A multi-wavelength laser processing device for OLED panel repair

Abstract

The utility model relates to laser processing technical field. Provide a kind of for the multi-wavelength laser processing device of OLED panel repair, it includes: upper light path pedestal, upper light path mechanism, lower light path pedestal and lower light path mechanism, upper light path mechanism is set on upper light path pedestal, first through-hole is provided on upper light path pedestal, lower light path pedestal is set below upper light path pedestal and with upper light path pedestal sliding connection, lower light path mechanism is set on lower light path pedestal;Upper light path mechanism includes several laser generating parts and several light path guide components, and several light path guide components are set on the light path of several laser generating parts corresponding;The number of first through-hole corresponds with the number of laser generating part, and the laser beam generated by each laser generating part passes through corresponding first through-hole and enters lower light path mechanism. Solve the problem that the existing multi-wavelength laser processing device is fixed due to upper and lower light path position, leads to cumbersome operation, positioning error is big, and light path guide is not accurate, leads to laser deviation and energy loss.

Description

Technical Field

[0001] This utility model relates to the field of laser processing technology, and more specifically, to a multi-wavelength laser processing device for OLED panel repair. Background Technology

[0002] With the continuous development of display technology, Organic Light Emitting Diode (OLED) panels, due to their excellent characteristics such as self-illumination, high contrast, wide viewing angle, and low power consumption, have been widely used in various fields such as smartphones, tablets, automotive displays, and flexible displays. During the manufacturing process of OLED panels, factors such as the precision of the evaporation process, mask defects, and foreign matter adhesion can easily lead to various minor defects, including pixel failure, micro-circuit breaks, and damage to the organic functional layer. These defects directly result in a decrease in panel yield; therefore, high-precision repair of OLED panels has become a key step in improving production efficiency.

[0003] Laser processing technology has become a core method for repairing minute defects in OLED panels due to its advantages such as non-contact operation, high precision, and small heat-affected zone. Among them, multi-wavelength laser processing devices are particularly important. Different wavelengths of lasers can match the material characteristics of different functional layers of OLED panels (such as metal electrode layers, organic light-emitting layers, and encapsulation layers). For example, short-wavelength lasers are suitable for removing surface foreign objects and repairing fine circuits, while long-wavelength lasers can be used for repairing deep circuit continuity, thereby achieving targeted treatment of various types of defects. However, existing multi-wavelength laser processing equipment still has significant shortcomings in practical applications: On the one hand, most devices use an integrated fixed installation method for the upper and lower optical path mechanisms, and the relative positions of the upper and lower optical path bases are not adjustable. When it is necessary to repair defects in different areas of the OLED panel, the panel needs to be moved frequently or the processing device needs to be adjusted as a whole. This is not only cumbersome to operate, but also prone to laser focusing deviation due to movement and positioning errors, affecting the repair accuracy. On the other hand, the corresponding design of the optical path guiding components and laser generators of multi-wavelength lasers is not perfect. Some devices lack dedicated optical path conduction and positioning structures, which makes it easy for the laser beam to deviate and lose energy during the transmission from the upstream optical path to the downstream optical path. It is difficult to ensure that each wavelength of laser acts accurately on the repair point, ultimately reducing the repair yield and processing efficiency, and failing to meet the high-precision and high-efficiency repair requirements of OLED panels. Utility Model Content

[0004] The purpose of this invention is to provide a multi-wavelength laser processing device for OLED panel repair, which aims to solve the problems of cumbersome operation, large positioning error, and laser deviation and energy loss caused by the fixed positions of the upper and lower optical paths in existing multi-wavelength laser processing devices, as well as the problems caused by inaccurate optical path guidance.

[0005] This utility model is achieved through the following technical solution: A multi-wavelength laser processing apparatus for OLED panel repair includes: an upper optical path base, an upper optical path mechanism, a lower optical path base, and a lower optical path mechanism. The upper optical path mechanism is disposed on the upper optical path base, and the upper optical path base is provided with a first through hole. The lower optical path base is disposed below the upper optical path base and is slidably connected to the upper optical path base. The lower optical path mechanism is disposed on the lower optical path base. The upper optical path mechanism includes a plurality of laser generators and a plurality of optical path guiding components. The plurality of optical path guiding components are disposed on the optical paths corresponding to the plurality of laser generators. The number of the first through holes corresponds to the number of laser generators. The laser beam generated by each laser generator passes through the corresponding first through hole and enters the lower optical path mechanism.

