Wafer cassette flip cleaning apparatus

Abstract

The utility model relates to wafer box cleaning technical field relates to a wafer box overturning cleaning equipment. The overturning mechanism carries wafer box to the support fixture on the cleaning cavity, the gate mechanism closes the opening on the cleaning cavity, the spray mechanism sprays and washes the outside of wafer box, the overturning mechanism overturns wafer box to make it cover to set on the cleaning mechanism, the elevating gear drives the cleaning mechanism to clean the inside of wafer box, to this, the quick cleaning of wafer box is completed, and the drying is carried out while the rapid dehydration, the watermark left on its surface is avoided, improves the effect of cleaning, and the overall structure is simple. The gate mechanism can close the cleaning tank, avoids the problems such as the splashing of cleaning liquid, improves the subsequent drying and the cleaning efficiency.

Description

Technical Field

[0001] This utility model relates to the field of wafer cell cleaning technology, and specifically to a wafer cell flipping and cleaning device. Background Technology

[0002] Wafers need to be transported multiple times during the manufacturing process. Currently, the wafer pods used to transport wafers are called front-opening unified pods (FOUPs). FOUPs are containers mainly used for transporting and storing several wafers.

[0003] A front-opening wafer transfer box mainly consists of a body and a cover. After a period of use, this type of box requires cleaning. More specifically, the equipment used to clean it needs to clean both the body and the cover separately. However, current cleaning machines can only spray the wafer box body in one direction, requiring multiple cleaning cycles, both inside and out, to ensure thorough cleaning of each area. This results in incomplete cleaning and low efficiency. Utility Model Content

[0004] The technical problem to be solved by this utility model is to provide a wafer cassette flipping and cleaning device that can quickly clean wafer cassettes, avoid problems such as splashing of cleaning fluid, and improve the efficiency of subsequent drying and cleaning.

[0005] To solve the above-mentioned technical problems, the technical solution adopted by this utility model is as follows:

[0006] A wafer cassette flipping and cleaning device includes:

[0007] A cleaning tank has a cleaning chamber inside, and a support fixture for loading wafer cassettes is provided on the bottom surface of the cleaning chamber. An opening is provided on one side of the cleaning chamber.

[0008] A spraying mechanism is disposed on the inner wall of the cleaning chamber, and the spraying mechanism is used to spray and clean the outer surface of the wafer cassette.

[0009] A cleaning mechanism is mounted on a support fixture. The cleaning mechanism is driven by a lifting device, which is used to drive the cleaning mechanism to clean the inside of the wafer cassette.

[0010] A gate mechanism is provided on the opening, and the gate mechanism is used to open and close the opening on the cleaning chamber;

[0011] A flipping mechanism is disposed opposite to the cleaning tank. The flipping mechanism is used to transport the wafer cassette to the support fixture of the cleaning chamber and simultaneously flip the wafer cassette so that it covers the cleaning mechanism.

[0012] In one embodiment of this utility model, the flipping mechanism includes a flipping frame, a rotating shaft is mounted on the flipping frame, clamping frames are provided at both ends of the rotating shaft, clamping fixtures are provided on the clamping frames, the rotating shaft is driven and connected to a rotary motor, the wafer cassette is clamped and positioned by the clamping fixtures on the two clamping frames, and the rotary motor drives the rotating shaft to rotate so as to flip and transport the wafer cassette on the clamping frame through the opening to the support fixture.

[0013] In one embodiment of this utility model, the clamping fixture includes a clamping bracket and a plurality of clamping components. The clamping bracket is disposed on the clamping frame, and the clamping component includes a clamping cylinder. The clamping cylinder is disposed on the clamping frame and is drivenly connected to a clamping plate. A guide rod on the clamping plate passes through a guide sleeve on the clamping frame. The clamping cylinder drives the clamping plate to clamp and position the wafer cassette on the clamping bracket.

