Wafer stage cleaning device and semiconductor processing apparatus

Abstract

The utility model provides a kind of wafer stage cleaning device and semiconductor processing equipment, wafer stage cleaning device includes sealing cover body, purging gas supply unit, air extraction dust removal unit and air pressure balance control piece, sealing cover body is used to cover in wafer stage outside, and with the stage surface jointly form a closed chamber, purging gas supply unit is communicated with sealing cover body, for supplying purging gas to chamber, to make the contamination suspended on wafer stage surface, air extraction dust removal unit is communicated with sealing cover body, for extracting and collecting the gas with contamination suspended, air pressure balance control piece is used to maintain air pressure balance inside and outside chamber in purging stage, and closed chamber is formed in the stage of air extraction negative pressure environment, the cleaning device uses contactless mode to clean wafer stage, can reach the effect of thoroughly cleaning wafer stage, and reduce the risk of damaging wafer stage in cleaning process.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor manufacturing technology, and more specifically, it relates to a wafer stage cleaning device and semiconductor processing equipment. Background Technology

[0002] Semiconductor manufacturing equipment is the foundation for achieving large-scale chip production. The wafer stage (Chuck), as a core positioning and support component in processes such as photolithography, inspection, and etching, directly determines the precision, efficiency, and overall yield of chip manufacturing. As chip manufacturing processes continue to evolve towards smaller nodes, higher demands are placed on the positioning stability, motion accuracy, and cleanliness of the wafer stage.

[0003] To ensure the long-term stable operation of equipment, semiconductor manufacturers generally adopt a preventative, periodic maintenance strategy, with cleaning the wafer stage being a crucial aspect. Currently, the mainstream industry practice is to rely on manual contact wiping using lint-free cloths dampened with specialized cleaning agents.

[0004] However, this manual contact wiping method has significant limitations. First, the mechanical pressure applied to the Chuck surface during wiping may be transmitted to its precision motion system, potentially affecting the accuracy of the Chuck's motion system. Second, fragile components such as the suction nozzle on the Chuck surface are easily damaged during friction, which can affect the vacuum adsorption function or even cause the entire machine to malfunction. In addition, for the widely used annular grooved vacuum Chuck, its complex microstructure is difficult to clean thoroughly by wiping, easily leaving behind particulate matter and posing a risk of process contamination. Utility Model Content

[0005] The purpose of this invention is to provide a wafer stage cleaning device and a semiconductor processing equipment. This wafer stage cleaning device can reduce the risk of damage to the wafer stage during the cleaning process and achieve the effect of thoroughly cleaning the wafer stage.

[0006] To achieve the above objectives, the technical solution adopted by this utility model is as follows: The first aspect of this utility model provides a wafer stage cleaning device, comprising: A sealing cover is used to cover the wafer stage and together with the surface of the wafer stage, form a closed chamber; a purge gas supply unit is connected to the sealing cover and is used to supply purge gas into the chamber to suspend contaminants on the surface of the wafer stage; an extraction and dust removal unit is connected to the sealing cover and is used to extract and collect the gas containing suspended contaminants; a pressure balance control component is disposed on the sealing cover and is used to maintain the pressure balance inside and outside the chamber during the purging phase and to close the chamber during the extraction phase to form a negative pressure environment.

[0007] In one specific embodiment, the purging gas supplied by the purging gas supply unit is nitrogen.

[0008] In one specific embodiment, the purging gas supply unit includes a high-pressure gas gun configured to inject gas in a pulsed or continuous manner.

[0009] In one specific embodiment, the nozzle of the high-pressure air gun is rotatably mounted.

[0010] In one specific embodiment, the air pressure balance control component includes at least one exhaust port and a filter element disposed on the exhaust port, the exhaust port being used to open during the purging phase and close during the evacuation phase.

[0011] In one specific embodiment, the vent is equipped with an automatic on / off valve.

[0012] In one specific embodiment, the air extraction and dust removal unit includes a vacuum pump and a dust collection device. The dust collection device is connected to the sealing cover, and the vacuum pump is connected to the dust collection device. The dust collection device is used to filter and retain particulate pollutants during the air extraction process.

[0013] In one specific embodiment, the device may further include a control unit, which is used to control the start-stop sequence of the high-pressure air gun, the automatic opening and closing valve, and the vacuum pump.