[0006] Optionally, the plurality of laser generating components include: a first laser component, a second laser component, and a third laser component, wherein the first laser component, the second laser component, and the third laser component are all disposed on the upper optical path base, and the optical paths of the first laser component, the second laser component, and the third laser component do not interfere with each other.

[0007] Optionally, the first laser component is provided with a first emission port, a second emission port and a third emission port, and the wavelengths of the laser beams emitted from the first emission port, the second emission port and the third emission port are different from each other.

[0008] Optionally, a wavelength conversion component is provided in the laser beam path emitted by the third laser component. The wavelength conversion component includes a focusing lens, a nonlinear crystal, and a collimating lens. The focusing lens is disposed on the incident side of the nonlinear crystal, and the collimating lens is disposed on the exit side of the nonlinear crystal.

[0009] Optionally, the first laser component is a femtosecond laser, the second laser component is a continuous green laser, and the third laser component is a nanosecond laser.

[0010] Optionally, the lower optical path mechanism includes a slit assembly and a galvanometer assembly, both of which are disposed on the lower optical path base. The slit assembly is located upstream of the galvanometer assembly, and the laser beam passes through the slit assembly and the galvanometer assembly in sequence.

[0011] Optionally, the slit assembly has a second through hole that penetrates the slit assembly. The slit assembly is internally provided with a first X-axis adjusting member, a second X-axis adjusting member, a first Y-axis adjusting member, and a second Y-axis adjusting member. The adjacent sides of the first X-axis adjusting member, the second X-axis adjusting member, the first Y-axis adjusting member, and the second Y-axis adjusting member form a rectangular through hole located at the second through hole. The first X-axis adjusting member, the second X-axis adjusting member, the first Y-axis adjusting member, and the second Y-axis adjusting member are all slidably connected to the slit assembly.

[0012] Optionally, it also includes a camera, an objective lens switching mechanism, and an objective lens. The camera and the objective lens switching mechanism are disposed on the lower optical path base, and the objective lens is disposed on the objective lens switching mechanism. The camera is located downstream of the lower optical path mechanism, and the objective lens switching mechanism is located downstream of the camera.

[0013] Optionally, the objective lens switching mechanism includes: a bracket, a linear guide rail, a sliding seat, and a driving component. The bracket is disposed on the lower optical path base, the linear guide rail is fixed on the bracket, the sliding seat is slidably disposed on the linear guide rail, the objective lens is mounted on the sliding seat, and the driving component is connected to the sliding seat to drive it to move along the linear guide rail.

[0014] Optionally, the optical path guiding assembly includes at least one of a reflector and a lens.

[0015] The technical solution of this utility model has at least the following advantages and beneficial effects: By designing the upper and lower optical path bases as a sliding connection structure, the relative positions of the upper and lower optical path mechanisms can be adjusted. When repairing defects in different areas of the OLED panel, there is no need to frequently move the panel or adjust the processing device as a whole. The repair points can be quickly aligned by sliding adjustment, which effectively simplifies the operation process and avoids the cumulative positioning error caused by multiple movements, significantly improving the accuracy of laser focusing and repair precision.

[0016] By setting a first through hole on the upper optical path base that corresponds one-to-one with the laser generator, and combining it with the targeted design of the optical path guiding component, a precise optical path conduction and positioning path is constructed. This ensures that the multi-wavelength laser beam is not prone to deviation or energy loss during transmission from the generator to the downstream optical path, and ensures that each wavelength laser can accurately act on the repair points of specific functional layers of the panel, thereby improving the stability and energy utilization of the repair process.

