Tool for preventing soldering internal tin pollution of SMP connector

CN224824821UActive Publication Date: 2026-10-09BEIJING RES INST OF TELEMETRY
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Patent Information

Application Number
CN202521849308.3
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-08-29
Publication Date
2026-10-09
Estimated Expiration
2035-08-29

AI Technical Summary

Technical Problem

[0005]本实用新型是为了解决SMP连接器因内部焊锡影响后续装配的问题,提供一种防止SMP连接器焊接内部锡污染的工装,工装压针1的边缘结构12能够将待焊接SMP连接器的内外边缘盖住,实现在SMP自动回流焊接时对焊锡的阻挡,本实用新型能够防止在SMP连接器焊接时,多余焊锡污染到SMP连接器内部,能够高效的完成微波组件的焊接

Benefits of technology

[0023](1)现有的工装无法有效阻挡焊锡的往SMP内部的流动,造成SMP连接器焊接时焊锡污染到SMP连接器内部,影响后续工序的装配;而本实用新型通过工装压针边缘结构将SMP连接器的内外边缘盖住,有效阻挡了SMP自动回流焊接时对焊锡流到SMP内部。

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model provides a kind of prevent SMP connector welding internal tin pollution's tool, including tool press needle, spring being sleeved in the outside of tool press needle, disc head screw being detachably connected with the rear end of tool press needle and the tool frame located the outside of microwave assembly;Tool press needle includes the press needle body, edge structure, front end structure and the insertion pin avoidance hole being connected in the front center of front end structure in turn.The edge structure of the tool press needle of the utility model can cover the inside and outside edge of the SMP connector to be welded, realize the blocking of soldering tin when SMP automatic reflow welding, the utility model can prevent excess soldering tin from polluting the inside of SMP connector when SMP connector welding, can efficiently complete the welding of microwave assembly;The utility model has universality and simplicity, suitable for the welding of SMP connector of various sizes by corresponding size adjustment.
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Description

Technical Field

[0001] This utility model relates to the field of electronic components technology, specifically to a tooling for preventing internal solder contamination during SMP connector soldering. Background Technology

[0002] Microwave components have been developing towards high integration and ultra-miniaturization over the past decade or so, and the number of connectors required for external connections has also increased, such as common SMPs, micro rectangular sockets, and glass bead insulators.

[0003] Currently, microwave components are mainly soldered using automated reflow equipment. The soldering quality of SMP connectors will seriously affect the production efficiency and soldering quality of microwave components. For example, excess solder inside the SMP connector will affect subsequent assembly.

[0004] Therefore, a device is needed to prevent internal solder contamination in SMP connector soldering. Summary of the Invention

[0005] This invention addresses the problem of internal solder affecting subsequent assembly in SMP connectors by providing a fixture to prevent internal solder contamination during SMP connector soldering. The edge structure 12 of the fixture pin 1 covers the inner and outer edges of the SMP connector to be soldered, thus blocking the solder during automatic reflow soldering of SMP connectors. This invention prevents excess solder from contaminating the inside of the SMP connector during soldering, enabling efficient soldering of microwave components.

[0006] This utility model provides a fixture for preventing internal solder contamination during SMP connector soldering, including a fixture pin, a spring sleeved on the outside of the fixture pin, a pan head screw detachably connected to the rear end of the fixture pin, and a fixture frame located outside the microwave assembly.

[0007] The tooling pressure pin includes a pressure pin body, an edge structure, a front end structure, and a pin clearance hole connected in sequence at the front center of the front end structure;

[0008] The SMP connector to be soldered includes a hollow housing and a pin that passes through and connects to the middle of the housing;

[0009] The pressure pin body is a cylindrical structure that can be detachably connected to the pan head screw. The edge structure includes a first cylinder and a second cylinder connected to the outside of the pressure pin body from back to front. The diameter of the first cylinder is larger than the diameter of the second cylinder, the diameter of the second cylinder is larger than the rear inner diameter of the outer shell, and the diameter of the pin clearance hole is larger than the pin diameter.