[0014] In one embodiment of the present invention, the spraying mechanism includes a spraying frame and an air knife frame. The spraying frame is provided with a spraying pipe and a plurality of outer nozzles are provided on the spraying pipe. The plurality of outer nozzles are arranged opposite to the wafer cassette. The air knife frame is arranged in the cleaning tank and is provided with a spray air knife. The spray air knife is arranged opposite to the spraying pipe.

[0015] In one embodiment of the present invention, the cleaning mechanism includes a cleaning base, on which a cleaning pipe, an air blowing pipe and a cleaning air knife are provided. The top and side of the cleaning pipe are provided with cleaning nozzles. The cleaning pipe, the air blowing pipe and the cleaning air knife are arranged opposite to each other. An air nozzle is provided at the top of the air blowing pipe. A heating pipe is provided on the cleaning base, and a temperature sensor is provided on one side of the heating pipe.

[0016] In one embodiment of the present invention, the lifting device includes a lifting driver, which is disposed at the bottom of the cleaning tank and drivenly connected to a drive shaft. The support fixture is provided with a guide hole, the drive shaft passes through the guide hole, and the cleaning mechanism is disposed on the free end of the drive shaft.

[0017] In one embodiment of this utility model, the gate mechanism includes a gate plate, which is disposed opposite to the opening. Linear modules are disposed on both sides of the cleaning tank, and the linear modules are driven to be connected to the lifting frame. The two ends of the gate plate are connected to the lifting frame. The linear modules drive the gate plate to open and close the opening on the cleaning chamber.

[0018] In one embodiment of this utility model, the lifting frame is provided with a slide rail, the gate plate is provided with a slider, the slider slides on the slide rail, the lifting frame is provided with a material pulling cylinder, the material pulling cylinder is driven connected to the gate plate, and the material pulling cylinder drives the gate plate to press against the opening on the cleaning chamber.

[0019] In one embodiment of the present invention, the support fixture includes a rotary table, a rotating platform is provided on the rotary table, and a support component is provided on the rotating platform.

[0020] In one embodiment of this utility model, the supporting component includes a positioning frame, a positioning support plate is provided on the positioning frame, a plurality of support frames are provided on both sides of the positioning frame, a movable frame is slidably provided on the support frame, the movable frame is connected to the support frame by screws, and a support top rod is provided on the movable frame.

[0021] The beneficial effects of this utility model are:

[0022] The flipping mechanism of this invention transports the wafer cassette onto the support fixture of the cleaning chamber. The gate mechanism closes the opening on the cleaning chamber, the spray mechanism sprays and cleans the outer surface of the wafer cassette, and the flipping mechanism flips the wafer cassette so that it covers the cleaning mechanism. The lifting device drives the cleaning mechanism to clean the inside of the wafer cassette, thereby completing the rapid cleaning of the wafer cassette. It dries the wafer cassette while rapidly dehydrating it, avoiding watermarks on the surface and improving the cleaning effect. The overall structure is simple. The gate mechanism can close the cleaning tank to avoid problems such as splashing of cleaning liquid and improve the efficiency of subsequent drying and cleaning. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of a wafer cassette flipping and cleaning device according to this utility model.

[0024] Figure 2 This is a schematic diagram of the flipping mechanism of this utility model.

[0025] Figure 3 This is a schematic diagram of the cleaning tank of this utility model.

[0026] Figure 4 This is a schematic diagram of the support fixture of this utility model.

[0027] Figure 5 This is a schematic diagram of the spraying mechanism of this utility model.