[0014] In one specific embodiment, the sealing cover includes a first cover and a second cover surrounding the first cover. The first cover is used to cover the wafer stage, and the second cover is used to protect the high-pressure air gun and the dust collection device.

[0015] The second aspect of this utility model provides a semiconductor processing apparatus, including a cleaning device for a stage, wherein the wafer stage cleaning device is the wafer stage cleaning device described above.

[0016] The wafer stage cleaning device provided by this utility model includes a sealing cover, a purge gas supply unit, an extraction and dust removal unit, and a pressure balance control component. The sealing cover is used to enclose the wafer stage and, together with the stage surface, forms a closed chamber. The purge gas supply unit is connected to the sealing cover and supplies purge gas into the chamber to suspend contaminants on the wafer stage surface. The extraction and dust removal unit is connected to the sealing cover and extracts and collects the gas containing suspended contaminants. The pressure balance control component is... Placed on the sealed cover, it is used to maintain the air pressure balance inside and outside the chamber during the blowing phase and to seal the chamber to form a negative pressure environment during the suction phase. The cleaning device blows the surface of the wafer stage with high-pressure airflow, causing contaminants to be suspended in the sealed cover. Then, the suction and dust removal unit performs suction circulation to clean the surface of the wafer stage. This solves the problem that manual wiping is difficult to clean inside the annular grooves and other dead corners with complex microstructures. The cleaning device uses a non-contact method to clean the wafer stage, reducing the risk of damage to the wafer stage during the cleaning process. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 A schematic diagram of the structure of the wafer stage provided in this embodiment of the present invention; Figure 2 A schematic diagram of the structure of the wafer stage provided in this embodiment of the present invention; Figure 3 A schematic diagram illustrating the working principle of the wafer stage cleaning device provided in this embodiment of the utility model; Figure 4 A partial structural schematic diagram of the wafer stage cleaning device provided in this embodiment of the utility model; Figure 5 A schematic diagram of the sealing strip at the bottom of the sealing cover of the wafer stage cleaning device provided in this embodiment of the utility model; Figure 6 A schematic diagram showing the open and closed states of the exhaust port of the wafer stage cleaning device provided in this embodiment of the utility model.

[0019] The following are the labeling elements in the figure: 1-Sealed cover; 2-Purge gas supply unit; 3-Exhaust gas removal unit; 4-Pressure balance control component; 11-Sealing strip; 12-First cover; 13-Second cover; 21-High-pressure air gun; 31-Dust collection device; 41-Exhaust port; A-Wafer stage. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0021] In the description of this utility model, it should be understood that the terms "comprising" and "having" as used herein, and any variations thereof, are intended to cover non-exclusive inclusion, for example, a process, method, system, product, or device that includes a series of steps or units is not necessarily limited to those steps or units that are explicitly listed, but may include other steps or units that are not explicitly listed or that are inherent to such process, method, product, or device.

[0022] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0023] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. It should be understood that the term "and / or" as used herein is merely a description of the relationship between related objects, indicating that three relationships may exist. For example, A and / or B can represent: A alone, A and B simultaneously, or B alone. In the description of this utility model, unless otherwise stated, "multiple" means two or more.

[0024] Figure 1 This is a schematic diagram of the structure of the wafer stage provided in an embodiment of the present invention. Figure 2Please refer to the schematic diagram of the wafer stage provided in the embodiment of this utility model. Figure 1 and Figure 2 Currently, wafer stage cleaning relies on manual contact wiping with a lint-free cloth dampened with a special cleaning agent. This manual contact wiping method has significant limitations. First, the mechanical pressure applied to the Chuck surface during wiping may be transmitted to its precision motion system, potentially affecting the Chuck's motion accuracy. Second, fragile components such as the suction nozzles on the Chuck surface are easily damaged during friction, affecting vacuum adsorption and even causing overall system failure. Furthermore, for widely used annular grooved vacuum Chucks, their complex microstructure is difficult to clean thoroughly by wiping, easily leaving residual particles and posing a risk of process contamination. These problems indicate that existing manual cleaning methods are not only insufficient in cleaning effectiveness but also harbor the risk of secondary damage to core components. Based on the above reasons, this application provides a wafer stage cleaning device and semiconductor processing equipment.

