Laser module and laser processing apparatus

Abstract

The utility model discloses a kind of laser module and laser processing equipment, it is related to laser processing technical field, wherein, laser module includes laser and laser drive module, cooling liquid flow path is arranged in the laser;The laser drive module is electrically connected with the laser, the laser drive module is located in the side of the laser, and is contacted with the laser, the outer wall of the laser drive module and the laser contact is heat-conducting material quality.The technical scheme of the application can improve the heat dissipation performance of laser module.

Description

Technical Field

[0001] This utility model relates to the field of laser processing technology, and in particular to a laser module and laser processing equipment. Background Technology

[0002] Laser processing equipment is a device that uses lasers to achieve processing purposes. In related technologies, the laser driver board is usually placed inside the laser to form an integrated laser module. However, with the increase of laser power, the heat effect of the laser itself and the heat of the heat-generating components on the driver board also increase sharply. The heat dissipation module set in the laser module is difficult to meet the heat dissipation requirements under high power operation. Utility Model Content

[0003] The main purpose of this invention is to propose a laser module and laser processing equipment, which aims to improve the heat dissipation performance of the laser module.

[0004] To achieve the above objectives, the laser module proposed in this utility model includes:

[0005] A laser, wherein a coolant flow path is provided in the laser; and

[0006] A laser driving module is electrically connected to the laser. The laser driving module is located on one side of the laser and is in contact with the laser. The outer wall of the laser driving module in contact with the laser is made of a thermally conductive material.

[0007] In one embodiment, the laser driving module includes:

[0008] The mounting box includes a mounting cavity and a clearance opening communicating with the mounting cavity. The mounting box is connected to and fits snugly against the laser. The mounting box is made of a thermally conductive material.

[0009] A drive board is disposed in the mounting cavity and electrically connected to the laser. An electrical connector between the drive board and the laser passes through the clearance opening.

[0010] In one embodiment, the mounting box includes a first sidewall and a second sidewall disposed opposite to each other, the first sidewall being fitted to the laser;

[0011] The laser driving module further includes a heat-conducting component, which is sandwiched between the driving plate and the first sidewall, and / or the heat-conducting component is sandwiched between the driving plate and the second sidewall.

[0012] In one embodiment, the thermally conductive element includes a thermally conductive silicone pad and / or a thermally conductive metal.

[0013] In one embodiment, the laser includes:

[0014] A laser body, comprising a laser generator and a laser channel, wherein the laser generated by the laser generator is emitted through the laser channel; and

[0015] A water-passing base is provided on the side of the laser body facing the laser driving module and is in contact with the laser driving module;

[0016] The coolant flow path includes a first flow path disposed in the water inlet and a second flow path disposed in the laser body, the first flow path and the second flow path being interconnected.

[0017] In one embodiment, the laser body is provided with a protective gas channel, the outlet of the protective gas channel and the light outlet of the laser channel face the same side, the laser also includes a gas pipe, the gas pipe passes through the water inlet, and one end of the gas pipe is connected to the inlet of the protective gas channel.

[0018] In one embodiment, the mounting box has a wiring groove on the side facing the laser, and the wiring groove communicates with the mounting cavity;

[0019] The laser driving module also includes connecting wires, some of which are located in the wiring groove. One end of the connecting wire is electrically connected to the driving board, and the other end of the connecting wire extends to the outside of the mounting cavity.

[0020] In one embodiment, the outgoing direction of the connecting wire is the same as the orientation of the inlet and outlet of the coolant flow path;

[0021] And / or, the wiring groove is offset from the laser;

[0022] And / or, the connecting line includes a first connecting segment and a second connecting segment connected to each other, the first connecting segment being disposed in the wiring groove and connected to the drive board, and the second connecting segment being bent relative to the first connecting segment and extending to the outside of the laser module;

[0023] And / or, the laser driving module further includes a wire fastening component, which is installed in the slot of the wiring channel to limit the position of the connecting wire;

[0024] And / or, the connection line includes at least one of a power line and a signal line.

[0025] In one embodiment, the outer wall of the laser driving module that contacts the laser is made of aluminum or an aluminum alloy.

[0026] And / or, the laser driving module is provided with a connecting part, which is attached to and connected to the laser.

