A silicon wafer rejection device

Abstract

The utility model relates to the field of silicon wafer defective removing device, especially to a silicon wafer defective removing device. Including mounting frame and mounting structure, the inner wall fixed connection of mounting frame has two link plates, the upper surface of mounting frame is installed with mounting plate by mounting structure, the upper surface of mounting plate is installed with straight line cylinder, the surface fixed connection of mounting frame has fixed frame, the upper surface of fixed frame is installed with link track and detection device, the side away from fixed frame of link plate all is installed with removing transition track. The utility model provides a silicon wafer defective removing device solves in the process of using to silicon wafer defective removing device, will appear because of the size difference of silicon wafer or the existence gap of track junction, and leads to the situation that defective silicon wafer occurs in the transfer process and is offset, and is stuck or is overturned, further leads to the falling of silicon wafer from the track and causes the shortcoming of secondary fragment and the further decline of reliability.

Description

Technical Field

[0001] This utility model relates to the field of silicon wafer defect rejection devices, and more particularly to a silicon wafer defect rejection device. Background Technology

[0002] A silicon wafer defect rejection device is a type of equipment used in the semiconductor manufacturing process to screen, inspect, and reject defective silicon wafers. These devices are typically used after wafer dicing, cleaning, and surface inspection in the silicon wafer production process. They are responsible for identifying and rejecting silicon wafers with surface defects, cracks, contamination, or other non-compliance with quality requirements. Such devices are quite common in existing technologies.

[0003] Existing technologies, such as the utility model patent with publication number CN221551838U, disclose a defective wafer rejection device. This patent employs multiple rollers spaced apart along its conveying direction. Each roller can carry at least two silicon wafers arranged axially along its roller. At least part of a detection device is located above the carrying conveyor to detect the at least two silicon wafers arranged axially along the roller. An adsorption conveyor is located downstream of the carrying conveyor and is positioned higher than the carrying conveyor, forming a defective wafer outlet between the carrying conveyor and the adsorption conveyor. The defective wafer rejection device of this utility model conveys silicon wafers to the detection device via multiple rollers for inspection. Each roller can carry at least two silicon wafers arranged axially along its roller, thus improving the detection efficiency. Simultaneously, an adsorption conveyor transfers good silicon wafers from the multiple rollers, and defective wafers are discharged from the defective wafer outlet, thereby achieving defective wafer rejection.

[0004] In the existing technology, during the use of silicon wafer defect rejection devices, defective silicon wafers may be misaligned, jammed, or overturned during the transfer process due to differences in silicon wafer size or gaps at the track connection. This can lead to the silicon wafers falling from the track, causing secondary fragmentation and further reducing reliability. Utility Model Content

[0005] The purpose of this invention is to address the shortcomings of existing technologies, such as the occurrence of defective silicon wafers shifting, getting stuck, or tipping over during the transfer process due to differences in silicon wafer size or gaps at the track connections, which in turn cause the silicon wafers to fall from the tracks, resulting in secondary fragmentation and further reduction in reliability. Therefore, this invention proposes a defective silicon wafer rejection device.

[0006] To solve the above-mentioned technical problems, this utility model provides a silicon wafer defect rejection device, comprising: a mounting frame and a mounting structure. Two connecting plates are fixedly connected to the inner wall of the mounting frame. A mounting plate is mounted on the upper surface of the mounting frame via the mounting structure. A linear cylinder is mounted on the upper surface of the mounting plate. A fixing frame is fixedly connected to the surface of the mounting frame. A connecting rail and a detection device are mounted on the upper surface of the fixing frame. Rejection transition rails are mounted on the side of the connecting plate away from the fixing frame. A rejection pre-rail is mounted inside the connecting rail. The rejection pre-rail is fixedly connected to the output end of the linear cylinder. A limiting structure is provided on the surface of the rejection pre-rail. The limiting structure includes four positioning posts and a fixing plate. The four positioning posts are fixedly connected to the rejection pre-rail, and the fixing plate is fixedly connected to the rejection pre-rail. An adjusting plate is slidably connected to the surfaces of the two positioning columns. A limit plate is fixedly connected to the upper surface of the adjusting plate, and an adjusting frame is fixedly connected to the lower surface of the adjusting plate. An inclined plate is rotatably connected to the inner wall of the adjusting frame, and a lead screw is rotatably connected to the inner wall of the fixed plate. An auxiliary plate is threadedly connected to the arc surface of the lead screw, and the auxiliary plate is rotatably connected to the two inclined plates. A first toothed ring is fixedly connected to the arc surface of the lead screw, and a toothed belt is drivenly connected to the surface of the first toothed ring. A protective cover is fixedly connected to the side of the fixed plate away from the front track. A motor is fixedly connected to the inner wall of the protective cover, and a drag cable is installed on the side of the motor away from the fixed plate. The arc surface of the motor output end is rotatably connected to the fixed plate, and a second toothed ring is fixedly connected to the arc surface of the motor output end. The second toothed ring is drivenly connected to the toothed belt.

