A kind of glue spreading plate used when bonding silicon single crystal rod and resin plate
Patent Information
- Application Number
- CN202522267452.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-10-27
- Publication Date
- 2026-10-09
- Estimated Expiration
- 2035-10-27
AI Technical Summary
[0003]现有的涂胶工具多为直边涂胶刀，在树脂板弧面上涂胶时使用现有的涂胶刀无法将胶均匀的涂抹在树脂板的弧面上，在后续的切割加工、硅片脱胶加工中很容易造成因粘接不牢而导致的掉片，造成产品损失，存在安全隐患
本实用新型的硅单晶棒和树脂板粘接时所使用的涂胶板具有结构简单、操作便捷的特点，能有效避免因单晶粘接时涂胶不均而导致切割后掉片所造成的产品损失、提高生产安全性。
Smart Images
Figure CN224823286U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of silicon wafer processing, specifically relating to a coating plate used in the wire cutting process for bonding silicon single crystal rods and resin plates. Background Technology
[0002] In the online cutting process, silicon single crystal rods need to be connected to the steel support of the cutting machine for processing. Since the surface of the silicon single crystal rod is arc-shaped and the surface of the steel support of the cutting machine is flat, a resin plate with one side arc-shaped and one side flat is needed as a connection carrier when connecting the columnar silicon single crystal rod to the flat steel support.
[0003] Existing adhesive application tools are mostly straight-edged adhesive applicators. When applying adhesive to the curved surface of a resin board, these applicators cannot evenly spread the adhesive on the curved surface. This can easily lead to wafer detachment due to weak adhesion during subsequent cutting and silicon wafer removal processes, resulting in product loss and posing safety hazards. Utility Model Content
[0004] To address the inconvenience of using existing adhesive applicators, the present invention aims to provide an adhesive applicator for bonding silicon single crystal rods and resin boards, thereby meeting the requirement of uniform adhesive application to the resin board, reducing the risk of wafer detachment, ensuring production output, avoiding economic losses, and eliminating safety hazards.
[0005] To achieve the above objectives, the present invention adopts the following technical solution: A coating plate for bonding a silicon single crystal rod and a resin plate, the coating plate comprising a main body and a coating plate head connected to the front end of the main body, the coating plate head having two sides and an arcuate surface connected to the front end of the two sides, wherein the two sides are planar and the arcuate surface has the same curvature as the arcuate surface of the resin plate.
[0006] Furthermore, the main body is rectangular in shape.
[0007] Furthermore, the coated sheet is cut and processed from a single piece of acrylic sheet.
[0008] Furthermore, all edges of the coated plate are chamfered.
[0009] The advantages of this utility model are: The adhesive coating plate used in the bonding of silicon single crystal rods and resin plates of this invention has the characteristics of simple structure and convenient operation. It can effectively avoid product loss caused by uneven adhesive coating during single crystal bonding, which leads to wafer drop after cutting and improves production safety. Attached Figure Description
[0010] Figure 1 This is a schematic diagram of the overall structure of the adhesive-coated plate of this utility model. Detailed Implementation
[0011] The present invention will now be described in detail with reference to the accompanying drawings. However, the embodiments described are only for explaining the present invention and are not intended to limit the scope of the present invention.
[0012] like Figure 1 As shown, the adhesive-coated plate of this utility model includes a generally rectangular main body 1 and an adhesive-coated plate head 2 connected to the front end of the main body. The adhesive-coated plate head 2 has two side surfaces extending from the main body and an arc-shaped surface connecting to the front end of the two side surfaces. The two side surfaces are designed to be flat, and the arc-shaped surface has the same curvature as the arc surface of the resin plate. The adhesive-coated plate is made of a single piece of acrylic sheet, and all its edges are chamfered.
[0013] The manufacturing process of this coated board is as follows: using acrylic sheets Figure 1 Cut the acrylic sheet into the shape shown. Cut out a coating plate head with the same curvature as the resin board at the top. Cut the two sides of the coating plate head into flat surfaces for flat coating. Cut a hand grip (i.e., main body 1) downwards for holding. Finally, bevel the entire cut acrylic sheet to ensure uniform coating and comfortable holding.
[0014] In practical applications, the adhesive-coated plate of this invention is used to bond silicon single crystal rods and resin plates. The specific operation process is as follows: In the adhesive application step of monocrystalline bonding, use an adhesive applicator to apply the adhesive. Hold the handle and pour a sufficient amount of adhesive onto the flat side of the resin board. Use the straight edge of the adhesive applicator to spread the adhesive evenly. After spreading evenly, flip the resin board over and pour a sufficient amount of adhesive onto the curved surface of the resin board. At this time, use the curved surface of the adhesive applicator head to press the curved surface of the adhesive applicator head against the curved surface of the resin board and spread the adhesive back and forth. After spreading the adhesive evenly, proceed with the monocrystalline bonding work.
[0015] As a specific embodiment of this utility model, the curved surface (curved coating position) of the coating plate is made according to the curvature of the resin plate used for bonding 12-inch silicon single crystal rods. The coating plate is 3mm thick, the main body is 40mm wide, and the length is 100mm; the side length of the coating plate head is 40mm, and the curvature of the curved surface is 36 degrees. Using this coating plate, AB glue can be quickly and evenly applied to the curved surface of the resin plate. The side shape of this product is designed to be flat while also accommodating the coating operation on the flat side of the resin plate. This design can effectively avoid uneven application of AB glue due to human factors during the coating process, resulting in localized wafer drop during slicing and when using an automatic cleaning machine with a suspended operation, effectively ensuring product yield and significantly helping actual production.
[0016] The adhesive coating plate used in the bonding of silicon single crystal rods and resin plates of this invention has the characteristics of simple structure and convenient operation. It can effectively avoid product loss caused by uneven adhesive coating during single crystal bonding, which leads to wafer drop after cutting and improves production safety.
Claims
1. A coating plate used for bonding silicon single crystal rods and resin plates, characterized in that, The coating board includes a main body and a coating board head connected to the front end of the main body. The coating board head has two sides and an arcuate surface connected to the front end of the two sides. The two sides are flat, and the arcuate surface has the same curvature as the arcuate surface of the resin board.
2. The adhesive-coated plate used for bonding silicon single crystal rods and resin plates according to claim 1, characterized in that, The main body is rectangular in shape.
3. The adhesive-coated plate used for bonding silicon single crystal rods and resin plates according to claim 1 or 2, characterized in that, The coated sheet is cut and processed from a single piece of acrylic sheet.
4. The adhesive-coated plate used for bonding silicon single crystal rods and resin plates according to claim 1 or 2, characterized in that, All edges of the coated board are chamfered.