Cleaning device

Abstract

The utility model discloses a kind of cleaning devices, suitable for the heat-conducting material cleaning that workpiece is daubed, including device body, delivery pump and cleaning liquid container.There is the cleaning tank for workpiece to place on device body, the back liquid tank isolated from cleaning tank, the communication hole being communicated back liquid tank and cleaning tank, the back liquid hole being communicated with back liquid tank, the subsiding tank being located below cleaning tank and being communicated with cleaning tank, the outer row hole being communicated with subsiding tank and the liquid inlet hole being communicated with cleaning tank.The liquid inlet hole is communicated with the output end of delivery pump, the input end of delivery pump is communicated with cleaning liquid container, cleaning liquid container is communicated with back liquid hole, and cleaning tank has the ultrasonic cleaning area that is staggered with subsiding tank relatively.The cleaning device of the utility model can improve the heat-conducting material cleaning effect and efficiency that workpiece is daubed, and prevent workpiece surface from being damaged during heat-conducting material cleaning process.

Description

Technical Field

[0001] This utility model relates to the technical field of cleaning, and in particular to a cleaning device suitable for cleaning the thermally conductive material applied to a workpiece. Background Technology

[0002] As is well known, in the field of thermally conductive silicone development and production, thermally conductive materials such as thermally conductive silicone gel and thermally conductive silicone grease are frequently applied to the surface of workpieces (such as, but not limited to, metal test fixtures) for various performance tests. After the test, the thermally conductive material applied to the workpiece surface needs to be cleaned off to meet the needs of the next application.

[0003] Currently, the common method for cleaning the thermally conductive materials applied to workpieces is to use a rag soaked in organic solvent to wipe away any residual thermally conductive materials such as thermally conductive silicone gel and thermally conductive grease on the workpiece surface. This cleaning method has the following drawbacks.

[0004] (a) Because manual cleaning is necessary, there are drawbacks such as low efficiency and poor efficiency, especially when the number of workpieces to be cleaned is large.

[0005] (ii) Because thermally conductive silicone gels and thermally conductive greases contain a large amount of thermally conductive fillers, which are generally high-hardness aluminum oxide, the wiping method can easily damage the surface roughness of the metal tooling and change the surface energy and other parameters of the workpiece under the action of friction. Especially when the workpiece is a precision test element, the workpiece that does not meet the surface roughness and surface energy requirements must be scrapped, resulting in a huge waste of cost.

[0006] Therefore, there is an urgent need for a cleaning device to overcome one or more of the aforementioned defects. Utility Model Content

[0007] The purpose of this invention is to provide a cleaning device that improves the cleaning effect and efficiency of the heat-conducting material applied to the workpiece and prevents damage to the workpiece surface during the cleaning process.

[0008] To achieve the above objectives, the cleaning device of this utility model is suitable for cleaning the thermally conductive material applied to a workpiece, and includes a device body, a delivery pump, and a cleaning fluid container. The device body has a cleaning tank for placing the workpiece, a return fluid tank separated from the cleaning tank, a connecting hole connecting the return fluid tank and the cleaning tank, a return fluid hole connected to the return fluid tank, a sinking tank located below the cleaning tank and connected to the cleaning tank, an external drain hole connected to the sinking tank, and a liquid inlet hole connected to the cleaning tank; the liquid inlet hole is connected to the output end of the delivery pump, the input end of the delivery pump is connected to the cleaning fluid container, the cleaning fluid container is connected to the return fluid hole, and the cleaning tank has an ultrasonic cleaning zone offset from the sinking tank.

[0009] Compared with existing technologies, this invention, through the cooperation of the device body, delivery pump, and cleaning fluid container, achieves a continuous cycle of cleaning the thermally conductive material coated on the workpiece surface during the cleaning process. First, the workpiece is placed in the ultrasonic cleaning zone of the cleaning tank. Then, under the action of the delivery pump, the cleaning fluid in the cleaning fluid container enters the cleaning tank through the inlet hole. The cleaning fluid in the cleaning tank flows into the return tank through the connecting hole, and then flows back to the cleaning fluid container through the return hole, thus continuously cleaning the thermally conductive material coated on the workpiece surface. Meanwhile, the thermally conductive material coated on the workpiece surface in the ultrasonic cleaning zone is detached from the workpiece surface under the action of ultrasound. The detached thermally conductive material is carried into the sedimentation tank for deposition as the cleaning fluid flows into the connecting hole. Therefore, this invention improves the cleaning effect and efficiency of the thermally conductive material coated on the workpiece and prevents damage to the workpiece surface during the cleaning process.

