An FMM production apparatus

Abstract

The utility model discloses a kind of FMM production equipment, it is related to the field of semiconductor technology, including at least one exposure device, exposure device is used to expose the substrate to be processed to form multiple spaced first pattern, characterized in that, FMM production equipment further includes at least one laser etching device, laser etching device is arranged in the downstream of exposure device, laser etching device includes laser etching assembly and first alignment component, first alignment component is used to identify first pattern, laser etching assembly is used to form the second pattern that is contiguous with the two ends of first pattern according to the identification result of first alignment component to substrate laser etching.This utility model solves the problem that high generation FMM production cost is too high.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, specifically to an FMM production equipment. Background Technology

[0002] Fine Metal Mask (FMM) is a core material in the display manufacturing process, and its main function is to achieve precise pattern transfer during the vapor deposition process. Typically, FMMs are manufactured by an exposure machine, which includes a light source and a photomask. The light from the light source passes through the photomask and illuminates the Invar alloy substrate, transferring the pattern on the photomask onto the Invar substrate.

[0003] Currently, larger exposure machines are commonly used for overall exposure of high-generation FMMs. However, the high price of these larger exposure machines leads to high production costs for FMMs, which is detrimental to cost reduction and market penetration of the main end product – Organic Light-Emitting Diode (OLED) screens.

[0004] Therefore, developing an FMM production equipment that can reduce production costs is an urgent problem to be solved in this field. Utility Model Content

[0005] This invention aims to address one of the technical problems in related technologies to a certain extent. To this end, this invention provides an FMM production equipment that solves the problem of excessively high production costs for high-generation FMMs.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: An FMM production apparatus includes at least one exposure device for exposing a substrate to be processed to form a plurality of spaced first patterns. The FMM production apparatus further includes a laser etching device disposed downstream of the exposure device. The laser etching device includes a laser etching component and a first alignment component. The first alignment component is used to identify the first patterns, and the laser etching component is used to perform laser etching on the substrate according to the identification result of the first alignment component to form a second pattern adjacent to both ends of the first patterns.

[0007] The FMM production equipment disclosed in this utility model is used to produce FMMs, including an exposure device and a laser etching device. The exposure device forms a first pattern on a substrate through exposure, and the laser etching device forms a second pattern adjacent to the first pattern on the substrate through laser etching. The patterns on the first and second patterns can be spliced ​​together to form a complete FMM pattern, so that an FMM pattern does not need to be formed in one exposure. The exposure device does not need to be large in size, which can significantly reduce equipment costs. By adopting the technical solution of this application, high-generation FMMs can be produced with low-generation equipment, thereby reducing the production cost of FMMs and facilitating market penetration. In addition, forming the first and second patterns at once with a larger exposure machine requires a long exposure time. By adopting the technical solution of this application, the formation time of a single FMM pattern can be shortened.

[0008] Typically, the pattern on an FMM is divided into two parts: a core pattern and an auxiliary pattern. The core pattern is the first pattern, and the auxiliary pattern is the second pattern. The first pattern has higher requirements for forming precision, while the second pattern has relatively lower requirements for forming precision. Forming the first pattern using an exposure device and the second pattern using a laser etching device can satisfy the precision requirements of the two parts of the pattern respectively.

[0009] During the formation of the first pattern, the substrate needs to undergo multiple processing steps. Exposure of the substrate by the exposure device is only one step. Further steps include development, etching, and film removal to reveal the first pattern, followed by laser etching to form the second pattern. During processing, a quality inspection process for the first pattern can be added before the formation of the second pattern. This prevents the first pattern from being scrapped after processing due to non-compliance with requirements, thus improving the production efficiency of FMM (Flat Metal Manufacturing).

[0010] The laser etching apparatus can identify and align the first pattern through the first alignment component, thereby avoiding the second pattern from overlapping with the first pattern or having too large a gap. At the same time, it can ensure that the positional relationship between the first pattern and the second pattern meets the requirements, so that the two parts of the pattern can be spliced ​​into a complete and qualified pattern.

[0011] Optionally, the first pattern includes a core pattern and alignment patterns located at both ends of its length direction. The first alignment component can identify the alignment patterns, so that the laser etching component forms the second pattern at the ends of the first pattern with the alignment patterns as a reference.

[0012] Optionally, the number of laser etching devices is one. The first alignment component includes a first identification alignment area and a second identification alignment area. The first identification alignment area and the second identification alignment area respectively identify two alignment patterns between two adjacent core patterns. The laser etching component performs laser etching between two first patterns to form two adjacent second patterns based on the identification results of the first identification alignment area and the second identification alignment area. Alternatively, the number of laser etching devices is one, the first alignment component identifies the alignment pattern at one end of the core pattern, and the laser etching component performs laser etching at one end of the first pattern to form a second pattern based on the identification result of the first alignment component.