[0017] It can achieve high-precision coordinated control of multi-wavelength lasers, adapting to the repair needs of different material properties such as the metal electrode layer and organic light-emitting layer of OLED panels. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall structure of the multi-wavelength laser processing device for OLED panel repair according to an embodiment of the present invention; Figure 2 This is a schematic diagram of the upper optical path mechanism of the multi-wavelength laser processing device for OLED panel repair according to an embodiment of the present invention; Figure 3 This is a schematic diagram of the overall structure of the slit assembly of the multi-wavelength laser processing device for OLED panel repair according to an embodiment of the present invention; Figure 4 This is a top view of the slit assembly of the multi-wavelength laser processing device for OLED panel repair according to an embodiment of the present invention. Figure 5 This is a cross-sectional view of the slit assembly of the multi-wavelength laser processing apparatus for OLED panel repair according to an embodiment of the present invention. Figure 6 for Figure 5 Enlarged structural diagram at point A in the middle; Icons: 1-Upper optical path base, 101-First through hole, 102-Optical path guiding component, 2-First laser component, 201-First emission port, 202-Second emission port, 203-Third emission port, 3-Second laser component, 4-Third laser component, 401-Wavelength conversion component, 5-Lower optical path base, 6-Slit component, 601-Second through hole, 602-First X-axis adjustment component, 603-Second X-axis adjustment component, 604-First Y-axis adjustment component, 605-Second Y-axis adjustment component, 7-Galvanometer component, 8-Camera, 9-Objective lens switching mechanism, 10-Objective lens. Detailed Implementation

[0019] The following is a detailed description of the embodiments, in conjunction with the accompanying drawings.

[0020] Reference Figure 1 , Figure 2A multi-wavelength laser processing apparatus for OLED panel repair includes: an upper optical path base 1, an upper optical path mechanism, a lower optical path base 5, and a lower optical path mechanism. The upper optical path mechanism is disposed on the upper optical path base 1, and the upper optical path base 1 has a first through hole 101. The lower optical path base 5 is disposed below the upper optical path base 1 and slidably connected to the upper optical path base 1. The lower optical path mechanism is disposed on the lower optical path base 5. The upper optical path mechanism includes a plurality of laser generators and a plurality of optical path guiding components 102, which are disposed on the optical paths corresponding to the plurality of laser generators. The number of first through holes 101 corresponds to the number of laser generators, and the laser beam generated by each laser generator passes through the corresponding first through hole 101 into the lower optical path mechanism. The upper optical path base 1, as a support platform for the upper optical path mechanism, can be made of a rigid material (such as aluminum alloy or steel) to ensure stability. The upper optical path base 1 has multiple first through holes 101, the number of which corresponds to the number of laser generators. The positions of the through holes are precisely aligned with the laser optical path for downward transmission of the laser beam. Each laser generator can correspond to multiple optical path guiding components 102. The optical path guiding components 102 may include optical elements such as lenses, mirrors, and beam expanders to calibrate and focus the laser beam, ensuring concentrated laser energy and accurate direction. The optical path guiding components 102 are positioned along the output optical path of the laser generator, guiding the laser beam to the corresponding first through hole 101. The sliding connection between the upper optical path base 1 and the lower optical path base 5 can be driven by a high-precision linear guide rail and a servo motor to achieve micron-level positioning. The relative position of the lower optical path base 5 can be adjusted by a control system (such as a PLC or industrial computer), thereby moving the lower optical path mechanism without moving the OLED panel or the entire device. A locking mechanism (such as pneumatic or mechanical locking) can be provided at the sliding connection to fix the lower optical path base after positioning, preventing deviations caused by vibration. After receiving the laser, the lower optical path mechanism uses internal optical elements for secondary focusing and deflection, ultimately targeting the defective areas of the OLED panel (such as the electrode layer and organic layer). Different wavelengths of laser light can be used to remove foreign objects, repair micro-circuit breaks, or activate the organic layer.