[0010] Preferably, the device body also has a valve for opening and closing the external discharge port.

[0011] Preferably, the end of the external discharge hole away from the sinking trough is provided with an internal thread structure, and the valve is threadedly connected to the internal thread structure; the valve is a ball valve switch.

[0012] Preferably, the intersection between the bottom surface of the sinking trough and the wall surface of the outer discharge hole is chamfered or rounded.

[0013] Preferably, the intersection between the bottom surface of the cleaning tank and the side surface of the sinking tank is chamfered or rounded.

[0014] Preferably, the bottom surface of both the cleaning tank and the sinking tank is a flat surface.

[0015] Preferably, the device body also has a hollow space located below the return hole for placing the delivery pump and the cleaning fluid container.

[0016] Preferably, the end of the return hole away from the return groove is provided with an internal thread structure.

[0017] Preferably, the junction between the wall of the return hole and the bottom surface of the return tank is chamfered or rounded, and the bottom surface of the return tank is flat.

[0018] Preferably, the connecting hole and the liquid inlet hole are each arranged upwards offset relative to the bottom surface of the cleaning tank.

[0019] Preferably, the distance from the connecting hole to the bottom surface of the cleaning tank is less than the distance from the liquid inlet hole to the bottom surface of the cleaning tank.

[0020] Preferably, the connecting hole and the liquid inlet hole are connected to the cleaning tank at the side of the cleaning tank, and the side of the cleaning tank connected by the connecting hole and the side of the cleaning tank connected by the liquid inlet hole are arranged adjacent to each other.

[0021] Preferably, the connecting hole is close to the sinking tank, and the liquid inlet hole is far from the sinking tank.

[0022] Preferably, the end of the liquid inlet hole away from the cleaning tank is provided with an internal thread structure, and the intersection between the hole wall surface of the liquid inlet hole and the side surface of the cleaning tank is arranged with a chamfer or rounding.

[0023] Preferably, the cleaning tank and the return tank are rectangular tanks arranged side by side.

[0024] Preferably, the two opposite ends of the rectangular groove are semi-circular.

[0025] Preferably, the device body also includes an ultrasonic cleaner for providing ultrasonic cleaning to the ultrasonic cleaning area. Attached Figure Description

[0026] Figure 1 This is a plan view of the cleaning device of this utility model.

[0027] Figure 2 This is a perspective view of the main body of the cleaning device of this utility model.

[0028] Figure 3 yes Figure 2 The device shown is a three-dimensional view from another angle.

[0029] Figure 4 yes Figure 2 The device shown is a three-dimensional view at another angle.

[0030] Figure 5 yes Figure 2 The diagram shows a plan view of the device body viewed in the direction indicated by arrow A.

[0031] Figure 6 It is along Figure 5 Internal view of the section cut along the BB line. Detailed Implementation

[0032] To explain the technical content and structural features of this utility model in detail, the following description is provided in conjunction with the embodiments and accompanying drawings.

[0033] Please see Figure 1 The cleaning device 100 of this utility model is suitable for cleaning the thermally conductive material (such as, but not limited to, thermally conductive silicone gel or thermally conductive silicone grease) applied to the workpiece to meet the needs of the next application of the workpiece.

[0034] Combined Figures 2 to 6 The cleaning device 100 of this utility model includes a device body 10, a delivery pump 20, and a cleaning fluid container 30. The device body 10 has a cleaning tank 11 for placing workpieces, a return fluid tank 12 separated from the cleaning tank 11, a connecting hole 13 connecting the return fluid tank 12 and the cleaning tank 11, a return fluid hole 14 communicating with the return fluid tank 12, a sinking tank 15 located below and communicating with the cleaning tank 11, an external drain hole 16 communicating with the sinking tank 15, and a fluid inlet hole 17 communicating with the cleaning tank 11. The fluid inlet hole 17 is connected to the output end 21 of the delivery pump 20. Optionally, it is located at... Figure 1 In this example, the inlet port 17 and the output end 21 of the transfer pump 20 are connected via the first pipe body 22 to achieve indirect connection between the inlet port 17 and the output end 21 of the transfer pump 20. Furthermore, to improve the ease of connection, the end of the inlet port 17 furthest from the cleaning tank 11 can be provided with an internal thread structure 171 to facilitate the assembly and disassembly of the first pipe body 22 and the inlet port 17. Obviously, depending on actual needs, the inlet port 17 and the first pipe body 22 can also be connected in other ways, therefore, this is not considered an example. Figure 1 , Figure 2 and Figure 6 The above is the limit.