[0013] Since a first pattern is spaced between two second patterns on an FMM pattern, and the first pattern has a large size, the gap between the two second patterns is large. If a laser etching device can process the second patterns at both ends of the first pattern at the same time, the laser etching device needs to be extremely large, which will increase the equipment cost. This solution discloses two ways to process the second pattern with a single laser etching device.

[0014] One processing method is as follows: the first alignment component of the laser etching device includes a first identification alignment area and a second identification alignment area, which can simultaneously identify two alignment patterns between two adjacent core patterns, thereby forming two adjacent second patterns. The distance between the two first patterns is equal to the length of the two second patterns and the sum of their distance. The length of the second pattern is much smaller than that of the first pattern, so that one laser etching device can simultaneously process and form two adjacent second patterns.

[0015] Another processing method is as follows: the laser etching device only identifies the alignment pattern at one end of the core pattern, and forms a second pattern at one end of the first pattern, and then forms a second second pattern at the other end of the first pattern.

[0016] Optionally, the number of laser etching devices is two, and the two laser etching devices are arranged at intervals. The first alignment components of the two laser etching devices respectively identify the alignment patterns at both ends of a core pattern. The laser etching components of the two laser etching devices respectively perform laser etching at both ends of a first pattern to form a second pattern according to the identification results of their respective first alignment components.

[0017] Optionally, the exposure apparatus includes two photomask assemblies arranged opposite each other, with a gap between the two photomask assemblies for the substrate to pass through, and the two photomask assemblies respectively expose the front and back sides of the substrate.

[0018] Optionally, the exposure apparatus further includes a second alignment component and a third alignment component, wherein one photomask component identifies the substrate through the second alignment component and aligns with the substrate according to the identification result, and the other photomask component identifies the aligned photomask component through the third alignment component and completes the alignment between the two photomask components according to the identification result.

[0019] Optionally, the exposure device comprises two units. One unit is located upstream to expose the substrate to form the first pattern, and the other unit is located downstream to expose the substrate at both ends of the first pattern to cure the photosensitive material on its surface. The substrate used to fabricate the FMM is a metallic material. During FMM fabrication, a layer of photosensitive material is coated onto the surface of the substrate. The photosensitive material on the exposed areas of the substrate is cured, preventing material damage during subsequent development and etching processes. After exposure by the upstream unit, the substrate forms the first pattern (a preliminary stage, requiring development, etching, and film removal to become visible). Exposure by the downstream unit cures the photosensitive material at both ends of the first pattern, preventing damage to the substrate before laser etching to form the second pattern, thus enabling the formation of an effective second pattern.

[0020] Optionally, the photomask assembly of the upstream exposure device includes a first glass substrate and a first light-shielding layer. Light from the light source passes through the first glass substrate and the first light-shielding layer sequentially and then illuminates the substrate to transfer the pattern on the first light-shielding layer onto the substrate to form the first pattern. The photomask assembly of the downstream exposure device includes a second glass substrate. Light from the light source passes through the second glass substrate and then illuminates the substrate at the end of the first pattern. When exposing the substrate to form the first pattern, the light generated by the light source can penetrate the first glass substrate and illuminate the first light-shielding layer. A precise pattern is formed on the first light-shielding layer through photolithography and etching processes, which is divided into a light-transmitting area and a light-shielding area (the pattern composed of the light-shielding areas can be transferred to the substrate to form the first pattern). When light illuminates the first light-shielding layer, some light can pass through the light-transmitting area and illuminate the substrate, so that the pattern formed on the substrate is the same as the pattern on the first light-shielding layer, thus realizing image transfer. The second glass substrate does not have a first light-shielding layer. After passing through the second glass substrate, the light from the light source directly illuminates the substrates at both ends of the first pattern for exposure. This means that the two parts of the substrate will not form a pattern after exposure; instead, all the photosensitive material on the surface will be cured. Therefore, the cost of the second glass substrate is not high, and the downstream exposure device can also be used on FMM production lines of other specifications.

