SMD patch lamp bead pin multi-station bending device

Abstract

The utility model discloses a kind of SMD patch lamp bead lead pin multi-station bending device, the utility model relates to SMD patch lamp bead processing technical field, including workstation assembly, the workstation assembly includes table body, electric turntable is fixedly installed in table body middle part, five fixed assemblies are fixed in the top of electric turntable moving end, first bending assembly, second bending assembly and shaping assembly are fixedly installed in the top outer side of table body, and two idle stations are also equipped in the top outer side of table body, first bending assembly, second bending assembly, shaping assembly and two idle stations and five fixed assemblies position one-to-one correspondence, the fixed assembly includes first fixed seat, the bottom of first fixed seat is fixedly connected with the top of electric turntable, vacuum chuck is equipped in the top one side of first fixed seat;The utility model, can automatically bend and shape to patch lamp bead lead, realize multi-station automation processing, with higher practical value.

Description

Technical Field

[0001] This utility model relates to the field of SMD chip LED processing technology, specifically to a multi-station bending device for SMD chip LED pins. Background Technology

[0002] SMD (Surface Mount Device) LED chips are LED devices that utilize surface mounting technology. They encapsulate the LED chip directly onto a PCB substrate, forming miniaturized, flat LED chips that can be directly soldered onto the circuit board surface, eliminating the need for the pin insertion method of traditional LED chips.

[0003] Based on the above, the following problems were found: Current full-color SMD surface mount LEDs typically have at least six pins, and uneven bending of the pins will seriously affect the yield of subsequent soldering. Existing pin bending methods rely heavily on manual labor, and the bending angles are inconsistent, resulting in a high scrap rate and inconvenience for use.

[0004] Therefore, in view of this, we have studied and improved the existing structure and its shortcomings, and provided a multi-station bending device for SMD LED chip pins, in order to achieve a more practical purpose. Utility Model Content

[0005] The purpose of this invention is to provide a multi-station bending device for SMD chip LED leads to solve the problems mentioned in the background art.

[0006] A multi-station bending device for SMD LED chip pins includes a worktable assembly. The worktable assembly includes a table body, an electric turntable fixedly installed in the middle of the table body, and five fixing components fixed at the top of the moving end of the electric turntable. The five fixing components are arranged in a circular array. A first bending component, a second bending component, and a shaping component are fixedly installed on the outer side of the top of the table body. Two empty workstations are also provided on the outer side of the top of the table body. The positions of the first bending component, the second bending component, the shaping component, and the two empty workstations correspond one-to-one with the positions of the five fixing components. Each fixing component includes a first fixing seat. The bottom of the first fixing seat is fixedly connected to the top of the electric turntable, and a negative pressure suction cup is provided on one side of the top of the first fixing seat.

[0007] By adopting the above technical solution, five fixing components are arranged in a circular array, which facilitates the clamping and fixing of the surface mount LED beads, and facilitates the subsequent bending of the leads of the surface mount LED beads. The five fixing components form five workstations, each corresponding to a different workflow, which facilitates the electric turntable to drive the surface mount LED beads into different workflows. The setting of two control workstations facilitates the formation of a loading workstation and a unloading workstation, which allows the electric turntable to drive the fixing components to pass through the loading workstation, the first bending component, the second bending component, the shaping component, and the unloading workstation in sequence. The setting of the first fixing base facilitates the fixing of the fixing components to be fixedly installed on the top of the electric turntable, which facilitates the movement of the fixing components driven by the operation of the electric turntable. The setting of the negative pressure suction cup facilitates the negative pressure adsorption of the surface mount LED bead body, ensuring its stable fixation during processing and avoiding displacement, which facilitates the rotation of the electric turntable to drive the surface mount LED beads through each workstation.

[0008] Furthermore, a pneumatic gripper is fixedly installed on the other side of the top of the first fixed base, and a silicone clamping piece is fixedly installed on the inner side of the gripping end of the pneumatic gripper. The silicone clamping piece is arranged on both sides of the negative pressure suction cup.

[0009] By adopting the above technical solution, the silicone clips facilitate the pneumatic gripper control of the silicone clips to clamp and fix the chip LED beads adsorbed by the negative pressure suction cup, thereby improving the stability of the fixing component in fixing the chip LED beads and avoiding displacement during subsequent processing, which would affect the accuracy.

[0010] Furthermore, the first bending assembly includes a second fixing seat, the bottom of which is fixedly connected to the platform.