[0028] Explanation of the numbers in the diagram: 1. Cleaning tank; 11. Air outlet pipe; 12. Lifting driver; 13. Opening; 14. Drive shaft; 15. Guide hole; 16. Cleaning seat; 17. Cleaning pipe; 18. Cleaning nozzle; 19. Air blowing pipe; 191. Air nozzle; 192. Cleaning air knife; 193. Heating pipe; 194. Temperature sensor; 2. Gate mechanism; 21. Gate plate; 22. Linear module; 23. Lifting frame; 24. Slide rail; 25. Material pulling cylinder; 3. Tilting mechanism; 31. Clamping device 32. Holding frame; 33. Clamping bracket; 34. Tilting frame; 35. Rotating shaft; 4. Rotary motor; 4. Clamping fixture; 41. Clamping cylinder; 42. Clamping plate; 43. Guide rod; 5. Support fixture; 51. Rotary table; 52. Rotating table surface; 53. Positioning frame; 54. Positioning support plate; 55. Support frame; 56. Movable frame; 57. Support top rod; 6. Spraying mechanism; 61. Spray pipe; 62. Outer nozzle; 63. Air knife frame; 64. Spray air knife; 65. Hot air nozzle. Detailed Implementation

[0029] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, so that those skilled in the art can better understand and implement the present invention. However, the embodiments are not intended to limit the present invention.

[0030] Reference Figure 1-5 As shown, a wafer cassette flipping and cleaning device includes:

[0031] The cleaning tank 1 has a cleaning chamber inside. A support fixture 5 for loading wafer cassettes is provided on the bottom surface of the cleaning chamber. An opening 13 is provided on one side of the cleaning chamber. An air outlet pipe 11 is provided on the top of the cleaning tank 1. A drain pipe is provided at the bottom of the cleaning tank 1.

[0032] A spraying mechanism 6 is disposed on the inner wall of the cleaning chamber, and the spraying mechanism 6 is used to spray and clean the outer surface of the wafer cassette.

[0033] A cleaning mechanism is mounted on a support fixture 5. The cleaning mechanism is driven by a lifting device, which is used to drive the cleaning mechanism to clean the inside of the wafer cassette.

[0034] A gate mechanism 2 is disposed on the opening 13, and the gate mechanism 2 is used to open and close the opening 13 on the cleaning chamber;

[0035] The flipping mechanism 3 is disposed opposite to the cleaning tank 1. The flipping mechanism 3 is used to transport the wafer cassette to the support fixture 5 of the cleaning chamber and flip the wafer cassette so that it covers the cleaning mechanism.

[0036] The flipping mechanism 3 of this invention transports the wafer cassette onto the support fixture 5 of the cleaning chamber. The gate mechanism 2 closes the opening 13 on the cleaning chamber. The spray mechanism 6 sprays and cleans the outer surface of the wafer cassette. The flipping mechanism 3 flips the wafer cassette so that it covers the cleaning mechanism. The lifting device drives the cleaning mechanism to clean the inside of the wafer cassette, thereby completing the rapid cleaning of the wafer cassette. It dries the wafer cassette while rapidly dehydrating it, avoiding watermarks on its surface and improving the cleaning effect. The overall structure is simple. The gate mechanism 2 can close the cleaning tank 1 to avoid problems such as splashing of cleaning liquid and improve the efficiency of subsequent drying and cleaning.

[0037] In one embodiment of this utility model, the flipping mechanism 3 includes a flipping frame 33, on which a rotating shaft 34 is rotatably mounted. Clamping frames 31 are provided at both ends of the rotating shaft 34, and clamping fixtures 4 are provided on the clamping frames 31. The rotating shaft 34 is driven and connected to a rotary motor 35. The wafer cassette is clamped and positioned by the clamping fixtures 4 on the two clamping frames 31. The rotary motor 35 drives the rotating shaft 34 to rotate so as to flip and transport the wafer cassette on the clamping frame 31 through the opening 13 to the support fixture 5.

