Wafer cassette cleaning machine

Abstract

The utility model relates to the technical field of semiconductor processing relates to a wafer box cleaning machine. The utility model can conveniently separate and clean the box body and door body of wafer box, ensure the cleanliness of all surfaces of wafer box, improve cleaning efficiency, a plurality of cleaning openings of different sizes are arranged on the cleaning tank, so that the cleaning openings of appropriate size can be selected according to the specifications of different door bodies for cleaning, the compatibility is good, and the use cost is greatly reduced, the gate assembly can close the spray tank, the problems such as heat preservation and avoiding splashing of cleaning liquid are solved, and the subsequent drying and cleaning efficiency are improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor processing technology, and specifically to a wafer cell cleaning machine. Background Technology

[0002] Wafers need to be transported multiple times during the manufacturing process. Wafer transfer cases are containers mainly used for transporting and storing several wafers. In the semiconductor industry, wafer transfer cases need to be cleaned after a certain period of use.

[0003] Existing cleaning methods generally require cleaning the main body and its doors separately. This usually requires specialized equipment or manual labor to separate the box and the door, which affects cleaning efficiency. In addition, different door sizes require specific cleaning equipment, resulting in poor compatibility and increased cleaning costs. Furthermore, cleaning the box can only be done by spraying in one direction, requiring multiple positional changes to the box to achieve cleaning inside and out, which can lead to incomplete cleaning and low efficiency. Utility Model Content

[0004] The technical problem to be solved by this utility model is to provide a wafer box cleaning machine that can easily separate and clean the box body and door of the wafer box, ensure the cleanliness of all surfaces of the wafer box, and improve cleaning efficiency.

[0005] To solve the above-mentioned technical problems, the technical solution adopted by this utility model is as follows:

[0006] A wafer cell cleaning machine, comprising:

[0007] A frame is provided with a loading / unloading station and a cleaning station, wherein the cleaning station is arranged opposite to the loading / unloading station.

[0008] A loading and unloading mechanism is provided on the loading and unloading station. The loading and unloading mechanism includes an unloading component and at least two loading components. The loading component is used to transfer the wafer cassette to the cleaning station. The unloading component is used to unload the cleaned wafer cassette.

[0009] The door cleaning mechanism is equipped with a cleaning station. The door cleaning mechanism includes a cover removal component and a cleaning tank. The cleaning tank has multiple cleaning openings. A cleaning component is installed inside each cleaning opening. The cover removal component is used to remove the wafer cassette from the loading mechanism and transfer it to the cleaning opening. The cleaning component is used to spray and clean the door on the cleaning opening.

[0010] A wafer cassette cleaning mechanism is installed at a cleaning station. The wafer cassette cleaning mechanism includes a flipping component, a support component, a spraying component, and a spray tank. The spray tank has a transport opening. The support component and the spraying component are installed inside the spray tank. A gate component is installed on the transport opening. The flipping component is used to transport the wafer cassette after the cover is removed to the support component in the spray tank for positioning. The spraying component is used to spray and clean the inside and outside of the wafer cassette on the support component.

[0011] A conveying mechanism is disposed on the top of the frame, and the conveying mechanism is used to convey the wafer cassette cleaned by the cleaning mechanism to the unloading assembly for unloading.

[0012] The frame is equipped with a heater, which is connected to the cleaning mechanism via a pipeline. The heater is used to deliver heated cleaning fluid to the cleaning mechanism for spray cleaning.

[0013] In one embodiment of this utility model, the handling mechanism includes a handling frame, a handling bracket slidably mounted on the handling frame, the handling bracket being driven and connected to a transfer linear module on the handling frame, a lifting frame slidably mounted on the handling bracket, the lifting frame being driven and connected to a lifting linear module on the handling bracket, and a picking gripper provided on the lifting frame for gripping the wafer cassette.

[0014] In one embodiment of the present invention, a buffer mechanism is further included. The buffer mechanism is disposed opposite to the unloading mechanism. The buffer mechanism includes a buffer frame, on which a buffer support is slidably mounted. The buffer support is driven and connected to a lifting cylinder on a buffer frame. A positioning base plate is disposed on the buffer support, and a buffer pin for positioning the wafer cassette is disposed on the positioning base plate.

[0015] In one embodiment of this utility model, the loading component and the unloading component have the same structure. The loading component includes a transmission track, a carrier frame is provided on the transmission track, and a positioning fixture for loading wafer boxes is provided on the carrier frame. The transmission track is used to drive the wafer boxes on the positioning fixture to the cover removal position of the door cleaning mechanism.