[0011] By adopting the above technical solution, the second fixing seat facilitates the fixed installation of the first bending component on the top of the platform, forming the first bending station, which facilitates the initial bending of the pins on both sides of the surface mount LED.

[0012] Furthermore, a first hydraulic rod is fixedly installed at the top of the second fixed base, and a bending block is fixedly installed at the output end of the first hydraulic rod. The bending block has a "C" shaped structure.

[0013] By adopting the above technical solution, the bending block is in a "C" shape, which makes it easier for the fixing component to move the surface mount LED into the bending block. When the component moves the surface mount LED into the bending block, the first hydraulic rod moves the bending block towards one end of the second fixing seat, thereby bending the pins at both ends of the surface mount LED to one side.

[0014] Furthermore, the second bending assembly includes a third fixing seat, on the top of which a mounting seat is fixedly installed.

[0015] By adopting the above technical solution and setting the third fixing seat, it is convenient to fix the second bending component on the top of the platform to form the second bending component, which facilitates further bending of the pins of the surface mount LED.

[0016] Furthermore, two second hydraulic rods are fixedly installed on both sides of the mounting base. The output ends of the two second hydraulic rods face opposite directions, and each of the output ends of the two second hydraulic rods is fixedly installed with a moving block. One end of the moving block is provided with a bending head.

[0017] By adopting the above technical solution, the second hydraulic rod facilitates the movement of the moving block, allowing the pre-bent surface mount LED to move between the two bending heads. The two bending heads approach each other and bend the pin ends bent to the surface mount side inward, so that the pins are positioned at the bottom of the surface mount LED.

[0018] Furthermore, a guide hole is provided at the other end of the movable block, and guide rods are fixedly installed at the top and bottom of the mounting base, with the guide rods slidably connected to the guide hole.

[0019] By adopting the above technical solution and setting the guide rod, it is convenient to guide and position the movement of the moving block, making the movement of the moving block more stable and accurate.

[0020] Furthermore, the shaping component includes a fourth fixed base, a third hydraulic rod is fixedly mounted on the top of the fourth fixed base, and a movable base is fixedly mounted on the output end of the third hydraulic rod.

[0021] By adopting the above technical solution and setting the fourth fixing seat, it is convenient to fix the shaping component on the top of the platform to form a shaping station, which facilitates further shaping of the bent pins, making the bent part of the pins flat and facilitating subsequent soldering.

[0022] Furthermore, the movable seat has two shaping blocks slidably connected inside, and a guide groove is provided on the inner side of the movable seat. Guide sliders are fixedly installed on both sides of one end of the shaping block, and the guide sliders are slidably connected to the guide groove.

[0023] By adopting the above technical solution, the guide groove facilitates the operation of the third hydraulic rod to drive the moving seat toward the surface mount LED, so that the shaping block presses the bent pin. During the pressing process, the two shaping blocks move closer to each other, so that the pin end moves closer to the inside of the surface mount LED during the flattening process, which helps to make the bent part of the pin flatter.

[0024] Furthermore, spring grooves are provided on opposite sides of the two shaping blocks, and buffer springs are fixedly installed inside the two spring grooves.

[0025] By adopting the above technical solution, the spring groove facilitates the fixed installation of the buffer spring. The buffer spring provides elasticity to keep the two shaping blocks away from each other and resets them. It provides buffering during pressing and shaping to prevent the pins from breaking or deforming due to excessive pressure.

[0026] Compared with the prior art, the beneficial effects of this utility model are as follows: The five fixing components arranged in a circular array facilitate the clamping and fixing of the surface-mount LED beads, making subsequent bending of the LED bead leads convenient. The five fixing components form five workstations, each corresponding to a different workflow, allowing the electric turntable to drive the surface-mount LED beads into different workflows. The two control workstations facilitate the formation of a loading and unloading workstation, allowing the electric turntable to drive the fixing components sequentially through the loading workstation, the first bending component, the second bending component, the shaping component, and the unloading workstation. The first fixing seat facilitates the fixed installation of the fixing components on the top of the electric turntable, allowing the electric turntable to move the fixing components. The negative pressure suction cup facilitates the negative pressure adsorption of the surface-mount LED bead body, ensuring stable fixation during processing and preventing displacement. This allows the rotation of the electric turntable to move the surface-mount LED beads through each workstation. This utility model can automatically bend and shape the surface-mount LED bead leads, achieving multi-station automated processing and possessing high practical value. Attached Figure Description

[0027] Figure 1 This is a three-dimensional structural diagram of a multi-station bending device for SMD chip LED leads according to this utility model;

[0028] Figure 2 This is an exploded view of the fixing component of this utility model;

[0029] Figure 3 This is a three-dimensional structural diagram of the first bending component of this utility model;

[0030] Figure 4 This is an exploded view of the second bending component of this utility model;

[0031] Figure 5 This is an exploded view of the shaping component of this utility model.