[0038] Specifically, the wafer cassette is placed on the support position formed by the two clamping brackets 32. The clamping fixture 4 can avoid problems such as shaking during the flipping process. The rotary motor 35 drives the rotary shaft 34 to rotate, and the wafer cassette on the clamping frame 31 enters the cleaning chamber through the opening 13. The material port of the wafer cassette is flipped downward and transported to the support fixture 5. At this time, the material port of the wafer cassette is covered on the cleaning mechanism. The wafer cassette is transported by flipping, which not only facilitates the disassembly of the wafer cassette door, but also reduces the size of the equipment for transporting the wafer cassette. At the same time, flipping transport can ensure the consistency of the wafer cassette position each time it is transported, and ensure the accuracy of subsequent processing.

[0039] In one embodiment of this utility model, the clamping fixture 4 includes a clamping bracket 32 ​​and a plurality of clamping components. The clamping bracket 32 ​​is disposed on the clamping frame 31, and the clamping components include a clamping cylinder 41. The clamping cylinder 41 is disposed on the clamping frame 31 and is drivenly connected to a clamping plate 42. A guide rod 43 on the clamping plate 42 passes through a guide sleeve on the clamping frame 31. The clamping cylinder 41 drives the clamping plate 42 to clamp and position the wafer cassette on the clamping bracket 32.

[0040] Specifically, the clamping cylinder 41 drives the clamping plate 42 to clamp and position the wafer cassette on the clamping bracket 32. The two clamping brackets 32 can easily perform initial positioning of the wafer cassette. The clamping cylinder 41 drives the clamping plate 42 to clamp the wafer cassette, which can avoid problems such as shaking during the flipping process and ensure the stability of transmission.

[0041] In one embodiment of the present invention, the spraying mechanism 6 includes a spraying frame and an air knife frame 63. The spraying frame is provided with a spraying pipe 61, and the spraying pipe 61 is provided with a plurality of outer nozzles 62. The plurality of outer nozzles 62 are arranged opposite to the wafer cassette. The air knife frame 63 is arranged in the cleaning tank 1, and the air knife frame 63 is provided with a spraying air knife 64. The spraying air knife 64 is arranged opposite to the spraying pipe 61.

[0042] Specifically, multiple outer nozzles 62 on the spray pipe 61 spray and clean the outside of the wafer cassette. The spray pipe 61 and the cleaning pipe 17 stop spraying and cleaning. The spray air knife 64 blows air onto the outer side of the wafer cassette to remove surface moisture. The spray air knife 64 may also have some hot air nozzles 65 to dry the wafer cassette with hot air. Drying is done while quickly dehydrating, which avoids watermarks on the surface and improves the cleaning effect.

[0043] In one embodiment of this utility model, the cleaning mechanism includes a cleaning base 16, on which a cleaning pipe 17, an air blowing pipe 19, and a cleaning air knife 192 are provided. The top and side of the cleaning pipe 17 are provided with cleaning nozzles 18. The cleaning pipe 17, the air blowing pipe 19, and the cleaning air knife 192 are arranged opposite to each other. The top of the air blowing pipe 19 is provided with an air nozzle 191. The cleaning base 16 is provided with a heating pipe 193, and a temperature sensor 194 is provided on one side of the heating pipe 193.

[0044] Specifically, the cleaning air knife 192 and the air nozzle 191 at the top of the air blowing pipe 19 blow air onto the inner wall of the wafer cassette to remove moisture from inside. The air nozzle 191 at the top of the air blowing pipe 19 is a radial air nozzle 191, which can remove moisture from the entire interior of the wafer cassette, resulting in a good cleaning effect. The heating tube 193 on the cleaning base 16 can heat the interior of the wafer cassette. Together with the cleaning air knife 192 or the air nozzle 191 at the top of the air blowing pipe 19, it creates gas turbulence inside for drying, improving drying efficiency.

[0045] In one embodiment of the present invention, the lifting device includes a lifting driver 12, which is disposed at the bottom of the cleaning tank 1 and is drivenly connected to a drive shaft 14. The support fixture 5 is provided with a guide hole 15, the drive shaft 14 passes through the guide hole 15, and the cleaning mechanism is disposed on the free end of the drive shaft 14.