[0021] Optionally, the exposure device includes one unit and a translation component. The photomask component includes a third glass substrate, a second light-shielding layer, and a baffle. The baffle divides the third glass substrate into a first exposure area and a second exposure area. Light from the light source passes through the first exposure area and the second light-shielding layer sequentially and then illuminates the substrate to transfer the pattern on the second light-shielding layer to the substrate to form the first pattern. Light from the light source passes through the second exposure area and then illuminates the substrate at the end of the first pattern to solidify the photosensitive material on its surface. The translation component can horizontally move the photomask component relative to the substrate along the width direction of the substrate to switch between the first exposure area and the second exposure area opposite to the substrate. The first and second exposure areas can expose different parts of the substrate respectively. Since the second light-shielding layer is only provided in the first exposure area, the substrate can form a first pattern (prototype) after exposure in the first exposure area, and the photosensitive material on the surface of the substrate can be solidified after exposure in the second exposure area. The first and second exposure areas are separated by a baffle to prevent light from propagating between the two exposure areas. The exposure area opposite to the substrate can be adjusted by moving the first and second photomask assemblies using the translation component.

[0022] Optionally, the FMM production equipment further includes multiple material pulling devices, each including a winding mechanism and a conveying roller. The winding mechanism is used to wind or unwind the substrate, and the conveying roller is used to convey the substrate through the exposure device and the laser etching device.

[0023] These features and advantages of this utility model will be described in detail in the following specific embodiments and accompanying drawings. The best embodiments or means of this utility model will be shown in detail in conjunction with the accompanying drawings, but this is not intended to limit the technical solution of this utility model. In addition, each of these features, elements and components appearing in the following text and drawings has multiple components and is labeled with different symbols or numbers for convenience, but all represent parts with the same or similar structure or function. Attached Figure Description

[0024] The present invention will be further described below with reference to the accompanying drawings: Figure 1 This is a schematic diagram of the structure of an FMM production equipment according to the present invention; Figure 2 This is a schematic diagram of the structure of the substrate in this utility model; Figure 3 This is a schematic diagram of the pattern structure of a section of FMM according to this utility model; Figure 4 This is a schematic diagram of another FMM production equipment according to the present invention; Figure 5 This is a schematic diagram of the structure of the photomask assembly of this utility model; Figure 6 This is a schematic diagram of another FMM production equipment in this utility model; Figure 7 This is a picture of an FMM (Factory Model); Figure 8 These are the vapor-deposited holes on the first strip of the FMM.

[0025] Figure label: Substrate 100, first pattern 101, second pattern 102, core pattern 103, alignment pattern 104, first marking pattern 105, second marking pattern 106, processing strip 110, first strip 120, second strip 130; Material pulling device 200; Channel 300, first exposure device 310, first photomask 311, first glass substrate 312, first light-shielding layer 313, second exposure device 320, second photomask 321, second glass substrate 322, third photomask 330, third glass substrate 331, second light-shielding layer 332, baffle 333, first exposure area 334, second exposure area 335; Laser etching device 400. Detailed Implementation

[0026] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described are intended to explain this utility model and should not be construed as limiting it.

[0027] The terms "an embodiment," "example," or "trademark" used in this specification refer to a particular feature, structure, or characteristic described in connection with the embodiment itself that may be included in at least one embodiment disclosed in this utility model. The phrase "in an embodiment" appearing in various places throughout the specification does not necessarily refer to the same embodiment.

[0028] Reference Figures 1 to 8 This utility model discloses an apparatus for producing FMM (Flat Metal Mesh). The raw material for FMM is substrate 100 (material is INVAR alloy). Substrate 100 is in roll form and is fixed and conveyed by a feeding device 200. The feeding device 200 includes a winding mechanism and a conveying roller. The winding mechanism is used to wind or unwind substrate 100, and the conveying roller is used to convey and support substrate 100. Substrate 100 can be conveyed unidirectionally or reciprocally.

[0029] A large number of FMMs can be formed on a single roll of substrate 100. During the processing of the roll, the substrate 100 is processed sequentially along its length by unwinding and rewinding to form multiple FMMs spaced apart from each other. Finally, the roll is cut to form individual FMMs. To facilitate processing and subsequent cutting, the spacing between the FMMs on the substrate 100 is the same.

[0030] The substrate 100 is divided along its length into a plurality of spaced-apart processing segments 110. Each processing segment 110 includes a first segment 120 and two second segments 130. Each first segment 120 is adjacent to a second segment 130 at both ends along its length. The FMM production equipment is used to form an FMM pattern on the substrate 100. The FMM pattern includes a first pattern 101 formed on the first segment 120 and a second pattern 102 formed on the second segments 130. A complete FMM pattern includes a first pattern 101 and two second patterns 102 located on both sides thereof.

[0031] The FMM has multiple through-holes, and both the first and second patterns are composed of multiple through-holes. For example... Figure 8 As shown, Figure 8 The vapor-deposited holes forming the first pattern on the first strip are shown.

