An electronic component soldering apparatus

Abstract

The utility model discloses an electronic component welding device belongs to electronic component welding technical field, the device includes injection cylinder, and the bottom of injection cylinder is provided with the output joint, and the inside slide fit of injection cylinder has the push piston, and the device still includes push rod, and the end fixed setting of push rod has the slide piston of inside slide cooperation with injection cylinder, and the bottom cooperation of slide piston is provided with the spring, and the other end cooperation of spring is provided with the plug board, and the plug board is located inside fixed position of injection cylinder, and is located between slide piston and push piston. The utility model is in use, and push rod makes slide piston move downward, and the gas below enters the sealed space between plug board and push piston through first one -way pipe valve, and the increase of gas volume produces pressure, and pushes the even extrusion of push piston tin cream. The tin cream amount of every delivery is guaranteed in the acceptable range, and too big amplitude change can not be produced, and the defective rate caused by poor welding is reduced.

Description

Technical Field

[0001] This utility model relates to the field of electronic component welding technology, and in particular to an electronic component welding device. Background Technology

[0002] Electronic component soldering is a key process that connects electronic components to substrates such as circuit boards by heating and melting solder or solder paste to achieve reliable electrical and mechanical connections.

[0003] When soldering with solder paste, first bring the refrigerated solder paste to room temperature and stir it thoroughly to avoid clumping. Load an appropriate amount of solder paste into a clean syringe, attaching a suitable needle to control the dispensing volume. Holding the syringe vertically to the substrate pads, gently push the plunger to expel the solder paste evenly, forming a dotted or linear deposit approximately 0.1-0.15mm thick. Use tweezers to pick up electronic components, place them on the solder paste-coated pads, and gently press them in place. Then, use a hot air gun to evenly heat the soldering area at an appropriate temperature (usually 240-260℃), observing the solder paste melt and flow to wet the leads. After cooling and solidifying, the soldering is complete. Maintain a clean environment during operation to prevent impurities from affecting the solder joint quality.

[0004] The shortcomings of the existing technical solutions are as follows: The current injection cylinders rely on manual control of the piston thrust to dispense solder paste, lacking a quantitative dispensing mechanism. This means the amount of solder paste dispensed each time depends solely on the operator's experience. This uncontrollability easily leads to two types of problems: insufficient dispensing results in solder paste failing to completely cover the pads or wet the component leads, causing cold solder joints; excessive dispensing causes excess solder paste to form solder balls or bridging short circuits during heating. Both situations significantly reduce soldering yield and increase rework costs. Utility Model Content

[0005] This invention provides an electronic component soldering device that can solve the problem in the prior art that cannot achieve quantitative output, resulting in the amount of solder paste extruded each time being judged only by the operator's experience, which easily leads to unstable output.

[0006] An electronic component welding apparatus includes an injection cylinder with an output connector at its bottom. A push piston is slidably fitted inside the injection cylinder. The apparatus also includes a push rod with a sliding piston fixedly mounted at its end, which slidably engages with the inside of the injection cylinder. A spring is fitted at the bottom of the sliding piston, and a stopper plate is fitted at the other end of the spring. The stopper plate is located at a fixed position inside the injection cylinder, between the sliding piston and the push piston, forming a sealed space between the sliding piston and the stopper plate, and a sealed space between the stopper plate and the push piston. A second one-way valve is provided on the sliding piston for supplying gas between the sliding piston and the stopper plate, and a first one-way valve is provided on the stopper plate for supplying gas between the stopper plate and the push piston.

[0007] As a further embodiment of this invention, the stopper plate is detachably connected to the inner wall of the syringe.

[0008] As a further embodiment of this utility model: a solder paste applicator is provided on the output connector, the solder paste applicator includes a mating connector that slides with the output connector, a connecting plate is fixedly provided at the end of the mating connector, and two sets of output tubes are provided on the connecting plate, with a shunt tube provided between each set of output tubes and the mating connector.

[0009] As a further embodiment of this invention: each set of output tubes is movably hinged to the connecting plate.