[0027] In one embodiment, the laser module further includes a slider, and at least one of the laser and the laser driving module is connected to the slider, which is used to slide in connection with a guide rail disposed on a laser processing equipment.

[0028] In one embodiment, the slider and the laser driving module are disposed on adjacent sides of the laser, and the slider is connected to both the laser and the laser driving module.

[0029] And / or, the slider is located at the bottom of the laser, the laser module further includes a connecting block, the connecting block is connected to the slider and located below the laser driving module, and the laser driving module is connected to the connecting block.

[0030] This application also proposes a laser processing device, comprising:

[0031] A frame, wherein the frame is provided with a processing area; and

[0032] As described in any of the preceding embodiments, the laser module is mounted on the frame, and the light output port of the laser module is oriented toward the processing area.

[0033] The technical solution of this utility model incorporates a coolant flow path within the laser of the laser module. The laser can dissipate heat through both water cooling and air cooling, resulting in high heat dissipation efficiency. The laser driver module is positioned outside the laser and in contact with it, allowing direct heat exchange between the driver module and the ambient air to dissipate some heat. Simultaneously, some heat from the driver module is transferred to the laser, where it is carried away by the coolant flowing through it, thus also providing effective heat dissipation for the driver module. In other words, in the laser module of this application, both the laser and the driver module can dissipate heat through both water cooling and air cooling, improving the heat dissipation performance of the laser module. Furthermore, both the driver module and the laser can utilize the coolant flowing through the laser for water cooling, eliminating the need for additional heat dissipation structures and avoiding increased weight. Attached Figure Description

[0034] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0035] Figure 1This is a structural diagram of an embodiment of the laser module provided in this application;

[0036] Figure 2 for Figure 1 Another structural view of the laser module;

[0037] Figure 3 for Figure 1 Exploded view of the laser module in the middle;

[0038] Figure 4 This is a structural diagram of an embodiment of the laser driving module in the laser module provided in this application;

[0039] Figure 5 An exploded view of an embodiment of the laser driving module in the laser module provided in this application;

[0040] Figure 6 An exploded view of an embodiment of the laser in the laser module provided in this application;

[0041] Figure 7 This is a structural diagram of an embodiment of the laser processing equipment provided in this application.

[0042] Explanation of icon numbers:

[0043] 100. Laser module; 10. Laser; 11. Laser body; 1111. Housing; 112. Laser generator; 12. Water inlet; 13. Coolant flow path; 131. First flow path; 132. Second flow path; 14. Electrical connector; 15. Air pipe; 16. Water connector;

[0044] 20. Laser driver module; 21. Mounting box; 211. Front shell; 2111. Second side wall; 212. Rear shell; 2121. First side wall; 2122. Clearance opening; 2123. Cable routing channel; 213. Mounting cavity; 214. Connecting part; 22. Driver board; 23. Heat-conducting component; 24. Cable fastener; 25. Connecting wire; 251. First connecting section; 252. Second connecting section; 253. Power cord; 254. Signal wire;

[0045] 30. Slider; 40. Connecting block; 50. Cable chain; 51. Cable connector; 60. Water pipe;

[0046] 1000, Laser processing equipment; 200, Frame; 300, Guide rail.

[0047] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0048] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.

[0049] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0050] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0051] Laser processing equipment is a device that uses lasers to achieve processing purposes. In related technologies, the laser driver board is usually placed inside the laser to form an integrated laser module. However, with the increase of laser power, the heat effect of the laser itself and the heat of the heat-generating components on the driver board also increase sharply. The heat dissipation module set in the laser module is difficult to meet the heat dissipation requirements under high power operation.

[0052] If the specifications of the heat dissipation module are improved on the laser module, such as by increasing the size or adding heat dissipation devices, the size and weight of the heat dissipation module will also increase, resulting in a significant increase in the overall size and weight of the laser module, which will in turn reduce the range of motion of the laser module and sacrifice speed performance.

[0053] If the laser driver board is separated from the laser and placed separately, a long cable is required to connect the laser driver board and the laser, which will restrict the high-speed movement of the laser. In addition, these cables will emit a lot of radiation, requiring additional electromagnetic shielding for the cables, resulting in a complex structure and increased design costs.

