A NAND screening fixture

Abstract

The utility model relates to a storage equipment technical field especially relates to a kind of NAND screening fixture, comprising: support and multiple PCBA;Multiple PCBA placement areas arranged by row and column are formed on support, a pair of guide slide rails is provided on the bottom plate of each PCBA placement area, guide rail slot is opened to the side surface of each guide slide rail towards another guide slide rail in the pair of guide slide rails;The guide rail slot of the guide slide rail in one PCBA placement area is mounted to the two sides of each PCBA, and PCBA can be relative to guide slide rail push-pull slidingly.The utility model can support the batch screening of NAND particles, and also can support the convenient, flexible, quick replacement of NAND particles to be screened set on NAND screening fixture.

Description

Technical Field

[0001] This utility model relates to the field of storage device technology, and in particular to a NAND screening fixture. Background Technology

[0002] Flash memory chips are typically categorized by their operating temperature range, such as standard-temperature flash memory chips, wide-temperature flash memory chips, and ultra-wide-temperature flash memory chips. For example, standard-temperature flash memory chips can operate in a temperature range of 0℃ to 70℃, while wide-temperature flash memory chips can operate in a temperature range of -45℃ to 80℃. Storage devices are generally classified into three categories: enterprise-grade, consumer-grade, and industrial-grade. Enterprise-grade and consumer-grade storage devices require standard-temperature flash memory chips, while industrial-grade storage devices require wide-temperature flash memory chips.

[0003] Flash memory manufacturers use the same materials, manufacturing processes, and technologies to produce flash memory chips. However, since different levels of storage devices require flash memory chips that can adapt to different operating temperatures, screening tests are needed to identify standard-temperature flash memory chips, wide-temperature flash memory chips, and ultra-wide-temperature flash memory chips from the flash memory chips produced by flash memory manufacturers.

[0004] To perform flash memory chip screening tests, a dedicated NAND screening fixture is typically required. However, the number of flash memory chips involved in the screening may range from hundreds to thousands. To support the screening of large numbers of flash memory chips, the NAND screening fixture needs to support batch screening and also allow for convenient, flexible, and quick replacement of the flash memory chips to be screened.

[0005] Therefore, how to enable NAND screening fixtures to support batch screening and to facilitate convenient, flexible and quick replacement of the flash memory chips to be screened set on the NAND screening fixture is a technical problem that urgently needs to be solved by those skilled in the art. Utility Model Content

[0006] This invention provides a NAND screening fixture that supports batch screening of NAND chips and allows for convenient, flexible, and quick replacement of the NAND chips to be screened on the NAND screening fixture.

[0007] To solve the above-mentioned technical problems, this utility model provides the following technical solution:

[0008] A NAND screening fixture includes: a support and multiple PCBAs; the support has multiple PCBA placement areas arranged in rows and columns for placing PCBAs, and each PCBA placement area has a pair of guide rails on its base plate, and each guide rail has a guide groove on its side facing the other guide rail in the pair; both sides of each PCBA are installed in the guide groove of the guide rail in a PCBA placement area, and the PCBA can slide relative to the guide rail.

[0009] In the NAND screening fixture described above, preferably, a first cutout area is provided on the base plate of each PCBA placement area; the size of the first cutout area on the base plate is smaller than the size of the PCBA, and when the PCBA is pushed to the designated position, the PCBA is located above the first cutout area on the base plate and will completely cover the first cutout area on the base plate.

[0010] In the NAND screening fixture described above, preferably, a second cutout area is provided on the top plate of the PCBA placement area at the top of the support, and the second cutout areas corresponding to each PCBA placement area in the top row are connected to form a hole.

[0011] In the NAND screening fixture described above, preferably, the side plate of the bracket has multiple air duct openings that penetrate the side plate, and each air duct opening connects to a row of PCBA placement areas.

[0012] In the NAND screening fixture described above, preferably, multiple PCBA placement areas located in the same row are interconnected, and external cold air flows into each row of PCBA placement areas through each air duct and flows and is transmitted within each row of PCBA placement areas.

[0013] In the NAND screening fixture described above, preferably, the cold air flowing in each row of PCBA placement area flows over the lower surface of the PCBA located above that row and the upper surface of the PCBA located in that row.

[0014] In the NAND screening fixture described above, preferably, a fan mounting frame is provided at each air duct opening on the side plate, and the fan is mounted on the fan mounting frame.