[0010] As a further embodiment of this utility model: a limiting plate is fixedly provided on the side of the plug plate near the sliding piston, and a guide plate that cooperates with the limiting plate is fixedly provided at the bottom of the sliding piston.

[0011] As a further embodiment of this utility model: the push piston is provided with a threaded hole coaxially on the side near the upper opening of the injection cylinder.

[0012] As a further embodiment of this utility model: an arc-shaped pad for supporting the stopper plate is fixedly provided on the inner side of the injection cylinder, and an L-shaped hanging plate that cooperates with the pad is fixedly provided at the bottom of the stopper plate.

[0013] As a further embodiment of this utility model: an internally threaded cylinder is fixedly provided at the lower end of the injection cylinder, the internally threaded cylinder is coaxially arranged with the output connector, and there is a gap between the internally threaded cylinder and the output connector; an externally threaded cylinder that mates with the internally threaded cylinder is fixedly provided on the connecting plate, and the externally threaded cylinder is coaxially arranged with the mating connector.

[0014] As a further embodiment of this utility model, a pressing plate is fixedly provided on the upper edge of the injection cylinder.

[0015] As a further embodiment of this utility model: a solder paste applicator is provided on the output connector, the solder paste applicator including a mating connector that is connected to the output connector, and a set of output tubes that are fixedly connected to the mating connector.

[0016] The beneficial effects of this utility model are:

[0017] 1. In use, this invention pushes the push rod to move the sliding piston downwards. Gas below enters the sealed space between the plug plate and the push piston through the first one-way valve. The increased gas volume generates pressure, pushing the push piston to evenly compress the solder paste. This ensures that the amount of solder paste delivered each time is within an acceptable range, without significant fluctuations. This reduces the problem of uneven solder paste output caused by workers being hesitant to squeeze or squeezing too much at once, thus lowering the defect rate due to poor soldering.

[0018] 2. When using this utility model, the operator can manually adjust the angle of the output tube according to actual needs, thereby changing the spacing at its ends, so that solder paste can be output to the pins of electronic components. It can adapt to the soldering of electronic components of various specifications, improve the applicability of the device, and increase production efficiency. Attached Figure Description

[0019] Figure 1 A schematic diagram of the overall structure of an electronic component welding device provided by this utility model;

[0020] Figure 2 A schematic diagram of the overall longitudinal section structure of an electronic component welding device provided by this utility model;

[0021] Figure 3 A schematic diagram of the push rod and its connecting parts for an electronic component welding device provided by this utility model;

[0022] Figure 4 A schematic diagram of the solder paste applicator structure of an electronic component soldering device provided by this utility model;

[0023] Figure 5 A schematic diagram of the plug plate structure of an electronic component welding device provided by this utility model.

[0024] Explanation of reference numerals in the attached figures:

[0025] 1. Injector; 101. Press plate; 102. Internally threaded cylinder; 104. Pad plate; 2. Output connector; 3. Plug plate; 301. First one-way valve; 302. Limiting plate; 303. L-shaped hanging plate; 4. Push piston; 401. Threaded hole; 5. Push rod; 501. Sliding piston; 502. Second one-way valve; 503. Guide plate; 6. Spring; 7. Solder paste applicator head; 701. Butt joint; 702. Connecting plate; 703. Externally threaded cylinder; 704. Output pipe; 705. Diverter pipe. Detailed Implementation

[0026] The specific embodiments of this utility model are described in detail below, but it should be understood that the protection scope of this utility model is not limited to the specific embodiments.

[0027] like Figures 1 to 5 As shown in the figure, an electronic component soldering device provided by this utility model includes an injection cylinder 1. An output connector 2 is provided at the bottom of the injection cylinder 1 for dispensing solder paste to the electronic component to be soldered. A push piston 4 is slidably fitted inside the injection cylinder 1, and the push piston 4 can move up and down within the injection cylinder 1 to push the solder paste out. The device also includes a push rod 5, the end of which is fixedly fitted with a sliding piston 501 that slidably engages with the inner side of the injection cylinder 1. The push rod 5 can push the sliding piston 501 to move along the inner side of the injection cylinder 1, thereby adjusting the internal space and pressure of the injection cylinder 1. A spring 6 is fitted at the bottom of the sliding piston 501, and a stopper plate 3 is fitted at the other end of the spring 6. The stopper plate 3 is located at a fixed position inside the injection cylinder 1, between the sliding piston 501 and the push piston 4. This ensures that the stopper plate 3 remains stationary relative to the injection cylinder 1 when other components move.

