Computer mainboard fin press-fitting mechanism

Abstract

The utility model discloses a computer mainboard fin press equipment relates to electronic component production technical field. The utility model discloses a rack and fixedly connected on the rack two slide rails still include: the down -pressing part, the down -pressing part sets up in the rack, the installation part, the installation part installs on two slide rails, the down -pressing part includes pressure assembly, and pressure assembly installs in the rack, and the positioning assembly sets up in the rack, and the pressure assembly includes the hydraulic cylinder of fixed connection in the inner wall of rack, the outer wall fixedly connected with the backing plate no. of hydraulic cylinder, the bottom fixedly connected with a plurality of spring no. of backing plate no. The utility model discloses a down -pressing part, has solved the computer mainboard fin press equipment in the use process of current, the position of inconvenient fixed fin, easily causes the fin and the mainboard contact gap too big or the incompatibility uneven when press -mounting, leads to the problem of the quality of installation decline.

Description

Technical Field

[0001] This utility model belongs to the field of electronic component manufacturing technology, and in particular relates to a pressing mechanism for heat sinks on computer motherboards. Background Technology

[0002] With the iteration of computer performance, such as the increase in the number of CPU and GPU cores, the increase in frequency, and the popularization of AI computing and cloud computing, the power consumption of the core heat-generating components of the motherboard, such as the CPU, Northbridge chip, and power management chip, has increased significantly, from tens of watts in the early days to hundreds of watts today. High temperatures can cause chip thermal throttling, accelerated component aging, and even hardware burnout. Therefore, the tight fit between the heat sink and the chip has become the key to ensuring the stable operation of the motherboard, and thus the heat sink pressing mechanism for computer motherboards came into being.

[0003] However, existing computer motherboard heatsink pressing mechanisms are not convenient for fixing the position of the heatsink during use, which can easily cause excessive gaps or uneven contact between the heatsink and the motherboard during pressing, resulting in a decrease in installation quality. Utility Model Content

[0004] The purpose of this utility model is to provide a computer motherboard heatsink pressing mechanism. By setting a pressing part, it solves the problem that existing computer motherboard heatsink pressing mechanisms are not convenient for fixing the position of the heatsink during use, and are prone to causing excessive gaps or uneven contact between the heatsink and the motherboard during pressing, resulting in a decrease in installation quality.

[0005] To solve the above-mentioned technical problems, this utility model is achieved through the following technical solution:

[0006] This utility model relates to a computer motherboard heatsink pressing mechanism, comprising a frame and two slide rails fixedly connected to the frame, and further comprising: a pressing part disposed within the frame; a mounting part mounted on the two slide rails; the pressing part comprising a pressure assembly mounted within the frame; and a positioning assembly disposed within the frame; the pressure assembly comprising a hydraulic cylinder fixedly connected to the inner wall of the frame, a pad fixedly connected to the outer wall of the hydraulic cylinder, a plurality of springs fixedly connected to the bottom of the pad, a pressure block fixedly connected to the bottom of the output shaft of the hydraulic cylinder, and an upper mold fixedly connected to the bottom of the plurality of springs, the output shaft of the hydraulic cylinder extending into the upper mold; four springs are provided, and the pressure block is located within the upper mold; the pressure assembly is used to press down the heatsink.

[0007] Furthermore, the mounting section includes a placement assembly mounted on top of two slide rails; and a buffer assembly disposed above the two slide rails for cushioning the placement assembly.

[0008] Furthermore, the positioning component includes a second spring fixedly connected to the inner wall of the upper mold. Each of the two second springs is provided with an extrusion member on the side of the two second springs that are close to each other. The extrusion member includes a top post fixedly connected to the side of the two second springs that are close to each other. A push block is fixedly connected to the side of the top post that is away from the second spring. The push block and the push block are adapted to each other. The positioning component is used to fix the heat sink.

[0009] Furthermore, the placement assembly includes two sliders slidably connected to the top of two slide rails, a pad second fixedly connected to the top of the two sliders, a base fixedly connected to the top of the pad second, a plurality of support columns fixedly connected to the top of the base, a lower mold fixedly connected to the top of the plurality of support columns, and push blocks second fixedly connected to the left and right sides of the lower mold; the two push blocks second are mirror-distributed, and the placement assembly is used to place the motherboard.

[0010] Furthermore, the buffer assembly includes several buffer posts 1 fixedly connected to the top of the pad 2, a buffer plate slidably connected to the inner wall of the base, and a buffer component provided on the top of each of the buffer posts 1. The buffer component includes a buffer post 2 slidably connected to the inner wall of the buffer post 1, and a spring 3 is sleeved on the outer wall of the buffer post 2. The buffer post 2 is located at the bottom of the buffer plate. The buffer plate is square in shape. The buffer assembly is used to protect the main board.