[0021] In some embodiments, the plurality of laser generating components include: a first laser component 2, a second laser component 3, and a third laser component 4. All three components are mounted on the upper optical path base 1, and their optical paths do not interfere with each other. The first laser component 2, second laser component 3, and third laser component 4 adopt a modular design and are respectively installed at specific positions on the upper optical path base 1 using high-precision brackets or mounting bases. During installation, it is ensured that the optical axes of each component are parallel or arranged at a preset angle to avoid physical spatial interference. Each laser component corresponds to a different wavelength range. For example, the first laser component 2 can generate short-wavelength lasers (such as ultraviolet lasers, with a wavelength of approximately 266nm), suitable for removing foreign matter from the surface of OLED panels or repairing fine circuits; the second laser component 3 can generate medium-wavelength lasers (such as green lasers, with a wavelength of approximately 532nm), used for repairing intermediate layer electrodes; and the third laser component 4 can generate long-wavelength lasers (such as infrared lasers, with a wavelength of approximately 1064nm), suitable for deep circuit conduction or organic layer activation. Each laser component is independently equipped with an optical path guiding assembly 102, including optical elements such as collimating lenses, reflecting mirrors, beam expanders, and focusing lenses. The optical path guiding assembly 102 is precisely arranged along the output optical path of the laser generator, forming a closed or semi-closed optical path channel to prevent external interference. The non-interference of optical paths avoids energy cross-loss or mutual interference between multiple laser beams during transmission, ensuring the energy concentration and focusing accuracy of each laser beam. Simultaneously, the modular optical path design reduces adjustment complexity and minimizes repair deviations caused by optical path misalignment, achieving micron-level processing accuracy.

[0022] In some embodiments, the first laser component 2 is provided with a first emission port 201, a second emission port 202, and a third emission port 203, and the wavelengths of the laser beams emitted from the first emission port 201, the second emission port 202, and the third emission port 203 are different from each other. The first laser component 2 can be a femtosecond laser, whose basic light source is usually a femtosecond pulsed laser in the infrared band (such as a center wavelength of about 1040 nm). Femtosecond lasers have the characteristics of ultrashort pulse width (typically on the order of 10^-15 seconds), high peak power, and low average power, making them suitable for high-precision processing. The femtosecond laser integrates a nonlinear frequency conversion module (such as a frequency doubling, third harmonic, or optical parametric oscillator) to perform wavelength conversion through a crystal (such as a BBO, LBO, etc.). For example: The first emission port 201 can output green laser (wavelength approximately 520nm) through frequency doubling technology. The second outlet 202 can output ultraviolet laser (wavelength approximately 347nm) through frequency triplet technology. The third exit port 203 can retain the fundamental frequency infrared laser (wavelength approximately 1040nm).

[0023] Each exit port is independently equipped with an optical modulation element (such as an acousto-optic modulator or an electro-optic modulator) to control the laser's switching, pulse energy, and repetition frequency, ensuring that the laser parameters for each wavelength can be adjusted independently. Each exit port is equipped with a corresponding optical path guiding component 102 (such as a collimating lens, a reflector, and a focusing lens) to ensure that the laser beam emitted from the exit port can be accurately calibrated and guided to the corresponding first through-hole 101.

[0024] In some embodiments, a wavelength conversion component 401 is provided in the laser beam path emitted from the third laser component 4. The wavelength conversion component 401 includes a focusing lens, a nonlinear crystal, and a collimating lens. The focusing lens is disposed on the incident side of the nonlinear crystal, and the collimating lens is disposed on the emitting side of the nonlinear crystal. The third laser component 4 can use a nanosecond laser as the basic light source to output fundamental frequency infrared laser (e.g., wavelength approximately 1064 nm), suitable for deep circuit conduction or organic layer activation and repair of OLED panels. To expand the applicable wavelength range, the wavelength conversion component 401 is integrated in the laser beam path emitted from the third laser component 4. The wavelength conversion component 401 is composed of a focusing lens, a nonlinear crystal, and a collimating lens in sequence. In practice, a focusing lens is installed on the incident side of the nonlinear crystal to converge the fundamental frequency light output from the nanosecond laser to the active region of the nonlinear crystal, thereby increasing the optical power density. The nonlinear crystal can be of types such as BBO (barium β-borate) or LBO (lithium triborate), and converts the fundamental frequency light into a new wavelength laser through second-order nonlinear optical effects (such as frequency doubling, sum-frequency doubling, or difference-frequency doubling) (for example, 1064nm infrared light is frequency-doubled to produce 532nm green light). A collimating lens is placed on the exit side of the nonlinear crystal to re-collimate the converted divergent laser beam into parallel light, ensuring laser directionality and energy stability, facilitating focusing and deflection by the subsequent optical path guiding assembly 102. The entire wavelength conversion assembly 401 is fixed in the optical path by a bracket, and the optical axes of each optical element are strictly aligned to reduce energy loss and beam distortion.