[0028] A sealed space is formed between the sliding piston 501 and the stopper plate 3, and a sealed space is also formed between the stopper plate 3 and the push piston 4. A second one-way valve 502 is provided on the sliding piston 501 for supplying gas between the sliding piston 501 and the stopper plate 3, and a first one-way valve 301 is provided on the stopper plate 3 for supplying gas between the stopper plate 3 and the push piston 4. During actual operation, when the push rod 5 is pushed to move the sliding piston 501 downwards, the sliding piston 501 will supply the gas below to the bottom of the stopper plate 3 through the first one-way valve 301, thereby increasing the gas volume between the stopper plate 3 and the push piston 4. The increased gas volume pushes the push piston 4 to move accordingly, and the movement of the push piston 4 squeezes the solder paste in the injection cylinder 1, causing it to be quantitatively discharged from the output connector 2. This ensures that the amount of solder paste delivered each time is within an acceptable range, without significant fluctuations, effectively reducing the problem of uneven solder paste output caused by operators being hesitant to squeeze or squeezing too much at once.

[0029] Two sets of limiting plates 302 are fixedly installed on the side of the stopper plate 3 near the sliding piston 501, and two sets of guide plates 503 that cooperate with the limiting plates 302 are fixedly installed at the bottom of the sliding piston 501. Figure 2 As shown, when the sliding piston 501 approaches the stopper plate 3, it will drive the guide plate 503 to insert between the limiting plates 302, thereby maintaining the minimum distance between the stopper plate 3 and the sliding piston 501. Two sets of arc-shaped and correspondingly distributed pads 104 are fixedly provided inside the injection cylinder 1 to support the stopper plate 3, as shown... Figure 3 As shown. An L-shaped hanging plate 303, which mates with the pad plate 104, is fixedly installed at the bottom of the stopper plate 3, as shown. Figure 5As shown. When installing the plug plate 3, the L-shaped hanging plate 303 can be pushed between the pads 104 first, and then the push rod 5 can be rotated. Through the transmission cooperation of the limiting plate 302 and the guide plate 503, the plug plate 3 can be rotated, thereby sending the end of the L-shaped hanging plate 303 to the bottom of the pad 104, completing the fixation of the plug plate 3 and ensuring that the plug plate 3 always maintains a stable position during the operation of the device.

[0030] The push piston 4 has a threaded hole 401 coaxially formed on the side near the upper opening of the injection cylinder 1. When all the solder paste has been dispensed from the injection cylinder 1 and more solder paste needs to be drawn, the push rod 5 and its connecting parts can be completely removed, and then screwed into the threaded hole 401 via the threaded rod, facilitating the upward pulling of the push piston 4. During the upward movement of the push piston 4, a negative pressure is generated inside the injection cylinder 1, which draws the solder paste into the injection cylinder 1. Finally, some air is drawn in to facilitate the subsequent assembly of the sliding piston 501. A press plate 101 is fixedly provided on the upper edge of the injection cylinder 1, allowing the operator to hold the injection cylinder 1 stably during solder paste extraction and dispensing, improving operational stability.