[0054] This utility model proposes a laser module 100, which has high heat dissipation performance and can meet the usage environment of processing with high laser power.

[0055] Please see Figure 1 and Figure 2 In one embodiment of the present invention, the laser module 100 includes a laser 10 and a laser driving module 20. The laser 10 is provided with a coolant flow path 13. The laser driving module 20 is electrically connected to the laser 10. The laser driving module 20 is located on one side of the laser 10 and is in contact with the laser 10. The outer wall of the laser driving module 20 in contact with the laser 10 is made of a heat-conducting material.

[0056] The laser module 100 proposed in this application is applied in a laser processing equipment 1000 for outputting laser light to perform at least one processing operation on a workpiece, such as laser engraving, laser cutting, laser welding, or laser marking. The laser 10, used for emitting laser light, includes at least a housing 1111 and a laser generator 112 disposed within the housing 1111. The housing 1111 is provided with a laser channel for emitting the laser light, and the laser light generated by the laser generator 112 can be emitted outward through the laser channel. Optionally, the laser 10 also includes an optical lens disposed in the laser channel, which can be used for at least one function, such as laser shaping, focusing, and changing the laser optical path.

[0057] The laser 10 also includes a coolant flow path 13, which has an inlet and an outlet. When applied to the laser processing equipment 1000, the inlet and outlet are connected to the cooling module, forming a coolant circuit. The cooling module can drive the coolant into the coolant flow path 13, allowing the coolant to exchange heat with the laser 10 before flowing out of the coolant flow path 13 to remove heat from the laser 10. Using water cooling, the laser 10 has good heat dissipation capabilities; furthermore, the laser 10 can directly exchange heat with the ambient air, allowing some heat to dissipate directly into the air. This allows the laser 10 to dissipate heat through both water cooling and air cooling, resulting in high heat dissipation efficiency. Optionally, the laser 10 also includes a water connector 16, with both the inlet and outlet equipped with it for easy connection to the water pipe 60.

[0058] The laser drive module 20 is a component in the laser module 100 used to control and drive the laser 10. It can control the switching of the laser 10, adjust the input voltage and current, and in some embodiments, can also be used to interact with the control system of the laser processing equipment 1000 to transmit control signals. The laser drive module 20 includes at least a drive board 22, which is a circuit board on which various components are integrated. Optionally, the laser drive module 20 may also include a mounting box 21, in which the drive board 22 is mounted in the mounting cavity 213 to protect the drive board 22.

[0059] In this embodiment, the laser driving module 20 is disposed outside the laser 10 and in contact with the laser 10, allowing the laser driving module 20 to be connected to the laser 10. The part of the laser driving module 20 in contact with the laser 10 is made of a thermally conductive material, which can be, but is not limited to, metallic materials such as aluminum and aluminum alloys, as well as non-metallic materials such as silicone and ceramics. With this heat dissipation method, the laser driving module 20 can directly exchange heat with the ambient air to dissipate some of the heat; simultaneously, another portion of the heat from the laser driving module 20 can be transferred to the laser 10, whereby this heat is carried away by the coolant flowing through the laser 10, thus enabling the laser driving module 20 to also dissipate heat effectively.

[0060] That is, in the laser module 100 of this application, both the laser 10 and the laser driving module 20 can be cooled by both water cooling and air cooling, which improves the heat dissipation performance of the laser module 100. Both the laser driving module 20 and the laser 10 can be cooled by the coolant flowing through the laser 10, without the need to add an additional heat dissipation structure, thus avoiding increasing the weight of the laser module 100.

[0061] Please see Figure 4 and Figure 5 In one embodiment, the laser driving module 20 includes a mounting box 21 and a driving plate 22. The mounting box 21 is provided with a mounting cavity 213 and a clearance opening 2122 communicating with the mounting cavity 213. The mounting box 21 is connected to and fits against the laser 10. The mounting box 21 is made of a thermally conductive material. The driving plate 22 is disposed in the mounting cavity 213 and is electrically connected to the laser 10. The electrical connector 14 between the driving plate 22 and the laser 10 passes through the clearance opening 2122.