[0007] The effect achieved by the above-mentioned components is as follows: when defective silicon wafers need to be rejected by the defect rejection device, the two limiting plates can be moved closer to each other by starting the motor until the distance between the two limiting plates matches the size of the defective silicon wafer. This can prevent the defective silicon wafer from shifting during the transition to the rejection transition track and falling between the two rejection transition tracks, thereby further reducing the probability of secondary fragmentation and improving the stability, reliability and overall operating efficiency of the defect rejection device.

[0008] Preferably, the inner wall of the auxiliary plate is slidably connected to two limiting rods, and the two limiting rods are fixedly connected to the fixed plate.

[0009] The effect achieved by the above components is that the limiting rod can limit the auxiliary plate and improve the stability of the auxiliary plate during movement.

[0010] Preferably, the inner wall of the protective cover is provided with a plurality of heat dissipation holes, which are evenly distributed on the arc surface of the protective cover.

[0011] The effect achieved by the above components is that the heat dissipation holes can help the motor dissipate heat, which helps to extend the service life of the motor.

[0012] Preferably, the inclined plate is a stainless steel plate, and the cross-section of the inclined plate is rectangular.

[0013] The effect achieved by the above components is that the stainless steel plate has high strength and good wear resistance, which can prevent the inclined plate from deforming during short-term use.

[0014] Preferably, the upper surface of the mounting plate is provided with a mounting structure, which includes two positioning grooves, two fixing blocks, and two mounting columns. The two positioning grooves are both formed on the mounting plate, the two fixing blocks are fixedly connected to the mounting plate, and the two mounting columns are fixedly connected to the mounting plate. A positioning plate is slidably connected to the inner wall of each positioning groove, and the two positioning plates are fixedly connected to the mounting bracket. A slot is formed on the inner wall of each positioning plate. Telescopic rods are fixedly connected to both sides of each fixing block. The four telescopic rods are grouped in pairs, and a locking plate is fixedly connected to the output end of each group of telescopic rods. The locking plate is slidably connected to the slot, and a limiting groove is formed on the inner wall of the locking plate. The limiting groove is slidably connected to the mounting column. A spring is fitted onto the arc surface of each telescopic rod, and both ends of the spring are fixedly connected to the fixing block and the locking plate, respectively.

[0015] The effect achieved by the above components is as follows: when personnel need to fix the mounting plate on the mounting frame, they can move the mounting plate until the positioning plate slides into the inner wall of the positioning groove. At this time, the spring rebounds and moves the clamping plate closer to the clamping groove until the clamping plate slides into the inner wall of the clamping groove. This allows personnel to quickly fix the mounting plate and improves the installation efficiency.

[0016] Preferably, a guide strip is fixedly connected to the upper surface of the positioning plate.

[0017] The effect achieved by the above components is that the guide strip can guide the positioning plate, making it easy for personnel to slide the positioning plate into the inner wall of the positioning groove.

[0018] Preferably, the arc surface of the spring is fitted with a bellows, and the two ends of the bellows are fixedly connected to the fixing block and the clamping plate, respectively.

[0019] The effect achieved by the above components is that the bellows can protect the spring and prevent the spring from coming into direct contact with other materials.

