Glass product edge polishing apparatus

Abstract

The application discloses glass product edge polishing equipment, relates to the technical field of polishing processing, and comprises a rack and a clamping assembly for clamping a wafer, the clamping assembly comprises a clamping frame corresponding to the wafer edge and a clamping jaw cylinder for driving the clamping frame to move, the rack is provided with a mounting frame connected with the clamping jaw cylinder, the rack is provided with a connecting frame, a polishing plate one corresponding to a notch of the wafer edge and a driving piece one for driving the polishing plate one are rotationally arranged on one side of the connecting frame close to the wafer edge, the rack is provided with a placing disc on one side of the mounting frame, a polishing plate two for polishing the wafer edge is arranged above the placing disc, a rotating frame is rotationally arranged above the placing disc of the rack, and the polishing plate two surrounds the rotating frame and is provided with a plurality of polishing plates. The whole structure integrates notch polishing and edge overall polishing functions, improves the universality and polishing effect of the equipment, and meets the polishing requirements of different parts of the wafer edge.

Description

Technical Field

[0001] This application relates to the field of polishing technology, and in particular to equipment for polishing the edges of glass products. Background Technology

[0002] In the semiconductor device manufacturing process, the wafer is the core basic material, and the flatness, cleanliness and dimensional accuracy of its edges directly affect the stability of subsequent key processes such as photolithography, thin film deposition and packaging, as well as the performance of the final device.

[0003] Edge polishing is a polishing process performed on the outer circle, flat reference edge, or notch notch of a wafer. Edge polishing can improve the surface finish of the chamfered edge, prevent dirt and grime from accumulating on the rough surface, and allow the wafer to be cleaned more thoroughly. Improving the edge finish can also reduce edge stress and lower the probability of breakage during subsequent processing.

[0004] Regarding the aforementioned technologies, the inventors believe that for wafers with notched structures, existing equipment lacks a polishing structure that precisely corresponds to the notched area, making it impossible to perform targeted polishing treatment on the notched area. Utility Model Content

[0005] The purpose of this application is to provide glass product edge polishing equipment to improve the problem that existing equipment lacks a polishing structure that precisely corresponds to the notch area for wafers with notched structures, and therefore cannot perform targeted polishing treatment on the notch area.

[0006] The glass product edge polishing equipment provided in this application adopts the following technical solution: A glass product edge polishing device includes a frame and a clamping assembly for holding wafers. The clamping assembly includes a clamping frame corresponding to the edge of the wafer and a gripper cylinder for driving the clamping frame to move. The frame is provided with a mounting frame connected to the gripper cylinder. The frame is also provided with a connecting frame. A polishing plate corresponding to a notch on the edge of the wafer and a driving component for driving the polishing plate are rotatably mounted on the side of the connecting frame near the edge of the wafer. A placement tray is provided on the side of the frame near the mounting frame. A second polishing plate for polishing the edge of the wafer is positioned above the placement tray. A rotating frame is rotatably mounted on the frame above the placement tray. Several polishing plates are arranged around the rotating frame.

[0007] By adopting the above technical solution, the gripper cylinder can drive the clamping frame to accurately clamp the wafer, ensuring the positional stability of the wafer during polishing and preventing displacement from affecting the polishing accuracy. The polishing plate 1, which is rotated on the connecting frame, corresponds to the notch on the edge of the wafer, and can specifically treat the notch area, solving the problem of incomplete notch polishing by traditional equipment. The drive component 1 can adjust the movement of the polishing plate 1 to ensure the force and efficiency of notch polishing. The placement tray, together with the rotating frame above and several polishing plates 2 arranged around it, can achieve full coverage polishing of the wafer edge, avoiding local missed polishing. The overall structure integrates notch polishing and overall edge polishing functions, improving the equipment's versatility and polishing effect, and meeting the polishing needs of different parts of the wafer edge.

[0008] Optionally, the clamping frame is provided with fixing blocks at both ends corresponding to the wafer edge, and the fixing block is provided with a clamping groove on the side near the wafer edge, and the inner sidewall of the clamping groove is arc-shaped with the wafer edge.