[0032] The FMM production equipment includes at least one exposure device and at least one laser etching device 400. The exposure device can expose the substrate 100 to form a first pattern 101 on the first strip 120. The laser etching device 400 can process the second strip 130 to form a second pattern 102 on the second strip 130. The laser etching device 400 includes a laser etching component and a first alignment component. The first alignment component is used to identify the first pattern 101. The laser etching component aligns the first pattern 101 according to the identification result of the first alignment component to form a second pattern 102 adjacent to the first pattern 101. This avoids problems such as overlap, misalignment, and excessive spacing between the second pattern 102 and the first pattern 101, and ensures that the relative positional relationship between the first pattern 101 and the second pattern 102 meets the requirements, so that the two patterns can be spliced ​​into a complete and qualified FMM pattern.

[0033] The FMM production equipment of this application allows for the processing of the first pattern 101 and the second pattern 102 on the first belt segment 120 and the second belt segment 130, respectively. These patterns can be combined to form a complete FMM pattern, eliminating the need for a single exposure cycle and reducing the size of the exposure device, thus lowering equipment costs. This enables the production of high-generation FMMs using lower-generation equipment, reducing FMM production costs and facilitating market adoption. Furthermore, forming the patterns on the first pattern 101 and the second pattern 102 in a single exposure using a larger exposure machine requires a longer exposure time; the technical solution of this application shortens the formation time of a single FMM pattern.

[0034] Among them, the first pattern 101 has higher requirements for forming accuracy, while the second pattern 102 has relatively lower requirements for forming accuracy. The processing accuracy of the exposure device is higher than that of the laser etching device 400. The formation of the first pattern 101 by the exposure device and the formation of the second pattern 102 by the laser etching device 400 can respectively meet the accuracy requirements of the first pattern 101 and the second pattern 102, ensuring that the FMM pattern can meet the usage standards.

[0035] During the formation of the first pattern 101 on the first strip 120, the substrate 100 needs to undergo multiple processing steps. Exposure of the substrate 100 by the exposure device is only one step. The substrate 100 also needs to undergo development, etching, and film removal steps to make the first pattern 101 visible on the first strip 120. Then, laser etching is performed on the second strip 130 to form the second pattern 102. During processing, a quality inspection process for the first pattern 101 can be added before laser etching. This allows for advance checks to ensure the first pattern 101 meets standards, preventing the entire processing strip 110 from being scrapped due to the pattern on the first strip 120 not meeting requirements. This shortens the processing cycle of the entire roll of substrate.

[0036] Typically, processing the substrate 100 using an exposure device results in a relatively high scrap rate. This issue exists for both high-generation and low-generation exposure machines, with similar scrap rates. Therefore, regardless of whether a high-generation or low-generation exposure machine is used, the substrate 100 undergoes quality inspection after exposure processing to ensure the pattern conforms to standards. The laser etching device 400, however, can directly edit the required drilling positions and arrangements, and can set laser energy and drilling depth for different areas, whether opening or partially etching. Although its processing precision is not as high as that of the exposure device, it virtually eliminates the possibility of the second pattern 102 being scrapped. By performing quality inspection on the first pattern 101 before forming the second pattern 102, the laser etching step on scrapped processing segments 110 can be avoided, thus preventing increased production time. Furthermore, the splicing production scheme requires significantly less time to process a complete FMM pattern compared to forming it in one go using a large-size photomask. Therefore, compared to the scheme using a larger-size photomask for one-time formation, the solution presented in this application has higher production efficiency.

[0037] Reference Figure 3 Based on the above embodiments, in one embodiment of the present invention, the first pattern 101 includes a core pattern 103 and an alignment pattern 104. In the length direction of the substrate 100, the core pattern 103 is provided with alignment patterns 104 at both ends. The alignment patterns 104 are used for the identification and alignment of the first alignment component. The laser etching component can determine the laser starting position according to the position of the alignment pattern 104, so as to perform laser etching on the second strip 130 to form a second pattern 102 that conforms to the standard.

[0038] Among them, the alignment patterns 104 at both ends of the core pattern 103 are the first marking pattern 105 and the second marking pattern 106, respectively. The first marking pattern 105 is located at the beginning of the core pattern 103, and the second marking pattern 106 is located at the end of the core pattern 103. The first alignment component can identify and distinguish the first marking pattern 105 and the second marking pattern 106 to determine the beginning and end of the core pattern 103.

[0039] Because a first pattern 101 is spaced between two second patterns 102 on a processing section 110, and the first pattern 101 has a large size, the spacing between the two second patterns 102 is large. If the laser etching device 400 can simultaneously process and form the second patterns 102 at both ends of the first pattern 101, then the laser etching device 400 would need to have a very large size, which would increase the equipment cost. (Refer to...) Figure 1 and Figure 2 Based on the above embodiments, in one embodiment of this utility model, a method for processing the second pattern 102 using a laser etching device 400 is disclosed.