[0025] The wafer stage cleaning device and semiconductor processing equipment provided by this utility model will be described in detail below with reference to specific embodiments.

[0026] Figure 3 This is a schematic diagram illustrating the working principle of the wafer stage cleaning device provided in an embodiment of the present invention. Figure 4 This is a partial structural schematic diagram of the wafer stage cleaning device provided in an embodiment of the present invention. Figure 5 Please refer to the schematic diagram of the bottom sealing strip of the sealing cover of the wafer stage cleaning device provided in this embodiment of the utility model. Figures 3-5 The first aspect of this embodiment provides a wafer stage cleaning device, including a sealing cover 1, a purge gas supply unit 2, an extraction and dust removal unit 3, and a pressure balance control component 4. The sealing cover 1 is used to cover the wafer stage A and together with the surface of the stage, forms a closed chamber. The purge gas supply unit 2 is connected to the sealing cover 1 and is used to supply purge gas into the chamber to suspend contaminants on the surface of the wafer stage A. The extraction and dust removal unit 3 is connected to the sealing cover 1 and is used to extract and collect the gas containing the suspended contaminants. The pressure balance control component 4 is disposed on the sealing cover 1 and is used to maintain the pressure balance inside and outside the chamber during the purge phase and to close the chamber during the extraction phase to form a negative pressure environment.

[0027] In this embodiment, the wafer stage A is the core positioning and support component for the wafer in processes such as photolithography, inspection, and etching. Its performance directly determines the precision, efficiency, and overall yield of chip manufacturing. The wafer stage A in this embodiment can be a vacuum chuck or an electrostatic chuck. For example, a vacuum chuck or electrostatic chuck can be used to fix the wafer, preventing any minute displacement during high-speed movement or the process itself, or to quickly and accurately move each chip area on the wafer to the processing head, such as below the lens of a photolithography machine, in the plasma area of ​​an etching machine, or directly below a measurement sensor.

[0028] In this embodiment, the sealing cover 1 is used to cover the wafer stage A and together with the surface of the stage, forms a closed chamber. The sealing cover 1 physically isolates the cleaning area of ​​the wafer stage A from other precision environments inside the semiconductor equipment, preventing the diffusion of particulate contaminants generated during the cleaning process, which could cause secondary contamination or equipment damage. The purge gas supply unit 2 supplies high-purity nitrogen gas. The closed chamber and the surface of the wafer stage A together form a closed space, which is the working chamber where the purge and suction actions occur. This closed chamber prevents operators or tools from directly contacting vulnerable parts such as the suction nozzle on the Chuck, avoiding the risk of collision or friction during wiping.

[0029] The sealing cover 1 in this embodiment is typically made of stainless steel. Stainless steel has high rigidity, low gas release, corrosion resistance, and is easy to clean. For example, the sealing cover 1 in this embodiment is made of stainless steel and assembled by laser welding, ensuring uniform welds, good sealing, and eliminating weld slag or protrusions produced by traditional welding. The inner cavity of the sealing cover 1 in this embodiment can be square or rectangular, with dimensions larger than the Chuck, to ensure complete coverage of the Chuck while allowing for airflow. A sealing strip 11 is provided at the bottom of the cover for soft contact sealing with the Chuck's base platform, ensuring airtightness while preventing damage to the precision platform from hard contact.

[0030] In this embodiment, the purge gas supply unit 2 is connected to the sealed enclosure 1 and is used to supply purge gas into the chamber to suspend contaminants on the surface of the wafer stage A. This embodiment generates shear force by spraying a high-speed, pure airflow onto the Chuck surface to overcome the adsorption force between the particles and the Chuck surface, causing them to change from an attached state to a suspended state, preparing for subsequent removal, thus achieving contactless cleaning of the wafer stage A surface. The purge gas supply unit 2 in this embodiment uses high-purity gas and does not introduce new contaminants. Exemplarily, one or more high-pressure air guns (or nozzle arrays) are used. The high-pressure air guns are installed at a specific angle (e.g., tilted at a certain angle to generate a rotating airflow or cover a specific area) above and / or to the side of the inner wall of the enclosure.