[0020] Compared with related technologies, the silicon wafer defect rejection device provided by this utility model has the following beneficial effects: This utility model provides a silicon wafer defect rejection device. By setting a limiting structure, when a defective silicon wafer needs to be rejected by the defect rejection device, the limiting structure can limit the defective silicon wafer, which can prevent the defective silicon wafer from shifting during the transition to the rejection transition track and falling between the two rejection transition tracks. This further reduces the probability of secondary fragmentation and improves the stability, reliability and overall operation efficiency of the defect rejection device.

[0021] By setting up an installation structure, when personnel need to fix the mounting plate to the mounting frame, the installation structure can facilitate quick and easy fixing of the mounting plate, thereby speeding up the fixing process and improving installation efficiency. Attached Figure Description

[0022] Figure 1 A schematic diagram of the structure of a defective silicon wafer rejection device provided by this utility model; Figure 2 for Figure 1 The diagram shows the structure of the limiting structure. Figure 3 for Figure 2 A schematic diagram of the enlarged structure at point A is shown. Figure 4 for Figure 1 The diagram shows the structural design of the installation structure. Figure 5 for Figure 4 The diagram shows a partial structural schematic.

[0023] Numbered in the diagram: 1. Mounting bracket; 2. Detection device; 3. Limiting structure; 301. Positioning post; 302. Fixing plate; 303. Limiting rod; 304. First toothed ring; 305. Second toothed ring; 306. Toothed belt; 307. Motor; 308. Protective cover; 309. Heat dissipation hole; 310. Lead screw; 311. Adjusting plate; 312. Limiting plate; 313. Adjusting bracket; 314. Inclined plate; 315. Auxiliary plate; 4 1. Installation structure; 401. Spring; 402. Positioning plate; 403. Positioning groove; 404. Guide bar; 405. Limiting groove; 406. Fixing block; 407. Corrugated pipe; 408. Slot; 409. Clamping plate; 410. Telescopic rod; 411. Mounting column; 5. Transition rail to be removed; 6. Front rail to be removed; 7. Connecting rail; 8. Linear cylinder; 9. Mounting plate; 10. Fixing bracket; 11. Connecting plate. Detailed Implementation

[0024] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0025] The specific implementation of this utility model will be described in detail below with reference to specific embodiments.

[0026] Please see Figure 1 This utility model provides a silicon wafer defect rejection device, comprising: a mounting frame 1 and a mounting structure 4. Two connecting plates 11 are fixedly connected to the inner wall of the mounting frame 1. A mounting plate 9 is mounted on the upper surface of the mounting frame 1 via the mounting structure 4. A linear cylinder 8 is mounted on the upper surface of the mounting plate 9. A fixing frame 10 is fixedly connected to the surface of the mounting frame 1. A connecting rail 7 and a detection device 2 are mounted on the upper surface of the fixing frame 10. A rejection transition rail 5 is mounted on the side of the connecting plate 11 away from the fixing frame 10. A rejection pre-rail 6 is mounted inside the connecting rail 7. The rejection pre-rail 6 is fixedly connected to the output end of the linear cylinder 8. A limiting structure 3 is provided on the surface of the rejection pre-rail 6. The mounting structure 4 is provided on the upper surface of the mounting plate 9.