[0062] In this embodiment, the drive board 22 is the main functional component of the laser drive module 20. It is placed in the mounting cavity 213 of the mounting box 21 to protect the drive board 22, preventing it from being directly exposed to the external environment and reducing the risk of damage to the drive board 22. The mounting box 21 is provided with a clearance opening 2122 that communicates with the mounting cavity 213. The electrical connector 14 between the drive board 22 and the laser 10 passes through the clearance opening 2122. When the laser drive module 20 and the laser 10 are connected as one unit, the clearance opening 2122 and the electrical connector 14 are both shielded by the laser drive module 20 and the laser 10, and are therefore not exposed to the external environment.

[0063] The mounting box 21 is made of a thermally conductive material, such as aluminum, aluminum alloy, or other rigid thermally conductive materials, to give it high structural strength and good thermal conductivity, allowing the heat generated by the drive board 22 to be transferred to the laser 10 through the mounting box. The connection between the mounting box 21 and the laser 10 can be, but is not limited to, at least one of bolt connection, magnetic connection, or snap-fit ​​connection.

[0064] Please see Figure 2 and Figure 5 In one embodiment, the mounting box 21 includes a first sidewall 2121 and a second sidewall 2111 disposed opposite to each other, the first sidewall 2121 being in contact with the laser 10; the laser driving module 20 also includes a heat-conducting element 23, the heat-conducting element 23 being sandwiched between the driving plate 22 and the first sidewall 2121, and / or, the heat-conducting element 23 being sandwiched between the driving plate 22 and the second sidewall 2111.

[0065] In this embodiment, the mounting box 21 includes a first sidewall 2121 and a second sidewall 2111 disposed opposite to each other. It is understood that both the first sidewall 2121 and the second sidewall 2111 have inner and outer surfaces. The inner surfaces of the first sidewall 2121 and the second sidewall 2111 form a mounting cavity 213. The outer surface of the first sidewall 2121 is in contact with the laser 10, allowing some of the heat from the laser control module to be transferred to the laser 10 at the location of the first sidewall 2121 for dissipation using the coolant flowing in the laser 10. A heat-conducting element 23 can be disposed between the inner surface of the first sidewall 2121 and the drive plate 22. The heat-conducting element 23 can be made of, but is not limited to, a metal material such as aluminum or aluminum alloy, or a non-metallic material such as silicone. The placement of the heat-conducting element 23 between the first sidewall 2121 and the drive plate 22 can improve the efficiency of heat transfer from the drive plate 22 to the first sidewall 2121, thereby allowing the heat generated by the drive plate 22 to be quickly transferred to the mounting shell for rapid heat dissipation.

[0066] Optionally, a heat-conducting element 23 can be provided between the second sidewall 2111 and the drive plate 22 to improve the efficiency of heat transfer from the drive plate 22 to the second sidewall 2111, so that the heat generated by the drive plate 22 can be quickly transferred to the mounting shell to enable the drive plate 22 to dissipate heat quickly.

[0067] Optionally, the mounting box 21 includes a front shell 211 and a rear shell 212 that cover each other, forming a mounting cavity 213. The front shell 211 is provided with a second side wall 2111, and the rear shell 212 is provided with a first side wall 2121. The front shell 211 and the rear shell 212 can be detachably connected to facilitate maintenance, disassembly, and inspection of the drive plate 22 located in the mounting cavity 213.

[0068] In one embodiment, the thermally conductive element 23 includes a thermally conductive silicone pad and / or a thermally conductive metal.

[0069] In this embodiment, the heat-conducting component 23 includes a heat-conducting silicone pad. The silicone material has good elasticity, so that the heat-conducting component 23 can not only have good thermal conductivity, but also play a certain buffering role, and better fill the gap between the drive plate 22 and the first side wall 2121 or the second side wall 2111, thereby increasing the heat-conducting area and improving the heat-conducting efficiency.

[0070] In addition, the heat-conducting component 23 may include heat-conducting metals, such as copper, copper alloys, etc., which are not limited here.