[0031] In one specific embodiment, a solder paste applicator 7 is fitted onto the output connector 2, which can simultaneously apply solder paste to the leads on both sides of an electronic component. The solder paste applicator 7 includes a mating connector 701 that slides into the output connector 2. A connecting plate 702 is fixedly mounted at the end of the mating connector 701, and two sets of output tubes 704 are movably hinged to the bottom of the connecting plate 702. This hinged connection allows for adjustment of the spacing between the ends of the output tubes 704 to accommodate different lead pitches of electronic components. A shunt tube 705 is fitted between each set of output tubes 704 and the mating connector 701. The shunt tube 705 evenly distributes the solder paste flowing from the mating connector 701 into the two sets of output tubes 704, thereby enabling simultaneous application of solder paste to the leads on both sides of the electronic component and improving soldering efficiency. An internally threaded cylinder 102 is fixedly mounted at the lower end of the injection cylinder 1. The internally threaded cylinder 102 is coaxially mounted with the output connector 2, and a gap exists between the internally threaded cylinder 102 and the output connector 2. An external threaded cylinder 703, which mates with the internal threaded cylinder 102, is fixedly mounted on the connecting plate 702. The external threaded cylinder 703 is coaxially arranged with the mating joint 701. When mating the output joint 2 and the mating joint 701, the external threaded cylinder 703 can be screwed into the internal threaded cylinder 102, thereby making the mating joint 701 and the output joint 2 nested together, thus completing the fixation of the output joint 2 and the mating joint 701 and ensuring that the solder paste applicator 7 will not loosen or fall off during operation.

[0032] In another specific embodiment, the output connector 2 is also equipped with a solder paste applicator 7, which includes a mating connector 701 that mates with the output connector 2, and a set of output tubes 704 that are fixedly connected to the mating connector 701. This allows only one set of pins to be soldered at a time, making it suitable for electronic components that require high soldering precision and need to be soldered individually for each pin.

[0033] Working principle: During device assembly, push rod 5 is first pushed to move the L-shaped hanging plate 303 at the bottom of the plug plate 3 to the spacer 104 inside the injection cylinder 1. Then, push rod 5 is rotated. Through the transmission cooperation of limiting plate 302 and guide plate 503, the plug plate 3 is rotated, thereby sending the end of the L-shaped hanging plate 303 to the bottom of the spacer 104, completing the fixation of the plug plate 3 and ensuring that the plug plate 3 maintains a stable position during device operation. At this time, a sealed space is formed between the sliding piston 501 and the plug plate 3, and a sealed space is also formed between the plug plate 3 and the push piston 4. Afterward, the external threaded cylinder 703 on the connecting plate 702 is screwed into the internal threaded cylinder 102 at the lower end of the injection cylinder 1, so that the mating joint 701 and the output joint 2 are nested together, thus completing the assembly.

[0034] After the solder paste is dispensed, the operator pushes the push rod 5, causing the sliding piston 501 at the end of the push rod 5 to move downwards along the inside of the injection cylinder 1. Gas below the sliding piston 501 is supplied to the sealed space between the stopper plate 3 and the push piston 4 through the first one-way valve 301 on the stopper plate 3, thereby increasing the gas volume between the stopper plate 3 and the push piston 4. The increased gas volume generates pressure, pushing the push piston 4 downwards within the injection cylinder 1. The movement of the push piston 4 squeezes the solder paste in the injection cylinder 1, causing it to flow out from the output connector 2 under pressure. After dispensing, the sliding piston 501 resets under the action of the spring 6, and outside air enters between the sliding piston 501 and the stopper plate 3 under the action of the first one-way valve 301, facilitating the next dispensing operation. Because the push piston 4 is moved by gas volume, the amount of solder paste dispensed each time is ensured to be within an acceptable range, without significant variations. This reduces the problem of uneven solder paste dispensing caused by operators being hesitant to dispense or dispensing too much at once, achieving quantitative dispensing of solder paste.

[0035] When soldering electronic components of different specifications, since the bottom of the connecting plate 702 is movably hinged with two sets of output tubes 704, the operator can manually adjust the angle of the output tubes 704 according to actual needs, thereby changing the spacing at their ends, to ensure that the solder paste can be accurately output to the pins of the electronic components.