[0027] In the embodiments of this utility model, please refer to Figure 2 and Figure 3The limiting structure 3 includes four positioning posts 301 and a fixing plate 302. The four positioning posts 301 are fixedly connected to the front removal track 6, and the fixing plate 302 is fixedly connected to the front removal track 6. Adjusting plates 311 are slidably connected to the surfaces of two positioning posts 301. A limiting plate 312 is fixedly connected to the upper surface of the adjusting plate 311, and an adjusting frame 313 is fixedly connected to the lower surface of the adjusting plate 311. An inclined plate 314 is rotatably connected to the inner wall of the adjusting frame 313. A lead screw 310 is rotatably connected to the inner wall of the fixing plate 302. An auxiliary plate 315 is threadedly connected to the arc surface of the lead screw 310. The screw 310 is rotatably connected to two inclined plates 314. A first toothed ring 304 is fixedly connected to the arc surface of the lead screw 310. A toothed belt 306 is drivenly connected to the surface of the first toothed ring 304. A protective cover 308 is fixedly connected to the side of the fixed plate 302 away from the front track 6. A motor 307 is fixedly connected to the inner wall of the protective cover 308. A drag cable is installed on the side of the motor 307 away from the fixed plate 302. The arc surface of the output end of the motor 307 is rotatably connected to the fixed plate 302. A second toothed ring 305 is fixedly connected to the arc surface of the output end of the motor 307. The second toothed ring 305 is drivenly connected to the toothed belt 306. When defective silicon wafers need to be rejected by the defective rejection device, the motor 307 can be started to move the two limiting plates 312 closer to each other until the distance between the two limiting plates 312 matches the size of the defective silicon wafer. This prevents the defective silicon wafer from shifting during the transition to the rejection transition track 5 and falling between the two rejection transition tracks 5, thereby further reducing the probability of secondary fragmentation and improving the stability, reliability and overall operating efficiency of the defective rejection device. The inner wall of the auxiliary plate 315 is slidably connected to two limiting rods 303, which are fixedly connected to the fixed plate 302. The limiting rods 303 can limit the auxiliary plate 315 and improve the stability of the auxiliary plate 315 during movement. The inner wall of the protective cover 308 is provided with several heat dissipation holes 309, which are evenly distributed on the arc surface of the protective cover 308. The heat dissipation holes 309 help dissipate heat from the motor 307, which helps extend the service life of the motor 307. The inclined plate 314 is made of stainless steel and has a rectangular cross-section. Stainless steel has high strength and good wear resistance, which can prevent the inclined plate 314 from deforming during short-term use. In the embodiments of this utility model, please refer to Figure 4 and Figure 5The installation structure 4 includes two positioning grooves 403, two fixing blocks 406, and two mounting columns 411. The two positioning grooves 403 are both opened on the mounting plate 9. The two fixing blocks 406 are fixedly connected to the mounting plate 9. The two mounting columns 411 are fixedly connected to the mounting plate 9. The inner wall of the positioning groove 403 is slidably connected to a positioning plate 402. The two positioning plates 402 are fixedly connected to the mounting bracket 1. The inner wall of the positioning plate 402 is provided with a slot 408. The two sides of the fixing blocks 406 are fixedly connected to telescopic rods 410. The four telescopic rods 410 are in pairs. The output end of one group of telescopic rods 410 is fixedly connected to a locking plate 409. The locking plate 409 is slidably connected to the slot 408. The inner wall of the locking plate 409 is provided with a limiting groove 405. The limiting groove 405 is slidably connected to the mounting column 411. The arc surface of the telescopic rod 410 is fitted with a spring 401. The two ends of the spring 401 are fixedly connected to the fixing block 406 and the locking plate 409, respectively. When personnel need to fix the mounting plate 9 to the mounting bracket 1, they can move the mounting plate 9 until the positioning plate 402 slides into the inner wall of the positioning groove 403. At this time, the spring 401 rebounds, causing the clamping plate 409 to move closer to the clamping groove 408 until it slides into the inner wall of the clamping groove 408. This allows personnel to quickly and easily fix the mounting plate 9, improving installation efficiency. A guide strip 404 is fixedly connected to the upper surface of the positioning plate 402. The guide strip 404 guides the positioning plate 402, making it easy for personnel to slide it into the inner wall of the positioning groove 403. A corrugated tube 407 is fitted onto the arc surface of the spring 401. The two ends of the corrugated tube 407 are fixedly connected to the fixing block 406 and the clamping plate 409, respectively. The corrugated tube 407 protects the spring 401, preventing it from directly contacting other materials. The working principle of the silicon wafer defect rejection device provided by this utility model is as follows: When rejecting defective silicon wafers by the defect rejection device, the operator can first start the motor 307. The output end of the motor 307 drives the second gear ring 305 to rotate. The second gear ring 305 drives the toothed belt 306 for transmission. The toothed belt 306 drives the first gear ring 304 to rotate. The first gear ring 304 drives the lead screw 310 to rotate. The lead screw 310 drives the auxiliary plate 315 to move closer to the fixed plate 302. The auxiliary plate 315 drives the two inclined plates 314. One end of the auxiliary plate 315 moves towards the fixed plate 302, and the auxiliary plate 315 slides on the arc surface of the two limiting rods 303. The limiting rods 303 can limit the auxiliary plate 315, which can improve the stability of the auxiliary plate 315 during movement. Then, the inclined plate 314 will drive the adjusting frame 313 to move away from the fixed plate 302. The inclined plate 314 is made of stainless steel plate. Stainless steel plate has high strength and good wear resistance, which can prevent the inclined plate 314 from deforming during short-term use. Then, the adjusting frame 313 drives the adjusting... The adjusting plate 311 moves away from the fixed plate 302, and the adjusting plate 311 drives the limiting plate 312 to move away from the fixed plate 302 until the distance between the two limiting plates 312 matches the size of the silicon wafer. The heat dissipation holes 309 on the inner wall of the protective cover 308 assist the motor 307 in heat dissipation, helping to extend the service life of the motor 307. Then, the silicon wafer is first inspected by the detection device 2 to determine if it is qualified. When a defective silicon wafer is detected, the linear cylinder 8 is activated. The output end of cylinder 8 retracts, and then the output end of linear cylinder 8 drives the rejection front track 6 to rotate. The rejection front track 6 drives the four positioning columns 301 and the fixing plate 302 to rotate. The four positioning columns 301 drive the two adjusting plates 311 to rotate. The adjusting plates 311 drive the limiting plate 312 to rotate until the rejection front track 6 is flush with the rejection transition track 5. At the same time, the stepper motor 307 inside the rejection front track 6 drives the conveyor belt to perform transmission. Then the defective silicon wafer will enter the rejection box through the rejection front track 6.