[0071] Please see Figure 3 and Figure 6 In one embodiment, the laser 10 includes a laser body 11 and a water inlet 12. The laser body 11 is provided with a laser generator 112 and a laser channel. The laser generated by the laser generator 112 is emitted through the laser channel. The water inlet 12 is located on the side of the laser body 11 facing the laser driving module 20 and is in contact with the laser driving module 20. The coolant flow path 13 includes a first flow path 131 in the water inlet 12 and a second flow path 132 in the laser body 11. The first flow path 131 and the second flow path 132 are interconnected.

[0072] In this embodiment, the laser body 11 includes a housing 1111 and a laser generator 112 disposed within the housing 1111. The housing 1111 has a receiving cavity and a laser channel communicating with the receiving cavity. The laser generator 112 is installed in the receiving cavity, and the laser generated by the laser generator 112 can be emitted outward from the laser channel. The housing 1111 of the laser body 11 is also provided with a second flow path 132, which is part of the coolant flow path 13 in the laser 10.

[0073] The first flow path 131 of the coolant flow path 13 is disposed in the water passage base 12. Two first flow paths 131 can be disposed in the water passage base 12, one of which is an inlet flow path connected to the inlet end of the second flow path 132, and the other is an outlet flow path connected to the outlet end of the second flow path 132. Optionally, the water passage base 12 can be configured as an integral structure, with the first flow path 131 formed in the water passage base 12; alternatively, the water passage base 12 can include a base body and a conduit embedded in the base body, with the first flow path 131 formed in the conduit. No limitation is made here.

[0074] The water-cooling base 12 is located on the side of the laser body 11 facing the laser driving module 20, and the laser driving module 20 is in contact with the side wall of the water-cooling base 12. In this arrangement, the laser driving module 20 is positioned adjacent to the coolant passage in the laser 10, allowing some of the heat generated by the laser driving module 20 to be quickly dissipated by the water-cooling base 12. Furthermore, the water-cooling base 12 separates the laser body 11 and the laser driving module 20, thus keeping the laser driving module 20 relatively away from the laser generator 112, reducing or preventing the mutual influence and accumulation of heat between the laser generator 112 and the laser driving module 20.

[0075] Please see Figure 6 In one embodiment, the laser body 11 is provided with a protective gas channel, the outlet of the protective gas channel and the light outlet of the laser channel face the same side, and the laser 10 also includes a gas pipe 15, which passes through the water seat 12 and one end of the gas pipe 15 is connected to the air inlet of the protective gas channel.

[0076] In this embodiment, a protective gas channel is provided in the laser body 11, and the outlet of the protective gas channel faces the same side as the light outlet of the laser channel. When the laser module 100 is applied in the laser processing equipment 1000 for laser processing, the laser module 100 can blow protective gas into the processing area while outputting laser light, which can blow away waste residue, dust and other impurities in the processing area. For metal processing materials, it can also reduce the surface temperature of the metal and prevent the material from being oxidized at high temperature or hardened by heat treatment.

[0077] The air pipe 15, which is connected to the air inlet of the protection channel, is inserted into the water seat 12, so that the air inlet of the air pipe 15 and the water inlet and outlet of the coolant flow path 13 are located on the same side of the laser module 100. This makes it easier to route the air pipe 15 and the water pipe 60 connected to the coolant flow path 13 on the same side of the laser module 100. For example, the air pipe 15 and the water pipe 60 can be housed in the drag chain 50, resulting in a reasonable overall structural layout.

[0078] Please see Figure 4In one embodiment, the mounting box 21 has a wiring groove 2123 on the side facing the laser 10, and the wiring groove 2123 is connected to the mounting cavity 213; the laser driving module 20 also includes a connecting line 25, part of which is located in the wiring groove 2123, one end of which is electrically connected to the driving board 22, and the other end of which extends to the outside of the mounting cavity 213.

[0079] In this embodiment, the connecting cable 25 used to connect the drive board 22 extends outward from the side of the mounting box 21 facing the laser 10, which reduces the distance between the connecting cable 25 and the water pipe 60 used to connect the coolant flow path 13, allowing the connecting cable 25 and the water pipe 60 to be uniformly and neatly arranged. Furthermore, a wiring groove 2123 is provided on the side of the mounting box 21 facing the laser 10, and part of the connecting cable 25 is embedded in the wiring groove 2123, allowing part of the connecting cable 25 to be recessed into the mounting box 21. This helps to reduce the size of the laser drive module 20 and conceal the connecting cable 25.