[0040] Method 1: The first alignment component includes a first identification alignment area and a second identification alignment area. The first identification alignment area can identify and align the first mark pattern 105, and the second identification alignment area can identify and align the second mark pattern 106. Therefore, the first alignment component can simultaneously identify the alignment pattern between two adjacent first mark patterns 105 and second mark patterns 106 on two processing strips 110.

[0041] After identification and alignment, the laser etching apparatus 400 can determine the beginning and end of the two first patterns 101 and form two adjacent second patterns 102 at the beginning and end of the two first patterns 101 respectively.

[0042] The laser etching component can process two second patterns sequentially. The laser etching component can also be equipped with two laser etching modules, which correspond to the first identification alignment area and the second identification alignment area respectively, so as to form two second patterns 102 simultaneously.

[0043] The distance between the two first strip segments 120 is equal to the sum of the lengths of the two second strip segments 130 and the distance between the two processing strip segments 110. The length of the second strip segment 130 is much shorter than that of the first strip segment 120, and the sum of the lengths of the two second strip segments 130 and the distance between the two processing strip segments 110 is also much shorter than that of the first strip segment 120. This allows a laser etching device 400 to simultaneously process two adjacent second strip segments 130 to form two adjacent second patterns 102.

[0044] Method 2: The first alignment component identifies only one of the first marker pattern 105 and the second marker pattern 106 at a time, while forming the second pattern 102 at one end of a first pattern 101.

[0045] The substrate 100 is a long strip of material that is conveyed during processing. After the substrate 100 is exposed, each first strip 120 is typically exposed sequentially. Then, the first strip 120 undergoes development, etching, and film removal processes to remove the photosensitive material from its surface, revealing the first pattern 101. The second pattern 102 is then formed. In this scheme, during the formation of the second pattern 102, the laser etching device 400 first forms the second pattern 102 at one end of the first pattern 101. When the substrate 100 is conveyed in the reverse direction, a second second pattern 102 is formed at the other end of the first pattern 101. This ensures a consistent feeding distance each time, facilitating program design.

[0046] Alternatively, each second strip segment 130 can be processed sequentially to form a second pattern 102 at the beginning and end of each first pattern 101. This design eliminates the need for reverse feeding.

[0047] like Figure 6As shown, unlike the above embodiments, in another embodiment of this utility model, the FMM production equipment includes two laser etching devices 400. The first alignment components of the two laser etching devices 400 respectively capture the first marking pattern 105 and the second marking pattern 106 to form the second pattern 102 at the beginning and end of the first pattern 101 respectively, which has higher processing efficiency.

[0048] Reference Figure 1 Based on the above embodiments, in one embodiment of the present invention, the exposure device includes two photomask assemblies arranged opposite to each other, forming a channel 300 between the two photomask assemblies for the substrate 100 to pass through, and the two photomask assemblies respectively expose the front and back sides of the substrate 100.

[0049] A portion of the first pattern 101 is located on the front side of the substrate 100, and another portion is located on the back side of the substrate 100. The position of the pattern on both sides has extremely high precision requirements, and the patterns on both sides are formed by exposure by two photomask assemblies respectively. In order for the first pattern 101 to meet the standard, the positional precision of the two photomask assemblies also has extremely high requirements.

[0050] During the exposure process, the two photomask assemblies first move closer together to clamp the substrate 100 before exposure. The two photomask assemblies can be aligned with each other (for ease of explanation, one photomask assembly will be referred to as the A-side photomask assembly and the other as the B-side photomask assembly). The exposure apparatus also includes a second alignment assembly and a third alignment assembly. The A-side photomask assembly identifies the substrate 100 through the second alignment assembly to determine the position of the first segment 120. Subsequently, the A-side photomask assembly can align with the substrate 100 based on the identification result. After the A-side photomask assembly completes its alignment, the B-side photomask assembly identifies the A-side photomask assembly through the third alignment assembly. Subsequently, the B-side photomask assembly can align with the A-side photomask assembly based on the identification result and perform exposure.

[0051] Reference Figure 1 Based on the above embodiments, in one embodiment of this utility model, there are two exposure devices, one of which is located upstream and the other is located downstream, and are respectively named the first exposure device 310 and the second exposure device 320.

[0052] The first exposure device 310 is located upstream to expose the first strip 120 to form a first pattern 101 (prototype), and the second exposure device 320 is located downstream to expose the second strip 130 to cure the photosensitive material on its surface.