[0032] In the diagram: 1. Workbench assembly; 11. Table body; 12. Electric turntable; 2. Fixing assembly; 21. First fixed seat; 22. Negative pressure suction cup; 23. Pneumatic gripper; 24. Silicone clamp; 3. First bending assembly; 31. Second fixed seat; 32. First hydraulic rod; 33. Bending block; 4. Second bending assembly; 41. Third fixed seat; 42. Guide rod; 43. Second hydraulic rod; 44. Moving block; 45. Guide hole; 46. Bending head; 47. Mounting seat; 5. Shaping assembly; 51. Fourth fixed seat; 52. Third hydraulic rod; 53. Moving seat; 54. Guide groove; 55. Shaping pressure block; 56. Guide slider; 57. Spring groove; 58. Buffer spring. Detailed Implementation

[0033] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0034] Please see Figures 1-5This utility model provides a technical solution: a multi-station bending device for SMD LED chip leads, including a workbench assembly 1, which includes a table body 11. An electric turntable 12 is fixedly installed in the middle of the table body 11. Five fixing components 2 are fixed to the top of the moving end of the electric turntable 12, arranged in a circular array. This circular array arrangement facilitates the clamping and fixing of the SMD LED chips, enabling subsequent bending of the chip chip leads. The five fixing components 2 form five workstations, each corresponding to a different workflow, allowing the electric turntable 12 to drive the SMD LED chips into different workflows. A first bending component 3, a second bending component 4, and a shaping component 5 are fixedly installed on the outer top of the table body 11. Two empty workstations are also provided on the outer top of the table body 11. Component 5 and two empty workstations correspond one-to-one with the positions of the five fixed components 2. The setting of two control workstations facilitates the formation of loading and unloading workstations, allowing the electric turntable 12 to drive the fixed components 2 sequentially through the loading workstation, the first bending component 3, the second bending component 4, the shaping component 5, and the unloading workstation. The fixed components 2 include a first fixed base 21, the bottom of which is fixedly connected to the top of the electric turntable 12. The first fixed base 21 facilitates the fixed components 2 to be fixedly installed on the top of the electric turntable 12, making it convenient for the electric turntable 12 to move the fixed components 2. A negative pressure suction cup 22 is provided on one side of the top of the first fixed base 21. The negative pressure suction cup 22 facilitates the negative pressure adsorption of the chip LED body, ensuring its stable fixation during processing and preventing displacement. This allows the rotation of the electric turntable 12 to move the chip LEDs through each workstation.

[0035] Among them, a pneumatic gripper 23 is fixedly installed on the other side of the top of the first fixed base 21. A silicone clamping piece 24 is fixedly installed on the inner side of the gripping end of the pneumatic gripper 23. The silicone clamping piece 24 is set on both sides of the negative pressure suction cup 22. The setting of the silicone clamping piece 24 makes it easier for the pneumatic gripper 23 to control the silicone clamping piece 24 to clamp and fix the chip LED beads adsorbed by the negative pressure suction cup 22, thereby improving the stability of the fixing component 2 in fixing the chip LED beads and avoiding displacement during subsequent processing, which would affect the accuracy.

[0036] The first bending assembly 3 includes a second fixing seat 31. The bottom of the second fixing seat 31 is fixedly connected to the platform 11. The setting of the second fixing seat 31 makes it easy to fix the first bending assembly 3 on the top of the platform 11 to form a first bending station, which facilitates the initial bending of the pins on both sides of the surface mount LED.

[0037] The first hydraulic rod 32 is fixedly installed on the top of the second fixed base 31. A bending block 33 is fixedly installed on the output end of the first hydraulic rod 32. The bending block 33 has a "C" shape. The "C" shape of the bending block 33 makes it easier for the fixing component 2 to move the surface mount LED into the bending block 33. The first hydraulic rod 32 moves the bending block 33 toward one end of the second fixed base 31, thereby bending the pins at both ends of the surface mount LED to one side.

[0038] The second bending assembly 4 includes a third fixing seat 41, and a mounting seat 47 is fixedly installed on the top of the third fixing seat 41. The third fixing seat 41 facilitates the fixed installation of the second bending assembly 4 on the top of the platform 11 to form the second bending assembly 4, which facilitates further bending of the pins of the surface mount LED.