[0011] This utility model has the following beneficial effects:

[0012] 1. By setting up a lower pressing part, during use, in the pressure assembly, the hydraulic cylinder drives the pressing block to move downward, which drives the upper mold to move downward synchronously. Spring 1 buffers the impact and compensates for errors during the pressing process; in the positioning assembly, when the upper mold moves downward, spring 2 on its inner wall pushes the top column and push block 1, which cooperates with push block 2 to achieve precise alignment between the heat sink and the motherboard, which is convenient for fixing the position of the heat sink, avoiding excessive contact gap or uneven fit of the heat sink during pressing, and improving the installation quality;

[0013] 2. By setting up the installation part, during use, in the placement component, the two sliders slide along the slide rail, driving the pad plate two and the base, support column and lower mold above to move. The push blocks two on both sides cooperate with the push block one of the lower pressing part for positioning. In the buffer component, when the placement component is subjected to force, the buffer plate presses down on the buffer column two. The buffer column two slides along the inner wall of the buffer column one and compresses the spring three. The impact force is absorbed through the deformation of the spring to achieve buffer protection, facilitate stable pressure transmission, improve the consistency of pressing, ensure the stability and reliability of pressing quality, and prevent damage to the workpiece when the pressure is too high.

[0014] Of course, any product implementing this utility model does not necessarily need to achieve all of the advantages described above at the same time. Attached Figure Description

[0015] To more clearly illustrate the technical solutions of the embodiments of this utility model, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0017] Figure 2 This is a partial cross-sectional view of the pressure assembly of this utility model;

[0018] Figure 3 This is a schematic diagram of the overall structure of the positioning component of this utility model;

[0019] Figure 4 This is a partial cross-sectional view of the placement component of this utility model;

[0020] Figure 5 This is a partial cross-sectional view of the buffer assembly of this utility model.

[0021] The attached diagram lists the components represented by each number as follows:

[0022] 101. Frame; 102. Slide rail; 2. Lower pressing section; 21. Pressure assembly; 211. Hydraulic cylinder; 212. Pad plate one; 213. Spring one; 214. Pressure block; 215. Upper mold; 22. Positioning assembly; 221. Spring two; 222. Top column; 223. Push block one; 3. Mounting section; 31. Placement assembly; 311. Slider; 312. Pad plate two; 313. Base; 314. Support column; 315. Lower mold; 316. Push block two; 32. Buffer assembly; 321. Buffer column one; 322. Buffer column two; 323. Spring three; 324. Buffer plate. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] Please see Figure 1-5As shown, this utility model is a computer motherboard heatsink pressing mechanism, including a frame 101 and two slide rails 102 fixedly connected to the frame 101, and further including: a pressing part 2, which is disposed inside the frame 101; and a mounting part 3, which is mounted on the two slide rails 102.

[0025] The pressing section 2 includes a pressure assembly 21, which is installed inside the frame 101; and a positioning assembly 22, which is disposed inside the frame 101. The pressure assembly 21 includes a hydraulic cylinder 211 fixedly connected to the inner wall of the frame 101. A pad 212 is fixedly connected to the outer wall of the hydraulic cylinder 211. Several springs 213 are fixedly connected to the bottom of the pad 212. A pressure block 214 is fixedly connected to the bottom of the output shaft of the hydraulic cylinder 211. An upper mold 215 is fixedly connected to the bottom of the several springs 213. The output shaft of the hydraulic cylinder 211 extends into the upper mold 215. There are four pressure blocks 214 located inside the upper mold 215. The positioning component 22 includes a second spring 221 fixedly connected to the inner wall of the upper mold 215. Each of the two second springs 221 has a pressing component on the side close to each other. The pressing component includes a top post 222 fixedly connected to the side close to each other of the two second springs 221. A push block 223 is fixedly connected to the side of the top post 222 away from the second spring 221. The push block 223 is adapted to the push block 216. By setting the lower pressing part 2, it is easy to fix the position of the heat sink, avoid the heat sink contact gap being too large or uneven fitting during pressing, and improve the installation quality.

[0026] The mounting section 3 includes a placement assembly 31, which is mounted on top of two slide rails 102; and a buffer assembly 32, which is positioned above the two slide rails 102. The buffer assembly 32 is used to buffer the placement assembly 31. The placement assembly 31 includes two sliders 311 slidably connected to the top of the two slide rails 102. A pad 312 is fixedly connected to the top of the two sliders 311. A base 313 is fixedly connected to the top of the pad 312. A plurality of support columns 314 are fixedly connected to the top of the base 313. A lower mold 315 is fixedly connected to the top of the plurality of support columns 314. Push blocks 316 are fixedly connected to the left and right sides of the lower mold 315. The push blocks 316 are distributed in a mirror image. The buffer assembly 32 includes several buffer pillars 321 fixedly connected to the top of the pad 312. The inner wall of the base 313 is slidably connected to a buffer plate 324. Each of the buffer pillars 321 has a buffer component on its top. The buffer plate 324 is square in shape. The buffer component includes a buffer pillar 322 slidably connected to the inner wall of the buffer pillar 321. The outer wall of the buffer pillar 322 is fitted with a spring 323. The buffer pillar 322 is located at the bottom of the buffer plate 324. By setting the mounting part 3, it is easy to stabilize the pressure transmission, improve the consistency of pressing, ensure the stability and reliability of the pressing quality, and prevent damage to the workpiece when the pressure is too high.