[0080] Please see Figure 2 In one embodiment, the outgoing direction of the connecting line 25 is the same as the orientation of the inlet and outlet of the coolant flow path 13.

[0081] This arrangement allows the connecting wires 25 and water pipes 60 to extend outward from the laser module 100 in the same direction, making it easier to organize and arrange the connecting wires 25 and water pipes 60 in a unified manner. For example, the connecting wires 25 and water pipes 60 can be uniformly introduced into the cable chain 50, improving the convenience of wiring and assembly.

[0082] Please see Figure 2 In one embodiment, the wiring groove 2123 is misaligned with the laser 10.

[0083] This configuration avoids the laser 10 blocking the exit point of the connecting cable 25, thus preventing interference between the laser 10 and the connecting cable 25. Optionally, the laser 10 is connected to a cable connector 51, allowing part of the cable routing groove 2123 to face the cable connector 51, so that the connecting cable 25 can directly enter the cable connector 51 after extending from the cable routing groove 2123, and extend into the cable chain 50.

[0084] Please see Figure 4 In one embodiment, the connecting line 25 includes a first connecting segment 251 and a second connecting segment 252 connected to each other. The first connecting segment 251 is disposed in the wiring groove 2123 and connected to the drive board 22. The second connecting segment 252 is bent relative to the first connecting segment 251 and extends to the outside of the laser module 100.

[0085] In this embodiment, the connecting line 25 includes a first connecting segment 251 embedded in the wiring groove 2123 and a second connecting segment 252 located outside the wiring groove 2123. The first connecting segment 251 is embedded in the wiring groove 2123 to sink the connecting line 25 into the mounting box 21, reducing the space occupied by the connecting line 25 and limiting the position of the connecting line 25. The second connecting segment 252 is located outside the wiring groove 2123 and can be freely bent relative to the first connecting segment 251 according to the wiring requirements, so that the output direction of the connecting line 25 is adjustable, which facilitates the overall wiring of the laser module 100.

[0086] Please see Figure 4 In one embodiment, the laser driving module 20 further includes a wire fastener 24, which is installed in the slot of the wiring groove 2123 to limit the connection wire 25.

[0087] This setup utilizes the wire-locking component 24 to limit the connection wire 25, preventing it from detaching from the cable tray 2123, thus improving the positional stability of the connection wire 25 and the overall structural stability of the laser drive module 20. When the laser module 100 is applied to the laser processing equipment 1000, the connection wire 25 and water pipe 60 are typically housed within the cable chain 50. Using the wire-locking component 24 to limit the connection wire 25 prevents it from being pulled out of the cable tray 2123 by the tension of the cable chain 50 or the stress on the wires during the movement of the laser module 100, thereby avoiding interruption of electrical signals or wear on the connection wire 25. Optionally, the wire-locking component 24 can cover the entire opening of the cable tray 2123, or it can only cover a portion of the opening of the cable tray 2123.

[0088] Please see Figure 4 In one embodiment, the connection line 25 includes at least one of a power line 253 and a signal line 254.

[0089] In this embodiment, the connecting line 25 may include a power line 253, which is used to supply power to the driver board 22 and is responsible for the transmission of electrical signals. It can be plugged into the driver board 22 through a terminal connector to achieve electrical connection. The connecting line 25 may also include a signal line 254, which is used to transmit control signals to control the execution of other functions on the driver board 22, such as controlling photoelectric reset, secondary connector connection, etc.

[0090] In one embodiment, the outer wall of the laser drive module 20 that contacts the laser 10 is made of aluminum or an aluminum alloy.

[0091] In this embodiment, the mounting box 21 of the laser driving module 20 can be made of aluminum or aluminum alloy. Aluminum or aluminum alloy has good thermal conductivity, which can quickly transfer the heat of the laser driving module 20 to the laser 10 for rapid heat dissipation. In addition, aluminum or aluminum alloy also has good structural strength, which can maintain structural stability and reduce the risk of deformation and damage. Optionally, the structure on the laser 10 that contacts the laser driving module 20 can also be made of aluminum or aluminum alloy. For example, the water inlet 12 in the laser 10 can be made of aluminum or aluminum alloy, or the outer shell 1111 of the laser body 11 can be made of aluminum or aluminum alloy.