[0039] The mounting base 47 has two fixedly mounted second hydraulic rods 43 on both sides. The output ends of the two second hydraulic rods 43 face opposite directions, and each of the output ends of the two second hydraulic rods 43 has a fixedly mounted moving block 44. One end of the moving block 44 is provided with a bending head 46. The setting of the second hydraulic rods 43 makes it easy to drive the moving block 44 to move, so that the surface mount LED bead that has been initially bent can be moved between the two bending heads 46. The two bending heads 46 approach each other and bend the pin end that has been bent to the surface mount side inward, so that the pin is set at the bottom of the surface mount LED bead.

[0040] The movable block 44 has a guide hole 45 at the other end. The top and bottom of the mounting base 47 are fixedly installed with guide rods 42. The guide rods 42 are slidably connected to the guide hole 45. The guide rods 42 facilitate the guidance and positioning of the movement of the movable block 44, making the movement of the movable block 44 more stable and accurate.

[0041] The shaping component 5 includes a fourth fixed base 51, a third hydraulic rod 52 is fixedly installed on the top of the fourth fixed base 51, and a movable base 53 is fixedly installed at the output end of the third hydraulic rod 52. The fourth fixed base 51 facilitates the fixed installation of the shaping component 5 on the top of the platform 11 to form a shaping station, which facilitates further shaping of the bent pins, making the bent part of the pins flat and facilitating subsequent welding.

[0042] The movable base 53 has two shaping blocks 55 slidably connected inside. The movable base 53 has a guide groove 54 on its inner side. Guide sliders 56 are fixedly installed on both sides of one end of the shaping block 55. The guide sliders 56 are slidably connected to the guide groove 54. The guide groove 54 facilitates the operation of the third hydraulic rod 52 to drive the movable base 53 toward the surface mount LED, so that the shaping block 55 presses the bent pin. During the pressing process, the two shaping blocks 55 move closer to each other, so that the pin end moves closer to the inside of the surface mount LED during the flattening process, which helps to make the bent part of the pin flatter.

[0043] Among them, the two shaping blocks 55 have spring grooves 57 on their opposite sides, and buffer springs 58 are fixedly installed inside the two spring grooves 57. The spring grooves 57 facilitate the fixed installation of buffer springs 58. The buffer springs 58 provide elastic force to make the two shaping blocks 55 move away from each other and reset. They provide buffering during pressing and shaping to prevent the pins from breaking or deforming due to excessive pressure.

[0044] Specifically, the working principle of this multi-station bending device for SMD LED chips is as follows: During use, five fixing components 2 are arranged in a circular array to clamp and fix the SMD LED chips, facilitating subsequent bending of the chip's leads. The five fixing components 2 form five stations, each corresponding to a different workflow, allowing the electric turntable 12 to drive the SMD LED chips into different workflows. The setting of two control stations facilitates the formation of a loading station and a unloading station, allowing the electric turntable 12 to drive the fixing components 2 sequentially through the loading station, the first bending component 3, the second bending component 4, the shaping component 5, and the unloading station. The first fixing base 21 facilitates the fixed installation of the fixing components 2 on the top of the electric turntable 12. The electric turntable 12 drives the fixing component 2 to move. The negative pressure suction cup 22 facilitates the negative pressure adsorption of the SMD LED chip, ensuring stable fixation during processing and preventing displacement. The rotation of the electric turntable 12 moves the SMD LED chip through various workstations. The silicone clamp 24 allows the pneumatic gripper 23 to control the silicone clamp 24 to hold and fix the SMD LED chip adsorbed by the negative pressure suction cup 22, improving the stability of the fixing component 2 in fixing the SMD LED chip and preventing displacement during subsequent processing that could affect accuracy. The second fixing seat 31 facilitates the fixing of the first bending component 3 on the top of the platform 11, forming the first bending workstation, which facilitates the initial bending of the leads on both sides of the SMD LED chip. The bending block 33... The structure is "C" shaped, which facilitates the movement of the SMD LED bead by the fixing component 2 into the bending block 33. The first hydraulic rod 32 moves the bending block 33 towards one end of the second fixing seat 31, causing the bending block 33 to bend the leads at both ends of the SMD LED bead to one side. The third fixing seat 41 facilitates the fixing of the second bending component 4 to the top of the platform 11, forming the second bending component 4, which allows for further bending of the leads of the SMD LED bead. The second hydraulic rod 43 facilitates the movement of the moving block 44, allowing the initially bent SMD LED bead to move between the two bending heads 46. The two bending heads 46 approach each other, bending the leads bent to the SMD side inwards, positioning the leads at the bottom of the SMD LED bead. This is achieved through a guide... The rod 42 facilitates the guidance and positioning of the moving block 44, making its movement more stable and accurate. The fourth fixed seat 51 allows for the fixed installation of the shaping component 5 on the top of the platform 11, forming a shaping station for further shaping of the bent leads, ensuring a smooth bend and facilitating subsequent soldering. The guide groove 54 allows the third hydraulic rod 52 to move the moving seat 53 towards the surface mount LED, enabling the shaping pressure block 55 to press the bent leads. During pressing, the two shaping pressure blocks 55 move closer together, causing the lead ends to move towards the inside of the surface mount LED as they are flattened, resulting in a smoother bend. The spring groove 57 further enhances the shaping process.The buffer spring 58 facilitates fixed installation and provides elasticity to keep the two shaping blocks 55 away from each other and reset, providing cushioning during pressing and shaping to prevent the pins from breaking or deforming due to excessive pressure.