[0046] Specifically, the lifting driver 12 drives the cleaning mechanism on the free end of the drive shaft 14 to move up and down, performing a comprehensive cleaning of the inside of the wafer cassette, resulting in high cleaning efficiency and good cleaning performance.

[0047] In one embodiment of the present invention, the gate mechanism 2 includes a gate plate 21, which is disposed opposite to the opening 13. Linear modules 22 are provided on both sides of the cleaning tank 1. The linear modules 22 are driven to be connected to the lifting frame 23. The two ends of the gate plate 21 are connected to the lifting frame 23. The linear modules 22 drive the gate plate 21 to open and close the opening 13 on the cleaning chamber.

[0048] Specifically, the linear module 22 drives the gate 21 to move toward the opening 13, so that the gate 21 moves to the position of the opening 13 to open and close the opening 13 on the cleaning chamber, which can seal the cleaning tank 1, avoid problems such as splashing of cleaning liquid, and improve the efficiency of subsequent drying and cleaning.

[0049] In one embodiment of this utility model, the lifting frame 23 is provided with a slide rail 24, the gate plate 21 is provided with a slider, the slider slides on the slide rail 24, the lifting frame 23 is provided with a material pulling cylinder 25, the material pulling cylinder 25 is drivenly connected to the gate plate 21, and the material pulling cylinder 25 drives the gate plate 21 to press against the opening 13 on the cleaning chamber.

[0050] Specifically, after the gate 21 moves to the position of the opening 13, the material pulling cylinder 25 drives the gate 21 to press against the opening 13 on the cleaning chamber, thereby closing the opening 13 on the cleaning chamber, which can press and seal the opening 13 to prevent the cleaning liquid from splashing and ensure the cleanliness of the cleaning equipment.

[0051] In one embodiment of the present invention, the support fixture 5 includes a rotary table 51, a rotating platform 52 is provided on the rotary table 51, and a support component is provided on the rotating platform 52.

[0052] Specifically, the rotating table 51 is equipped with a rotating platform 52, and the wafer cassette is located on the rotating platform 52. The wafer cassette is cleaned while rotating, which greatly ensures the comprehensive cleaning of the wafer cassette, resulting in high cleaning efficiency.

[0053] In one embodiment of the present invention, the supporting component includes a positioning frame 53, a positioning support plate 54 is provided on the positioning frame 53, a plurality of support frames 55 are provided on both sides of the positioning frame 53, a movable frame 56 is slidably provided on the support frame 55, the movable frame 56 is connected to the support frame 55 by screws, and a support top rod 57 is provided on the movable frame 56.

[0054] Specifically, when the wafer cassette's feed port is placed on the cleaning mechanism, one edge of the wafer cassette's feed port is supported and positioned by a positioning bracket 54, and it is supported by a support rod 57. The support rod 57 has a small contact area with the wafer cassette. By ensuring the wafer cassette is supported and positioned while reducing the contact area with the wafer cassette, the cleaning of the wafer cassette can be more comprehensive and the cleaning effect can be improved.