[0010] The SMP connector to be soldered is located on the side of the microwave assembly. The front end structure extends into the rear end of the SMP connector to be soldered. The second cylinder is positioned between the inner and outer edges of the rear of the housing. The pressure pin body is detachably connected to the pan head screw and is located between the microwave assembly and the tooling frame. The spring is located between the first cylinder and the inner wall of the tooling frame.

[0011] In a preferred embodiment of the tooling for preventing internal solder contamination during SMP connector soldering described in this utility model, the diameter of the first cylinder is greater than or equal to the rear outer diameter of the housing, and the diameter of the second cylinder is less than the rear outer diameter of the housing.

[0012] The edge structure also includes a frustum structure connected to the front of the second cylinder, with a gradually decreasing outer diameter and connected to the pressure needle body.

[0013] In a preferred embodiment of the tooling for preventing internal solder contamination during SMP connector soldering described in this utility model, the length of the pressure pin body is greater than the length of the front end structure.

[0014] The tooling for preventing internal solder contamination in SMP connectors described in this utility model is preferably made of stainless steel for the tooling pins.

[0015] The tooling for preventing internal solder contamination during SMP connector soldering described in this utility model, as a preferred embodiment, involves a solder ring placed between the SMP connector to be soldered and the microwave component.

[0016] The tooling for preventing internal solder contamination during SMP connector soldering described in this utility model, in a preferred embodiment, has a hollow frame, and the side of the tooling frame is detachably connected to the microwave component via screws.

[0017] The tooling for preventing internal solder contamination in SMP connectors described in this utility model, preferably, has an aluminum frame.

[0018] The tooling for preventing internal solder contamination during SMP connector soldering described in this utility model, in a preferred embodiment, has a threaded mounting hole at the rear of the pressure pin body, and a through hole on the tooling frame for the pressure pin body to pass through.

[0019] The tooling for preventing internal solder contamination during SMP connector soldering according to the present invention, in a preferred embodiment, includes a solder pad connected to the front end of the housing, and a pin penetrating and connecting the housing and the middle of the solder pad.

[0020] The tooling for preventing internal solder contamination during SMP connector soldering described in this utility model, as a preferred embodiment, has both the tooling pins and the SMP connector to be soldered having an axisymmetric structure.

[0021] First, a corresponding tooling pin structure is designed based on the existing SMP connector structure. Then, the tooling pin is placed into the entire tooling to complete the tooling assembly before welding. The product then enters the reflow oven to complete the welding.

[0022] This utility model has the following advantages:

[0023] (1) Existing tooling cannot effectively prevent solder from flowing into the SMP, causing solder to contaminate the inside of the SMP connector during SMP connector soldering and affecting the assembly of subsequent processes; however, this utility model covers the inner and outer edges of the SMP connector through the tooling pin edge structure, effectively preventing solder from flowing into the SMP during SMP automatic reflow soldering.

[0024] (2) Compared with other methods of blocking solder, such as applying solder resist to SMP connectors, the present invention does not require the use of other materials for soldering.

[0025] (3) This utility model is versatile and simple. By adjusting the corresponding size, it is suitable for welding SMP connectors of various sizes. Attached Figure Description

[0026] Fig. 1 This is a schematic diagram of a tooling for preventing internal solder contamination during SMP connector soldering and the installation state of the SMP connector to be soldered.

[0027] Fig. 2 This is a partial cross-sectional view of a tooling for preventing internal solder contamination during SMP connector soldering and the SMP connector to be soldered in its installed state.

[0028] Fig. 3 This is a schematic diagram illustrating the usage state of a tooling system designed to prevent internal solder contamination during SMP connector soldering.

[0029] Figure label:

[0030] 1. Tooling pin; 11. Pin body; 12. Edge structure; 121. First cylinder; 122. Second cylinder; 123. Transition structure; 13. Front end structure; 14. Pin clearance hole; 2. Spring; 3. Pan head screw; 4. Microwave assembly; 5. Tooling frame; 6. SMP connector to be soldered; 61. Housing; 62. Pin; 63. Solder pad. Detailed Implementation

[0031] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0032] Example 1

[0033] like Figs. 1-3 As shown, a tooling for preventing internal solder contamination in SMP connector soldering includes a tooling pin 1, a spring 2 sleeved on the outside of the tooling pin 1, a pan head screw 3 detachably connected to the rear end of the tooling pin 1, and a tooling frame 5 located outside the microwave assembly 4.