[0025] In some embodiments, the second laser component 3 may be a continuous green laser. It is suitable for repairing defects located in the middle functional layer of a panel, such as annealing fine ITO lines to eliminate microcracks, or performing gentle heat treatment on specific organic layers to improve electrical contact, without causing excessive ablation of the surface layer as short-wavelength ultraviolet light, nor penetrating too deeply as long-wavelength infrared light.

[0026] In some embodiments, the lower optical path mechanism includes a slit assembly 6 and a galvanometer assembly 7, both disposed on the lower optical path base 5. The slit assembly 6 is located upstream of the galvanometer assembly 7, and the laser beam passes sequentially through the slit assembly 6 and the galvanometer assembly 7. The core of the slit assembly 6 is a high-precision, adjustable-width slit aperture, comprising a pair of parallel blades. The distance between the two blades is controlled by a precision micro-motion mechanism (such as a stepper motor or piezoelectric ceramic driver), thereby changing the slit width. The laser beam transmitted from the upper optical path mechanism through the first through-hole 101 first illuminates the slit assembly 6. The adjustable slit serves to shape the beam and filter stray light. Beam shaping: trimming the cross-section (usually circular) of the laser beam into a rectangular or linear spot that better matches the shape of the defect to be repaired. For example, for the repair of fine lines, a narrow slit can be used to form a linear spot to improve repair accuracy. Filtering stray light: The slit allows the high-energy, high-quality portion of the laser beam to pass through, while blocking the low-energy, poorly directional stray light from the edges caused by diffraction or defects in optical elements, thereby improving the quality of the laser beam acting on the workpiece.

[0027] The galvanometer assembly 7 follows immediately after the slit assembly 6 and is fixed to the lower optical path base 5. The galvanometer assembly 7 is the core component for achieving rapid and precise laser positioning. It mainly consists of a pair of high-speed galvanometer motors (controlling the X-axis and Y-axis mirrors respectively), a scanning lens (f-theta lens), and corresponding control circuitry. The laser beam, after being shaped and filtered by the slit, is incident on the X-axis and Y-axis mirrors of the galvanometer assembly 7. The control system drives the two galvanometer motors to deflect the mirrors at high speed and with precision according to a preset repair pattern path. The deflected laser beam then passes through a specially designed scanning lens (f-theta lens). This lens ensures that the laser beam, at different deflection angles, forms a dimensionally stable and distortion-free focused spot on the same focal plane (i.e., the OLED panel surface). This allows the laser beam to perform high-speed, arbitrary-trajectory scanning motion within the fixed field of view of the panel without moving the lower optical path base 5 or the panel itself.

[0028] In some embodiments, refer to Figure 3 , Figure 4 , Figure 5 , Figure 6The slit assembly 6 has a second through hole 601 that penetrates the slit assembly 6. Inside the slit assembly 6 are a first X-axis adjusting member 602, a second X-axis adjusting member 603, a first Y-axis adjusting member 604, and a second Y-axis adjusting member 605. The adjacent sides of the first X-axis adjusting member 602, the second X-axis adjusting member 603, the first Y-axis adjusting member 604, and the second Y-axis adjusting member 605 form a rectangular through hole located at the second through hole 601, effectively forming the transmission channel for the laser beam. The first X-axis adjusting member 602, the second X-axis adjusting member 603, the first Y-axis adjusting member 604, and the second Y-axis adjusting member 605 are all slidably connected to the slit assembly 6. The second through hole 601 is a through-hole, either circular or rectangular, for the passage of the laser beam. The initial size of the second through hole 601 is slightly larger than the expected laser beam cross-section, providing adjustment space for the adjusting members. Each adjusting component is a high-precision slider structure made of wear-resistant materials (such as ceramic or hardened steel), with sharpened edges to reduce laser diffraction effects. The adjusting components are mounted on the main track of the slit assembly 6 via a sliding connection. Specifically, the sliding connection utilizes a high-precision linear guide (such as a ball bearing guide or crossed roller guide) in conjunction with a micron-level stepper motor or piezoelectric actuator. Each adjusting component can independently translate along the X-axis or Y-axis, thereby changing the width of the rectangular through-hole in the X-direction and the width in the Y-direction.