[0031] In this embodiment, the extraction and dust removal unit 3 is connected to the sealed cover 1 and is used to extract and collect gas containing suspended pollutants. The extraction and dust removal unit 3 completely removes the suspended particles from the Chuck surface. The extraction and collection of gas by the extraction and dust removal unit 3 prevents the extracted particles from directly entering the vacuum pump or being discharged into the environment. Exemplarily, this embodiment uses a vacuum pump to provide the suction power. This embodiment includes a filter in the extraction path; when suspended particles are drawn away with the airflow, they are trapped in the filter, ensuring that clean gas is discharged, thereby protecting the vacuum pump and meeting environmental emission requirements.

[0032] In this embodiment, the air pressure balance control component 4 is disposed on the sealing cover 1. It is used to maintain the air pressure balance inside and outside the chamber during the purging phase and to seal the chamber to form a negative pressure environment during the evacuation phase. For example, when a large amount of gas is injected into the sealed chamber by the high-pressure air gun, the pressure inside the chamber will rise sharply. At this time, opening the air pressure balance control component 4 can prevent the internal pressure from being too high, thereby preventing: a) excessive pressure on the sealing strip, which would lead to seal failure; b) high-pressure airflow violently ejected from the gap, which would blow the contaminants to other parts of the equipment. When evacuation is required, this component is closed to ensure the chamber is sealed, so that the evacuation unit can quickly and efficiently form a stable negative pressure environment inside the chamber.

[0033] The wafer stage cleaning device provided by this utility model includes a sealing cover, a purge gas supply unit, an extraction and dust removal unit, and a pressure balance control component. The sealing cover is used to enclose the wafer stage and, together with the stage surface, forms a closed chamber. The purge gas supply unit is connected to the sealing cover and supplies purge gas into the chamber to suspend contaminants on the wafer stage surface. The extraction and dust removal unit is connected to the sealing cover and extracts and collects the gas containing suspended contaminants. The pressure balance control component is... Placed on the sealed cover, it is used to maintain the air pressure balance inside and outside the chamber during the blowing phase and to seal the chamber to form a negative pressure environment during the suction phase. The cleaning device blows the surface of the wafer stage with high-pressure airflow, causing contaminants to be suspended in the sealed cover. Then, the suction and dust removal unit performs suction circulation to clean the surface of the wafer stage. This solves the problem that manual wiping is difficult to clean inside the annular grooves and other dead corners with complex microstructures. The cleaning device uses a non-contact method to clean the wafer stage, reducing the risk of damage to the wafer stage during the cleaning process.

[0034] In one specific embodiment, the purge gas supplied by the purge gas supply unit 2 is high-purity nitrogen. Nitrogen is an inert gas with stable chemical properties and will not react with any materials in the equipment.

[0035] In one specific embodiment, please refer to Figure 3The purging gas supply unit 2 includes a high-pressure air gun 21, which is configured to spray gas in a pulsed or continuous manner. Pulsed spraying releases a high-pressure gas flow in a very short time (e.g., 0.1-0.5 seconds). Pulsed gas spraying can generate stronger impact and shear forces than continuous airflow. This high-intensity impact can more effectively overcome the strong adhesion between small particles and the Chuck surface, making it particularly suitable for removing tightly adhered stubborn contaminants for a more thorough cleaning. Continuous spraying can create a continuous and stable airflow field within the sealed chamber. For a large number of loose, lightweight particles (such as settled dust), continuous airflow can achieve a large-area, uniform cleaning effect. Continuous spraying can continuously replenish gas, helping to maintain stable airflow within the chamber and preventing particle re-settling. Furthermore, it creates a directional airflow near the extraction port, more efficiently guiding suspended particles into the extraction and dust removal unit 3, improving overall dust removal efficiency and effectiveness. Operators or the control system can flexibly choose the appropriate method based on the degree of contamination of the Chuck and the cleaning objective.

[0036] Preferably, the nozzle of the high-pressure air gun 21 is rotatable. Exemplarily, in this embodiment, a miniature, high-torque servo motor or stepper motor is integrated into the nozzle. The motor housing is fixed to the inner wall or top plate of the housing via a flange, and the motor's output shaft is directly connected to the nozzle's base. The rotatable nozzle, through dynamic scanning, allows the high-pressure airflow to cover every corner of the Chuck surface, especially the inner walls of annular grooves, recesses, and sides of complex geometries—areas difficult to reach with traditional fixed nozzles and wiping. When the nozzle rotates, the ejected airflow generates a varying tangential velocity component relative to the Chuck surface, better entraining particles and applying a peeling force to them. Its cleaning efficiency is far higher than that of a vertically impacting fixed airflow, achieving the same or better cleaning effect in a shorter time and with lower air pressure, further reducing equipment load and operating costs.