[0016] In one embodiment of this utility model, the cover removal assembly includes a material removal rack, a material removal bracket slidably mounted on the material removal rack, a material removal linear module mounted on the material removal rack, the material removal linear module being drivenly connected to the material removal bracket, a vacuum suction cup portion and a connecting block matching the door body being mounted on the material removal bracket, the material removal linear module being used to drive the material removal bracket to remove the door body from the wafer cassette and transfer it to the cleaning opening for door body cleaning.

[0017] In one embodiment of this utility model, a cleaning chamber is provided in the cleaning tank, and a partition is provided on the cleaning tank to divide the cleaning chamber into multiple independent chambers. Each independent chamber is provided with a cleaning opening that matches the door body, and a drain pipe is provided on each independent chamber for draining water from its matching independent chamber.

[0018] In one embodiment of this utility model, the cleaning assembly includes a cleaning frame and a cleaning air knife. The cleaning frame is provided with a cleaning pipe, and a plurality of cleaning nozzles are evenly arranged on the cleaning pipe. The cleaning nozzles on the cleaning pipe are arranged opposite to the cleaning opening. An air knife seat is provided on the cleaning opening, and the cleaning air knife is arranged on the air knife seat. The cleaning air knife is arranged opposite to the cleaning pipe, and the cleaning air knife is used to dry the door body after it has been cleaned by the cleaning nozzles.

[0019] In one embodiment of this utility model, the flipping assembly includes a flipping frame, a rotating shaft is mounted on the flipping frame, clamping frames are provided at both ends of the rotating shaft, clamping fixtures are provided on the clamping frames, the rotating shaft is driven and connected to a rotary motor, the wafer cassette is clamped and positioned by the clamping fixtures on the two clamping frames, and the rotary motor drives the rotating shaft to rotate so as to flip and transport the wafer cassette body on the clamping frames through the transport opening to the support assembly.

[0020] In one embodiment of the present invention, the support assembly includes a rotating platform, a rotating surface is provided on the rotating platform, and a support component is provided on the rotating surface.

[0021] In one embodiment of the present invention, the spraying assembly includes an outer spraying component disposed on the inner wall of the spray tank and an inner spraying component disposed on the miscellaneous support assembly;

[0022] The outer spray component includes a spray frame and an air knife frame. The spray frame is equipped with a spray pipe and multiple outer nozzles. The multiple outer nozzles are arranged opposite to the wafer cassette on the support assembly. The air knife frame is arranged on the inner wall of the spray tank and is equipped with spray air knives. The spray air knives are arranged opposite to the spray pipe.

[0023] The inner spray component includes a spray base, on which a spray branch pipe, an air blowing pipe, and an inner air knife are provided. The spray base is mounted on a lifting drive. Inner nozzles are provided on the top and sides of the spray branch pipe. The spray branch pipe, air blowing pipe, and inner air knife are arranged opposite to each other. An air nozzle is provided on the top of the air blowing pipe. A heating pipe is provided on the spray base, and a temperature sensor is provided on one side of the heating pipe.

[0024] The beneficial effects of this utility model are:

[0025] The feeding assembly of this invention transports the wafer cassette to the cleaning station. The cap removal assembly removes the door of the wafer cassette from the feeding mechanism and transfers it to the cleaning opening. The cleaning assembly sprays the door on the cleaning opening for cleaning. The flipping assembly moves the wafer cassette body after cap removal onto the support assembly in the spray tank for positioning. The spraying assembly sprays the inside and outside of the cassette body on the support assembly for cleaning. After cleaning, the cassette body and door are returned to the feeding assembly. The transport mechanism transports the wafer cassette cleaned by the cleaning mechanism to the unloading assembly for unloading. This allows for convenient separation and cleaning of the wafer cassette body and door, ensuring the cleanliness of all surfaces of the wafer cassette and improving cleaning efficiency. The cleaning tank has multiple cleaning openings of different sizes, allowing for selection of the appropriate size opening for cleaning according to the specifications of different doors, providing good compatibility and greatly reducing operating costs. The gate assembly can seal the spray tank, providing insulation and preventing splashing of cleaning liquid, thus improving the efficiency of subsequent drying and cleaning. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of a wafer cassette cleaning machine according to the present invention.

[0027] Figure 2 This is a schematic diagram of the loading and unloading mechanism of this utility model.

[0028] Figure 3 This is a schematic diagram of the cache mechanism of this utility model.

[0029] Figure 4 This is a schematic diagram of the handling mechanism of this utility model.

[0030] Figure 5 This is a schematic diagram of the door cleaning mechanism of this utility model.

[0031] Figure 6 This is a schematic diagram of the feeding component of this utility model.

[0032] Figure 7 This is a schematic diagram of the cleaning tank of this utility model.

[0033] Figure 8 This is a side view of the cleaning tank of this utility model.

