure 5 As shown, the mask 1 has multiple first fixing holes 17 along its circumference, and the base 3 has multiple second fixing holes 33 along its circumference. Each first fixing hole 17 and each second fixing hole 33 is provided in a one-to-one correspondence and can be connected and fixed by connecting bolts. Alternatively, the mask 1 and the base 3 can be clamped and fixed by clamping components, or the mask 1 and the base 3 can be fixed by snap-fitting or other methods.

[0054] like Figure 4 , Figure 5 and Figure 6 As shown, the base 3 also has a second clearance groove 32 communicating with the positioning cavity. This second clearance groove 32 can make way for the second protrusion structure 44 on the back side of the substrate 4 (i.e., the surface away from the mask 1), structures that need to be kept clean, etc. For example, when the back side of the substrate 4 has a second protrusion structure 44, the second clearance groove 32 can make way for the second protrusion structure 44. In the installed state, the second protrusion structure 44 is located within the second clearance groove 32, facilitating smooth installation. Figure 6 As shown, the spraying fixture also includes a sealing element 5. The sealing element 5 is arranged circumferentially along the second relief groove 32. One end of the sealing element 5 abuts against the base 3, and the other end is used to abut against the substrate 4. That is, the sealing element 5 is clamped between the base 3 and the substrate 4 to seal the area in the second relief groove 32, thereby protecting the second protruding structure 44 and preventing copper powder from entering the space formed by the substrate 4 and the second relief groove 32, thus ensuring the cleanliness of the second protruding structure 44.

[0055] like Figure 6 As shown, the base 3 can also be provided with a sealing groove 34, which is arranged along the circumference of the second clearance groove 32. The sealing element 5 is embedded in the sealing groove 34, which improves the positional stability of the sealing groove 34 and thus improves the sealing performance.

[0056] In this embodiment, there are no restrictions on the specific structure of the seal 5. For example, a rubber sealing strip can be used, or the seal 5 can be formed by filling the sealing groove 34 with a rubber substance.

[0057] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0058] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0059] The above are merely preferred embodiments of this application. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principles of this application, and these improvements and modifications should also be considered within the scope of protection of this application.

Claims

1. A spraying fixture, characterized in that, Including mask (1); The mask (1) has a through-hole (11) along the first direction, and the mask (1) forms a first wall (12) along one side wall of the first direction. The first wall surface (12) has a groove (14), the spray hole (11) is connected to the groove (14), and the projection of the spray hole (11) on the first wall surface (12) is located within the projection range of the groove (14) on the first wall surface (12).

2. The spraying fixture according to claim 1, characterized in that, The mask (1) is provided with a plurality of spray holes (11), each spray hole (11) is spaced apart, and the groove (14) is connected to at least two of the spray holes (11).

3. The spraying fixture according to claim 2, characterized in that, The first wall surface (12) is provided with at least two spaced grooves (14).

4. The spraying fixture according to any one of claims 1-3, characterized in that, The projection of the end of the nozzle (11) facing the first wall (12) onto the first wall (12) is the first projection, and the projection of the end of the nozzle (11) away from the first wall (12) onto the first wall (12) is the second projection. The first projection is within the second projection, and the first projection is located within the projection range of the groove (14) on the first wall (12).

5. The spraying fixture according to claim 4, characterized in that, The nozzle (11) includes a first segment (111) and a second segment (112) arranged along its axial direction. The first segment (111) is located on the side of the second segment (112) facing the first wall (12). The projection of the first segment (111) on the first wall (12) is the first projection. The projection of the end of the second segment (112) away from the first segment (111) on the first wall (12) forms the second projection.

6. The spraying fixture according to claim 5, characterized in that, The second segment (112) is gradually widened from one end toward the first segment (111) toward the other end away from the first segment (111).

7. The spraying fixture according to any one of claims 1-3, characterized in that, The first wall surface (12) is also provided with a first relief groove (18), which is used to accommodate a first protrusion structure (43) provided on the surface of the substrate (4).

8. The spraying fixture according to any one of claims 1-3, characterized in that, The spraying fixture also includes a base (3), which is detachably connected to the mask (1). In the connected state, the mask (1) and the base (3) form a positioning cavity, which is used to accommodate the substrate (4) to be sprayed.

9. The spraying fixture according to claim 8, characterized in that, The mask (1) is provided with a protrusion (15) on the side facing the first wall (12). The protrusion (15) is arranged along the circumference of the first wall (12) and surrounds to form a first positioning groove (16). The first wall (12) forms the bottom wall of the first positioning groove (16). The base (3) is provided with a second positioning groove (31) on the side wall facing the mask (1). In the connected state, the mask (1) is fixed to the base (3) along the circumference. The first positioning groove (16) and the second positioning groove (31) are connected to form the positioning cavity.

10. The spraying fixture according to claim 8, characterized in that, The base (3) is also provided with a second relief groove (32) communicating with the positioning cavity. The second relief groove (32) is used to accommodate a second protrusion structure (44) provided on the surface of the substrate (4).

11. The spraying fixture according to claim 10, characterized in that, The spraying fixture also includes a sealing element (5), which is arranged circumferentially along the second relief groove (32). One end of the sealing element (5) abuts against the base (3), and the other end is used to abut against the substrate (4).

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