[0027] A specific application of this embodiment is as follows: In use, first, the motherboard to be press-fitted is placed on the buffer plate 324 and fixed. Then, the heat sink is placed into the upper mold 215 and secured. During this process, the heat sink pushes the push block 223, which in turn moves the top post 222 and compresses the spring 221 until the heat sink moves above the push block 223. At this point, the spring 221 releases its elasticity and pushes the top post 222 and the push block 223 back to their original positions, securing the heat sink. Then, the mounting part 3 is slid along the two slide rails 102 to below the lower pressing part 2, and the hydraulic cylinder 211 is activated. During this process, the output shaft of the hydraulic cylinder 211 drives the pressing block 214 downwards. When the pressure assembly... When the 21 moves above the placement component 31, the push block 223 is squeezed by the push block 316, which drives the top column 222 to move together and compress the spring 221. At this time, the upper mold 215 is stuck on the top of the lower mold 315, and the heat sink in the upper mold 215 moves downward after losing the limit of the push block 223 and comes into contact with the main board in the lower mold 315. Then the output shaft of the hydraulic cylinder 211 drives the pressure block 214 to continue to move downward until the pressure block 214 presses the heat sink, thus completing the pressing of the heat sink. When the pressure is too high, the buffer plate 324 will drive the buffer column 322 to move downward and compress the spring 323, thereby releasing the excessive pressure and preventing damage to the heat sink.

[0028] In the description of this specification, references to terms such as "an embodiment," "example," "specific example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0029] The preferred embodiments of this utility model disclosed above are merely illustrative of the present utility model. These preferred embodiments do not exhaustively describe all details, nor do they limit the utility model to the specific implementations described. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of this utility model, thereby enabling those skilled in the art to better understand and utilize it. This utility model is limited only by the claims and their full scope and equivalents.

Claims

1. A computer motherboard heatsink pressing mechanism, comprising a frame (101) and two slide rails (102) fixedly connected to the frame (101), characterized in that, Also includes: The pressing part (2) is disposed inside the frame (101); Mounting part (3), which is mounted on two slide rails (102); The pressing part (2) includes a pressure assembly (21) which is installed inside the frame (101); as well as Positioning component (22), the positioning component (22) is disposed within the frame (101); The pressure assembly (21) includes a hydraulic cylinder (211) fixedly connected to the inner wall of the frame (101), a pad (212) fixedly connected to the outer wall of the hydraulic cylinder (211), a plurality of springs (213) fixedly connected to the bottom of the pad (212), a pressure block (214) fixedly connected to the bottom of the output shaft of the hydraulic cylinder (211), an upper mold (215) fixedly connected to the bottom of the plurality of springs (213), and the output shaft of the hydraulic cylinder (211) extends into the upper mold (215). Among them, four springs (213) are provided, and the pressure block (214) is located inside the upper mold (215).

2. The computer motherboard heatsink pressing mechanism according to claim 1, characterized in that, The mounting part (3) includes a placement assembly (31) mounted on top of two slide rails (102); and A buffer assembly (32) is disposed above two slide rails (102); Among them, the buffer component (32) is used to buffer the placement component (31).

3. The computer motherboard heatsink pressing mechanism according to claim 2, characterized in that, The positioning component (22) includes a second spring (221) fixedly connected to the inner wall of the upper mold (215), and each of the two second springs (221) is provided with a pressing element on the side that is close to each other.

4. The computer motherboard heatsink pressing mechanism according to claim 3, characterized in that, The placement component (31) includes two sliders (311) slidably connected to the top of two slide rails (102), a pad (312) is fixedly connected to the top of the two sliders (311), a base (313) is fixedly connected to the top of the pad (312), a plurality of support columns (314) are fixedly connected to the top of the base (313), a lower mold (315) is fixedly connected to the top of the plurality of support columns (314), and push blocks (316) are fixedly connected to the left and right sides of the lower mold (315). Among them, the two push blocks 2 (316) are mirror images of each other.

5. The computer motherboard heatsink pressing mechanism according to claim 4, characterized in that, The buffer assembly (32) includes several buffer posts (321) fixedly connected to the top of the pad plate (312), and a buffer plate (324) is slidably connected to the inner wall of the base (313). Each of the buffer posts (321) is provided with a buffer component on its top. Among them, the buffer plate (324) is a square block.

6. The computer motherboard heatsink pressing mechanism according to claim 5, characterized in that, The extrusion member includes a top post (222) fixedly connected to one side of the two springs (221) that are close to each other, and a push block (223) is fixedly connected to the side of the top post (222) away from the springs (221). Among them, push block one (223) is compatible with push block two (316).

7. A computer motherboard heatsink pressing mechanism according to claim 6, characterized in that, The buffer component includes a second buffer column (322) that is slidably connected to the inner wall of the first buffer column (321), and a third spring (323) is sleeved on the outer wall of the second buffer column (322). Among them, buffer column 2 (322) is located at the bottom of buffer plate (324).

Images