[0034] Figure 9 This is a schematic diagram of the flipping component of this utility model.

[0035] Figure 10 This is a schematic diagram of the spray tank of this utility model.

[0036] Figure 11 This is a schematic diagram of the box cleaning mechanism of this utility model.

[0037] Figure 12 This is a schematic diagram of the support component of this utility model.

[0038] Figure 13 This is a schematic diagram of the cap removal component of this utility model.

[0039] Explanation of the labels in the diagram: 1. Frame; 11. Heater; 12. Wafer box; 121. Door; 2. Transport mechanism; 21. Transport rack; 22. Transport bracket; 23. Transfer linear module; 24. Lifting linear module; 25. Lifting frame; 26. Picking gripper; 3. Buffer mechanism; 31. Buffer rack; 32. Buffer bracket; 33. Lifting cylinder; 34. Positioning substrate; 35. Buffer pin; 4. Loading / unloading mechanism; 5. Loading assembly; 522. Transfer track; 523. Positioning fixture; 524. Lifting cylinder; 525. Lifting bracket 54. Lifting gate component; 201. Material handling position; 6. Unloading assembly; 7. Cleaning station; 8. Box cleaning mechanism; 81. Spray tank; 811. Air outlet pipe; 812. Lifting drive; 813. Transport opening; 814. Drive shaft; 815. Guide hole; 816. Spray base; 817. Spray branch pipe; 818. Inner nozzle; 819. Air blowing pipe; 8191. Air nozzle; 8192. Inner air knife; 8193. Heating pipe; 8194. Temperature sensor; 82. Gate assembly; 821. Spray gate plate; 822. Gate linear module; 823, Gate frame; 83, Tilting mechanism; 831, Clamping frame; 832, Clamping bracket; 833, Tilting frame; 834, Rotating shaft; 835, Rotary motor; 84, Clamping fixture; 841, Clamping cylinder; 842, Clamping plate; 843, Guide rod; 85, Support fixture; 851, Rotating table; 852, Rotating table surface; 853, Positioning frame; 854, Positioning support plate; 855, Support frame; 856, Movable frame; 857, Support top rod; 86, Spraying assembly; 861, Spray pipe; 862, External... 863. Side nozzle; 864. Air knife holder; 865. Spray air knife; 866. Hot air nozzle; 9. Door cleaning mechanism; 95. Cover removal assembly; 951. Material removal rack; 952. Material removal linear module; 953. Material removal bracket; 954. Material removal plate; 955. Vacuum suction cup part; 956. Connecting block; 96. Cleaning assembly; 961. Cleaning tank; 962. Independent chamber; 963. Cleaning opening; 964. Cleaning chamber; 965. Cleaning pipe; 966. Cleaning nozzle; 967. Air knife seat; 968. Cleaning air knife; 9693. Drain pipe. Detailed Implementation

[0040] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, so that those skilled in the art can better understand and implement the present invention. However, the embodiments are not intended to limit the present invention.

[0041] Reference Figure 1-13 As shown, a wafer cell cleaning machine includes:

[0042] A frame 1 is provided with a loading / unloading station and a cleaning station 7, wherein the cleaning station 7 is arranged opposite to the loading / unloading station.

[0043] The loading and unloading mechanism 4 is set on the loading and unloading station. The loading and unloading mechanism 4 includes a unloading component 6 and at least two loading components 5. The loading component 5 is used to transfer the wafer cassette 12 to the picking position 201 of the cleaning station 7. The unloading component 6 is used to unload the cleaned wafer cassette 12.

[0044] Both the unloading assembly 6 and the loading assembly 5 are equipped with existing lifting door components 54, which are used to separate the cleaning station 7 and provide protection.

[0045] The door body 121 cleaning mechanism is provided with a cleaning station 7. The door body 121 cleaning mechanism includes a cover removal component 95 and a cleaning tank 961. The cleaning tank 961 has multiple cleaning openings 963. A cleaning component 96 is provided inside the cleaning opening 963. The cover removal component 95 is used to remove the door body 121 from the wafer cassette 12 located on the loading mechanism and transfer it to the cleaning opening 963. The cleaning component 96 is used to spray clean the door body 121 on the cleaning opening 963.

[0046] A housing cleaning mechanism 8 is installed on the cleaning station 7. The housing cleaning mechanism 8 includes a flipping component, a support component, a spraying component 86, and a spray tank 81. The spray tank 81 has a transport opening 813. The support component and the spraying component 86 are installed inside the spray tank 81. A gate component 82 is installed on the transport opening 813. The flipping component is used to transport the wafer housing 12 after the cover is removed to the support component in the spray tank 81 for positioning. The spraying component 86 is used to spray and clean the inner and outer sides of the housing on the support component.