[0035] Simultaneously, the input end 23 of the transfer pump 20 is connected to the cleaning fluid container 30, and the cleaning fluid container 30 is connected to the return port 14; optionally, at... Figure 1 In this example, the cleaning fluid container 30 and the return port 14 are connected via a second pipe 31 to achieve indirect connection between the cleaning fluid container 30 and the return port 14. The cleaning fluid container 30 and the input end 23 of the delivery pump 20 are connected via a third pipe 32 to achieve indirect connection between the cleaning fluid container 30 and the input end 23 of the delivery pump 20. Furthermore, to improve the ease of connection, the end of the return port 14 furthest from the return tank 12 can be provided with an internal thread structure 141 to facilitate the assembly and disassembly of the second pipe 31 and the return port 14. Obviously, depending on actual needs, the return port 14 and the second pipe 31 can also be connected in other ways, therefore, this is not considered an example. Figure 1 and Figure 4 The above is the limit.

[0036] The cleaning tank 11 has an ultrasonic cleaning zone 11a that is offset from the sink 15. That is, the ultrasonic cleaning zone 11a is formed by a portion of the cleaning tank 11 that is away from the sink 15. This design facilitates the deposition of thermally conductive material cleaned from the workpiece surface into the sink 15. Specifically, in Figure 6As an example, the device body 10 also includes an ultrasonic cleaner 40 that provides ultrasonic cleaning for the ultrasonic cleaning zone 11a. Since the specific structure and working principle of the ultrasonic cleaner 40 are existing, they will not be described in detail here. More specifically, see the description below.

[0037] like Figure 1 As shown, as an example, the device body 10 also has a valve 18 for opening and closing the external drain hole 16, so that the operator can open or close the external drain hole 16 as needed; for example, when it is necessary to drain the heat-conducting material deposited in the sink 15, the valve 18 can be opened; when it is necessary to clean the heat-conducting material applied to the surface of the workpiece, the valve 18 needs to be closed to close the external drain hole 16. Specifically, in Figure 1 As an example, the end of the external drain hole 16 furthest from the sinkhole 15 is provided with an internal thread structure 161. The valve 18 is threadedly connected to this internal thread structure 161. This design improves the ease of installation and removal between the valve 18 and the external drain hole 16. More specifically, in Figure 1 In the example shown, valve 18 is a ball valve switch; obviously, depending on actual needs, valve 18 can also be other types of structures, such as sealing plugs, etc., therefore it is not considered... Figure 1 The above is the limit.

[0038] like Figure 2 , Figure 3 and Figure 6 As shown, as an example, the junction 156 between the bottom surface 151 of the sink trough 15 and the wall surface 162 of the external drain hole 16 is rounded, which facilitates the smooth discharge of the heat-conducting material in the sink trough 15 to the outside through the external drain hole 16. Obviously, depending on actual needs, the junction 156 between the bottom surface 151 of the sink trough 15 and the wall surface 162 of the external drain hole 16 can also be chamfered. Therefore, it is not necessary to... Figure 2 , Figure 3 and Figure 6 The above is the limit.

[0039] like Figure 2 and Figure 3 As shown, as an example, the cleaning tank 11 and the return tank 12 are rectangular tanks arranged side by side. Alternatively, in... Figure 2 and Figure 3 In the example shown, the two opposite ends of the rectangular tank are semi-circular, a design that facilitates the manufacturing and processing of the cleaning tank 11 and the return tank 12. Obviously, depending on actual needs, the shapes of the cleaning tank 11 and the return tank 12 can also be other than those specified here. Figure 2 and Figure 3 The above is for reference only. Additionally, regarding... Figure 6In this example, the junction 115 between the bottom surface 111 of the cleaning tank 11 and the side surface of the sinking tank 15 is rounded. This design facilitates the smooth flow of the heat-conducting material cleaned from the workpiece surface into the sinking tank 15 as the cleaning fluid flows towards the connecting hole 13. Furthermore, in... Figure 6 In this example, the bottom surface 111 of the cleaning tank 11 and the bottom surface 151 of the sinking tank 15 are both flat surfaces to facilitate the manufacture of the cleaning tank 11 and the sinking tank 15. Specifically, in Figure 2 and Figure 3 In this example, the sinking trough 15 is a circular trough. Obviously, depending on actual needs, the sinking trough 15 can also be other shapes well known in the art, so it is not specified here. Figure 2 and Figure 3 The above is the limit.