[0029] In some embodiments, the system further includes a camera 8, an objective lens switching mechanism 9, and an objective lens 10. The camera 8 and objective lens switching mechanism 9 are mounted on the lower optical path base 5, and the objective lens 10 is mounted on the objective lens switching mechanism 9. The camera 8 is located downstream of the lower optical path mechanism, and the objective lens switching mechanism 9 is located downstream of the camera 8. The camera 8 can be a high-resolution CCD or CMOS industrial camera, fixedly mounted on the lower optical path base 5 using a precision bracket. Its optical axis is at a specific angle (e.g., tilted at a certain angle) to the main laser optical path (the optical path after the galvanometer assembly 7) or is coaxial with the laser optical path through a beam splitter. The position of the camera 8 ensures that it can clearly capture the image of the OLED panel area to be repaired, magnified by the objective lens 10. The objective lens switching mechanism 9 can be fixedly mounted on the lower optical path base 5, located downstream of the camera 8 (i.e., closer to the OLED panel). The objective lens switching mechanism 9 can be an electrically driven rotating tower or a multi-position sliding platform with multiple mounting positions. Objective 10 can be a set of high-precision objectives with different magnifications (e.g., 5X, 10X, 20X, 50X) and working distances.

[0030] In some embodiments, the objective lens switching mechanism 9 includes: a bracket, a linear guide rail, a sliding seat, and a drive component. The bracket is mounted on the lower optical path base 5, the linear guide rail is fixed to the bracket, the sliding seat is slidably mounted on the linear guide rail, the objective lens is mounted on the sliding seat, and the drive component is connected to the sliding seat to drive it to move along the linear guide rail. The bracket can be a rigid frame, securely mounted on the lower optical path base 5 by bolts or other fasteners, serving as the basic support for the entire switching mechanism to ensure the stability and non-deformation of the linear guide rail and objective lens mounting positions. The bracket can be made of aluminum alloy or steel, balancing lightweight and high strength. The linear guide rail can be a high-precision, low-friction linear guide rail, such as a crossed roller guide rail or a high-grade ball linear guide rail. The sliding seat can be a slider on the linear guide rail, with multiple objective lens mounting interfaces designed on its upper part. These interfaces can be standard objective lens threaded interfaces (such as M26×0.75) and equipped with electrical connection points (for automatically identifying objective lens magnification and parameters). The drive component can be a linear motor. When the objective lens magnification needs to be switched according to the size and precision requirements of the defect to be repaired, the system will send a command to the drive unit; the drive unit will move the sliding seat along the linear guide rail, so that the objective lens currently required is precisely moved to the center of the optical path; after it is in place, the system locks the position and performs focus adjustment, and then the camera 8 can observe through the new objective lens or start laser processing.

Claims

1. A multi-wavelength laser processing apparatus for OLED panel repair, characterized in that, include: The upper optical path base (1), the upper optical path mechanism, the lower optical path base (5) and the lower optical path mechanism are provided. The upper optical path mechanism is disposed on the upper optical path base (1). The upper optical path base (1) is provided with a first through hole (101). The lower optical path base (5) is disposed below the upper optical path base (1) and is slidably connected to the upper optical path base (1). The lower optical path mechanism is disposed on the lower optical path base (5). The upper optical path mechanism includes a plurality of laser generators and a plurality of optical path guiding components (102), wherein the plurality of optical path guiding components (102) are disposed on the optical paths corresponding to the plurality of laser generators; the number of the first through holes (101) corresponds to the number of laser generators, and the laser beam generated by each laser generator passes through the corresponding first through hole (101) and enters the lower optical path mechanism.