[0047] The transport mechanism 2 is located on the top of the frame 1. The transport mechanism 2 is used to transport the wafer cassette 12 cleaned by the cleaning mechanism to the unloading assembly 6 for unloading.

[0048] The frame 1 is equipped with a heater 11, which is connected to the cleaning mechanism through a pipeline. The heater 11 is used to deliver the heated cleaning liquid to the cleaning mechanism for spray cleaning.

[0049] The feeding assembly 5 of this utility model transports the wafer cassette 12 to the cleaning station 7. The cap removal assembly 95 removes the door 121 of the wafer cassette 12 from the feeding mechanism and transfers it to the cleaning opening 963. The cleaning assembly 96 sprays and cleans the door 121 on the cleaning opening 963. The flipping assembly moves the wafer cassette 12 after cap removal onto the support assembly in the spray tank 81 for positioning. The spraying assembly 86 sprays and cleans the inner and outer sides of the cassette on the support assembly. After cleaning, the cassette and door 121 are returned to the feeding assembly 5. The transport mechanism 2 cleans the cleaning mechanism. The wafer cassette 12 is transported to the unloading assembly 6 for unloading, which facilitates the separation and cleaning of the cassette 12 body and the door 121, ensuring the cleanliness of all surfaces of the wafer cassette 12 and improving cleaning efficiency. The cleaning tank 961 has multiple cleaning openings 963 of different sizes, which can be selected according to the specifications of different door 121s, with good compatibility and greatly reducing the cost of use. The gate assembly 82 can seal the spray tank 81, which can keep it warm and prevent the cleaning liquid from splashing, thereby improving the efficiency of subsequent drying and cleaning.

[0050] In one embodiment of this utility model, the conveying mechanism 2 includes a conveying frame 21, a conveying bracket 22 is slidably mounted on the conveying frame 21, the conveying bracket 22 is drivenly connected to the transfer linear module 23 on the conveying frame 21, a lifting frame 25 is slidably mounted on the conveying bracket 22, the lifting frame 25 is drivenly connected to the lifting linear module 24 on the conveying bracket 22, and a picking gripper 26 is provided on the lifting frame 25, the picking gripper 26 gripping the wafer cassette 12.

[0051] Specifically, the transfer linear module 23 and the lifting linear module 24 form a two-axis motion module. The two-axis motion module drives the picking gripper 26 to move above the wafer cassette 12. The picking gripper 26 can be an electric gripper or a pneumatic gripper. After the picking gripper 26 clamps the picking position 201 on the wafer cassette 12, it moves to the unloading assembly 6 under the transport of the two-axis motion module. The unloading assembly 6 is used to transfer and move the wafer cassette 12 out, which can quickly transport the wafer cassette 12.

[0052] In one embodiment of the present invention, a buffer mechanism 3 is further included. The buffer mechanism 3 is disposed opposite to the unloading mechanism. The buffer mechanism 3 includes a buffer frame 31. A buffer support 32 is slidably mounted on the buffer frame 31. The buffer support 32 is driven and connected to a lifting cylinder 33 on the buffer frame. A positioning base plate 34 is provided on the buffer support 32. A buffer pin 35 for positioning the wafer cassette 12 is provided on the positioning base plate 34.

[0053] Specifically, the positioning substrate 34 is provided with buffer pins 35 for positioning the wafer cassette 12, which can quickly position the bottom of the wafer cassette 12. The buffer bracket 32 ​​is driven and connected to the lifting cylinder 33 on the buffer frame, which can adjust the height of the wafer cassette 12, so as to facilitate the rapid transportation of the wafer cassette 12 by the subsequent handling mechanism 2 and improve the handling efficiency.

[0054] In one embodiment of this utility model, the loading component 5 and the unloading component 6 have the same structure. The loading component 5 includes a transmission track 522, on which a carrier frame is provided. The carrier frame is provided with a positioning fixture 523 for loading the wafer cassette 12. The transmission track 522 is used to drive the wafer cassette 12 on the positioning fixture 523 to the cover removal position of the cleaning mechanism of the door 121, so as to facilitate the rapid transfer of the wafer cassette 12.

[0055] Specifically, lifting cylinders 524 are provided on both sides of the transmission track 522. The lifting cylinders 524 are driven to connect with the lifting bracket 525. The positioning fixture 523 is provided with a clearance groove that matches the lifting bracket 525. The lifting cylinders 524 drive the lifting bracket 525 to lift the wafer cassette 12 on the positioning fixture 523 so that it is removed from the positioning fixture 523.