[0015] In the NAND screening fixture described above, preferably, the fan placement frame is located near the rear side of the support at the air duct opening, and the fan placement frame is opposite to the control component on the PCBA when pushed to the designated position.

[0016] In the NAND screening fixture described above, preferably, each air duct opening has two regions that extend both upwards and downwards, one of which extends both upwards and downwards near the front side of the bracket, and the other extends both upwards and downwards near the rear side of the bracket, with the fan placement frame located in the region extending both upwards and downwards near the rear side of the bracket.

[0017] In the NAND screening fixture described above, preferably, an adapter plate is provided on the rear side of the bracket, and multiple connectors are provided on the adapter plate. Each connector corresponds to a PCBA placement area, and the connectors are connected to the traces connected to the PCBA.

[0018] In the NAND screening fixture described above, preferably, the rear end of the guide rail is provided with a push stop to prevent the PCBA from sliding out of the guide rail groove during the process of pushing the PCBA into the PCB placement area, and the front end of the guide rail is provided with a pull-out stop to prevent the PCBA from sliding out of the guide rail groove during the process of pulling the PCBA out of the PCB placement area; wherein, the push stop is the maximum position that the PCBA can be pushed into when pushed on the guide rail groove, and the pull-out stop is the maximum position that the PCBA can be pulled out of when pulled out of the guide rail groove.

[0019] In the NAND screening fixture described above, preferably, each guide rail has an insertion opening on its upper surface that connects to the guide rail groove, and the insertion openings on a pair of guide rails are positioned opposite each other; the left and right sides of the PCBA have outwardly protruding flaps at opposite positions, and the flaps on the left and right sides are inserted into the guide rail groove through the insertion openings of the guide rails on the left and right sides.

[0020] The NAND screening fixture described above preferably includes: a region for placing a control component and a plurality of regions for placing NAND chips; wherein the region for placing the control component is provided with a control component, each region for placing NAND chips places one NAND chip to be screened, and the control component is coupled to all NAND chips to be screened.

[0021] In the NAND screening fixture described above, preferably, the distance between the side of the wing on the PCBA closest to the NAND particle to be screened and the NAND particle to be screened closest to that side is greater than the distance between the guide rail pull-out stop and the front end of the guide rail.

[0022] The NAND screening fixture described above preferably includes at least two supports, wherein the bottom plate of the lowermost NAND placement area of ​​one support is fixedly connected to the top plate of the uppermost NAND placement area of ​​the other support to extend the NAND screening fixture.

[0023] A method for assembling a NAND screening fixture bracket and a PCBA, applicable to any of the aforementioned NAND screening fixtures, includes the following steps: mounting both sides of the PCBA into the guide rail grooves of a guide slide rail within a PCBA placement area; pushing the PCBA along the guide rail grooves into the PCBA placement area of ​​the bracket until the PCBA reaches the push stop at the rear end of the guide slide rail, and then stopping the pushing; connecting the power signal line group on the bracket to the power interface on the PCBA, and connecting the serial connector signal line group on the bracket to the serial connector on the PCBA.

[0024] A method for screening NAND flash memory, applied to the NAND screening fixture described in any of the above claims, includes the following steps: mounting NAND chips to be screened on a PCBA; assembling the PCBA with the NAND chips to be screened mounted to a support frame; placing the NAND screening fixture in a temperature chamber; and having the control components of the PCBA perform the NAND chip screening process under various ambient temperatures and record the screening results.

[0025] A method for replacing NAND flash memory, applied to the NAND screening fixture described in any of the above claims, includes the following steps: after the NAND chips on the PCBA have been screened, the PCBA is pulled out from the PCBA placement area of ​​the bracket along the guide rail groove of the guide rail until the PCBA is pulled out to the pull-out stop at the front end of the guide rail, and then the pulling is stopped; the screened NAND chips on the PCBA are removed, and new NAND chips to be screened are installed on the PCBA.

[0026] Compared with the above-mentioned background technology, the NAND screening fixture, its support and PCBA assembly method, and the NAND flash memory screening / replacement method provided by this utility model can support the batch screening of NAND chips, and can also support the convenient, flexible and quick replacement of the NAND chips to be screened set on the NAND screening fixture. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this utility model. For those skilled in the art, other drawings can be obtained based on these drawings.