[0028] Additionally, when personnel need to fix the mounting plate 9 onto the mounting bracket 1, they can first move the mounting plate 9. The mounting plate 9 will cause the two fixing blocks 406 and the two mounting posts 411 to move towards the positioning plate 402 until the guide strip 404 and the positioning plate 402 slide into the inner wall of the positioning groove 403. Then, as the guide strip 404 slides along the inner wall of the positioning groove 403, it will abut against the inclined surface of the clamping plate 409. The guide strip 404 will then cause the clamping plate 409 to move towards the fixing block 406. The guide strip 404 can guide the positioning plate 402, making it easier for personnel to slide the positioning plate 402 into the positioning groove 403. The inner wall of the slot 403 is then wound up by the clamping plate 409, which drives the two springs 401 and the two bellows 407. The clamping plate 409 also drives the output ends of the two telescopic rods 410 to move closer to the fixed block 406. At this time, the mounting post 411 slides on the inner wall of the limiting slot 405. The bellows 407 can protect the springs 401 and prevent the springs 401 from directly contacting other materials until the mounting plate 9 abuts against the mounting bracket 1. At this time, the slot 408 corresponds to the clamping plate 409. Then the spring 401 rebounds, causing the clamping plate 409 to move closer to the slot 408 until the clamping plate 409 slides into the inner wall of the slot 408.

[0029] The circuits and controls involved in this utility model are all existing technologies and will not be described in detail here.

[0030] The above description is merely an embodiment of this utility model and does not limit the patent scope of this utility model. Any equivalent structural or procedural transformations made based on the content of this utility model specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this utility model.