[0009] By adopting the above technical solution, the fixing blocks at both ends of the clamping frame are adapted to the edge of the wafer. The inner sidewall of the clamping groove is set in an arc shape with the edge of the wafer, which can increase the contact area during clamping, reduce wafer edge damage caused by excessive local pressure, and at the same time, the arc fit makes the clamping more stable, further improving the positional accuracy during the wafer polishing process, avoiding polishing deviation caused by non-fitting clamping, and ensuring the flatness and consistency of the wafer edge after polishing.

[0010] Optionally, the driving end of the first driving component is provided with a rotating seat, and the first polishing plate is arranged in a ring along the circumferential sidewall of the rotating seat.

[0011] By adopting the above technical solution, the rotating seat at the driving end of the driving component drives the circularly arranged polishing plate to move. The circularly distributed polishing plate can contact the wafer edge notch from multiple angles and directions. Compared with a single polishing plate, it can expand the polishing coverage, increase the polishing frequency, and improve the polishing efficiency of the notch area. At the same time, the circular distribution ensures that the polishing force is applied evenly to the notch area, preventing local over-polishing or uneven polishing caused by the long-term action of a single polishing plate, and ensuring that the polishing quality of the notch area is consistent with that of other edge areas.

[0012] Optionally, the frame is provided with a second driving component for driving the rotating frame to rotate, and an annular frame is provided on the outer side of the rotating frame, with the second polishing plates spaced apart along the circumferential direction of the annular frame.

[0013] By adopting the above technical solution, the second drive component on the frame drives the rotating frame to rotate the annular frame. The second polishing plates, which are circumferentially spaced on the annular frame, rotate synchronously with the frame, which can continuously polish the edge of the wafer on the placement tray. The spacing ensures the continuity of polishing and prevents adjacent polishing plates from interfering with each other.

[0014] Optionally, the annular frame is rotatably provided with a connecting rod connected to the second polishing plate, and a pendulum is provided at the end of the connecting rod away from the second polishing plate. The annular frame is provided with a limiting block to restrict the swing amplitude of the pendulum.

[0015] By adopting the above technical solution, one end of the connecting rod rotatably connected to the annular frame is connected to the second polishing plate, and the other end is equipped with a pendulum. When the annular frame rotates, the pendulum drives the connecting rod to swing under the action of centrifugal force, so that the second polishing plate can adaptively adjust the contact angle and pressure according to the actual situation of the wafer edge, preventing uneven polishing caused by small deviations in the wafer edge size; the limiting block on the annular frame can limit the swing amplitude of the pendulum, preventing the second polishing plate from exceeding the preset polishing range due to excessive swing amplitude, ensuring that the polishing process is stable and controllable, and at the same time protecting the second polishing plate and the wafer from excessive collision damage.

[0016] Optionally, the frame is provided with a driving component three above the rotating frame to drive the rotating frame to move downward. The driving end of the driving component three is provided with a connecting seat connected to the driving component two. The placement tray is provided with vacuum adsorption holes for adsorbing wafers.

[0017] By adopting the above technical solution, the driving component three drives the driving component two and the rotating frame to move down as a whole through the connecting seat. This can adjust the contact distance and pressure between the polishing plate two and the edge of the wafer, meet the pressure adjustment requirements of wafers of different thicknesses or different polishing precision requirements, and improve the applicability of the equipment. The vacuum adsorption holes in the placement tray can firmly adsorb the wafer on the placement tray, preventing the wafer from shifting or rotating due to force during polishing, further ensuring the accuracy of the polishing position. Compared with mechanical clamping, vacuum adsorption can reduce damage to the wafer surface and protect the wafer quality.

[0018] Optionally, the diameter of the annular frame is larger than the diameter of the wafer, the size of the placement disk is smaller than the size of the wafer, and the annular frames are arranged in pairs on the upper and lower sides of the wafer, the second polishing plate is arranged opposite to each other on the upper and lower sides of the wafer, and the pendulum has a gap between itself and the wafer on the placement disk in its natural state.