[0028] Figure 1A The structure of the NAND screening fixture is shown;

[0029] Figure 1B A cross-sectional view of the NAND screening fixture is shown;

[0030] Figure 1CThe structure of the support frame was shown;

[0031] Figure 1D A side view of the bracket is shown;

[0032] Figure 1E The rear view of the bracket is shown;

[0033] Figure 1F A cross-sectional view of the guide rail is shown;

[0034] Figure 1G The structure of a single PCBA is shown;

[0035] Figure 1H The structure of the NAND test socket is shown;

[0036] Figure 2 A schematic diagram showing two NAND screening fixtures stacked together is provided.

[0037] Figure 3A A 3D view showing the initial state of the bracket and PCBA assembly;

[0038] Figure 3B A cross-sectional view showing the initial state of the bracket and PCBA assembly;

[0039] Figure 4A A 3D view showing the completed state of the bracket and PCBA assembly;

[0040] Figure 4B A cross-sectional view showing the completed state of the bracket and PCBA assembly;

[0041] Figure 5A A 3D view showing the PCBA being pulled out during NAND flash chip replacement;

[0042] Figure 5B This shows a cross-sectional view of the PCBA being pulled out during NAND flash chip replacement. Detailed Implementation

[0043] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0044] like Figure 1A and Figure 1B As shown, this utility model provides a NAND screening fixture, including: a bracket 10 and multiple PCBA (Printed Circuit Board Assembly) 20.

[0045] like Figure 1C As shown, multiple PCBA placement areas 101 are formed on the support 10. Each PCBA placement area 101 is a hollow rectangular cell, serving as space on the support 10 for placing PCBA 20. All PCBA placement areas 101 are arranged in rows and columns, that is, all PCBA placement areas are arranged in N rows and M columns. As an example, six PCBA placement areas 101 are formed on the support 10, and the six PCBA placement areas 101 are arranged in three rows and two columns. In addition, multiple PCBA placement areas 101 located in the same row are interconnected to facilitate the flow of cold air from each row of PCBA placement areas 101; multiple PCBA placement areas 101 located in the same column are aligned to ensure that all PCBA placement areas 101 are neatly arranged on the support 10.

[0046] Each PCBA placement area 101 includes a base plate 11 and a top plate 12, and the base plate 11 and top plate 12 of multiple PCBA placement areas 101 located in the same row are integrally formed. In adjacent rows of PCBA placement areas 101 arranged in relative positions, the base plate 11 of the upper PCBA placement area 101 and the top plate of the lower PCBA placement area 101 are the same plate. Furthermore, the height of each PCBA placement area 101 is greater than the height of the PCBA 20. In each PCBA placement area 101, the PCBA 20 is placed on the base plate 11, and an air duct is formed between the PCBA 20 and the top plate 12 to allow cool air flowing through the PCBA placement area 101 to be transported from left to right (e.g., ...). Figure 1A The red arrows indicate the direction of cold air flow in the duct as it passes through PCBA placement area 101.

[0047] Each PCBA placement area 101 has a cutout area 111 on its base plate 11. The cutout area 111 is a hole that penetrates the base plate 11 of the PCBA placement area 101. The cutout area 111 is located in the middle area of ​​the base plate 11, and its size is smaller than that of the PCBA 20. This ensures that the PCBA 20 can be placed on the base plate 11 of the PCBA placement area 101, preventing the PCBA 20 from falling from the cutout area 111 into another PCBA placement area 101 located below it. In each PCBA placement area 101, the PCBA 20 is placed above the cutout area 111. When the PCBA 20 is pushed to the bottom (e.g., pushed to...), the PCBA 20 will be placed in the cutout area 111. Figure 1F(As shown in the push stop position), the PCBA20 will completely cover the cutout area 111. By setting the cutout area 111 on the base plate 11 of the PCBA placement area 101, the weight of the bracket 10 can be reduced. At the same time, the cool air flowing in each row of PCBA placement area 101 can flow over the lower surface of the PCBA20 above the row and the upper surface of the PCBA20 in the row, thereby accelerating the heat dissipation of the PCBA20.