[0053] The substrate 100 used for fabricating the FMM is made of metal. During FMM fabrication, a photosensitive material is coated onto the surface of the substrate 100. In the exposed areas of the substrate 100, the photosensitive material is cured, preventing material damage during subsequent development and etching processes. After exposure, the first segment 120 undergoes development and etching, and finally, after film removal (removal of the photosensitive material), the first pattern 101 is revealed. After exposure, the second segment 130, during the development and etching steps following the first segment 120, ensures that the metal on the second segment 130 is not damaged, allowing for laser etching to form an effective second pattern 102.

[0054] The photomask assembly of the first exposure apparatus 310 includes a first light source and a first photomask 311. The patterns on the two first photomasks 311 of the first exposure apparatus 310 are different, and the first pattern 101 is formed by superimposing the patterns on the two first photomasks 311.

[0055] For ease of explanation, one first photomask 311 will be referred to as the A-side photomask, and the other first photomask 311 as the B-side photomask. Based on the scheme disclosed in the above embodiments, during the processing of the first strip 120, the substrate 100 is moved to the exposure area between the two first photomasks 311. The A-side photomask is aligned with the first strip 120 through the second alignment component, so that the pattern position accuracy of the A-side photomask on the substrate 100 is within ±50μm. Then, the position of the A-side photomask is locked, and the B-side photomask is fitted onto the A-side photomask (the alignment of the two first photomasks 311 is accurate to ±0.5μm) through the third alignment component for exposure, so that the patterns on the A-side photomask and the B-side photomask are simultaneously transferred to the first strip 120 to form the first pattern 101.

[0056] The first photomask 311 includes a first glass substrate 312 and a first light-shielding layer 313. The first light-shielding layer 313 is formed on the first glass substrate 312 by sputtering or evaporation. A precise pattern is formed on the first light-shielding layer 313 by photolithography and etching. The pattern is divided into light-transmitting areas and light-shielding areas (the pattern formed by the light-shielding areas is the first pattern 101 that needs to be transferred to the first strip 120). The light from the first light source passes through the first glass substrate 312 and then shines on the first light-shielding layer 313 and onto the substrate 100. The photosensitive material on the surface of the substrate 100 after being irradiated by the light from the light-transmitting areas can be retained after development and etching to form the first pattern 101 on the first strip 120.

[0057] The photomask assembly of the second exposure apparatus 320 includes a second light source and a second photomask 321. The second photomask 321 includes a second glass substrate 322. The light from the second light source passes through the second glass substrate 322 and directly irradiates the second strip 130.

[0058] The second photomask 321 of the second exposure device 320 does not have a structure that functions like the first light-shielding layer 313. The light from the second light source, after passing through the second glass substrate 322, directly illuminates the second strip 130, exposing the entire second strip 130. This exposure does not form a pattern on the second strip 130; it merely solidifies the photosensitive material on the surface of the second strip 130, ensuring its retention after development and etching. This prevents the metal on the surface of the second strip 130 from being lost during the etching process, allowing it to be used in subsequent laser etching processes. Because the second photomask 321 of the second exposure device 320 does not have a structure that functions like the first light-shielding layer 313, its cost is low. Furthermore, the second exposure device 320 can also be used in other types of modular FMM production lines. Through its versatility, the overall cost of multiple modular FMM production lines of different specifications can be reduced.

[0059] Alternatively, after exposing the first segment, the first photomask on the first exposure device can be replaced with a second photomask to expose the second segment. This eliminates the need for a second exposure device.

[0060] Reference Figure 4 and Figure 5 Unlike the above embodiments, in another embodiment of this utility model, the photomask assembly of the exposure device includes a third light source, a third photomask 330, and a translation component. The third photomask 330 includes a third glass substrate 331, a second light-shielding layer 332, and a baffle 333. The baffle 333 divides the third glass substrate 331 into a first exposure area 334 and a second exposure area 335. The second light-shielding layer 332 is disposed in the first exposure area 334. The first exposure area 334 is used to expose the first strip 120 to form a first pattern 101. The second exposure area 335 is used to expose the second strip 130 to solidify the photosensitive material on the surface of the second strip 130. The translation component can move the two third photomasks 330 horizontally and simultaneously relative to the substrate 100 along the width direction of the substrate 100.

[0061] The exposure device can expose the first strip 120 and the second strip 130 respectively through a set of third photomasks 330. Since only the first exposure area 334 is provided with the second light-shielding layer 332, the second strip 130 will not produce a pattern after being exposed through the second exposure area 335. The first exposure area 334 and the second exposure area 335 are separated by a baffle 333 to prevent light from propagating between the two exposure areas.