[0056] Specifically, the lifting cylinder 524 drives the lifting bracket 525 to move upward. Since the positioning fixture 523 is equipped with a matching lifting bracket, the wafer box 12 can be lifted and positioned twice, ensuring the relative accuracy between the wafer box 12 and the material picking bracket 953 after the second positioning. This makes it easier to pick up the door 121 on the wafer box 12, and the material picking accuracy is high.

[0057] In one embodiment of this utility model, the cover-removing assembly 95 includes a material-removing rack 951, a material-removing bracket 953 slidably mounted on the material-removing rack 951, a material-removing linear module 952 mounted on the material-removing rack 951, the material-removing linear module 952 being drivenly connected to the material-removing bracket 953, the material-removing bracket 953 being provided with a vacuum suction cup 955 and a connecting block 956 matching the door body 121, the material-removing linear module 952 being used to drive the material-removing bracket 953 to remove the door body 121 from the wafer cassette 12 and transfer it to the cleaning opening 963 for cleaning the door body 121.

[0058] The material picking bracket 953 is equipped with a cylinder or other driver to drive the material picking plate 954 to move back and forth on the material picking bracket 953. The connecting block 956 can also be an unlocking block or other structure in the prior art, used to push and unlock the door body 121 and the wafer box 12 through the latch or other structure, so as to facilitate the quick picking of material from the door body 121, greatly facilitate the material picking operation of the door body 121, and can easily separate the wafer box 12 from the door body 121, further improving the efficiency of cleaning the wafer box 12.

[0059] In one embodiment of this utility model, a cleaning chamber 964 is provided inside the cleaning tank 961. A partition is provided on the cleaning tank 961 to divide the cleaning chamber 964 into multiple independent chambers 962. Each independent chamber 962 is provided with a cleaning opening 963 that matches the door body 121. Each independent chamber 962 is provided with a drain pipe 9693. The drain pipe 9693 is used to drain water from its matched independent chamber 962. By providing a drain pipe 9693 for drainage in each independent chamber 962, problems such as contamination caused by cross-flow of cleaning fluid can be avoided.

[0060] In one embodiment of this utility model, the cleaning assembly 96 includes a cleaning frame and a cleaning air knife 968. The cleaning frame is provided with a cleaning pipe 965, and a plurality of cleaning nozzles 966 are evenly arranged on the cleaning pipe 965. The cleaning nozzles 966 on the cleaning pipe 965 are arranged opposite to the cleaning opening 963. The cleaning opening 963 is provided with an air knife seat 967, and the cleaning air knife 968 is arranged on the air knife seat 967. The cleaning air knife 968 is arranged opposite to the cleaning pipe 965. The cleaning air knife 968 is used to dry the door body 121 after it has been cleaned by the cleaning nozzles 966. It can quickly clean and dry the door body 121, facilitate the rapid transfer of the door body 121, and has a fast cleaning cycle.

[0061] In one embodiment of this utility model, the flipping assembly includes a flipping frame 833, a rotating shaft 834 is rotatably mounted on the flipping frame 833, clamping frames 831 are provided at both ends of the rotating shaft 834, clamping fixtures 84 are provided on the clamping frames 831, the rotating shaft 834 is driven and connected to a rotary motor 835, the wafer cassette 12 is clamped and positioned by the clamping fixtures 84 on the two clamping frames 831, and the rotary motor 835 drives the rotating shaft 834 to rotate so as to flip and transport the wafer cassette 12 on the clamping frame 831 to the support assembly through the transport opening 813.

[0062] The clamping fixture 84 can avoid problems such as shaking during the flipping process. The rotary motor 835 drives the rotary shaft 834 to rotate, which can cover the material port of the wafer box 12 on the inner spray component. The wafer box 12 is transported by flipping, which not only facilitates the disassembly of the wafer box 12 door 121, but also reduces the size of the equipment for transporting the wafer box 12. At the same time, flipping transport can ensure the consistency of the position of the wafer box 12 each time it is transported, ensuring the accuracy of subsequent processing.

[0063] In one embodiment of this utility model, the clamping fixture 84 includes a clamping bracket 832 and a plurality of clamping components. The clamping bracket 832 is disposed on the clamping frame 831. The clamping components include a clamping cylinder 841, which is disposed on the clamping frame 831. The clamping cylinder 841 is drivenly connected to the clamping plate 842. The guide rod 843 on the clamping plate 842 passes through the guide sleeve on the clamping frame 831. The clamping cylinder 841 drives the clamping plate 842 to clamp and position the wafer cassette 12 on the clamping bracket 832.

[0064] Specifically, the clamping cylinder 841 drives the clamping plate 842 to clamp and position the wafer cassette 12 on the clamping bracket 832. The two clamping brackets 832 can easily perform initial positioning of the wafer cassette 12. The clamping cylinder 841 drives the clamping plate 842 to clamp the wafer cassette 12, which can avoid problems such as shaking during the flipping process and ensure the stability of transmission.