[0048] In the two adjacent rows of PCBA placement areas 101, the bottom plate 11 of the upper PCBA placement area 101 and the top plate of the lower PCBA placement area 101 are the same plate. The top plate 12 of the uppermost row of PCBA placement areas 101 does not serve as the bottom plate 11 of any PCBA placement area 101. The top plate 12 of the uppermost row of PCBA placement areas 101 also has a cutout area 121, and the cutout areas 121 corresponding to each PCBA placement area 101 are interconnected, forming a hole in the top plate 12 of the uppermost row of PCBA placement areas 101. The cutout area 121 is located in the middle area of ​​the top plate 12, and the size of the cutout area 121 on the top plate 12 is equal to the size of the cutout area 111 on the bottom plate 11. By providing a hollowed-out area 121 on the top plate 12 of the uppermost PCBA placement area 101, the weight of the support 10 can be reduced. When two NAND screening fixtures are used in a stacked manner, the cold air flowing through the uppermost row of PCBA placement areas 101 of the lower NAND screening fixture can flow through the lower surface of the PCBA 20 placed in the lowermost row of PCBA placement areas 101 of the upper NAND screening fixture, which is conducive to heat dissipation of PCBA 20 when two NAND screening fixtures are used in a stacked manner.

[0049] like Figure 1C and Figure 1D As shown, the side plate 13 of the bracket 10 has multiple air ducts 131 that pass through the side plate 13, and each air duct 131 connects to a row of PCBA placement areas 101, so that external cold air flows into each PCBA placement area 101 through the air ducts 131 and flows and is transmitted within each row of PCBA placement areas 101 to dissipate heat from the PCBA 20 placed in the PCBA placement area 101. Optionally, all the air ducts 131 on one side of the bracket 10 extend horizontally and are arranged parallel to each other, so that each air duct 131 occupies a larger area, which is conducive to more cold air being introduced into the PCBA placement area 101. Alternatively, the left and right side plates 13 of the bracket 10 are identical in shape, structure, and size, so that the left and right side plates 13 of the bracket 10 can be interchanged, reducing the number of parts of the bracket 10 and reducing the processing cost of the bracket 10.

[0050] Optionally, a fan mounting frame 14 is provided at each air duct opening 131 of the side plate 13, and a fan is mounted on the fan mounting frame 14 to input cold air into each row of PCBA placement areas 101, thereby enhancing the intensity of the cold air flowing within the PCBA placement areas 101. The edge of the fan mounting frame 14 is fixed to the outer surface of the side plate 13, and the central through-hole of the fan mounting frame 14 corresponds to the air duct opening 131, so that the fan mounted on the fan mounting frame 14 blows cold air into the PCBA placement area 101. Alternatively, the fan mounting frame 14 is positioned near the rear side of the bracket 10 at the air duct opening 131, and the fan mounting frame 14 is opposite to the control components on the PCBA 20 when pushed all the way down, thereby enhancing the intensity of the cold air flowing through the control components on the PCBA 20.

[0051] Optionally, each air duct opening 131 has two areas that extend both upwards and downwards. One area extends both upwards and downwards near the front of the bracket 10, and the other area extends both upwards and downwards near the rear of the bracket 10, so that the shape, structure, and size of the left and right side plates 13 of the bracket 10 are completely identical. Alternatively, a fan mounting frame 14 is positioned in the area extending both upwards and downwards near the rear of the bracket 10, with the through-hole portion of the fan mounting frame 14 opposite to the area extending both upwards and downwards, thereby preventing obstruction of cold air entering the PCBA placement area 101.

[0052] Optionally, such as Figure 1B and Figure 1EAs shown, an adapter plate 15 is provided on the rear side of the bracket 10, and multiple connectors 151 are provided on the adapter plate 15. Each connector 151 corresponds to a PCBA placement area 101, that is, one connector 151 corresponds to one PCBA placement area 101. The connector 151 is connected to the traces 16 connected to the PCBA 20, and is used to provide power signals and serial connector signals provided by the outside (e.g., a temperature chamber) to the traces 16 connected to the PCBA 20 in the corresponding PCBA placement area 101. The traces 16 include: a power signal line group 161 and a serial connector signal line group 162. The power signal line group 161 is used to transmit power signals, and the serial connector signal line group 162 is used to transmit serial connector signals, such as control signals. Optionally, the adapter board 15 corresponds to two adjacent columns of PCBA placement areas 101, and the adapter board 15 is provided with connectors 151 that correspond one-to-one with each row of PCBA placement areas 101 in these two columns. That is, the left half of an adapter board 15 corresponds to the PCBA placement area 101 in the left column, and the right half of the adapter board 15 has connectors 151 that correspond one-to-one with each row of PCBA placement areas 101 in the right column.