[0034] Both the tooling pin 1 and the SMP connector 6 to be soldered are axisymmetric structures;

[0035] The tooling pin 1 includes a pin body 11, an edge structure 12, a front end structure 13, and a pin clearance hole 14 connected in sequence at the front center of the front end structure 13. The rear part of the pin body 11 is provided with a threaded mounting hole. The tooling pin 1 is made of aluminum. The pin body 11 is a cylindrical structure that can be detachably connected to the pan head screw 3. The length of the pin body 11 is greater than the length of the front end structure 13.

[0036] The edge structure 12 includes a first cylinder 121, a second cylinder 122, and a frustum structure 123 connected to the front of the pressure needle body 1 from back to front, the outer diameter of which gradually decreases and is connected to the pressure needle body 11.

[0037] The SMP connector 6 to be soldered includes a hollow housing 61, a pin 62 that passes through and is connected to the middle of the housing 61, and a pad 63 that is connected to the front end of the housing 61. The pin 62 passes through and is connected to the middle of the housing 61 and the pad 63.

[0038] The diameter of the first cylinder 121 is greater than the diameter of the second cylinder 122, the diameter of the second cylinder 122 is greater than the rear inner diameter of the outer shell 61, and the diameter of the pin clearance hole 14 is greater than the diameter of the pin 62; the diameter of the first cylinder 121 is greater than or equal to the rear outer diameter of the outer shell 61, and the diameter of the second cylinder 122 is less than the rear outer diameter of the outer shell 61.

[0039] The SMP connector 6 to be soldered is located on the side of the microwave assembly 4. The front end structure 13 extends into the rear end of the SMP connector 6 to be soldered. The second cylinder 122 is placed between the inner and outer edges of the rear part of the housing 61. The pressure pin body 11 is detachably connected to the pan head screw 3 and is located between the microwave assembly 4 and the tooling frame 5. The spring 2 is located between the first cylinder 121 and the inner wall of the tooling frame 5.

[0040] A solder ring is placed between the SMP connector 6 to be soldered and the microwave component 4.

[0041] The tooling frame 5 is a hollow structure. The side of the tooling frame 5 is detachably connected to the microwave component 4 by screws. The tooling frame 5 is provided with a through hole through which the pressure needle body 11 can pass. The tooling frame 5 is made of aluminum.

[0042] In this embodiment, the diameter of the pressure needle body is 3mm and the length is 15mm, the diameter of the first cylinder 121 is 4mm and the length is 0.5mm, the diameter of the second cylinder 122 is 3.8mm and the length is 0.5mm, the length of the transition structure 123 is 0.3mm, the diameter of the front end structure 13 is 3mm and the length is 2.7mm, and the diameter of the insertion needle clearance hole 14 is 0.4mm and the length is 1.5mm.

[0043] The diameter of pin 62 is 0.38mm.

[0044] The method of using this utility model is as follows:

[0045] (1) The SMP connector 6 to be soldered is designed with a tooling pin 1 having an edge structure 12. The edge structure 12 of the tooling pin 1 can cover the inner and outer edges of the SMP connector to be soldered, thereby blocking the solder during SMP automatic reflow soldering.

[0046] (2) The spring 2 is sleeved on the pressure needle body 11. The rear end of the pressure needle body 11 passes through the opening on the tooling frame 5. The tooling pressure needle 1 is assembled on the tooling frame 5 using a pan head screw 3. The mounting screw 3 is tightened with a force of 35 cN·m. The head size of the pan head screw 3 is larger than the opening on the tooling frame 5.