[0065] The gate assembly 82 includes a spray gate plate 821, which is disposed opposite to the transport opening 813. Gate linear modules 822 are provided on both sides of the spray tank 81. The gate linear modules 822 are drivenly connected to the gate frame 823. Both ends of the spray gate plate 821 are connected to the gate frame 823. The gate linear modules 822 drive the spray gate plate 821 to open and close the transport opening 813 on the spray tank 81, which can seal the spray tank 81, thereby keeping it warm and preventing the cleaning liquid from splashing, and improving the efficiency of subsequent drying and cleaning.

[0066] In one embodiment of the present invention, the support assembly includes a rotary table 851, a rotating platform 852 is provided on the rotary table 851, and a support component is provided on the rotating platform 852.

[0067] Specifically, the rotating stage 851 is equipped with a rotating platform 852, and the wafer cassette 12 is located on the rotating platform 852. The wafer cassette 12 is cleaned while rotating, which greatly ensures the comprehensive cleaning of the wafer cassette 12, resulting in high cleaning efficiency.

[0068] In one embodiment of the present invention, the supporting component includes a positioning frame 853, a positioning support plate 854 is provided on the positioning frame 853, a plurality of support frames 855 are provided on both sides of the positioning frame 853, a movable frame 856 is slidably provided on the support frame 855, the movable frame 856 is connected to the support frame 855 by screws, and a support top rod 857 is provided on the movable frame 856.

[0069] Specifically, when the cover of the feed port of the wafer cassette 12 is placed on the cleaning mechanism, one edge of the feed port of the wafer cassette 12 is supported and positioned by the positioning support plate 854, and it is supported by the support rod 857. The contact area between the support rod 857 and the wafer cassette 12 is small. While ensuring the support and positioning of the wafer cassette 12, the contact area with the wafer cassette 12 is reduced, which can make the cleaning of the wafer cassette 12 more comprehensive and improve the cleaning effect.

[0070] In one embodiment of the present invention, the spraying assembly 86 includes an outer spraying component disposed on the inner wall of the spraying tank 81 and an inner spraying component disposed on the miscellaneous support assembly;

[0071] The outer spray component includes a spray frame and an air knife frame 863. The spray frame is provided with a spray pipe 861, and the spray pipe 861 is provided with a plurality of outer nozzles 862. The plurality of outer nozzles 862 are arranged opposite to the wafer cassette 12 on the support assembly. The air knife frame 863 is provided on the inner wall of the spray tank 81. The air knife frame 863 is provided with a spray air knife 864 and a hot air nozzle 865. The spray air knife 864 is arranged opposite to the spray pipe 861.

[0072] The inner spray component includes a spray base 816, on which a spray branch pipe 817, an air blowing pipe 819, and an inner air knife 8192 are provided. The spray base 816 is mounted on a lifting drive 812. The top and side of the spray branch pipe 817 are provided with inner nozzles 818. The spray branch pipe 817, the air blowing pipe 819, and the inner air knife 8192 are arranged opposite to each other. The top of the air blowing pipe 819 is provided with an air nozzle 8191. The spray base 816 is provided with a heating pipe 8193, and a temperature sensor 8194 is provided on one side of the heating pipe 8193.

[0073] Specifically, the inner air knife 8192 and the air nozzle 8191 at the top of the air blowing pipe 819 blow air onto the inner wall of the wafer cassette 12 to remove moisture from its interior. The air nozzle 8191 at the top of the air blowing pipe 819 is a radial air nozzle, which can remove moisture from the entire interior of the wafer cassette 12, resulting in a good cleaning effect. The heating tube 8193 on the spray seat 816 can heat the interior of the wafer cassette 12. Together with the inner air knife 8192 or the air nozzle 8191 at the top of the air blowing pipe 819, it can create gas turbulence inside for drying, thereby improving drying efficiency.

[0074] Multiple outer nozzles 862 on the spray pipe 861 spray and clean the outside of the wafer cassette 12. The spray pipe 861 and spray branch pipe 817 stop spraying and cleaning. The spray air knife 864 blows air onto the outer side of the wafer cassette 12 to remove surface moisture. The spray air knife 864 may also have some hot air nozzles 865 to dry the wafer cassette 12 with hot air. Drying is done while quickly dehydrating, which avoids watermarks on the surface and improves the cleaning effect.

[0075] The lifting driver 812 is disposed at the bottom of the spray tank 81 and is drivenly connected to the drive shaft 814. The support assembly is provided with a guide hole 815, the drive shaft 814 passes through the guide hole 815, and the cleaning mechanism is disposed on the free end of the drive shaft 814.