[0053] Optionally, such as Figure 1C and Figure 1F As shown, each PCBA placement area 101 has a pair of opposing guide rails 17 on its base plate 11. Each guide rail 17 has a guide groove 171 on its side facing the other guide rail 17 in the pair, so that after the left and right sides of the PCBA 20 are installed into the guide groove 171, the PCBA 20 can slide on each pair of guide rails 17. Optionally, in two adjacent PCBA placement areas 101 in the same row, the two guide rails 17 that are close together are a single integral structure, that is, the two guide rails 17 that are back to back are a single unit.

[0054] To prevent the PCBA20 from detaching from both ends of the guide rail 17 during pushing, pulling, and sliding, a push stop 172 is provided at the rear end of the guide rail 17 to prevent the PCBA20 from detaching from the guide rail groove 171 near the rear end. A pull-out stop 173 is provided at the front end of the guide rail 17 to prevent the PCBA20 from detaching from the guide rail groove 171 near the front end. The push stop 172 represents the maximum position the PCBA20 can be pushed into when pushed within the guide rail groove 171, and the pull-out stop 173 represents the maximum position the PCBA20 can be pulled out of the guide rail groove 171. In this invention, "rear" refers to the side of the bracket 10 where the adapter plate 15 is located, i.e., the direction in which the PCBA20 is pushed into the NAND placement area 101; "front" refers to the side of the bracket 10 away from the adapter plate 15, i.e., the direction in which the PCBA20 is pulled out of the NAND placement area 101. Optionally, the push stop 172 refers to the maximum position that the PCBA20 can be pushed into when pushed within the guide rail groove 171. For example, the push stop 172 is the junction of the rear end of the guide rail 17 with the guide rail groove 171 and the part without the guide rail groove 171. The pull-out stop 173 refers to the maximum position that the PCBA20 can be pulled out when pulled out within the guide rail groove 171. For example, the pull-out stop 173 is the junction of the front end of the guide rail 17 with the guide rail groove 171 and the part without the guide rail groove 171.

[0055] To accommodate the PCBA20 within the guide rail slots 171, each guide rail 17 has an insertion opening 174 on its upper surface that connects to the guide rail slot 171. The insertion openings 174 on a pair of opposing guide rails 17 are also positioned opposite each other. This allows the PCBA20 to be inserted into the guide rail slots 171 simultaneously from the two opposing insertion openings 174 on the pair of guide rails 17. Optionally, the insertion opening 174 is located slightly towards the rear end of the upper surface of the guide rail 17 to facilitate the insertion of the PCBA20 into the guide rail slots 171.

[0056] like Figure 1B and Figure 1G As shown, PCBA20 includes: a region 21 for placing control components and a region 22 for placing NAND chips; wherein, the region 21 for placing control components is provided with a control component 211, the region 22 for placing NAND chips is provided with a plurality of NAND chips 221 to be screened, and the control component 211 is coupled to all the NAND chips 221 to be screened.

[0057] To facilitate pushing and pulling the PCBA20 within the guide rail groove 171 of the guide slide rail 17, a handle 23 is provided on the front side of the PCBA20. This handle allows the PCBA20 to be pushed into or pulled out of the PCBA placement area 101 by gripping the handle 23. Optionally, the handle 23 is located in the middle of the front side of the PCBA20 to avoid interference with adjacent components when gripping the handle 23. A gold finger 24 is provided on the rear side of the PCBA20. The gold finger 24 connects to the control component 211, providing a data transmission interface for the control component 211.

[0058] Additionally, the PCBA20 has outwardly protruding flaps 25 on its left and right sides, respectively. When inserting the PCBA20 into the guide rail grooves 171, the flaps 25 on both sides are first inserted into the guide rail grooves 171 of the guide rails 17 through the insertion openings 174 on both sides. Then, both sides of the entire PCBA20 are inserted into the guide rail grooves 171 of the guide rails 17, allowing the PCBA20 to move in a push-pull motion relative to the guide rails 17. Optionally, the flaps 25 on the left and right sides are located near the rear side of the PCBA20 to facilitate insertion of the PCBA20 into the guide rail grooves 17.