[0019] By adopting the above technical solution, the diameter of the annular frame is larger than the diameter of the wafer, ensuring that the paired annular frames can completely cover the upper and lower edges of the wafer. Combined with the polishing plates arranged opposite each other, the upper and lower edges of the wafer can be polished simultaneously, reducing polishing steps and improving polishing efficiency. The size of the placement disk is smaller than the size of the wafer, which allows the wafer edge to be fully exposed within the working range of the polishing plate, preventing the placement disk from obstructing and affecting edge polishing. The pendulum has a gap with the wafer in its natural state, which can prevent the pendulum from contacting the wafer and causing damage when not in operation. During operation, the centrifugal force drives the polishing plate to contact the wafer, ensuring the controllability and safety of the polishing action.

[0020] Optionally, a buffer pad layer is provided on the inner sidewall of the clamping groove extending toward the clamping frame.

[0021] By adopting the above technical solution, the buffer pad layer on the inner sidewall of the clamping groove can play a buffering role when clamping the wafer, reducing the rigid contact between the fixing block and the edge of the wafer, preventing the wafer edge from being indented or damaged due to excessive clamping force, and protecting the integrity of the wafer edge.

[0022] In summary, this application includes at least one of the following beneficial technical effects: 1. The gripper cylinder can drive the clamping frame to precisely clamp the wafer, ensuring the positional stability of the wafer during polishing and preventing displacement from affecting the polishing accuracy; the polishing plate rotatably set on the connecting frame corresponds to the notch on the edge of the wafer, which can specifically treat the notch area and solve the problem of incomplete notch polishing in traditional equipment; 2. The fixing blocks at both ends of the clamping frame are adapted to the edge of the wafer. The inner wall of the clamping groove is arc-shaped with the edge of the wafer, which can increase the contact area during clamping, reduce wafer edge damage caused by excessive local pressure, and at the same time, the arc-shaped fit makes the clamping more stable, further improving the positional accuracy during the wafer polishing process, avoiding polishing deviation caused by non-fitting clamping, and ensuring the flatness and consistency of the wafer edge after polishing. 3. Drive component three drives drive component two and the rotating frame to move down together via the connecting seat. This can adjust the contact distance and pressure between the polishing plate two and the wafer edge, meeting the pressure adjustment requirements for wafers of different thicknesses or different polishing precision requirements, and improving the applicability of the equipment. The vacuum adsorption holes in the placement tray can firmly adsorb the wafer onto the placement tray, preventing displacement or rotational deviation of the wafer due to force during polishing, further ensuring the accuracy of the polishing position. Compared with mechanical clamping, vacuum adsorption can reduce damage to the wafer surface and protect the wafer quality. Attached Figure Description

[0023] Figure 1 This is an overall schematic diagram of a glass product edge polishing equipment; Figure 2 yes Figure 1 A magnified view of part A in the middle.

[0024] Figure 3 This is a partial schematic diagram of glass product edge polishing equipment.

[0025] In the diagram, 1. Frame; 11. Drive component three; 12. Connecting seat; 2. Clamping assembly; 21. Clamping frame; 22. Gripper cylinder; 23. Mounting frame; 24. Fixing block; 241. Clamping groove; 242. Buffer pad; 3. Connecting frame; 31. Polishing plate one; 32. Drive component one; 33. Rotating seat; 4. Placement tray; 41. Vacuum adsorption hole; 5. Polishing plate two; 51. Rotating frame; 52. Drive component two; 53. Annular frame; 54. Connecting rod; 55. Pendulum; 56. Limiting block. Detailed Implementation

[0026] The following is in conjunction with the appendix Figure 1 - Appendix Figure 3 This application will be described in further detail below.