[0036] After all the solder paste has been dispensed from the syringe 1, an extraction operation is required. First, remove the push rod 5 and its connecting parts from the syringe 1. Then, take a threaded rod and screw it into the threaded hole 401 on the push piston 4. Next, pull the push piston 4 upwards using the threaded rod. As the push piston 4 moves upwards, the internal space of the syringe 1 increases, and the air pressure decreases, thus creating a negative pressure. This negative pressure is used to draw the solder paste from the external container into the syringe 1. Finally, some air needs to be evacuated. This air will be expelled again when the sliding piston 501 and other components are reinstalled into the syringe 1, thus completing the reassembly operation of the syringe 1.

[0037] The above-disclosed embodiments are only a few specific examples of the present utility model. However, the embodiments of the present utility model are not limited thereto. Any changes that can be conceived by those skilled in the art should fall within the protection scope of the present utility model.

Claims

1. An electronic component welding apparatus, comprising an injection cylinder (1), wherein an output connector (2) is provided at the bottom of the injection cylinder (1), and a push piston (4) is slidably fitted inside the injection cylinder (1), characterized in that, The device also includes a push rod (5), at the end of which a sliding piston (501) is fixedly mounted and slides in cooperation with the inner side of the syringe (1). A spring (6) is mounted at the bottom of the sliding piston (501), and a stopper plate (3) is mounted at the other end of the spring (6). The stopper plate (3) is located at a fixed position inside the syringe (1) and is located between the sliding piston (501) and the push piston (4). A sealed space is formed between the sliding piston (501) and the stopper plate (3), and a sealed space is formed between the stopper plate (3) and the push piston (4). A second one-way valve (502) for supplying gas between the sliding piston (501) and the stopper plate (3) is provided on the sliding piston (501), and a first one-way valve (301) for supplying gas between the stopper plate (3) and the push piston (4) is provided on the stopper plate (3).

2. The electronic component welding apparatus as described in claim 1, characterized in that, The stopper plate (3) is detachably connected to the inner wall of the injection cylinder (1).

3. The electronic component welding apparatus as described in claim 2, characterized in that, The output connector (2) is provided with a solder paste applicator (7). The solder paste applicator (7) includes a mating connector (701) that slides with the output connector (2). A connecting plate (702) is fixedly provided at the end of the mating connector (701). Two sets of output tubes (704) are provided on the connecting plate (702). A shunt tube (705) is provided between each set of output tubes (704) and the mating connector (701).

4. The electronic component welding apparatus as described in claim 3, characterized in that, Each output tube (704) is movably hinged to the connecting plate (702).

5. An electronic component welding apparatus as described in claim 2 or 4, characterized in that, A limiting plate (302) is fixedly provided on the side of the plug plate (3) near the sliding piston (501), and a guide plate (503) that cooperates with the limiting plate (302) is fixedly provided at the bottom of the sliding piston (501).

6. The electronic component welding apparatus as described in claim 5, characterized in that, The push piston (4) has a threaded hole (401) coaxially opened on the side near the upper opening of the injection cylinder (1).

7. The electronic component welding apparatus as described in claim 6, characterized in that, The syringe (1) is fixedly provided with an arc-shaped pad (104) for supporting the stopper plate (3), and the bottom of the stopper plate (3) is fixedly provided with an L-shaped hanging plate (303) that cooperates with the pad (104).

8. The electronic component welding apparatus as described in claim 3, characterized in that, An internally threaded cylinder (102) is fixedly provided at the lower end of the injection cylinder (1). The internally threaded cylinder (102) is coaxially arranged with the output connector (2). There is a gap between the internally threaded cylinder (102) and the output connector (2). An externally threaded cylinder (703) that mates with the internally threaded cylinder (102) is fixedly provided on the connecting plate (702). The externally threaded cylinder (703) is coaxially arranged with the butt joint (701).

9. The electronic component welding apparatus as described in claim 5, characterized in that, A button plate (101) is fixedly provided on the upper edge of the syringe (1).

10. The electronic component welding apparatus as described in claim 2, characterized in that, The output connector (2) is provided with a solder paste applicator (7), which includes a mating connector (701) that is connected to the output connector (2) and a set of output tubes (704) that are fixedly connected to the mating connector (701).

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