[0059] Furthermore, the distance between the front side of the fin 25 on the PCBA20 and the nearest NAND chip 221 to be screened (e.g., ...) Figure 1G As shown in a), it is greater than the distance between the pull-out stop 173 on the guide rail 17 and the front end of the guide rail 17 (e.g., Figure 1F As shown in b), when the PCBA20 is pulled out of the guide rail groove 171 of the guide rail 17, the area 22 on the PCBA20 where the NAND chip is placed can be completely pulled out of the guide rail 17 to facilitate the replacement of the NAND chip.

[0060] In addition, PCBA20 is provided with a power interface 26 and a serial port connector 27; the power interface 26 is connected to the power signal line group 161 for transmitting power signals, and is also connected to the control unit 211 and all NAND chips 221 to be screened, so as to provide power signals to the control unit 211 and all NAND chips 221 to be screened; the serial port connector 27 is connected to the serial port connector signal line group 162 for transmitting serial port connector signals, and is also connected to the control unit 211, so as to provide serial port connector signals, such as control signals, to the control unit 211.

[0061] Figure 1B As shown, the NAND chips 221 to be screened are mounted to the corresponding positions in the area 22 where NAND chips are placed via the NAND test socket 28. For example, Figure 1H As shown, the NAND test socket 28 includes a NAND chip mounting base 281 and pins 282 located below it. The NAND chip mounting base 281 is connected to the pins 282. The pins 282 are inserted into the area 22 where NAND chips are placed, thereby placing the NAND chip 221 to be screened in the NAND chip placement area 22 of the PCBA 20. The NAND chip can be replaced by installing or removing the NAND chip from the NAND chip mounting base 281 of the NAND test socket 28, making the replacement of NAND chips convenient and quick.

[0062] Optionally, such as Figure 2 As shown, the NAND screening fixture supports an extended stacking function. Two or more NAND screening fixtures can be stacked together and then fixedly connected together, thereby combining two or more NAND screening fixtures into a larger NAND screening fixture for use, which can increase the number of NAND chips that the NAND screening fixture can screen.

[0063] Specifically, the bottom plate 11 of the lowest row of PCBA placement areas 101 on the support 10 of the upper NAND screening fixture is fixedly connected to the top plate 12 of the uppermost row of PCBA placement areas 101 on the support 10 of the lower NAND screening fixture, thereby extending and stacking two or more NAND screening fixtures together to form a NAND screening fixture capable of screening more NAND chips. Optionally, both the bottom plate 11 and the top plate 12 are rectangular flat plates to facilitate the stacking of two or more NAND screening fixtures.

[0064] Assembly process of bracket 10 and PCBA20:

[0065] 1. Install both sides of PCBA20 into the guide rail groove 171 of the guide rail 17 in the PCBA placement area 101;

[0066] like Figure 3A and 3B As shown, the wing 25 on PCBA20 is placed into the assembly opening 174 of the guide rail 17 of the bracket 10. The position and shape after placement are shown in the figure. Figure 3A and Figure 3B The part within the red oval frame.

[0067] 2. Push the PCBA along the guide rail groove into the PCBA placement area of ​​the bracket until the PCBA is pushed to the push stop at the rear end of the guide rail, then stop pushing.

[0068] like Figure 4A and 4BAs shown, hold the handle 23 on PCBA20 and push it along the direction of propulsion (e.g., Figure 4A (In the direction indicated by the red arrow) Push PCBA20 along the guide rail groove of guide rail 17 into the PCBA placement area 101 of bracket 10. When the wing 25 on PCBA20 is pushed to the push stop position 172, stop pushing PCBA20.

[0069] 3. Connect the power signal cable group on the bracket to the power interface on the PCBA, and connect the serial port connector signal cable group on the bracket to the serial port connector on the PCBA.

[0070] After pushing PCBA20 to the push stop position 172, connect the power signal line group on bracket 10 to the power interface on PCBA20, and connect the serial port connector signal line group on bracket 10 to the serial port connector on PCBA20.

[0071] The screening process for NAND chips to be screened:

[0072] 1. Install the NAND flash memory chips to be screened on PCBA20.