[0040] like Figure 6 As shown, as an example, the connecting hole 13 and the liquid inlet hole 17 are each offset upward relative to the bottom surface 111 of the cleaning tank 11 to effectively prevent the thermally conductive material cleaned from the workpiece surface from entering the connecting hole 13 along with the cleaning liquid, thereby more effectively ensuring that the thermally conductive material cleaned from the workpiece surface is deposited at the sink 15; alternatively, in Figure 6 In this example, the distance D2 from the connecting hole 13 to the bottom surface 111 of the cleaning tank 11 is less than the distance D1 from the inlet hole 17 to the bottom surface 111 of the cleaning tank 11. This design facilitates the return of the cleaning fluid in the cleaning tank 11 to the return tank 12 via the connecting hole 13. Obviously, depending on actual needs, the relationship between the distance D2 from the connecting hole 13 to the bottom surface 111 of the cleaning tank 11 and the distance D1 from the inlet hole 17 to the bottom surface 111 of the cleaning tank 11 can be other than that, so it is not considered as such. Figure 6 The above is for reference only. Additionally, regarding... Figure 6 In the example shown, the connecting hole 13 and the liquid inlet hole 17 are each connected to the cleaning tank 11 at a side surface 112 of the cleaning tank 11. The side surface 112 of the cleaning tank 11 connected by the connecting hole 13 and the side surface 112 of the cleaning tank 11 connected by the liquid inlet hole 17 are arranged adjacent to each other, as shown in the figure. Figure 6 As shown. Furthermore, in Figure 6 In this design, the connecting hole 13 is close to the sink 15, and the liquid inlet hole 17 is far away from the sink 15. This design makes it easier for the heat-conducting material cleaned from the workpiece surface to be carried to the sink 15 as the cleaning liquid flows into the connecting hole 13.

[0041] Combination Figures 1 to 5 As an example, the device body 10 also has a hollow space 19 located below the return hole 14 for placing the delivery pump 20 and the cleaning fluid container 30, so that the structure of the cleaning device 100 of this utility model is more compact.

[0042] like Figure 3As shown, as an example, the junction 124 between the wall surface 142 of the return hole 14 and the bottom surface 121 of the return tank 12 is rounded. This design facilitates the return of the cleaning fluid in the return tank 12 to the cleaning fluid container 30 via the return hole 14. Obviously, depending on actual needs, the junction 124 between the wall surface 142 of the return hole 14 and the bottom surface 121 of the return tank 12 can also be chamfered. Therefore, it is not necessary to... Figure 3 The above is for illustrative purposes only. Additionally, the bottom surface 121 of the return tank 12 is flat to facilitate its manufacture.

[0043] like Figure 3 and Figure 6 As shown, as an example, the junction 117 between the wall surface 172 of the inlet hole 17 and the side surface 112 of the cleaning tank 11 is rounded to facilitate the flow of cleaning fluid delivered by the pump 20 into the cleaning tank 11. Obviously, depending on actual needs, the junction 117 between the wall surface 172 of the inlet hole 17 and the side surface 112 of the cleaning tank 11 can also be chamfered. Therefore, it is not necessary to... Figure 3 and Figure 6 The above is the limit.