[0062] By moving the third photomask 330 using the translation component, the exposure area opposite to the substrate 100 can be adjusted. When exposing the first segment 120, the translation component moves two third photomasks 330 to match the first exposure area 334 with the first segment 120. When exposing the second segment 130, the translation component moves two third photomasks 330 to match the second exposure area 335 with the second segment 130.

[0063] Based on the above embodiments, in one embodiment of the present invention, the laser etching apparatus further includes a purging device, which can clean up the metal shavings generated during the laser etching process in a timely manner.

[0064] Based on the above embodiments, in one embodiment of this utility model, the laser etching device 400 uses a femtosecond laser with a wavelength of 343nm, and the laser etching size accuracy can reach ±1μm, and the position accuracy can reach ±0.5μm.

[0065] Based on the above embodiments, in one embodiment of this utility model, the process sequence for forming the pattern in this application is as follows: The first step is to expose the first section; The second step is to expose the second segment; The third step is development (development of the pattern on the photosensitive material). Step 4, etching (wet chemical etching). Step 5: Removal of the film (peeling off the photosensitive material). Step 6, Macroscopic inspection (initial visual screening); Step 7, AOI inspection (automatic optical inspection); Step 8, TPCD inspection (hole wall roughness inspection); Step 9: Cleaning (with deionized water); Step 10, AOI re-inspection (defect confirmation); Step 11: Repair the first section (if quality inspection confirms that the first section cannot be repaired to the standard, this processed section shall be scrapped). Step 12: Laser etching is performed on the second segment; Step 13: Rewashing and Packaging (Final Cleaning and Sealing).

[0066] Reference Figures 1 to 5 Based on the above embodiments, in one embodiment of this utility model, a specific description is given of how to produce high-generation FMMs using low-generation FMM production equipment.

[0067] For example, the FMM production equipment in this application is of G6 generation specifications and can be used to produce G8.6 generation FMMs. The typical dimensions of a G6 generation FMM are: length 1200mm and width usually less than 300mm. The typical dimensions of a G8.6 generation FMM are: length 1650-1750mm and width 350-600mm, with the core pattern length being approximately 1210mm. G6 generation FMMs are suitable for the fabrication of screens for small to medium-sized electronic products such as mobile phones and tablets, while G8.6 generation FMMs are suitable for the fabrication of screens for medium to large-sized electronic products such as tablets, laptops, and monitors.

[0068] The G8.6 generation FMM pattern includes a first pattern 101 and a second pattern 102, which can be produced using G6 generation FMM production equipment (referring to a G6 generation exposure machine that can complete the production of G6 generation FMMs in a single exposure) in a splicing manner. The size of the first pattern 101 of the G8.6 generation FMM is approximately the same as the size of the entire G6 generation FMM. The exposure device can form the first pattern 101 of the G8.6 generation FMM, and the laser etching device 400 can form the second pattern 102 of the G8.6 generation FMM.

[0069] in: The dimensions of the first glass substrate 312 of the first photomask 311 are the same as the dimensions of the photomask in the G6 generation FMM production equipment. The size of the first light-shielding layer 313 of the first photomask 311 is the same as the size of the first light-shielding layer 313 of the photomask on the G8.6 generation FMM production equipment (here referring to the G8.6 generation exposure machine that can complete the production of G8.6 generation FMM in one exposure).

[0070] Thus, the first pattern 101 of the G8.6 generation FMM can be formed by exposure using G6 generation FMM equipment, while the second pattern 102 has lower processing precision requirements and can therefore be processed by laser etching device 400, thereby realizing the production of G8.6 generation FMM using G6 generation equipment. Compared to directly producing G8.6 generation FMM using a single exposure method with a G8.6 generation exposure machine, the scrap rate of G8.6 generation and G6 generation is almost the same. Using G6 generation equipment to produce G8.6 generation FMM by splicing can save about 90% in equipment costs and also has higher production efficiency.

[0071] In addition, because the G6 generation mask is smaller than the G8.6 generation mask, the G6 generation mask has higher precision during alignment and fitting, which improves the yield of FMM.

[0072] The above are merely specific embodiments of this utility model, but the scope of protection of this utility model is not limited thereto. Those skilled in the art should understand that this utility model includes, but is not limited to, the contents described in the accompanying drawings and the specific embodiments above. Any modifications that do not depart from the functional and structural principles of this utility model will be included within the scope of the claims.