[0045] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A multi-station bending device for SMD surface mount LED chip leads, characterized in that, The system includes a workbench assembly (1), which includes a table body (11). An electric turntable (12) is fixedly installed in the middle of the table body (11). Five fixed components (2) are fixed at the top of the moving end of the electric turntable (12). The five fixed components (2) are arranged in a circular array. A first bending component (3), a second bending component (4), and a shaping component (5) are fixedly installed on the outer side of the top of the table body (11). Two empty workstations are also provided on the outer side of the top of the table body (11). The positions of the first bending component (3), the second bending component (4), the shaping component (5), and the two empty workstations correspond one-to-one with the positions of the five fixed components (2). The fixed component (2) includes a first fixed seat (21). The bottom of the first fixed seat (21) is fixedly connected to the top of the electric turntable (12). A negative pressure suction cup (22) is provided on one side of the top of the first fixed seat (21).

2. The multi-station bending device for SMD LED chip leads according to claim 1, characterized in that, A pneumatic gripper (23) is fixedly installed on the other side of the top of the first fixed base (21). A silicone clip (24) is fixedly installed on the inner side of the gripping end of the pneumatic gripper (23). The silicone clip (24) is arranged on both sides of the negative pressure suction cup (22).

3. The multi-station bending device for SMD LED chip leads according to claim 1, characterized in that, The first bending assembly (3) includes a second fixing seat (31), the bottom of which is fixedly connected to the platform (11).

4. The multi-station bending device for SMD LED chip leads according to claim 3, characterized in that, The top of the second fixed seat (31) is fixedly installed with a first hydraulic rod (32), and the output end of the first hydraulic rod (32) is fixedly installed with a bending block (33), which has a "C" shaped structure.

5. The multi-station bending device for SMD LED chip leads according to claim 1, characterized in that, The second bending assembly (4) includes a third fixing seat (41), and a mounting seat (47) is fixedly installed on the top of the third fixing seat (41).

6. The multi-station bending device for SMD LED chip leads according to claim 5, characterized in that, The mounting base (47) is fixedly mounted with two second hydraulic rods (43) on both sides. The output ends of the two second hydraulic rods (43) face opposite directions, and each of the output ends of the two second hydraulic rods (43) is fixedly mounted with a moving block (44). One end of the moving block (44) is provided with a bending head (46).

7. The multi-station bending device for SMD LED chip leads according to claim 6, characterized in that, The other end of the movable block (44) is provided with a guide hole (45), and the top and bottom of the mounting base (47) are fixedly installed with guide rods (42), and the guide rods (42) are slidably connected to the guide hole (45).

8. The multi-station bending device for SMD LED chip leads according to claim 1, characterized in that, The shaping component (5) includes a fourth fixed seat (51), a third hydraulic rod (52) is fixedly installed on the top of the fourth fixed seat (51), and a movable seat (53) is fixedly installed at the output end of the third hydraulic rod (52).

9. A multi-station bending device for SMD LED chip leads according to claim 8, characterized in that, The movable seat (53) has two shaping blocks (55) slidably connected inside. The movable seat (53) has a guide groove (54) on its inner side. The shaping blocks (55) have guide sliders (56) fixedly installed on both sides of one end. The guide sliders (56) are slidably connected to the guide grooves (54).

10. The multi-station bending device for SMD LED chip leads according to claim 9, characterized in that, Spring grooves (57) are provided on one side of the two shaping blocks (55), and buffer springs (58) are fixedly installed inside the two spring grooves (57).

Images