[0092] Please see Figure 2 and Figure 4 In one embodiment, the laser driving module 20 is provided with a connecting part 214, which is attached to and connected to the laser 10.

[0093] In this embodiment, the connecting portion 214 of the laser driving module 20 overlaps with the laser 10, which can limit the laser driving module 20 in the height direction of the laser 10 and prevent the laser driving module 20 from sliding down relative to the laser 10. Optionally, the connection method between the connecting portion 214 and the laser 10 can be, but is not limited to, at least one of bolt connection, snap-fit ​​connection, magnetic connection, etc.

[0094] Please see Figure 1 and Figure 2 In one embodiment, the laser module 100 further includes a slider 30, at least one of the laser 10 and the laser drive module 20 being connected to the slider 30, which is used to slide in connection with a guide rail 300 disposed on the laser processing equipment 1000.

[0095] In this embodiment, the laser module 100 is provided with a slider 30. The slider 30 has a mounting surface and a connecting surface facing away from each other. The mounting surface is positioned towards the laser 10 and / or the laser driving module 20. At least one of the laser 10 and the laser driving module 20 is mounted on the mounting surface. This allows the laser 10 to be connected to the slider 30, the laser driving module 20 to be connected to the slider 30, or both the laser 10 and the laser driving module 20 to be connected to the slider 30. Optionally, the connection method between the slider 30 and the laser 10 or the laser driving module 20 can be, but is not limited to, at least one method such as bolt connection, snap-fit ​​connection, plug-in connection, or magnetic connection.

[0096] A roller or other sliding connection structure is provided on one side of the connection surface for sliding connection with the guide rail 300 on the laser processing equipment 1000, so that when the laser module 100 is applied to the laser processing equipment 1000, it can slide along the guide rail 300, thereby allowing the laser processing equipment 1000 to be moved to different positions for laser processing.

[0097] Please see Figure 1 and Figure 2 In one embodiment, the slider 30 and the laser driving module 20 are located on adjacent sides of the laser 10, and the slider 30 is connected to both the laser 10 and the laser driving module 20. This arrangement, with the slider 30, laser 10, and laser driving module 20 connected in pairs, results in high overall structural stability of the laser module 100.

[0098] Please see Figure 1 and Figure 2 In one embodiment, the slider 30 is located at the bottom of the laser 10, and the laser module 100 also includes a connecting block 40, which is connected to the slider 30 and located below the laser driving module 20. The laser driving module 20 is connected to the connecting block 40.

[0099] In this embodiment, the slider 30 is located at the bottom of the laser 10, that is, the laser 10 is supported on the slider 30. The laser driving module 20 is connected to the slider 30 through the connecting block 40 and is supported on the connecting block 40, thereby reducing the risk of the laser driving module 20 and the laser 10 sinking and misaligning, so as to ensure the stability of the electrical connection between the laser driving module 20 and the laser 10, and also to ensure the overall structural stability of the laser module 100.

[0100] Please see Figure 7 This application also proposes a laser processing equipment 1000, including a frame 200 and a laser module 100. The frame 200 is provided with a processing area. The specific structure of the laser module 100 refers to any of the foregoing embodiments. The laser module 100 is disposed on the frame 200, and the light output port of the laser module 100 is arranged facing the processing area.

[0101] The laser processing equipment 1000 can be used to perform at least one laser processing operation on the processed materials, such as laser engraving, laser welding, laser cutting, laser marking, and laser cleaning. The laser processing equipment 1000 employs the laser module 100 proposed in the foregoing embodiments of this application. Due to the good heat dissipation performance of the laser module 100, the laser processing equipment 1000 can use high-power lasers for processing, thus meeting the processing needs of thicker and harder materials and improving its applicability.

[0102] Since the laser processing equipment 1000 proposed in this application adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here.

[0103] Please see Figure 7In some embodiments, the laser processing equipment 1000 further includes a guide rail 300 disposed on the frame 200, and a slider 30 slidably connected to the guide rail 300 is disposed on the laser module 100. The laser processing equipment 1000 is also provided with a drive mechanism for driving the laser module 100 to slide along the guide rail 300, so that the laser module 100 can be moved to different positions for processing.