[0027] Glass product edge polishing equipment, refer to Figure 1 and Figure 2 The system includes a frame 1, on which a clamping assembly 2 for clamping wafers is mounted. The clamping assembly 2 includes a clamping frame 21 corresponding to the edge of the wafer and a gripper cylinder 22 for moving the clamping frame 21. A mounting bracket 23 connected to the gripper cylinder 22 is fixedly mounted on the frame 1. The gripper cylinder 22 is stably fixed to the frame 1 by the mounting bracket 23. Both ends of the clamping frame 21 are integrally formed with fixing blocks 24 adapted to the edge of the wafer. A clamping groove 241 is formed on the side of the fixing block 24 near the edge of the wafer. The inner side of the clamping groove 241... The wall is set in an arc shape along the edge of the wafer, and a buffer pad 242 is bonded to the inner side wall of the clamping groove 241; a connecting frame 3 is also fixedly connected to the frame 1. A polishing plate 31 corresponding to the notch of the wafer edge is rotatably set on the side of the connecting frame 3 near the edge of the wafer through a bearing. A driving component 32 for driving the polishing plate 31 to rotate is installed on the connecting frame 3. The driving end of the driving component 32 is fixedly connected to a rotating seat 33 through a coupling. The polishing plate 31 is distributed in a ring along the circumferential side wall of the rotating seat 33 and is fixed to the rotating seat 33 with bolts.

[0028] Reference Figure 1 and Figure 3A placement tray 4 is placed on one side of the mounting frame 23 in the rack 1. The placement tray 4 is smaller than the wafer size, and a vacuum adsorption port 41 for adsorbing the wafer is embedded in the placement tray 4. The vacuum adsorption port 41 is connected to an external vacuum pump through a gas pipe. A rotating frame 51 is mounted on the rack 1 above the placement tray 4 and rotates via bearings. A second drive component 52 is mounted on the rack 1 to drive the rotation of the rotating frame 51. An annular frame 53 is welded to the outside of the rotating frame 51. The diameter of the annular frame 53 is larger than the diameter of the wafer, and the annular frames 53 are arranged in pairs on the upper and lower sides of the wafer. Connecting rods 54 are rotatably mounted on the annular frames 53 along their circumference via bearings. One end of the connecting rod 54 is fixedly connected to a second polishing plate 5 by bolts. The second polishing plates 55 on the upper and lower annular frames 53 are arranged opposite each other, and the connecting rods 54 are away from the polishing plate 53. One end of the blank plate 5 is welded with a pendulum 55. A limit block 56 is fixedly installed on the ring frame 53 to limit the swing amplitude of the pendulum 55. In its natural state, the pendulum 55 leaves a gap with the wafer on the placement plate 4. The frame 1 is also equipped with a drive component 3 11 that drives the rotating frame 51 to move down. The drive end of the drive component 3 11 is fixedly connected to the connecting seat 12 by bolts. The drive component 2 52 is fixed to the connecting seat 12 by bolts. The drive component 3 11 can drive the connecting seat 12, the drive component 2 52 and the rotating frame 51 to move up and down as a whole.

[0029] The implementation principle of this application embodiment is as follows: The first drive unit 32 is activated, which drives the rotating seat 33 to rotate. The polishing plate 31, which is arranged in a ring on the rotating seat 33, rotates synchronously with the rotating seat 33. The polishing plate 31 contacts the notch at the edge of the wafer and performs targeted polishing on the notch. The ring-shaped polishing plate 31 acts on the notch from multiple angles to ensure uniform polishing of the notch. Then, the wafer is transferred to the placement tray 4 by manual or robotic equipment. The vacuum adsorption holes 41 in the placement tray 4 are activated. The vacuum adsorption holes 41 generate negative pressure through an external vacuum pump to firmly adsorb the wafer on the placement tray 4, preventing displacement of the wafer during subsequent polishing. Then, the third drive unit 11 is activated. 11. The connecting seat 12 drives the second driving component 52 and the rotating frame 51 to move downwards as a whole, so that the polishing plate 5 on the upper and lower annular frames 53 approaches the upper and lower edges of the wafer until the polishing plate 5 makes contact with the wafer edge. Then, the second driving component 52 is activated, which drives the rotating frame 51 and the annular frame 53 to rotate synchronously. The connecting rod 54 on the annular frame 53 rotates with the frame, and the pendulum 55 drives the connecting rod 54 to swing under the action of centrifugal force, so that the polishing plate 5 adaptively adjusts the contact angle and pressure with the wafer edge, and performs circumferential continuous polishing on the upper and lower edges of the wafer. The limiting block 56 limits the swing amplitude of the pendulum 55 to prevent the polishing plate 5 from exceeding the preset range. The structure integrates notch polishing and overall edge polishing functions, improves the versatility of the equipment and the polishing effect, and meets the polishing needs of different parts of the wafer edge.