[0076] Specifically, the lifting driver 812 drives the cleaning mechanism on the free end of the drive shaft 814 to move up and down, performing a comprehensive cleaning of the inside of the wafer cassette 12. The cleaning efficiency is high and the cleaning efficiency is good.

[0077] Usage process

[0078] The wafer cassette 12 is placed on the positioning fixture 523 on the transport frame. The transfer track 522 drives the wafer cassette 12 on the positioning fixture 523 to be transferred to the cover-removing position of the cleaning mechanism of the door 121. The material picking linear module 952 is used to drive the material picking bracket 953 to move to the position of the wafer cassette 12. The material picking bracket 953 is provided with a vacuum suction cup 955 and a connecting block 956 that matches the door 121, which can disassemble and grab the door 121. The material picking linear module 952 then drives the material picking bracket 953 to transfer the door 121 picked up by the material to the cleaning opening 963. The cleaning nozzles 966 on the cleaning tube 965 are arranged opposite to the door 121 on the cleaning opening 963. Multiple cleaning nozzles 966 on the cleaning tube 965 spray liquid to clean the door 121. After liquid cleaning, the cleaning air knife 968 blows the door 121 dry, thereby completing the material picking and cleaning of the wafer cassette 12 door 121.

[0079] The clamping fixtures 84 on the two clamping frames 831 clamp and position the wafer cassette 12. The rotary motor 835 drives the rotary shaft 834 to rotate so that the wafer cassette 12 on the clamping frame 831 is flipped and transported to the support assembly through the transport opening 813. The gate assembly 82 seals the transport opening 813. The cassette is covered by the inner spraying component. Multiple outer nozzles 862 on the spray pipe 861 spray and clean the outer side of the wafer cassette 12.

[0080] The inner nozzles 818 on the top and sides of the spray branch pipe 817 spray and clean the inner wall of the wafer cassette 12. The lifting driver 812 drives the cleaning mechanism on the free end of the drive shaft 814 to move up and down, thoroughly cleaning the inside of the wafer cassette 12. A rotating table 851 is provided with a rotating platform 852, on which the wafer cassette 12 is located, cleaning the wafer cassette 12 while it rotates. The spray air knife 864 blows air onto the outer surface of the wafer cassette 12 to remove surface moisture. The side air knife and the air nozzles 8191 on the top of the air blowing pipe 819 blow air onto the inner wall of the wafer cassette 12 to remove internal moisture, thus completing the cleaning of the cassette. The transfer mechanism 83 then transports the cleaned wafer cassette 12 to the positioning fixture 523. At the same time, the cleaned door 121 is assembled onto the cassette via the cover removal assembly 95. The transfer linear module 23 and the lifting linear module 24 form a two-axis motion module. The two-axis motion module drives the material handling gripper 26 to move above the wafer cassette 12. The material handling gripper 26 can be an electric gripper or a pneumatic gripper. After the material handling gripper 26 clamps the material handling position 201 on the wafer cassette 12, it moves to the unloading assembly 6 under the transport of the two-axis motion module. The unloading assembly 6 is used to transfer and remove the wafer cassette 12, thus completing the cleaning of the cassette and door 121 in one go, with high cleaning efficiency.

[0081] The above-described embodiments are merely preferred embodiments provided to fully illustrate the present invention, and the scope of protection of the present invention is not limited thereto. Equivalent substitutions or modifications made by those skilled in the art based on the present invention are all within the scope of protection of the present invention. The scope of protection of the present invention is defined by the claims.

Claims

1. A wafer cell cleaning machine, characterized in that, include: A frame is provided with a loading / unloading station and a cleaning station, wherein the cleaning station is arranged opposite to the loading / unloading station. A loading and unloading mechanism is provided on the loading and unloading station. The loading and unloading mechanism includes an unloading component and at least two loading components. The loading component is used to transfer the wafer cassette to the cleaning station. The unloading component is used to unload the cleaned wafer cassette. The door cleaning mechanism is equipped with a cleaning station. The door cleaning mechanism includes a cover removal component and a cleaning tank. The cleaning tank has multiple cleaning openings. A cleaning component is installed inside each cleaning opening. The cover removal component is used to remove the wafer cassette from the loading mechanism and transfer it to the cleaning opening. The cleaning component is used to spray and clean the door on the cleaning opening. A wafer cassette cleaning mechanism is installed at a cleaning station. The wafer cassette cleaning mechanism includes a flipping component, a support component, a spraying component, and a spray tank. The spray tank has a transport opening. The support component and the spraying component are installed inside the spray tank. A gate component is installed on the transport opening. The flipping component is used to transport the wafer cassette after the cover is removed to the support component in the spray tank for positioning. The spraying component is used to spray and clean the inside and outside of the wafer cassette on the support component. A conveying mechanism is disposed on the top of the frame, and the conveying mechanism is used to convey the wafer cassette cleaned by the cleaning mechanism to the unloading assembly for unloading. The frame is equipped with a heater, which is connected to the cleaning mechanism via a pipeline. The heater is used to deliver heated cleaning fluid to the cleaning mechanism for spray cleaning.