[0073] 2. Assemble the PCBA20 containing the NAND chips to be screened with the bracket 10. Place the NAND screening fixture, including the bracket 10 and multiple PCBA20s, into the temperature chamber. The temperature chamber provides multiple working ambient temperatures. The control components of the PCBA20 perform the NAND chip screening process under multiple ambient temperatures and record the screening results.

[0074] After a set of NAND chips to be screened on PCBA20 has been screened, the NAND chips already screened on PCBA20 in the NAND screening fixture can be replaced with new NAND chips to be screened.

[0075] NAND chip replacement:

[0076] 1. After the NAND chips on the PCBA are screened, the PCBA is pulled out from the PCBA placement area of ​​the bracket along the guide rail groove until the PCBA is pulled out to the pull-out stop at the front end of the guide rail, at which point the pulling out stops.

[0077] After screening a group of NAND chips on PCBA20, hold handle 23 on PCBA20 and follow... Figure 5A and Figure 5BThe red arrow indicates that the PCBA20 is pulled out of the PCBA placement area of ​​the bracket 10 along the guide rail groove of the guide rail 17. When the wing 25 on the PCBA20 is pulled to the pull-out stop 173, the pull-out of the PCBA20 is stopped. At this time, the area 221 on the PCBA20 where the NAND chip is placed is completely pulled out to the outside of the PCBA placement area.

[0078] 2. Remove the screened NAND chips from PCBA20 and install new NAND chips to be screened in the area where NAND chips are placed on PCBA20.

[0079] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0080] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A NAND screening fixture, characterized in that, include: Support and multiple PCBAs; The support has multiple PCBA placement areas arranged in rows and columns for placing PCBAs. Each PCBA placement area has a pair of guide rails on its base plate. Each guide rail has a guide groove on its side facing the other guide rail in the pair. Each PCBA is mounted on both sides in the guide rail groove of a guide rail within the PCBA placement area, and the PCBA can be pushed and pulled relative to the guide rail.

2. The NAND screening fixture according to claim 1, characterized in that, Each PCBA placement area has a first cutout area on its base plate; The size of the first cutout area on the base plate is smaller than the size of the PCBA. When the PCBA is pushed to the designated position, the PCBA is located above the first cutout area on the base plate and will completely cover the first cutout area on the base plate.

3. The NAND screening fixture according to any one of claims 1 or 2, characterized in that, A second cutout area is provided on the top plate of the PCBA placement area at the top of the bracket, and the second cutout areas corresponding to each PCBA placement area in the top row are connected to form a hole.

4. The NAND screening fixture according to claim 1 or 2, characterized in that, The side panel of the bracket has multiple air duct openings that pass through the side panel, and each air duct opening connects to a row of PCBA placement areas.

5. The NAND screening fixture according to claim 4, characterized in that, Multiple PCBA placement areas located in the same row are interconnected.

6. The NAND screening fixture according to claim 4, characterized in that, A fan mounting frame is provided at each air duct opening on the side panel, and the fan is installed on the fan mounting frame.

7. The NAND screening fixture according to claim 6, characterized in that, The fan mounting frame is positioned near the rear of the bracket at the air duct opening, and the fan mounting frame is opposite to the control components on the PCBA when pushed to the designated position.

8. The NAND screening fixture according to claim 1 or 2, characterized in that, The rear end of the guide rail is equipped with a push stop to prevent the PCBA from sliding out of the guide rail groove during the process of pushing the PCBA into the PCB placement area. The front end of the guide rail is equipped with a pull-out stop to prevent the PCBA from sliding out of the guide rail groove during the process of pulling the PCBA out of the PCB placement area. Among them, the push stop is the maximum position that the PCBA can be pushed into when it is pushed on the guide rail groove, and the pull-out stop is the maximum position that the PCBA can be pulled out when it is pulled out of the guide rail groove.

9. The NAND screening fixture according to claim 8, characterized in that, Each guide rail has an insertion opening on its upper surface that connects to the guide rail groove, and the insertion openings on a pair of guide rails are positioned opposite each other. The PCBA has outwardly protruding winglets on opposite sides, and the winglets on the left and right sides are inserted into the guide rail grooves through the insertion openings of the guide rails on the left and right sides.

10. The NAND screening fixture according to claim 1 or 2, characterized in that, It includes at least two supports, wherein the bottom plate of the lowermost NAND placement area of ​​one support is fixedly connected to the top plate of the uppermost NAND placement area of ​​the other support to extend the NAND screening fixture.

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