Claims

1. An FMM production apparatus, comprising at least one exposure device for exposing a substrate (100) to be processed to form a plurality of spaced first patterns (101), characterized in that, The FMM production equipment also includes at least one laser etching device (400), which is located downstream of the exposure device. The laser etching device (400) includes a laser etching component and a first alignment component. The first alignment component is used to identify a first pattern (101), and the laser etching component is used to perform laser etching on the substrate (100) according to the identification result of the first alignment component to form a second pattern (102) adjacent to both ends of the first pattern (101).

2. The FMM production equipment according to claim 1, characterized in that, The first pattern (101) includes a core pattern (103) and alignment patterns (104) located at both ends of its length direction. The first alignment component can identify the alignment pattern (104) so ​​that the laser etching component forms the second pattern (102) at the end of the first pattern (101) with the alignment pattern (104) as a reference.

3. The FMM production equipment according to claim 2, characterized in that, The number of laser etching devices (400) is one. The first alignment component includes a first identification alignment area and a second identification alignment area. The first identification alignment area and the second identification alignment area respectively identify two alignment patterns (104) between two adjacent core patterns (103). The laser etching component performs laser etching between two first patterns (101) to form two adjacent second patterns (102) according to the identification results of the first identification alignment area and the second identification alignment area. Alternatively, the number of laser etching devices (400) is one, the first alignment component identifies the alignment pattern (104) at one end of the core pattern (103), and the laser etching component performs laser etching at one end of the first pattern (101) to form a second pattern (102) according to the identification result of the first alignment component.

4. The FMM production equipment according to claim 2, characterized in that, The number of laser etching devices (400) is two, and the two laser etching devices (400) are arranged at intervals. The first alignment components of the two laser etching devices (400) respectively identify the alignment patterns (104) at both ends of a core pattern (103). The laser etching components of the two laser etching devices (400) respectively perform laser etching at both ends of a first pattern (101) to form a second pattern (102) according to the identification results of their respective first alignment components.

5. The FMM production equipment according to any one of claims 1 to 4, characterized in that, The exposure apparatus includes two photomask assemblies arranged opposite each other, forming a channel (300) between the two photomask assemblies for the substrate (100) to pass through, and the two photomask assemblies respectively expose the front and back sides of the substrate (100).

6. The FMM production equipment according to claim 5, characterized in that, The exposure apparatus further includes a second alignment component and a third alignment component, wherein one photomask component identifies the substrate (100) through the second alignment component and aligns with the substrate (100) according to the identification result, and the other photomask component identifies the aligned photomask component through the third alignment component and completes the alignment between the two photomask components according to the identification result.

7. The FMM production equipment according to claim 5, characterized in that, The exposure device is provided in two parts. One exposure device is located upstream to expose the substrate (100) to form the first pattern (101), and the other exposure device is located downstream to expose the substrate (100) at both ends of the first pattern (101) to cure the photosensitive material on its surface.

8. The FMM production equipment according to claim 7, characterized in that, The photomask assembly of the upstream exposure device includes a first glass substrate (312) and a first light-shielding layer (313). Light from the light source passes through the first glass substrate (312) and the first light-shielding layer (313) in sequence and then irradiates the substrate (100) to transfer the pattern on the first light-shielding layer (313) to the substrate (100) to form the first pattern (101). The photomask assembly of the downstream exposure device includes a second glass substrate (322). Light from the light source passes through the second glass substrate (322) and then irradiates the substrate (100) at the end of the first pattern (101).

9. The FMM production equipment according to claim 5, characterized in that, The exposure device is provided, and the exposure device further includes a translation component. The photomask component includes a third glass substrate (331), a second light-shielding layer (332), and a baffle (333). The baffle (333) divides the third glass substrate (331) into a first exposure area (334) and a second exposure area (335). The second light-shielding layer (332) is disposed in the first exposure area (334). The light from the light source passes through the first exposure area (334) and the second light-shielding layer (332) in sequence and then illuminates the substrate ( On the substrate (100), the pattern on the second light-shielding layer (332) is transferred to the substrate (100) to form the first pattern (101). The light from the light source penetrates the second exposure area (335) and then shines on the substrate (100) at the end of the first pattern (101) to solidify the photosensitive material on its surface. The translation component can horizontally move the photomask component relative to the substrate (100) along the width direction of the substrate (100) to switch between the first exposure area (334) or the second exposure area (335) opposite to the substrate (100).

10. The FMM production equipment according to any one of claims 1 to 4, characterized in that, The FMM production equipment also includes multiple material pulling devices (200), each of which includes a winding mechanism and a conveying roller. The winding mechanism is used to wind or unwind the substrate (100), and the conveying roller is used to convey the substrate (100) so that the substrate (100) passes through the exposure device and the laser etching device (400).

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