2. The wafer cell cleaning machine as described in claim 1, characterized in that, The handling mechanism includes a handling frame, on which a handling bracket is slidably mounted. The handling bracket is driven and connected to a transfer linear module on the handling frame. A lifting frame is slidably mounted on the handling bracket. The lifting frame is driven and connected to a lifting linear module on the handling bracket. A picking gripper is provided on the lifting frame, and the picking gripper grips the wafer cassette.

3. The wafer cell cleaning machine as described in claim 1, characterized in that, It also includes a buffer mechanism, which is arranged opposite to the unloading mechanism. The buffer mechanism includes a buffer frame, on which a buffer support is slidably mounted. The buffer support is driven and connected to a lifting cylinder on a buffer frame. A positioning base plate is provided on the buffer support, and a buffer pin for positioning the wafer cassette is provided on the positioning base plate.

4. The wafer cell cleaning machine as described in claim 1, characterized in that, The loading component and the unloading component have the same structure. The loading component includes a conveyor track, on which a carrier frame is provided. On the carrier frame, a positioning fixture for loading wafer boxes is provided. The conveyor track is used to drive the wafer boxes on the positioning fixture to the cover removal position of the door cleaning mechanism.

5. The wafer cell cleaning machine as described in claim 1, characterized in that, The cover removal assembly includes a material removal rack, a material removal bracket slidingly mounted on the material removal rack, a material removal linear module mounted on the material removal rack, the material removal linear module being drivenly connected to the material removal bracket, a vacuum suction cup and a connecting block matching the door body mounted on the material removal bracket, the material removal linear module being used to drive the material removal bracket to remove the door body from the wafer cassette and transfer it to the cleaning opening for door body cleaning.

6. The wafer cell cleaning machine as described in claim 1, characterized in that, The cleaning tank is provided with a cleaning chamber, and the cleaning tank is provided with a partition to divide the cleaning chamber into multiple independent chambers. Each independent chamber is provided with a cleaning opening that matches the door body. Each independent chamber is provided with a drain pipe for draining water from its matching independent chamber.

7. The wafer cell cleaning machine as described in claim 1, characterized in that, The cleaning assembly includes a cleaning frame and a cleaning air knife. The cleaning frame is provided with a cleaning pipe, and multiple cleaning nozzles are evenly arranged on the cleaning pipe. The cleaning nozzles on the cleaning pipe are arranged opposite to the cleaning opening. An air knife seat is provided on the cleaning opening, and the cleaning air knife is arranged on the air knife seat. The cleaning air knife is arranged opposite to the cleaning pipe. The cleaning air knife is used to dry the door body after it has been cleaned by the cleaning nozzles.

8. The wafer cell cleaning machine as described in claim 1, characterized in that, The flipping assembly includes a flipping frame with a rotating shaft mounted on it. Clamping frames are provided at both ends of the rotating shaft, and clamping fixtures are provided on the clamping frames. The rotating shaft is driven and connected to a rotary motor. The wafer cassette is clamped and positioned by the clamping fixtures on the two clamping frames. The rotary motor drives the rotating shaft to rotate so as to flip and transport the wafer cassette on the clamping frames through the transport opening to the support assembly.

9. The wafer cell cleaning machine as described in claim 1, characterized in that, The support assembly includes a rotating platform, on which a rotating surface is provided, and on which a support component is provided.

10. The wafer cell cleaning machine as described in claim 1, characterized in that, The spraying assembly includes an outer spraying component disposed on the inner wall of the spray tank and an inner spraying component disposed on the miscellaneous support assembly; The outer spray component includes a spray frame and an air knife frame. The spray frame is equipped with a spray pipe and multiple outer nozzles. The multiple outer nozzles are arranged opposite to the wafer cassette on the support assembly. The air knife frame is arranged on the inner wall of the spray tank and is equipped with spray air knives. The spray air knives are arranged opposite to the spray pipe. The inner spray component includes a spray base, on which a spray branch pipe, an air blowing pipe, and an inner air knife are provided. The spray base is mounted on a lifting drive. Inner nozzles are provided on the top and sides of the spray branch pipe. The spray branch pipe, air blowing pipe, and inner air knife are arranged opposite to each other. An air nozzle is provided on the top of the air blowing pipe. A heating pipe is provided on the spray base, and a temperature sensor is provided on one side of the heating pipe.

Images