[0055] Usage process

[0056] The wafer cassette is placed on the support position formed by the two clamping brackets 32. The clamping cylinder 41 drives the clamping plate 42 to clamp and position the wafer cassette on the clamping brackets 32. The two clamping brackets 32 can facilitate the initial positioning of the wafer cassette. The clamping cylinder 41 drives the clamping plate 42 to clamp the wafer cassette, which can avoid problems such as shaking during the flipping process and ensure the stability of the transmission. The rotary motor 35 drives the rotary shaft 34 to rotate, and the wafer cassette on the clamping bracket 31 enters the cleaning chamber through the opening 13. The feed port of the wafer cassette is flipped downward and transported to the support fixture 5. At this time, the feed port of the wafer cassette is covered by the cleaning mechanism. The clamping cylinder 41 drives the clamping plate 42 to release the wafer cassette, and the clamping bracket 32 ​​returns to the initial position. The wafer cassette is transported by flipping, which not only facilitates the handling of the wafer cassette door. The disassembly can also reduce the size of the equipment for handling wafer cassettes. At the same time, the flipping and handling can ensure the consistency of the wafer cassette position each time it is handled, ensuring the accuracy of subsequent processing. When the cover of the wafer cassette's feed port is placed on the cleaning mechanism, one edge of the wafer cassette's feed port is supported and positioned by the positioning support plate 54. It is supported by the support rod 57. The contact area between the support rod 57 and the wafer cassette is small. While ensuring the support and positioning of the wafer cassette, the contact area with the wafer cassette is reduced, which can make the cleaning of the wafer cassette more comprehensive and improve the cleaning effect. The linear module 22 drives the gate plate 21 to move towards the opening 13. After the gate plate 21 moves to the position of the opening 13, the pulling cylinder 25 drives the gate plate 21 to press against the opening 13 on the cleaning chamber, thereby closing the opening 13 on the cleaning chamber.

[0057] Multiple outer nozzles 62 on the spray pipe 61 spray and clean the outside of the wafer cassette. A cleaning pipe 17 on the cleaning seat 16 passes inside the wafer cassette. Cleaning nozzles 18 on the top and sides of the cleaning pipe 17 spray and clean the inner wall of the wafer cassette. The lifting driver 12 drives the cleaning mechanism on the free end of the drive shaft 14 to move up and down, performing a comprehensive cleaning of the inside of the wafer cassette. A rotating table 51 has a rotating platform 52 on which the wafer cassette is located. The wafer cassette is cleaned while rotating, greatly ensuring comprehensive cleaning and high efficiency. After a period of high-pressure spray cleaning, the spray pipe 61 and cleaning pipe 17 stop spraying. The spray air knife 64 blows air onto the outer surface of the wafer cassette to remove surface moisture. The spray air knife 64 can also have hot air nozzles 65 to dry the wafer cassette with hot air. Air nozzles 191 on the top of the air blowing pipe 19 blow air onto the inner wall of the wafer cassette to remove moisture. The air nozzles 191 on the top of the air blowing pipe 19 are radial air nozzles, which can remove moisture from the entire interior of the wafer cassette, resulting in a good cleaning effect. The heating tube 193 on the cleaning seat 16 can heat the interior of the wafer cassette. Together with the cleaning air knife 192 or the air nozzles 191 on the top of the air blowing pipe 19, they create turbulent airflow inside for drying, improving drying efficiency. The cleaning liquid is discharged through the drain pipe, and water vapor and other gases are discharged through the air outlet pipe 11. The gate mechanism 2 opens the opening 13, and the flipping mechanism 3 then transports the cleaned wafer cassette, thus completing the rapid cleaning of the wafer cassette. It dries the wafer cassette while rapidly dehydrating it, avoiding watermarks on the surface and improving the cleaning effect. The overall structure is simple.

[0058] The above-described embodiments are merely preferred embodiments provided to fully illustrate the present invention, and the scope of protection of the present invention is not limited thereto. Equivalent substitutions or modifications made by those skilled in the art based on the present invention are all within the scope of protection of the present invention. The scope of protection of the present invention is defined by the claims.

Claims

1. A wafer cassette flipping and cleaning device, characterized in that, include: A cleaning tank has a cleaning chamber inside, and a support fixture for loading wafer cassettes is provided on the bottom surface of the cleaning chamber. An opening is provided on one side of the cleaning chamber. A spraying mechanism is disposed on the inner wall of the cleaning chamber, and the spraying mechanism is used to spray and clean the outer surface of the wafer cassette. A cleaning mechanism is mounted on a support fixture. The cleaning mechanism is driven by a lifting device, which is used to drive the cleaning mechanism to clean the inside of the wafer cassette. A gate mechanism is provided on the opening, and the gate mechanism is used to open and close the opening on the cleaning chamber; A flipping mechanism is disposed opposite to the cleaning tank. The flipping mechanism is used to transport the wafer cassette to the support fixture of the cleaning chamber and simultaneously flip the wafer cassette so that it covers the cleaning mechanism.