Claims

1. A silicon wafer defect rejection device, characterized in that, include: The mounting bracket (1) and the mounting structure (4) are provided. Two connecting plates (11) are fixedly connected to the inner wall of the mounting bracket (1). A mounting plate (9) is mounted on the upper surface of the mounting bracket (1) via the mounting structure (4). A linear cylinder (8) is mounted on the upper surface of the mounting plate (9). A fixing bracket (10) is fixedly connected to the surface of the mounting bracket (1). A connecting rail (7) and a detection device (2) are mounted on the upper surface of the fixing bracket (10). A removal transition rail (5) is installed on the side of the connecting plate (11) away from the fixing bracket (10). An anti-removal track (6) is installed inside the track (7). The anti-removal track (6) is fixedly connected to the output end of the linear cylinder (8). A limiting structure (3) is provided on the surface of the anti-removal track (6). The limiting structure (3) includes four positioning posts (301) and a fixing plate (302). The four positioning posts (301) are fixedly connected to the anti-removal track (6), and the fixing plate (302) is fixedly connected to the anti-removal track (6). An adjusting plate (311) is slidably connected to the surface of two of the positioning posts (301). The adjusting plate (311) has a sliding connection between its surface and the surface of the adjusting plate (311). A limiting plate (312) is fixedly connected to the upper surface of the adjusting plate (311), and an adjusting frame (313) is fixedly connected to the lower surface of the adjusting plate (311). An inclined plate (314) is rotatably connected to the inner wall of the adjusting frame (313), and a lead screw (310) is rotatably connected to the inner wall of the fixing plate (302). An auxiliary plate (315) is threadedly connected to the arc surface of the lead screw (310). The auxiliary plate (315) is rotatably connected to the two inclined plates (314). A first toothed ring (304) is fixedly connected to the arc surface of the lead screw (310). The surface of the first toothed ring (304) is... A toothed belt (306) is connected to the transmission. A protective cover (308) is fixedly connected to the side of the fixed plate (302) away from the front track (6). A motor (307) is fixedly connected to the inner wall of the protective cover (308). A drag cable is installed on the side of the motor (307) away from the fixed plate (302). The arc surface of the output end of the motor (307) is rotatably connected to the fixed plate (302). A second toothed ring (305) is fixedly connected to the arc surface of the output end of the motor (307). The second toothed ring (305) is connected to the toothed belt (306) for transmission.

2. The silicon wafer defect rejection device according to claim 1, characterized in that, The inner wall of the auxiliary plate (315) is slidably connected to two limiting rods (303), and the two limiting rods (303) are fixedly connected to the fixing plate (302).

3. The silicon wafer defect rejection device according to claim 1, characterized in that, The inner wall of the protective cover (308) is provided with a number of heat dissipation holes (309), and the number of heat dissipation holes (309) are evenly opened on the arc surface of the protective cover (308).

4. The silicon wafer defect rejection device according to claim 1, characterized in that, The inclined plate (314) is a stainless steel plate, and the cross section of the inclined plate (314) is rectangular.

5. The silicon wafer defect rejection device according to claim 1, characterized in that, The upper surface of the mounting plate (9) is provided with a mounting structure (4). The mounting structure (4) includes two positioning grooves (403), two fixing blocks (406), and two mounting posts (411). The two positioning grooves (403) are both opened on the mounting plate (9). The two fixing blocks (406) are fixedly connected to the mounting plate (9). The two mounting posts (411) are fixedly connected to the mounting plate (9). The inner wall of the positioning groove (403) is slidably connected with a positioning plate (402). The two positioning plates (402) are fixedly connected to the mounting bracket (1). The inner wall of the positioning plate (402) is provided with a slot (4). 08), both sides of the fixed block (406) are fixedly connected with telescopic rods (410), the four telescopic rods (410) are in pairs, and the output end of one group of telescopic rods (410) is fixedly connected with a card plate (409). The card plate (409) is slidably connected with the card groove (408). The inner wall of the card plate (409) is provided with a limiting groove (405). The limiting groove (405) is slidably connected with the mounting column (411). The arc surface of the telescopic rod (410) is fitted with a spring (401). The two ends of the spring (401) are fixedly connected to the fixed block (406) and the card plate (409) respectively.

6. The silicon wafer defect rejection device according to claim 5, characterized in that, The upper surface of the positioning plate (402) is fixedly connected with a guide strip (404).

7. The silicon wafer defect rejection device according to claim 5, characterized in that, The spring (401) has a bellows (407) fitted on its arc surface, and the two ends of the bellows (407) are fixedly connected to the fixing block (406) and the clamping plate (409) respectively.

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