[0037] Figure 6 Please refer to the schematic diagram showing the open and closed states of the exhaust port of the wafer stage cleaning device provided in this embodiment of the utility model. Figures 4-6The pressure balance control component 4 includes at least one exhaust port 41 and a filter element disposed thereon. The exhaust port 41 is used to open during the purging phase to prevent excessive pressure in the chamber and to close during the vacuuming phase. During the purging phase, the high-pressure air gun injects a large amount of gas into the sealed chamber. Without the exhaust port 41, the pressure inside the chamber would rise sharply, generating enormous pressure. For example, it could damage the sealing strip between the bottom of the enclosure and the equipment platform, causing the device to malfunction. The exhaust port acts as a pressure relief channel during the purging phase, promptly expelling excess gas and maintaining a basic pressure balance between the inside and outside of the chamber. This ensures that the cleaning process is strictly isolated within the enclosure, protecting the safety of the main equipment. The presence of the exhaust port maintains the pressure difference between the inside and outside of the chamber, ensuring that the airflow ejected by the air gun can continuously rush towards the Chuck surface at high speed, thereby efficiently suspending contaminants. In this embodiment, the exhaust port 41 closes when the purging phase ends and vacuuming is required. After closing the exhaust port 41, the suction force of the extraction and dust removal unit is ensured to act entirely on the sealed chamber, establishing a high negative pressure environment. This negative pressure environment facilitates the formation of a stable, directional airflow from all sides towards the exhaust port, efficiently sweeping suspended particles into the dust collection system for thorough removal without residue. The filter element ensures that only clean gas is discharged from the exhaust port, while all particulate contaminants are trapped on the filter element or remain in the chamber awaiting extraction. This achieves exhaust only, without dust discharge, ensuring the entire cleaning process is isolated from the equipment environment.

[0038] Preferably, the exhaust port 41 is equipped with an automatic opening and closing valve, which receives control signals and automatically opens and closes. In this embodiment, the exhaust port 41 equipped with an automatic opening and closing valve achieves fully automatic closed-loop control of the entire cleaning process, eliminating the need for manual intervention. If a manual valve is used, the operator must open it during purging and close it before vacuuming. This not only increases operational complexity but also introduces the risk of human error; if it is forgotten to close, the entire vacuuming step will fail, leading to cleaning failure.

[0039] In one specific embodiment, please refer to Figure 3The extraction and dust removal unit 3 includes a vacuum pump and a dust collection device 31. The dust collection device is connected to the sealed cover, and the vacuum pump is connected to the dust collection device 31. The dust collection device 31 is used to filter and trap particulate pollutants during the extraction process. In this embodiment, the vacuum pump provides controllable suction power, forming a directional airflow within the sealed chamber. The negative pressure generated by the vacuum pump creates a stable airflow from all sides of the chamber towards the extraction port, which can efficiently and quickly physically remove all suspended pollutants from the chamber, ensuring thorough cleaning and solving the fundamental problem of incomplete cleaning. The filter in the dust collection device 31 can trap and collect almost 100% of particulate pollutants in the airflow, ensuring that the final discharged gas is clean. The pollutants are safely trapped in the replaceable filter element. In this embodiment, the dust collection device 31 is equipped with a one-way valve to prevent gas in the dust collection device 31 from flowing back into the sealed cover 1.

[0040] Furthermore, the device may also include a control unit, which controls the start-up and shutdown sequence of the high-pressure air gun, the automatic opening and closing valve, and the vacuum pump. In this embodiment, the control unit controls the start-up and shutdown sequence of the high-pressure air gun, the automatic opening and closing valve, and the vacuum pump to ensure that each component operates at the correct time and in the correct sequence. For example, the control unit opens the exhaust valve for a preset time, then starts the high-pressure air gun; after the high-pressure air gun operates for a preset time, it closes the exhaust valve; then the vacuum pump starts; and after the vacuum pump operates for a preset time, it shuts down.