2. The wafer cassette flipping and cleaning equipment as described in claim 1, characterized in that, The flipping mechanism includes a flipping frame with a rotating shaft mounted on it. Clamping frames are provided at both ends of the rotating shaft, and clamping fixtures are provided on the clamping frames. The rotating shaft is driven and connected to a rotary motor. The wafer cassette is clamped and positioned by the clamping fixtures on the two clamping frames. The rotary motor drives the rotating shaft to rotate so as to flip and transport the wafer cassette on the clamping frames through the opening to the support fixture.

3. The wafer cassette flipping and cleaning equipment as described in claim 2, characterized in that, The clamping fixture includes a clamping bracket and multiple clamping components. The clamping bracket is disposed on the clamping frame, and the clamping components include a clamping cylinder. The clamping cylinder is disposed on the clamping frame and is drivenly connected to a clamping plate. A guide rod on the clamping plate passes through a guide sleeve on the clamping frame. The clamping cylinder drives the clamping plate to clamp and position the wafer cassette on the clamping bracket.

4. The wafer cassette flipping and cleaning equipment as described in claim 1, characterized in that, The spraying mechanism includes a spray frame and an air knife frame. The spray frame is equipped with a spray pipe and multiple outer nozzles. The multiple outer nozzles are arranged opposite to the wafer cassette. The air knife frame is arranged in the cleaning tank and is equipped with spray air knives. The spray air knives are arranged opposite to the spray pipe.

5. The wafer cassette flipping and cleaning equipment as described in claim 1, characterized in that, The cleaning mechanism includes a cleaning base, on which a cleaning pipe, an air blowing pipe, and a cleaning air knife are provided. Cleaning nozzles are provided on the top and sides of the cleaning pipe. The cleaning pipe, air blowing pipe, and cleaning air knife are arranged opposite to each other. An air nozzle is provided on the top of the air blowing pipe. A heating pipe is provided on the cleaning base, and a temperature sensor is provided on one side of the heating pipe.

6. The wafer cassette flipping and cleaning equipment as described in claim 1, characterized in that, The lifting device includes a lifting driver, which is disposed at the bottom of the cleaning tank and is drivenly connected to a drive shaft. The support fixture is provided with a guide hole, the drive shaft passes through the guide hole, and the cleaning mechanism is disposed on the free end of the drive shaft.

7. The wafer cassette flipping and cleaning equipment as described in claim 1, characterized in that, The gate mechanism includes a gate plate, which is arranged opposite to the opening. Linear modules are arranged on both sides of the cleaning tank. The linear modules are driven and connected to the lifting frame. The two ends of the gate plate are connected to the lifting frame. The linear modules drive the gate plate to open and close the opening on the cleaning chamber.

8. The wafer cassette flipping and cleaning equipment as described in claim 7, characterized in that, The lifting frame is equipped with a slide rail, and the gate plate is equipped with a slider. The slider slides on the slide rail. The lifting frame is equipped with a material pulling cylinder, which is connected to the gate plate. The material pulling cylinder drives the gate plate to press against the opening on the cleaning chamber.

9. The wafer cassette flipping and cleaning equipment as described in claim 1, characterized in that, The support fixture includes a rotary table, on which a rotating surface is provided, and on which a support component is provided.

10. The wafer cassette flipping and cleaning equipment as described in claim 9, characterized in that, The supporting component includes a positioning frame, on which a positioning support plate is provided. Multiple support frames are provided on both sides of the positioning frame. A movable frame is slidably mounted on the support frame. The movable frame is connected to the support frame by screws. A support top rod is provided on the movable frame.

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