[0104] The above description is merely an exemplary embodiment of the present utility model and does not limit the patent scope of the present utility model. Any equivalent structural transformations made based on the technical concept of the present utility model and the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.

Claims

1. A laser module, characterized in that, include: A laser, wherein a coolant flow path is provided; and A laser driving module is electrically connected to the laser. The laser driving module is located on one side of the laser and is in contact with the laser. The outer wall of the laser driving module in contact with the laser is made of a thermally conductive material.

2. The laser module as described in claim 1, characterized in that, The laser driving module includes: The mounting box includes a mounting cavity and a clearance opening communicating with the mounting cavity. The mounting box is connected to and fits snugly against the laser. The mounting box is made of a thermally conductive material. A drive board is disposed in the mounting cavity and electrically connected to the laser. An electrical connector between the drive board and the laser passes through the clearance opening.

3. The laser module as described in claim 2, characterized in that, The mounting box includes a first sidewall and a second sidewall disposed opposite to each other, the first sidewall being attached to the laser; The laser driving module further includes a heat-conducting component, which is sandwiched between the driving plate and the first sidewall, and / or the heat-conducting component is sandwiched between the driving plate and the second sidewall.

4. The laser module as described in claim 3, characterized in that, The thermally conductive component includes a thermally conductive silicone pad and / or a thermally conductive metal.

5. The laser module as described in claim 2, characterized in that, The mounting box has a wiring groove on the side facing the laser, and the wiring groove communicates with the mounting cavity; The laser driving module also includes connecting wires, some of which are located in the wiring groove. One end of the connecting wire is electrically connected to the driving board, and the other end of the connecting wire extends to the outside of the mounting cavity.

6. The laser module as described in claim 5, characterized in that, The direction of the connecting wire's outlet is the same as the orientation of the coolant flow path's inlet and outlet. And / or, the wiring groove is offset from the laser; And / or, the connecting line includes a first connecting segment and a second connecting segment connected to each other, the first connecting segment being disposed in the wiring groove and connected to the drive board, and the second connecting segment being bent relative to the first connecting segment and extending to the outside of the laser module; And / or, the laser driving module further includes a wire fastening component, which is installed in the slot of the wiring channel to limit the position of the connecting wire; And / or, the connection line includes at least one of a power line and a signal line.

7. The laser module as described in claim 1, characterized in that, The laser includes: A laser body, comprising a laser generator and a laser channel, wherein the laser generated by the laser generator is emitted through the laser channel; and A water-passing base is provided on the side of the laser body facing the laser driving module and is in contact with the laser driving module; The coolant flow path includes a first flow path disposed in the water inlet and a second flow path disposed in the laser body, the first flow path and the second flow path being interconnected.

8. The laser module as described in claim 7, characterized in that, The laser body is provided with a protective gas channel, the outlet of the protective gas channel and the light outlet of the laser channel face the same side. The laser also includes a gas pipe, which passes through the water inlet and one end of the gas pipe is connected to the inlet of the protective gas channel.

9. The laser module as described in any one of claims 1 to 8, characterized in that, The material of the outer wall of the laser driving module that contacts the laser includes aluminum or aluminum alloy; And / or, the laser driving module is provided with a connecting part, which is attached to and connected to the laser.

10. The laser module as described in any one of claims 1 to 8, characterized in that, The laser module also includes a slider, and at least one of the laser and the laser driving module is connected to the slider, which is used to slide in connection with a guide rail on the laser processing equipment.

11. The laser module as described in claim 10, characterized in that, The slider and the laser driving module are located on adjacent sides of the laser, and the slider is connected to the laser and the laser driving module respectively; And / or, the slider is located at the bottom of the laser, the laser module further includes a connecting block, the connecting block is connected to the slider and located below the laser driving module, and the laser driving module is connected to the connecting block.

12. A laser processing device, characterized in that, include: A frame, wherein the frame is provided with a processing area; and The laser module as described in any one of claims 1 to 11, wherein the laser module is disposed on the frame and the light output port of the laser module is disposed facing the processing area.

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