[0047] (3) Install the SMP connector 6 (model: SMP(M)-JHD8, manufactured by Xi'an Elite Electronic Industry Co., Ltd.) to be soldered onto the microwave assembly 4, and place the solder ring (Pn63Pb37) and apply flux. Then, place the microwave assembly 4 into the corresponding position in the fixture frame 5 and fix it with screws. The compression of the spring 2 is 3mm.

[0048] (4) Place the assembled tooling frame 5 onto the reflow oven carrier to complete the reflow soldering process of SMP connector 2 and microwave component 4.

[0049] (5) After all the components have cooled down, clean the flux from microwave component 4.

[0050] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A tooling for preventing internal solder contamination during SMP connector soldering, characterized in that: It includes a tooling pin (1), a spring (2) sleeved on the outside of the tooling pin (1), a pan head screw (3) detachably connected to the rear end of the tooling pin (1), and a tooling frame (5) located outside the microwave assembly (4); The tooling pressure pin (1) includes a pressure pin body (11), an edge structure (12), a front end structure (13), and a pin clearance hole (14) connected in sequence to the front center of the front end structure (13); The SMP connector (6) to be soldered includes a hollow housing (61) and a pin (62) that passes through and connects to the middle of the housing (61); The pressure pin body (11) is a cylindrical structure that is detachably connected to the pan head screw (3). The edge structure (12) includes a first cylinder (121) and a second cylinder (122) connected from back to front to the outside of the pressure pin body (11). The diameter of the first cylinder (121) is larger than the diameter of the second cylinder (122). The diameter of the second cylinder (122) is larger than the rear inner diameter of the outer shell (61). The diameter of the pin clearance hole (14) is larger than the diameter of the pin (62). The SMP connector (6) to be soldered is located on the side of the microwave assembly (4). The front end structure (13) extends into the rear end of the SMP connector (6) to be soldered. The second cylinder (122) is positioned between the inner and outer edges of the rear part of the housing (61). The pressure pin body (11) is detachably connected to the pan head screw (3) and is located between the microwave assembly (4) and the tooling frame (5). The spring (2) is located between the first cylinder (121) and the inner wall of the tooling frame (5).

2. The tooling for preventing internal solder contamination in SMP connector soldering according to claim 1, characterized in that: The diameter of the first cylinder (121) is greater than or equal to the rear outer diameter of the outer shell (61), and the diameter of the second cylinder (122) is smaller than the rear outer diameter of the outer shell (61). The edge structure (12) also includes a frustum structure (123) connected to the front of the second cylinder (122), with a gradually decreasing outer diameter and connected to the pressure needle body (11).

3. The tooling for preventing internal solder contamination in SMP connector soldering according to claim 1, characterized in that: The length of the pressure needle body (11) is greater than the length of the front end structure (13).

4. The tooling for preventing internal solder contamination in SMP connector soldering according to claim 1, characterized in that: The tooling needle (1) is made of stainless steel.

5. The tooling for preventing internal solder contamination in SMP connector soldering according to claim 1, characterized in that: A solder ring is provided between the SMP connector (6) to be soldered and the microwave component (4).

6. The tooling for preventing internal solder contamination in SMP connector soldering according to claim 1, characterized in that: The tooling frame (5) is a hollow structure, and the side of the tooling frame (5) is detachably connected to the microwave component (4) by screws.

7. The tooling for preventing internal solder contamination in SMP connector soldering according to claim 1, characterized in that: The tooling frame (5) is made of aluminum.

8. The tooling for preventing internal solder contamination in SMP connector soldering according to claim 1, characterized in that: The rear part of the pressure needle body (11) is provided with a threaded mounting hole, and the tooling frame (5) is provided with a through hole through which the pressure needle body (11) can pass.

9. The tooling for preventing internal solder contamination in SMP connector soldering according to claim 1, characterized in that: The SMP connector (6) to be soldered also includes a pad (63) connected to the front end of the housing (61), and the pin (62) is connected through the middle of the housing (61) and the pad (63).

10. The tooling for preventing internal solder contamination in SMP connector soldering according to claim 1, characterized in that: Both the tooling pin (1) and the SMP connector to be soldered (6) are axisymmetric structures.