[0030] The embodiments described in this specific implementation are preferred embodiments of this application and are not intended to limit the scope of protection of this application. Identical components are represented by the same reference numerals. Therefore, all equivalent changes made to the structure, shape, and principle of this application should be included within the scope of protection of this application.

Claims

1. Glass product edge polishing equipment, characterized in that: The device includes a frame (1) and a clamping assembly (2) for holding wafers. The clamping assembly (2) includes a clamping frame (21) corresponding to the edge of the wafer and a gripper cylinder (22) for moving the clamping frame (21). The frame (1) is provided with a mounting frame (23) connected to the gripper cylinder (22). The frame (1) is provided with a connecting frame (3). The connecting frame (3) is rotatably provided with a polishing plate (31) corresponding to the notch of the wafer edge and a driving component (32) for driving the polishing plate (31) on the side of the connecting frame (3) near the edge of the wafer. The frame (1) is provided with a placement tray (4) on the side of the mounting frame (23). A polishing plate (5) for polishing the edge of the wafer is provided above the placement tray (4). The frame (1) is rotatably provided with a rotating frame (51) above the placement tray (4). Several polishing plates (5) are arranged around the rotating frame (51).

2. The glass product edge polishing equipment according to claim 1, characterized in that: The clamping frame (21) has fixing blocks (24) at both ends corresponding to the wafer edge. The fixing block (24) has a clamping groove (241) on the side near the wafer edge. The inner wall of the clamping groove (241) is arc-shaped along the wafer edge.

3. The glass product edge polishing equipment according to claim 2, characterized in that: The driving end of the driving component (32) is provided with a rotating seat (33), and the polishing plate (31) is arranged in a ring along the circumferential side wall of the rotating seat (33).

4. The glass product edge polishing equipment according to claim 3, characterized in that: The frame (1) is provided with a second driving component (52) for driving the rotating frame (51) to rotate. An annular frame (53) is provided on the outside of the rotating frame (51). The second polishing plate (5) is spaced apart along the circumferential direction of the annular frame (53).

5. The glass product edge polishing equipment according to claim 4, characterized in that: The annular frame (53) is rotatably provided with a connecting rod (54) connected to the polishing plate (5). A pendulum (55) is provided at the end of the connecting rod (54) away from the polishing plate (5). The annular frame (53) is provided with a limiting block (56) to limit the swing amplitude of the pendulum (55).

6. The glass product edge polishing equipment according to claim 5, characterized in that: The frame (1) is located above the rotating frame (51) and is provided with a driving component three (11) for driving the rotating frame (51) to move down. The driving end of the driving component three (11) is provided with a connecting seat (12) connected to the driving component two (52). The placement tray (4) is provided with a vacuum adsorption hole (41) for adsorbing wafers.

7. The glass product edge polishing equipment according to claim 6, characterized in that: The diameter of the annular frame (53) is larger than the diameter of the wafer, the size of the placement disk (4) is smaller than the size of the wafer, and the annular frame (53) is arranged in pairs on the upper and lower sides of the wafer. The polishing plate (5) is arranged opposite to each other on the upper and lower sides of the wafer. The pendulum (55) has a gap between itself and the wafer on the placement disk (4) in its natural state.

8. The glass product edge polishing equipment according to claim 2, characterized in that: The inner wall of the clamping groove (241) extends toward the clamping frame (21) and is provided with a buffer pad layer (242).

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