[0044] Compared with the prior art, by utilizing the cooperation of the device body 10, the delivery pump 20, and the cleaning fluid container 30, during the cleaning process of the thermally conductive material coated on the surface of the workpiece, the workpiece is first placed in the ultrasonic cleaning zone 11a of the cleaning tank 11; then, under the action of the delivery pump 20, the cleaning fluid in the cleaning fluid container 30 enters the cleaning tank 11 through the inlet hole 17; the cleaning fluid entering the cleaning tank 11 enters the return tank 12 along the connecting hole 13, and the cleaning fluid entering the return tank 12 flows back to the cleaning fluid container 30 along the return hole 14, realizing the continuous circulation of the cleaning fluid to clean the thermally conductive material coated on the surface of the workpiece; while the thermally conductive material coated on the surface of the workpiece located in the ultrasonic cleaning zone 11a is detached from the surface of the workpiece under the action of ultrasound, and the detached thermally conductive material is carried into the sink 15 for deposition during the process of the cleaning fluid flowing into the connecting hole; therefore, the cleaning device 100 of this utility model improves the cleaning effect and efficiency of the thermally conductive material coated on the workpiece, and prevents damage to the surface of the workpiece during the cleaning process of the thermally conductive material.

[0045] It should be noted that the first tube 22, the second tube 31 and the third tube 33 mentioned above can all be selected as flexible hoses; in addition, the delivery pump 20 is a circulation pump.

[0046] The above-disclosed examples are merely preferred embodiments of the present utility model and should not be construed as limiting the scope of the present utility model. Therefore, any equivalent variations made in accordance with the claims of the present utility model shall fall within the scope of the present utility model.

Claims

1. A cleaning apparatus suitable for cleaning thermally conductive materials applied to workpieces, characterized in that, The device includes a main body, a delivery pump, and a cleaning fluid container. The main body has a cleaning tank for placing the workpiece, a return fluid tank separated from the cleaning tank, a connecting hole connecting the return fluid tank and the cleaning tank, a return fluid hole connected to the return fluid tank, a sinking tank located below the cleaning tank and connected to the cleaning tank, an external drain hole connected to the sinking tank, and a liquid inlet hole connected to the cleaning tank. The liquid inlet hole is connected to the output end of the delivery pump, the input end of the delivery pump is connected to the cleaning fluid container, and the cleaning fluid container is connected to the return fluid hole. The cleaning tank has an ultrasonic cleaning zone offset from the sinking tank.

2. The cleaning device according to claim 1, characterized in that, The device body also has a valve for opening and closing the external discharge hole.

3. The cleaning device according to claim 2, characterized in that, The end of the external discharge hole away from the sinking trough is provided with an internal thread structure, and the valve is threadedly connected to the internal thread structure; the valve is a ball valve switch.

4. The cleaning device according to claim 1, characterized in that, The junction between the bottom surface of the sinking trough and the wall surface of the external drain hole is chamfered or rounded; the junction between the bottom surface of the cleaning tank and the side surface of the sinking trough is chamfered or rounded.

5. The cleaning device according to claim 4, characterized in that, The bottom surfaces of both the cleaning tank and the sinking tank are flat.

6. The cleaning apparatus according to claim 1, characterized in that, The device body also has a hollow space located below the return hole for placing the delivery pump and cleaning fluid container.

7. The cleaning device according to claim 1, characterized in that, The end of the return hole away from the return tank is provided with an internal thread structure. The intersection between the hole wall and the bottom surface of the return tank is chamfered or rounded. The bottom surface of the return tank is flat.

8. The cleaning apparatus according to claim 1, characterized in that, The connecting hole and the liquid inlet hole are each offset upward relative to the bottom surface of the cleaning tank. The distance from the connecting hole to the bottom surface of the cleaning tank is less than the distance from the liquid inlet hole to the bottom surface of the cleaning tank. The connecting hole and the liquid inlet hole are each connected to the cleaning tank at a side surface of the cleaning tank. The side surface of the cleaning tank connected by the connecting hole and the side surface of the cleaning tank connected by the liquid inlet hole are arranged adjacent to each other. The connecting hole is close to the sinking tank, and the liquid inlet hole is far away from the sinking tank.

9. The cleaning apparatus according to claim 8, characterized in that, The end of the liquid inlet hole away from the cleaning tank is provided with an internal thread structure, and the intersection between the hole wall surface of the liquid inlet hole and the side surface of the cleaning tank is arranged with a chamfer or rounding.

10. The cleaning apparatus according to claim 1, characterized in that, The cleaning tank and the return tank are rectangular tanks arranged side by side, with semi-circular ends at opposite ends; the device body also has an ultrasonic cleaner that provides ultrasonic cleaning for the ultrasonic cleaning zone.

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