[0041] In one specific embodiment, please refer to Figure 3 and Figure 4 The sealing cover 1 includes a first cover 12 and a second cover 13 surrounding the first cover 12. The first cover 12 is used to cover the wafer stage A. The second cover 13 is used to protect the high-pressure air gun 21 and the dust collection device 31. In this embodiment, the second cover 13 not only protects the high-pressure air gun 21 and the dust collection device 31, but also serves an aesthetic purpose.

[0042] A second aspect of this embodiment provides a semiconductor processing apparatus, including a stage cleaning device, wherein the wafer stage cleaning device is the wafer stage cleaning device described in the above embodiment.

[0043] For example, the cleaning device for a wafer stage includes a sealing cover, a purge gas supply unit, an extraction and dust removal unit, and a pressure balance control component. The sealing cover is used to cover the wafer stage and together with the surface of the wafer stage, forms a closed chamber. The purge gas supply unit is connected to the sealing cover and is used to supply purge gas into the chamber to suspend contaminants on the surface of the wafer stage. The extraction and dust removal unit is connected to the sealing cover and is used to extract and collect the gas containing suspended contaminants. The pressure balance control component is disposed on the sealing cover and is used to maintain the pressure balance inside and outside the chamber during the purge phase and to close the chamber during the extraction phase to form a negative pressure environment.

[0044] The cleaning device of this semiconductor processing equipment uses high-pressure airflow to blow away contaminants on the surface of the wafer stage, causing them to be suspended in the sealed enclosure. Then, the air extraction and dust removal unit performs air circulation to clean the surface of the wafer stage. This solves the problem that manual wiping is difficult to clean inside the annular grooves and other dead corners with complex microstructures. The cleaning device uses a non-contact method to clean the wafer stage, reducing the risk of damage to the wafer stage during the cleaning process.

[0045] In the above description, the terms "an embodiment," "some embodiments," "example," "specific example," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this utility model. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0046] The above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.

Claims

1. A wafer stage cleaning device, characterized in that, include: A sealing cover is used to cover the wafer stage and together with the surface of the wafer stage, form a closed chamber; A purge gas supply unit, connected to the sealed cover, is used to supply purge gas into the chamber to suspend contaminants on the surface of the wafer stage. The exhaust dust removal unit is connected to the sealed cover and is used to extract and collect the gas containing suspended pollutants. A pressure balance control component is installed on the sealing cover to maintain the pressure balance between the inside and outside of the chamber during the purging phase and to close the chamber to create a negative pressure environment during the evacuation phase.

2. The wafer stage cleaning apparatus according to claim 1, characterized in that: The purging gas supplied by the purging gas supply unit is nitrogen.

3. The wafer stage cleaning device according to claim 1, characterized in that: The purging gas supply unit includes a high-pressure gas gun, which is configured to inject gas in a pulsed or continuous manner.

4. The wafer stage cleaning device according to claim 3, characterized in that: The nozzle of the high-pressure air gun can be rotatably set.

5. The wafer stage cleaning device according to claim 4, characterized in that: The pressure balance control component includes at least one exhaust port and a filter element disposed on the exhaust port, the exhaust port being used to open during the purging phase and close during the evacuation phase.

6. The wafer stage cleaning apparatus according to claim 5, characterized in that: The exhaust port is equipped with an automatic on / off valve.

7. The wafer stage cleaning apparatus according to claim 6, characterized in that: The air extraction and dust removal unit includes a vacuum pump and a dust collection device. The dust collection device is connected to the sealing cover, and the vacuum pump is connected to the dust collection device. The dust collection device is used to filter and retain particulate pollutants during the air extraction process.

8. The wafer stage cleaning apparatus according to claim 7, characterized in that: The device may further include a control unit, which is used to control the start-stop sequence of the high-pressure air gun, the automatic opening and closing valve, and the vacuum pump.

9. The wafer stage cleaning apparatus according to claim 7 or 8, characterized in that: The sealing cover includes a first cover and a second cover surrounding the first cover. The first cover is used to cover the wafer stage, and the second cover is used to protect the high-pressure air gun and the dust collection device.

10. A semiconductor processing apparatus, characterized in that: The invention includes a wafer stage cleaning device, wherein the wafer stage cleaning device is the wafer stage cleaning device according to any one of claims 1-9.

Images