2. The multi-wavelength laser processing apparatus for OLED panel repair as described in claim 1, characterized in that, The plurality of laser generating components include: a first laser component (2), a second laser component (3) and a third laser component (4), wherein the first laser component (2), the second laser component (3) and the third laser component (4) are all disposed on the upper optical path base (1), and the optical paths of the first laser component (2), the second laser component (3) and the third laser component (4) do not interfere with each other.

3. The multi-wavelength laser processing apparatus for OLED panel repair as described in claim 2, characterized in that, The first laser component (2) is provided with a first emission port (201), a second emission port (202) and a third emission port (203), and the wavelengths of the laser beams emitted from the first emission port (201), the second emission port (202) and the third emission port (203) are different from each other.

4. The multi-wavelength laser processing apparatus for OLED panel repair as described in claim 2, characterized in that, A wavelength conversion component (401) is provided on the laser beam path emitted by the third laser component (4). The wavelength conversion component (401) includes a focusing lens, a nonlinear crystal, and a collimating lens. The focusing lens is disposed on the incident side of the nonlinear crystal, and the collimating lens is disposed on the exit side of the nonlinear crystal.

5. The multi-wavelength laser processing apparatus for OLED panel repair as described in claim 2, characterized in that, The first laser component (2) is a femtosecond laser, the second laser component (3) is a continuous green laser, and the third laser component (4) is a nanosecond laser.

6. The multi-wavelength laser processing apparatus for OLED panel repair as described in claim 1, characterized in that, The lower optical path mechanism includes a slit assembly (6) and a galvanometer assembly (7). Both the slit assembly (6) and the galvanometer assembly (7) are disposed on the lower optical path base (5). The slit assembly (6) is located upstream of the galvanometer assembly (7). The laser beam passes through the slit assembly (6) and the galvanometer assembly (7) in sequence.

7. The multi-wavelength laser processing apparatus for OLED panel repair as described in claim 6, characterized in that, The slit assembly (6) has a second through hole (601) that penetrates the slit assembly (6). The slit assembly (6) is provided with a first X-axis adjusting member (602), a second X-axis adjusting member (603), a first Y-axis adjusting member (604), and a second Y-axis adjusting member (605). The adjacent sides of the first X-axis adjusting member (602), the second X-axis adjusting member (603), the first Y-axis adjusting member (604), and the second Y-axis adjusting member (605) form a rectangular through hole. The rectangular through hole is located at the second through hole (601). The first X-axis adjusting member (602), the second X-axis adjusting member (603), the first Y-axis adjusting member (604), and the second Y-axis adjusting member (605) are all slidably connected to the slit assembly (6).

8. The multi-wavelength laser processing apparatus for OLED panel repair as described in claim 1, characterized in that, It also includes a camera (8), an objective lens switching mechanism (9) and an objective lens (10). The camera (8) and the objective lens switching mechanism (9) are disposed on the lower optical path base (5), and the objective lens (10) is disposed on the objective lens switching mechanism (9). The camera (8) is located downstream of the lower optical path mechanism, and the objective lens switching mechanism (9) is located downstream of the camera (8).

9. The multi-wavelength laser processing apparatus for OLED panel repair as described in claim 8, characterized in that, The objective lens switching mechanism (9) includes: a bracket, a linear guide rail, a sliding seat, and a driving component. The bracket is disposed on the lower optical path base (5), the linear guide rail is fixed on the bracket, the sliding seat is slidably disposed on the linear guide rail, the objective lens is mounted on the sliding seat, and the driving component is connected to the sliding seat to drive it to move along the linear guide rail.

10. The multi-wavelength laser processing apparatus for OLED panel repair as described in claim 1, characterized in that, The optical path guiding assembly (102) includes at least one of a reflector and a lens.

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